PITTSBURGH, Sept. 30, 2026 /PRNewswire/ — Daimon Robotics, a physical AI company focused on tactile intelligence, is showcasing its full-stack physical AI capabilities at IROS 2026 in Pittsburgh. Under the theme “From Touch to Intelligence,” the company is presenting its tactile infrastructure and latest advances in dexterous robotic manipulation.
Building a Tactile Intelligence Infrastructure for Physical AI
As robots take on increasingly complex tasks in the physical world, perception must go beyond seeing objects and their surroundings. Contact, force, slip, and material response often determine whether an action succeeds — yet these physical properties remain difficult to capture through vision alone. Tactile sensing provides the missing layer of physical information, giving robots a more direct understanding of how they interact with the world.
Daimon is building an infrastructure that connects tactile perception, physical interaction data, and world models. At IROS, the company demonstrated three layers of this stack:
Perception — DM-Tac Series: Vision-based tactile sensors delivering multidimensional, high-resolution, and high-frequency perception across more than twelve tactile modalities, with more than 110,000 sensing units. Live demos at IROS — including underwater sensing, durability testing, and empty-package detection—showcase the sensors’ fine-grained perception and stability across challenging conditions.Data — Data-Nexus Acquisition System integrates data acquisition devices, networking, processing pipelines, and evaluation benchmark into a unified data production workflow, continuously generating high-quality physical interaction data for model training.World Model — Daimon-TWM grounds intelligence in physical interaction data, enabling Physical Cognition, Predictive Decision-Making, and Real-Time Control for dexterous manipulation.
Daimon-TWM Makes Its First In-Person Public Demonstration Since Launch
IROS 2026 marks the first in-person public demonstration of Daimon-TWM since its launch in August. The model is demonstrated through two live autonomous manipulation tasks:
Friendship Bracelet Stringing: From picking up tiny engraved beads to aligning their small openings and threading them onto a flexible string, the task demands small-scale precision, deformable-material handling, and adaptation to changing contact conditions. Daimon-TWM continuously adjusts its actions based on subtle physical interactions, rather than following a fixed motion sequence.Canvas Tote Heat-Transfer Printing: The robot autonomously handles sticker placement, film removal, hot stamping, curing, and final placement. The long-horizon task involves precise placement, delicate peeling, changing contact conditions, and force-sensitive operations across multiple sequential steps. Daimon-TWM enables the robot to anticipate the consequences of each action and adapt its next move based on the physical state of the task.
Across both tasks, Daimon-TWM uses tactile feedback to stay responsive to the physical state of the task, adapting its actions from one step to the next.
Grounding Physical AI in the Real World
Daimon is building tactile intelligence infrastructure to empower robots to learn, adapt, and perform increasingly dexterous manipulation in the physical world—moving robotics from seeing to feeling, and from understanding the world to interacting with it.
About Daimon Robotics
Daimon Robotics is dedicated to building a closed-loop Physical AI ecosystem that seamlessly integrates tactile sensing, data, and models. Driven by our breakthrough tactile technology, we empower robots with true physical intelligence.
Our core product portfolio features high-resolution, high-frequency vision-based tactile sensors, a VTLA multimodal data acquisition system, and a tactile-grounded physical world model, enabling robots to achieve robust and dexterous manipulation in the contact-rich and complex real world.
Originating from the robotics research team at The Hong Kong University of Science and Technology, Daimon Robotics officially commenced operations in 2023. The company is headquartered in Shenzhen, with an R&D branch in Hong Kong.
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