New Poly-Si slurry, silicon bare wafer surface treatment solution, and glass TGV slurry support next-generation semiconductor manufacturing as the company expands its engagement in Taiwan and Japan.
SEOUL, South Korea, Nov. 2, 2026 /PRNewswire/ — Ace nanochem Co., Ltd., a South Korean semiconductor materials company led by CEO Jonghoon Lee, has completed development of three materials solutions for semiconductor manufacturing: Poly-Si slurry for power trench MOSFETs, a surface treatment solution for silicon bare wafers after chemical mechanical polishing (CMP), and slurry for glass through-glass via (TGV) processing. The company plans to build on these developments to expand its engagement with semiconductor manufacturers in Taiwan and Japan.
The three solutions address different challenges in semiconductor manufacturing, from selective polishing in power devices to surface cleanliness and planarity in advanced packaging.
Ace nanochem’s Poly-Si Slurry for Power Trench MOSFETs is designed to provide high removal rates for polysilicon while minimizing damage to the gate oxide. The formulation aims to improve polishing performance while reducing scratches, particle generation, dishing, and erosion, helping support process control and wafer surface quality.
The Silicon Bare Wafer Surface Treatment Solution is applied after CMP to improve wafer surface wettability and help prevent contamination. By reducing particle adhesion following polishing, the solution is designed to support the stringent surface cleanliness requirements of subsequent manufacturing processes.
For advanced semiconductor packaging, Ace nanochem’s Slurry for Glass TGV is designed to polish materials with different physical properties, including copper bulk, barrier metal, and bare glass. Its ability to process these materials together is intended to support the planarity and surface uniformity required for TGV manufacturing.
Building on its experience supplying semiconductor materials to major manufacturers in South Korea, Ace nanochem is working to develop further business opportunities in Taiwan and Japan, both important markets in the global semiconductor industry. The company participates regularly in SEMICON TAIWAN and pursues technical collaboration with leading foundries to strengthen relationships with overseas customers and industry partners.
“These three products reflect our focus on developing semiconductor materials for demanding manufacturing processes, from power devices to advanced packaging,” said Jonghoon Lee, CEO of Ace nanochem. “We aim to build on our materials technology and manufacturing capabilities to deepen technical collaboration with semiconductor manufacturers in Taiwan, Japan, and other global markets.”
About Ace nanochem Co., Ltd.
Since launching its colloidal silica business in December 1999, Ace nanochem Co., Ltd. has accumulated more than 20 years of specialized expertise in colloidal silica (SiO2) nanoparticle control technology.
The company operates fully automated manufacturing lines and a dedicated raw material production facility with a stated annual capacity of 60,000 tons. Ace nanochem supplies its ACESOL® semiconductor CMP slurries and ACESOL®WP wafer polishing slurries to major semiconductor and wafer manufacturers, including SK hynix, SK siltron, SSMC, GlobalWafers, and Amkor Technology.
The company has received the South Korean government’s $10 Million Export Tower award and Best Partner Awards from SK hynix, SK siltron, and SSMC.
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SOURCE Ace nanochem Co., Ltd.
