Connect with us

Technology

Fan-Out Wafer Level Packaging Market size is set to grow by USD 5.52 billion from 2024-2028, increased demand for compactly designed electronics to boost the market growth, Technavio

Published

on

NEW YORK, June 19, 2024 /PRNewswire/ — The global fan-out wafer level packaging market  size is estimated to grow by USD 5.52 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 23.77%  during the forecast period.  Increased demand for compactly designed electronics is driving market growth, with a trend towards increasing adoption of semiconductor ics in automobiles. However, increased production costs because of warpage  poses a challenge. Key market players include Amkor Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies Inc., Infineon Technologies AG, Jiangsu Changdian Technology Co. Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc., Panasonic Holdings Corp., Powertech Technology Inc., Renesas Electronics Corp., Singapore Semiconductor Industry Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp., Yield Engineering Systems, and Yole Developpement SA.

Get a detailed analysis on regions, market segments, customer landscape, and companies – Click for the snapshot of this report

Forecast period

2024-2028

Base Year

2023

Historic Data

2018 – 2022

Segment Covered

Technology (High density and Standard density), Type (200 mm, 300 mm, and Panel), and Geography (APAC, North America, Europe, South America, and Middle East and Africa)

Region Covered

APAC, North America, Europe, South America, and Middle East and Africa

Key companies profiled

Amkor Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies Inc., Infineon Technologies AG, Jiangsu Changdian Technology Co. Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc., Panasonic Holdings Corp., Powertech Technology Inc., Renesas Electronics Corp., Singapore Semiconductor Industry Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp., Yield Engineering Systems, and Yole Developpement SA

Key Market Trends Fueling Growth

The automotive industry’s shift from mechanical and hydraulic systems to electronic or hybrid alternatives, driven by the rise of autonomous cars, is fueling the demand for semiconductor ICs and sensors. This trend is leading to the increased adoption of FOWLP (Fan-Out Wafer Level Packaging) technology in the automotive sector. Major car manufacturers like Audi, General Motors, and Tesla are investing in ICs and sensors for advanced driver assistance systems (ADAS) and autonomous vehicles. FOWLP offers high material density, greater I/O points, and improved reliability, making it the preferred packaging solution for automotive ICs. Safety regulations and the need for smart automotive solutions are also driving the demand for MEMS sensors, further boosting the FOWLP market. 

The Fan-Out Wafer Level Packaging (FO-WLP) market is experiencing significant growth, driven by the increasing demand for smaller, more efficient semiconductor devices. Memory and logic semiconductors are the primary applications for FO-WLP technology. The use of FO-WLP in power management and sensor applications is also on the rise. The trend towards higher integration and miniaturization in electronics is fueling the adoption of FO-WLP. The technology offers several advantages, including reduced power consumption, improved reliability, and increased design flexibility. The future looks bright for FO-WLP, with continued innovation and advancements expected in this dynamic market. 

Research report provides comprehensive data on impact of trend. For more details- Download a Sample Report

Market Challenges

The FOWLP market faces challenges due to warpage issues, which increase production costs. Warpage is a distortion in the molded part’s surface, leading to wafer deformation and wastage. Differential shrinkage, thermal expansion mismatches, and post-processing steps are common causes. These issues result in higher manufacturing and packaging costs for ICs, potentially hindering market growth.The Fan-Out Wafer Level Packaging (FO-WLP) market faces several challenges. One challenge is the complexity of the technology, which requires precise chip placement and interconnect design. Another challenge is the high cost of FO-WLP compared to traditional packaging methods. Additionally, the need for high yield and reliability in FO-WLP is crucial for mass production. Furthermore, the integration of different materials and processes in FO-WLP can be difficult, requiring advanced manufacturing techniques. Lastly, the increasing demand for smaller form factors and higher performance in electronic devices puts pressure on the FO-WLP industry to continuously innovate and improve.

For more insights on driver and challenges – Download a Sample Report

Segment Overview 

This fan-out wafer level packaging market report extensively covers market segmentation by

Technology 1.1 High density1.2 Standard densityType 2.1 200 mm2.2 300 mm2.3 PanelGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

1.1 High density-  The Fan-Out Wafer Level Packaging (FO-WLP) market is experiencing significant growth due to the increasing demand for miniaturization and higher integration in semiconductor devices. FO-WLP technology enables the direct connection of dies to the substrate, reducing the number of interconnects and improving overall performance. Companies such as Samsung, Micron, and SK Hynix are leading the market with their innovative FO-WLP solutions. This technology is particularly beneficial for memory and logic applications, leading to its widespread adoption in the consumer electronics and automotive industries.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2018 – 2022)  – Download a Sample Report

Research Analysis

The Fan-Out Wafer Level Packaging (FO-WLP) market is experiencing significant growth in various sectors, including consumer electronics and advanced electronics. FO-WLP is a semiconductor-based technology that enables footprint-sensitive devices, such as smartphones, smartwatches, and laptops, to incorporate high-performing ICs with minimal increase in size and weight. This technology utilizes advanced packaging methods, such as PoP (Package-on-Package) and memory-on-logic solutions, to enhance the functionality of consumer electronics. FO-WLP also addresses thermal issues by employing wafer-level packaging and wafer-level processes. The IC packaging technology reduces manufacturing costs and enables heterogeneous integration and panel level technology in ultra-thin portable devices. FO-WLP is revolutionizing the consumer electronics sector by enabling the production of high-performing, compact devices.

Market Research Overview

The Fan-Out Wafer Level Packaging (FO-WLP) market refers to the technology and process of integrating various semiconductor devices onto a single wafer using wafer-level packaging techniques. This packaging method offers several advantages such as reduced interconnect resistance, improved reliability, and enhanced system performance. The FO-WLP market caters to various applications including memory, logic, and sensor technologies. The technology is gaining popularity due to the increasing demand for miniaturization, higher integration density, and the need for advanced packaging solutions in the electronics industry. The market is expected to grow significantly in the coming years due to the increasing adoption of FO-WLP in advanced semiconductor applications. The process involves various techniques such as redistribution layer (RDL) formation, wafer bonding, and final packaging. The market is driven by factors such as the increasing demand for high-performance and power-efficient semiconductor devices, the miniaturization trend in the electronics industry, and the growing adoption of advanced packaging solutions.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

TechnologyHigh DensityStandard DensityType200 Mm300 MmPanelGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

View original content to download multimedia:https://www.prnewswire.com/news-releases/fan-out-wafer-level-packaging-market-size-is-set-to-grow-by-usd-5-52-billion-from-2024-2028–increased-demand-for-compactly-designed-electronics-to-boost-the-market-growth-technavio-302176433.html

SOURCE Technavio

Continue Reading

Technology

Revolune and Concept Life Sciences Partner to Help Customers Transition Multiplex IF Assays to Flexible New Workflows

Published

on

By

OBERKOCHEN, Germany, Oct. 27, 2026 /PRNewswire/ — Revolune today announced a partnership with Concept Life Sciences to help biopharma and life sciences customers reassess, transfer, and scale multiplex immunofluorescence assays using Revolune’s flexible staining technology, which now supports 4- to 7-plex assays. 

The collaboration addresses a growing market need as customers evaluate alternatives to existing workflows and reconsider how best to support tissue biomarker research. With Revolune now offering 4- to 7-plex assay capabilities, Concept Life Sciences can help customers transfer established assays onto the Revolune platform, preserve valuable panel know-how, and move more easily from existing workflows to flexible, ready-to-use multiplex formats. 

“Many customers are not starting from a blank page — they already have assays, panels, and tissue biomarker strategies they need to preserve while moving toward more flexible workflows,” said Adrian Arechiga, CCO of Revolune. “Concept Life Sciences brings the translational biology, biomarker, and assay development expertise needed to help customers make that transition practically and confidently.” 

Concept Life Sciences is a leading contract research organization serving the global life sciences industry, with capabilities across discovery, development, analytical services, translational biology, biomarker discovery, spatial biology, and end-to-end chemistry. By combining these capabilities with Revolune’s adaptable multiplex immunofluorescence technology, the companies aim to help customers generate decision-ready tissue biomarker insights while reducing the operational burden of assay transfer and implementation. 

The partnership is designed for research teams that want to retain the scientific value of existing workflows while gaining access to a more flexible platform for multiplex staining. Customers can work with Concept Life Sciences to evaluate assay transfer feasibility, optimize panel design, run tissue staining workflows, and connect resulting biomarker data to broader discovery and development programs. 

“We are excited to work with Revolune to support customers who are rethinking how they approach multiplex tissue analysis,” said Adam Davenport, CSO at Concept Life Sciences. “Together, we can help teams transfer existing assays, explore new panels, and apply multiplex immunofluorescence in ways that support meaningful translational decisions.” 

The Concept Life Sciences partnership forms part of Revolune’s broader strategy to build an ecosystem of partners that support adoption across different customer needs — from specialist service execution to assay migration, translational biology, and integrated R&D support.

Meet Revolune and Concept Life Sciences at SITC 2026

Revolune and Concept Life Sciences will both be attending the Society for Immunotherapy of Cancer (SITC) Annual Meeting, November 4–8, 2026, in Phoenix, Arizona. 

Meet both teams at SITC at Sundown, a relaxed evening of complimentary drinks, dinner and conversation hosted by Concept Life Sciences on November 6, 6.30-8.30 pm. More information: https://www.conceptlifesciences.com/campaigns/sitc-2026.

About Revolune

Revolune is a life science company dedicated to making multiplex immunofluorescence as accessible and practical as routine tissue analysis. Its reagent technologies help laboratories move rapidly from existing primary antibodies to ready-to-use multiplex kits, simplifying spatial biology workflows and enabling researchers to focus on biological questions rather than assay management. 

About Concept Life Sciences

Concept Life Sciences is a leading contract research organisation (CRO) serving the global life sciences industry. For over 25 years, the company, and its heritage companies, have provided consultative and collaborative drug discovery and development services. Our approach, supported by passionate scientists and world-leading capabilities, enables clients to overcome complex scientific challenges and improves program success rates. The company has successfully helped 29 candidates advance to the clinic.

The company offers sophisticated translational biology services coupled with exceptional end-to-end chemistry capabilities to support drug discovery and development across a range of established and emerging modalities, with the ability to seamlessly integrate capabilities and provide bespoke solutions to address client needs.

Collectively, the company’s high-quality services and commitment to customer service across the drug development pathway enhances efficiency in drug discovery, helping clients advance their drugs to clinic in as little as 32 months, well ahead of the industry average of 60 months.

View original content to download multimedia:https://www.prnewswire.com/news-releases/revolune-and-concept-life-sciences-partner-to-help-customers-transition-multiplex-if-assays-to-flexible-new-workflows-302919466.html

SOURCE Revolune

Continue Reading

Technology

From Global Orders to Global Growth: Financial Infrastructure for Mid-Market Exporters

Published

on

By

At the 140th Canton Fair, PhotonPay demonstrates how its stablecoin-centric financial operating system helps growing exporters manage cross-border collections, currency conversion and global payments.

HONG KONG, Oct. 27, 2026 /PRNewswire/ — For a growing homewares exporter, a major overseas order brings opportunity, but also an immediate question: how will the business finance production, cover shipping costs and manage cash until the buyer pays?

A furniture manufacturer may need to pay suppliers weeks or months before receiving the final payment. A home décor or festive-goods exporter may be managing several seasonal orders at once, each with different delivery schedules, payment terms and currencies. As the business expands into more markets, tracking incoming payments, converting currencies and paying suppliers becomes increasingly complex.

These are everyday challenges behind international trade. At the second phase of the 140th Canton Fair, themed “Quality Home Life” and featuring furniture, kitchenware, household items, home decorations, gifts and festive products, PhotonPay is highlighting how financial infrastructure can help growing exporters manage these demands as they expand internationally.

Financial Tools for the Next Stage of Growth

Large multinational companies can draw on dedicated treasury teams, established banking relationships and sophisticated systems to manage funds across markets. Smaller businesses may have simpler payment needs. Mid-market exporters occupy a different position: their operations span multiple countries and currencies, while their finance teams often remain lean.

At the same time, production and freight costs must be covered before all customer payments arrive. Receivables may be spread across currencies and accounts, while suppliers expect payment according to their own schedules. Finance teams must track receipts, reconcile invoices and maintain a clear view of available funds.

Across multiple markets and overlapping orders, these tasks can consume significant time and complicate decisions about when and where to deploy cash. Growing exporters need practical tools to coordinate collections, manage funds across currencies and pay counterparties worldwide, without having to build a large treasury function from scratch.

Connecting Fiat and Stablecoin Rails to Global Business

Bank accounts and fiat payment networks remain central to international trade, connecting businesses to local collection methods and established banking relationships. Stablecoins offer an additional way to transfer value across borders, with transactions possible outside conventional banking hours depending on the network and transaction arrangements.

Connecting fiat and stablecoin rails can give businesses more flexibility in managing cross-border funds. For exporters, the practical value lies in connecting the stages of a cross-border financial workflow: receiving customer payments, converting currencies and making funds available for supplier payments and other business expenses.

PhotonPay is built around this connection. As a stablecoin-centric financial operating system, PhotonPay brings together a cross-border financial infrastructure across both fiat and stablecoin rails.

Its multi-asset wallet supports fiat currencies and stablecoins within a unified environment. Local collection capabilities cover 21 currencies, enabling businesses to receive payments in the currencies their customers use. Through integrated on- and off-ramp services, businesses can convert between fiat and stablecoins, while 24/7 foreign exchange allow funds to move across markets at any time. Cross-border payouts in fiat and stablecoins are available across 200+ countries and territories. Card issuing capabilities also allow companies to manage overseas business spending directly from one platform.

These capabilities connect the key stages of cross-border financial operations, and for growing exporters, this provides a more integrated way to manage international payments as their business expands.

PhotonPay also extends its infrastructure to platforms through Embedded Finance. Its APIs enable B2B platforms, marketplaces and other digital businesses to integrate financial capabilities, including accounts, fiat and stablecoin wallets, global payouts and card issuing, into their own products. This allows platforms to build collection, payment and fund management services into existing workflows and extend financial capabilities to their customers.

Financial Infrastructure That Grows With the Business

For mid-market exporters, international growth brings new customers, more markets and greater demands on financial operations. The ability to manage funds across borders needs to keep pace, supporting everything from the next production run to the next supplier payment and the next market entry.

By connecting fiat and stablecoin rails within one financial operating system, PhotonPay helps growing businesses manage cross-border funds with greater flexibility as they scale internationally.

Visit PhotonPay at Area D, Booths DT1714–DT1718, during the 140th Canton Fair.

About PhotonPay

PhotonPay is a stablecoin-powered payment operating system built for global infrastructure. Designed for modern enterprises, PhotonPay enables businesses to send, receive, convert, and settle funds across both fiat and stablecoin rails through a single, compliance-first integration, spanning 200+ countries and territories.

For more information, visit [www.photonpay.com].

Disclaimer

This material is for general informational purposes only and does not constitute legal, regulatory, tax, accounting, or investment advice, nor an offer or solicitation for any product or service. The availability, features, and regulatory treatment of PhotonPay’s products and services may vary depending on the user’s location, business model, and the laws and regulations that apply. Any descriptions of functionality, performance, efficiency, cost savings, or compliance support (including, without limitation, references to “real‑time”, “24/7”, “high‑efficiency”, or “compliant” solutions) are aspirational or forward‑looking in nature. Actual outcomes may differ due to market conditions, technological constraints, and regulatory developments, and PhotonPay makes no express or implied representation, warranty, or guarantee as to the achievement of any particular result.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/from-global-orders-to-global-growth-financial-infrastructure-for-mid-market-exporters-302920151.html

SOURCE PhotonPay

Continue Reading

Technology

Rockwell Automation Unveils Record-Breaking Innovation Lineup at Automation Fair 2026

Published

on

By

From AI-powered manufacturing and next-generation control to cybersecurity and digital engineering, Rockwell showcases technologies designed to help manufacturers build the future of industrial operations

MILWAUKEE, Oct. 27, 2026 /PRNewswire/ — Rockwell Automation, Inc. (NYSE: ROK), the world’s largest company dedicated to industrial automation and digital transformation, today announced an expanded product showcase for Automation Fair® 2026. Across the plant floor and enterprise, Rockwell’s latest innovations help manufacturers unlock greater productivity, simplify operations and strengthen resilience in an increasingly complex industrial environment. Together, these technologies demonstrate how AI, automation and digital transformation are reshaping the future of industrial operations.

At Automation Fair 2026, attendees will get an exclusive look at new technologies designed to help manufacturers modernize production, accelerate decision-making and scale innovation with greater confidence. The innovations span Rockwell’s automation and software portfolio showcasing practical applications that address some of the industry’s most pressing operational challenges.

“Production systems today are balancing growth, workforce challenges, cybersecurity threats and the need to adapt faster than ever before,” said Matheus Bulho, senior vice president, software & control, Rockwell Automation. “At Automation Fair 2026, we’re bringing together hardware, software and industrial intelligence in new ways, giving customers the tools to move faster, adapt with confidence and create more resilient and autonomous operations.”

Among the list of record-breaking innovative new technologies being showcased are:

LogixEdge™ Controller, enhancing the power of Logix with new form factors and seamless integration of IT and OT workloads that further amplify Logix’s powerful multidiscipline control and information capabilities, including AI workloads that enable autonomous controlCompactLogix® 5390 Controller, delivering enhanced performance and security with greater scalability for modern production system environments.PointMax™ I/O, a next-generation I/O platform designed to simplify deployment and support high-performance machine applications.Armor™ PowerFlex® 330 Integrated Drive Motor, combining motor and drive functionality in a compact solution to reduce complexity and accelerate installation.EtherNet/IP™ In-cabinet Solution, helping manufacturers simplify what it takes to construct, wire, deploy and manage industrial control systems more efficiently.FactoryTalk® Optix™ Version 1.9 and new OptixPanel™ Pro and PanelView™ Pro graphic terminals, providing expanded visualization capabilities across larger distributed systems, enhanced security and a modern operator experience.FactoryTalk® Conductor™, enabling organizations to orchestrate industrial intelligence and agentic engineering across design, operations and maintenance for their entire operations.FactoryTalk® AssetIQ™, FactoryTalk® Design Workbench™ and FactoryTalk® ResilientEdge™ software, helping customers simplify enterprise OT asset management, streamline engineering and improve resilience of edge deployments.New AI innovations for the Plex Smart Manufacturing Platform™ and AI-powered Quality Management capabilities, bringing practical artificial intelligence to everyday manufacturing workflows.Expanded cybersecurity offerings, including SecureOT™ Platform Managed Services, OT Cybersecurity Assessment Suite, and capabilities designed to support OEMs in building more secure machines from the start

In addition to product announcements, attendees will have the opportunity to experience live demonstrations, engage with Rockwell Automation experts and partners and explore the innovations driving greater productivity, flexibility and resilience across manufacturing.

Registration is now open. Join thousands of industrial professionals at Automation Fair 2026 and be among the first to experience Rockwell’s latest innovations in action. Register today at automationfair.com.

About Rockwell Automation
Rockwell Automation, Inc. (NYSE: ROK), is a global leader in industrial automation and digital transformation. We connect the imaginations of people with the potential of technology to expand what is humanly possible, making the world more productive and more sustainable. Headquartered in Milwaukee, Wisconsin, Rockwell Automation employs approximately 26,000 problem solvers dedicated to our customers in more than 100 countries. To learn more about how we are bringing the Connected Enterprise® to life across industrial enterprises, visit www.rockwellautomation.com.

 

View original content to download multimedia:https://www.prnewswire.com/news-releases/rockwell-automation-unveils-record-breaking-innovation-lineup-at-automation-fair-2026-302907266.html

SOURCE Rockwell Automation, Inc.

Continue Reading

Trending