Technology
Fan-Out Wafer Level Packaging Market size is set to grow by USD 5.52 billion from 2024-2028, increased demand for compactly designed electronics to boost the market growth, Technavio
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2 years agoon
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NEW YORK, June 19, 2024 /PRNewswire/ — The global fan-out wafer level packaging market size is estimated to grow by USD 5.52 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 23.77% during the forecast period. Increased demand for compactly designed electronics is driving market growth, with a trend towards increasing adoption of semiconductor ics in automobiles. However, increased production costs because of warpage poses a challenge. Key market players include Amkor Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies Inc., Infineon Technologies AG, Jiangsu Changdian Technology Co. Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc., Panasonic Holdings Corp., Powertech Technology Inc., Renesas Electronics Corp., Singapore Semiconductor Industry Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp., Yield Engineering Systems, and Yole Developpement SA.
Get a detailed analysis on regions, market segments, customer landscape, and companies – Click for the snapshot of this report
Forecast period
2024-2028
Base Year
2023
Historic Data
2018 – 2022
Segment Covered
Technology (High density and Standard density), Type (200 mm, 300 mm, and Panel), and Geography (APAC, North America, Europe, South America, and Middle East and Africa)
Region Covered
APAC, North America, Europe, South America, and Middle East and Africa
Key companies profiled
Amkor Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies Inc., Infineon Technologies AG, Jiangsu Changdian Technology Co. Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc., Panasonic Holdings Corp., Powertech Technology Inc., Renesas Electronics Corp., Singapore Semiconductor Industry Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp., Yield Engineering Systems, and Yole Developpement SA
Key Market Trends Fueling Growth
The automotive industry’s shift from mechanical and hydraulic systems to electronic or hybrid alternatives, driven by the rise of autonomous cars, is fueling the demand for semiconductor ICs and sensors. This trend is leading to the increased adoption of FOWLP (Fan-Out Wafer Level Packaging) technology in the automotive sector. Major car manufacturers like Audi, General Motors, and Tesla are investing in ICs and sensors for advanced driver assistance systems (ADAS) and autonomous vehicles. FOWLP offers high material density, greater I/O points, and improved reliability, making it the preferred packaging solution for automotive ICs. Safety regulations and the need for smart automotive solutions are also driving the demand for MEMS sensors, further boosting the FOWLP market.
The Fan-Out Wafer Level Packaging (FO-WLP) market is experiencing significant growth, driven by the increasing demand for smaller, more efficient semiconductor devices. Memory and logic semiconductors are the primary applications for FO-WLP technology. The use of FO-WLP in power management and sensor applications is also on the rise. The trend towards higher integration and miniaturization in electronics is fueling the adoption of FO-WLP. The technology offers several advantages, including reduced power consumption, improved reliability, and increased design flexibility. The future looks bright for FO-WLP, with continued innovation and advancements expected in this dynamic market.
Research report provides comprehensive data on impact of trend. For more details- Download a Sample Report
Market Challenges
The FOWLP market faces challenges due to warpage issues, which increase production costs. Warpage is a distortion in the molded part’s surface, leading to wafer deformation and wastage. Differential shrinkage, thermal expansion mismatches, and post-processing steps are common causes. These issues result in higher manufacturing and packaging costs for ICs, potentially hindering market growth.The Fan-Out Wafer Level Packaging (FO-WLP) market faces several challenges. One challenge is the complexity of the technology, which requires precise chip placement and interconnect design. Another challenge is the high cost of FO-WLP compared to traditional packaging methods. Additionally, the need for high yield and reliability in FO-WLP is crucial for mass production. Furthermore, the integration of different materials and processes in FO-WLP can be difficult, requiring advanced manufacturing techniques. Lastly, the increasing demand for smaller form factors and higher performance in electronic devices puts pressure on the FO-WLP industry to continuously innovate and improve.
For more insights on driver and challenges – Download a Sample Report
Segment Overview
This fan-out wafer level packaging market report extensively covers market segmentation by
Technology 1.1 High density1.2 Standard densityType 2.1 200 mm2.2 300 mm2.3 PanelGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa
1.1 High density- The Fan-Out Wafer Level Packaging (FO-WLP) market is experiencing significant growth due to the increasing demand for miniaturization and higher integration in semiconductor devices. FO-WLP technology enables the direct connection of dies to the substrate, reducing the number of interconnects and improving overall performance. Companies such as Samsung, Micron, and SK Hynix are leading the market with their innovative FO-WLP solutions. This technology is particularly beneficial for memory and logic applications, leading to its widespread adoption in the consumer electronics and automotive industries.
For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2018 – 2022) – Download a Sample Report
Research Analysis
The Fan-Out Wafer Level Packaging (FO-WLP) market is experiencing significant growth in various sectors, including consumer electronics and advanced electronics. FO-WLP is a semiconductor-based technology that enables footprint-sensitive devices, such as smartphones, smartwatches, and laptops, to incorporate high-performing ICs with minimal increase in size and weight. This technology utilizes advanced packaging methods, such as PoP (Package-on-Package) and memory-on-logic solutions, to enhance the functionality of consumer electronics. FO-WLP also addresses thermal issues by employing wafer-level packaging and wafer-level processes. The IC packaging technology reduces manufacturing costs and enables heterogeneous integration and panel level technology in ultra-thin portable devices. FO-WLP is revolutionizing the consumer electronics sector by enabling the production of high-performing, compact devices.
Market Research Overview
The Fan-Out Wafer Level Packaging (FO-WLP) market refers to the technology and process of integrating various semiconductor devices onto a single wafer using wafer-level packaging techniques. This packaging method offers several advantages such as reduced interconnect resistance, improved reliability, and enhanced system performance. The FO-WLP market caters to various applications including memory, logic, and sensor technologies. The technology is gaining popularity due to the increasing demand for miniaturization, higher integration density, and the need for advanced packaging solutions in the electronics industry. The market is expected to grow significantly in the coming years due to the increasing adoption of FO-WLP in advanced semiconductor applications. The process involves various techniques such as redistribution layer (RDL) formation, wafer bonding, and final packaging. The market is driven by factors such as the increasing demand for high-performance and power-efficient semiconductor devices, the miniaturization trend in the electronics industry, and the growing adoption of advanced packaging solutions.
Table of Contents:
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation
TechnologyHigh DensityStandard DensityType200 Mm300 MmPanelGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa
7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix
About Technavio
Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.
With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.
Contacts
Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/
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SOURCE Technavio
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A fleet that delivered — and a clear signal to act
The ABB ACS800 drives at Jamul — installed in 2010 — had maintained a strong reliability record across well over a decade of near-continuous operation in one of the most demanding industrial environments. Over time, however, the cumulative effects of electrical aging reached a point where trip event patterns were no longer in line with the plant’s operational requirements — a natural inflection point for a fleet that had been running full steam since installation, and a clear signal that the time had come to act.
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Expertise brought to the plant
Two decades of working knowledge of ACC’s equipment and operational calendar shaped the approach. ABB developed a service plan tailored to ACC’s shutdown windows and budget cycle. The multi-year ABB Motion OneCare agreement includes scheduled drive reconditioning, ABB Ability™ Digital Powertrain Insights, and energy appraisals. To start, ABB brought its reconditioning expertise directly to Jamul. Earlier this year, 25 ACS800 drives were restored to factory specification without interrupting production, with the original enclosures retained. Phase two is in planning: an additional 25 ACS800 modules are scheduled for on-site reconditioning in the last quarter of 2026.
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STOCKHOLM, Oct. 27, 2026 /PRNewswire/ —
Record sales, operating profit and margin
Third quarter
Net sales totaled SEK 40,771 M (38,146), with organic growth of 4% (3) and acquired net growth of 2% (5). Exchange rates affected sales by 1% (–6).Organic sales growth was strong in Americas and EMEIA, good in Global Technologies and Entrance Systems, but declined in Asia Pacific.Three acquisitions with combined annual sales of about SEK 350 M and one divestment were completed during the quarter.Operating income1 (EBITA) increased by 12% to SEK 7,612 M (6,815) with an operating margin of 18.7% (17.9).Operating income1 (EBIT) increased by 11% to SEK 7,102 M (6,416) with an operating margin of 17.4% (16.8).Net income1 amounted to SEK 4,718 M (4,144).Earnings per share1 amounted to SEK 4.24 (3.73).Operating cash flow amounted to SEK 7,405 M (6,969).
Sales and income
Third quarter
January–September
2025
2026
Δ
2025
2026
Δ
Sales, SEK M
38,146
40,771
7 %
114,102
115,781
1 %
Of which:
Organic growth
1,119
1,428
4 %
2,671
3,568
3 %
Acquisitions and divestments
1,853
935
2 %
5,417
2,623
2 %
Exchange rate effects
–2,243
262
1 %
–4,572
–4,512
–4%
Operating income (EBIT)1, SEK M
6,416
7,102
11 %
18,216
19,242
6 %
Operating margin (EBITA)1, %
17.9 %
18.7 %
17.0 %
17.8 %
Operating margin (EBIT)1, %
16.8 %
17.4 %
16.0 %
16.6 %
Income before tax1, SEK M
5,563
6,333
14 %
15,648
17,018
9 %
Net income1, SEK M
4,144
4,718
14 %
11,658
12,678
9 %
Operating cash flow, SEK M
6,969
7,405
6 %
14,845
16,847
13 %
Earnings per share1, SEK
3.73
4.24
14 %
10.49
11.41
9 %
1 Excluding items affecting comparability for the same period of the previous year. Please see the tabulated figures section in this report, page 12, for further details about the financial effects in 2025.
Comments by the President and CEO
“I am happy to report another record strong quarter for ASSA ABLOY in which our sales grew by 7%, driven by 4% organic sales growth, 2% net acquired growth and 1% from currency movements. This is the seventh consecutive quarter with organic sales growth despite the geopolitical and macroeconomic uncertainties we have seen in the last couple of years. The good organic sales growth contributed to a record-high operating margin and for the first time our operating profit exceeds SEK 7bn in a quarter!
Organic sales growth was strong in the Americas and EMEIA divisions – 6% and 5% respectively. Americas growth was driven by continued strong growth in the non-residential segment and Latin America. The North America Residential segment improved and had good sales growth. In EMEIA, the growth was driven by very strong sales growth in Central Europe, while the other regions had good or stable sales growth developments. Global Technologies grew by 4%, with strong sales growth in HID, while Global Solutions’ growth was low single-digit due to temporarily lower deliveries in the retail business unit. Entrance Systems reported good organic growth of 3%, driven by Pedestrian and Perimeter Security. Organic sales in Asia Pacific declined 1% due to weak sales in Greater China.
The operating profit (EBIT) totaled SEK 7,102 M, up 11% vs. last year. The operating margin improved by 60 bps year-on-year to 17.4% (16.8) driven by excellent operating leverage of 47% due to price realization and cost efficiencies. The operating cash flow improved by 6% year-on-year to SEK 7,405 M, resulting in an excellent cash conversion of 117%.
Our people make the difference
Our decentralized organization and commitment to innovation remain two of our key competitive advantages. However, the foundation of everything we do is our 65,000 people. Their dedication, expertise and curiosity drive our success. As more of our products and solutions become electromechanical, our technology platforms create new opportunities to realize synergies. To continue to lead this transition, we continue to invest in our people. Over the last eight years, the number of internal applications for each open position has almost tripled, demonstrating the strength of our culture and the career opportunities available within ASSA ABLOY. Developing talent remains a strategic priority. Through leadership development programs, continuous learning opportunities and increased cross-divisional collaboration, we are building the capabilities to support future growth. Our ‘Together We’ culture is founded on empowerment, innovation and integrity. This supports our ambition to be a world-leading organization, knowing that when our people succeed, our business succeeds too.
Our acquisition strategy also brings talented people into the Group, adding fresh perspectives, new ideas and entrepreneurship. We are proud that many founders of the companies we acquire choose to remain with ASSA ABLOY. During the quarter, we acquired three businesses. We also announced the signing of Gunnebo Entrance Control, which will strengthen and complement our existing offering in pedestrian access solutions.
We are proud of what we have accomplished in the first nine months and are confident in our ability to deliver another strong year. At the same time, we remain focused on the opportunities ahead. To ensure that ASSA ABLOY remains long-term competitive, we will also launch our 11th manufacturing footprint program during the fourth quarter.
Thank you for your continued trust in ASSA ABLOY.”
Nico Delvaux
President and CEO
Further information can be obtained from:
Nico Delvaux, President and CEO
phone: +46 8 506 485 82
Erik Pieder, Executive Vice President and CFO,
phone: +46 8 506 485 72
Björn Tibell, Head of Investor Relations,
phone: +46 70 275 67 68
e-mail: bjorn.tibell@assaabloy.com
ASSA ABLOY is holding a telephone and web conference at 09.00 CET on 27 October, 2026, which can be followed online at assaabloy.com/investors.
It is possible to submit questions by telephone on:
08–505 100 31, +44 203 059 5863 or +1 631 570 5613
This information is information that ASSA ABLOY AB is obliged to make public pursuant to the EU Market Abuse Regulation. The information was submitted for publication, through the agency of the contact persons set out above, at 08.00 CET on 27 October, 2026.
This information was brought to you by Cision http://news.cision.com.
https://news.cision.com/assa-abloy/r/quarterly-report-q3-2026,c4415570
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The full report (PDF)
https://news.cision.com/assa-abloy/i/assa-abloy-logo-door-,c3576156
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