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Winbond Introduces the New Automotive-qualified W77T Secure Flash Memory

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TAICHUNG, Taiwan, Dec. 11, 2024 /PRNewswire/ — Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today unveils the TrustME® W77T Secure Flash family, specifically designed for the automotive industry. This ISO26262 ASIL-D Ready, ISO21434 Certified, UNECE WP.29 and TISAX compliant Secure Flash is tailored to meet the demands of emerging automotive applications, such as software-defined vehicles (SDVs) and E/E systems, providing advanced protection for connected and autonomous vehicles.

Operating at a 200MHz Double Transfer Rate (DTR) on the industry-standard Octal/xSPI interface, the W77T delivers a read bandwidth of up to 400MB/s, making it ideal for automotive System-on-Chip (SoC) designs that require fast boot times and high-performance processing capabilities. Available in a range of densities from 64Mb to 1Gb, the W77T is offered in TFBGA (Octal SPI), SOIC (Quad SPI) and WSON (Quad SPI) packages. It also features extended Replay Protected Monotonic Counters (RPMC) with 8 counters for PC based implementation. Other advanced capabilities include JEDEC SPI CRC, JEDEC xSPI compatible interface, ECC, and is manufactured in our security certified fabrication facility to ensure a secure supply chain.

As part of Winbond’s TrustME® Secure Flash family, the W77T offers robust security features, including Post-Quantum Cryptography (PQC) capabilities for the security engine, NIST 800-193 compliant firmware resiliency, LMS-OTS (NIST-800-208) based remote attestation for secure supply chain, Common Criteria, ISO21434, FIPS 140-3 certification and ISO26262 Functional Safety requirements, ensuring vehicle safety, performance, and integrity.

Winbond’s W77T Secure Flash is backward compatible with the popular W25Q NOR Flash and W77Q Secure Flash family and comes equipped with an arsenal of features designed to ensure Automotive security:

Code and Data Protection: robust protection for both code and data, making it exceedingly difficult for hackers to tamper. Root of Trust implementation follows the TCG DICE attestation mechanism.Authentication: Winbond Secure Flash devices employ stringent authentication protocols, ensuring that only authorized actors and software layers gain access.Secure Software Updates with Rollback Protection: the devices facilitate remote secure software updates while safeguarding against rollback attacks, ensuring that only legitimate updates are executed. To maintain the highest level of security and integrity during software updates, W77T employs Leighton-Micali Signature (LMS) algorithms, as recommended by NIST Special Publication 800-208. This method guarantees the authenticity and integrity of the updating software, thereby providing an additional layer of security.Platform Resiliency: follows NIST 800-193 recommendations, unauthorized code changes are automatically detected, enabling the system to recover to a secure state and disturbing potential cyber threats.Secure Supply Chain: Secure Flash ensures the integrity and authenticity of flash content throughout the entire supply chain. The W77T implements remote attestation based on LMS-OTS (NIST 800-208). This advanced approach effectively prevents content tampering and misconfiguration during platform assembly, transportation, and configuration, safeguarding against cyber adversaries.

“We are excited to launch our most advanced Secure Flash product family- W77T Secure Flash,” says Winbond, emphasizing our commitment to providing safety and security in automotive flash components. “As E/E architectures evolve to support software-defined vehicle designs, security, and high reliability are top priorities for designers and vehicle manufacturers. The market will demand a high-performing, feature-rich, yet highly secure vehicle. The W77T is an effective solution for meeting these challenges and driving innovation in the automotive industry.”

The 256Mb, 512Mb and 1Gb samples are available now, with 64Mb, 128Mb devices available shortly. For more information on Winbond’s Secure Flash products and solutions, please visit the website https://www.winbond.com/hq/product/trustme/ 

About Winbond
Winbond Electronics Corporation is one of the few companies worldwide with proprietary products and technology in both memory and logic integrated circuits. The Company provides customer-driven solutions backed by the expert capabilities of product design, R&D, manufacturing, and promoting brand name products globally. Winbond’s product portfolio, consisting of Code Storage Flash, TrustME® Secure Flash, Customized Memory Solution (CMS), is widely used by tier 1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, China, Japan, Germany, India, Korea, Hong Kong, Singapore, and Israel. With its 12-inch fabs located in CTSP and South Taiwan Science Park (STSP)’s Kaohsiung Science Park, Winbond keeps pace to develop in-house technologies to provide high-quality integrated circuit products and services.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Spokesperson
Chih-Chung Chou
Chief Financial Officer
TEL: +886-3-567-8168/+886-987-365-682

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SOURCE Winbond Electronics Corporation

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Mastech Digital to Announce Second Quarter 2026 Financial Results; Participate in Upcoming Investor Conference

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July 24, 2026

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PITTSBURGH, July 24, 2026 /PRNewswire/ — Mastech Digital, Inc. (NYSE American: MHH) (“Mastech Digital”), a leading provider of Digital Transformation IT Services, today announced the date for the release of its financial results for the second quarter ended June 30, 2026, and its participation in an upcoming investor conference.

Second Quarter 2026 Earnings:

Mastech Digital will report its financial results for the second quarter 2026 before the market opens on Thursday, August 6, 2026. Management will host a live conference call and webcast at 9:00 a.m. Eastern Time on that day to discuss the Company’s financial performance and operating results.  The conference call will be hosted by Nirav Patel, President and CEO, and Kannan Sugantharaman, Chief Financial and Operations Officer.

Those wishing to participate via webcast should access the call through Mastech Digital’s Investor Relations website at https://investors.mastechdigital.com. Those wishing to participate via telephone may dial in at 1-800-715-9871 (USA) or 1-646-307-1963 (International) with the passcode 7506988. The replay will be available via webcast through Mastech Digital’s Investor Relations website.

Upcoming Investor Conference:

Mr. Sugantharaman will host a fireside chat at the Sidoti Micro-Cap Investor Conference on Wednesday, August 19, 2026, at 9:15 a.m. Eastern Time.

Mastech Digital management is scheduled to host virtual one-on-one and small group meetings with investors during the conference on August 19-20, 2026. Investors interested in arranging a meeting should contact their Sidoti representative or reach out to the Mastech Digital investor relations team at investors@mastechdigital.com.

About Mastech Digital, Inc.

Mastech Digital (NYSE American: MHH) is a leading provider of Digital Transformation IT Services. The Company offers Data Management, Analytics & AI Solutions, and IT Staffing Services with a digital-first approach. A minority-owned enterprise, Mastech Digital is headquartered in Pittsburgh, PA, with offices across the U.S., Canada, Europe, and India. Visit us at www.mastechdigital.com.

Investor Relations Contact:
investors@mastechdigital.com 

 

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SOURCE Mastech Digital, Inc.

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SOLAI Limited Announces Extraordinary General Meeting

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July 24, 2026

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AKRON, Ohio, July 24, 2026 /PRNewswire/ — SOLAI Limited (NYSE: SLAI) (“SOLAI” or the “Company”) (previously known as “BIT Mining Limited”), a technology-driven personal AI and digital infrastructure provider, today announced that it will hold its extraordinary general meeting of shareholders at 428 South Seiberling Street, Akron, Ohio, US on August 14, 2026 at 10:00 a.m., New York time.

Holders of record of ordinary shares and preference shares of the Company at the close of business on July 20, 2026, New York time (the “Record Date”) are entitled to receive notice of, and to attend and vote at, the extraordinary general meeting or any adjournment thereof. Holders of the Company’s American Depositary Shares (“ADSs”) who wish to exercise their voting rights for the underlying ordinary shares must act through the depositary of the Company’s ADS program, Deutsche Bank Trust Company Americas.

The notice of the extraordinary general meeting, which sets forth the resolutions to be submitted to shareholder approval at the extraordinary general meeting is available on the Investor Relations section of the Company’s website at https://ir.solai.com. 

About SOLAI Limited

SOLAI Limited (previously known as “BIT Mining Limited”) (NYSE: SLAI) (previously traded under “BTCM”) is a technology-driven personal AI and digital infrastructure provider. Building upon its historical legacy in digital asset mining and blockchain network operations, the Company is leveraging extensive experience in large-scale hardware deployment, data center operations, and high-performance computing to build the foundational infrastructure for personal AI computing and digital asset ecosystems globally.

For more information:

SOLAI Limited
ir@solai.com
ir.solai.com
www.solai.com 

Christensen Advisory
Jason Ng
Tel: +852-2117-0861
Email: solai@christensencomms.com 

 

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SOURCE SOLAI Limited

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/U P D A T E — TrendAI/

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2 hours ago

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July 24, 2026

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This release has been updated to include new information provided by TrendAI. The complete, corrected release follows, with additional details at the end:

TrendAI™ Adopts Claude Opus 5 to Advance Vulnerability Prioritization and Virtual Patching

As a participant in Anthropic’s Cyber Verification Program, TrendAI applies frontier reasoning to convert vulnerability intelligence into faster protection across hybrid environments

DALLAS, July 24, 2026 /PRNewswire/ — TrendAI™, the enterprise AI security leader from Trend Micro Incorporated (TYO: 4704; TSE: 4704), today announced it is adopting Claude Opus 5, Anthropic’s latest and most capable Opus model, to help security teams convert vulnerability intelligence into immediate protection, from prioritization to virtual patching. The move builds on TrendAI’s collaboration with Anthropic on Claude Opus 4.8, extending the same defensive focus to a model that delivers step-change gains in advanced reasoning, agentic workflows, and long-horizon analysis. As AI makes finding vulnerabilities easier than ever, the harder problem becomes protecting organizations faster than software can be permanently patched, and that is where TrendAI is putting Opus 5 to work.

As a participant in Anthropic’s Cyber Verification Program, which credentials organizations for the defensive use of frontier AI models, TrendAI is positioned to apply Claude Opus 5 to defensive security as access becomes available. The model is Zero Data Retention compatible, supporting TrendAI’s governance and data-protection requirements as it scales AI across security operations.

The work extends to TrendAI Threat Research, where frontier AI models are combined with our proprietary frontier intelligence engine and human expertise to generate pre-disclosure intelligence. Those insights power TrendAI Vision One™, delivering stronger detection, deeper forensic insights, and proactive protection through virtual patching.

Rachel Jin, Chief Platform and Business Officer, Head of TrendAI™:
“With Claude Opus 5, TrendAI can move from vulnerability intelligence to action faster than ever, prioritizing what matters most by exploitability and business impact. Finding the vulnerability was always the hard part. Now the challenge is protecting organizations faster than software can be permanently patched, and frontier reasoning is what changes that equation, extending all the way to virtual patching that protects customers before a vendor fix ships. This is what it means to secure the AI age, fearlessly.”

These capabilities support TrendAI Vision One™ in helping security analysts, AppSec teams, and SOC teams prioritize exposure, map attack paths, and accelerate mitigation, including virtual patching, across hybrid environments, moving vulnerability management from a static scanning process into a faster, context-aware risk mitigation workflow.

About TrendAI™
TrendAI™, the global AI security leader and enterprise business unit of Trend Micro, empowers organizations with full AI visibility and consolidated security that inspires confidence, drives innovation, and eliminates risk. Trusted by the largest enterprises and governments across 185 countries, TrendAI™ secures the entire organization, from identities, to infrastructure, to data. Global Fortune 500 companies rely on TrendAI™ to cut risk and stop threats up to three months earlier, powered by world-leading threat and attack intelligence. Through deep ecosystem partnerships with market leaders like NVIDIA, Anthropic, AWS, Google, and Microsoft, TrendAI™ empowers your organization to securely drive forward at the speed of AI. AI Fearlessly. Learn more: trendaisecurity.com

About Anthropic
Anthropic is an AI safety and research company dedicated to building reliable, interpretable, and steerable AI systems. Its Claude family of models, including Claude Opus 5, enables advanced capabilities across a wide range of applications, including code understanding and security analysis.

Update: The latest version of this release includes additional statements from TrendAI related to the original announcement.

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SOURCE TrendAI

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