Technology
Artificial Intelligence (AI) Chips Market: 51% Growth from North America, Report on AI Impact on Market Trends – Technavio
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2 years agoon
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NEW YORK, Dec. 12, 2024 /PRNewswire/ — Report on how AI is redefining market landscape – The global artificial intelligence (AI) chips market size is estimated to grow by USD 389.25 billion from 2024 to 2028, according to Technavio. The market is estimated to grow at a CAGR of over 68.13% during the forecast period.
For comprehensive forecast and historic data on regions,market segments, customer landscape, and companies- Click for the snapshot of this report
Report Attribute
Details
Base Year
2023
Forecast period
2024-2028
Historic Data for
2018 – 2022
Segments Covered
Product (ASICs, GPUs, CPUs, and FPGAs), End-user (Media and advertising, BFSI, IT and telecommunication, and Others), and Geography (North America, Europe, APAC, South America, and Middle East and Africa)
Key Companies Covered
Advanced Micro Devices Inc., Alphabet Inc., Baidu Inc., Broadcom Inc., Cerebras, Fujitsu Ltd., Graphcore Ltd., Huawei Technologies Co. Ltd., Intel Corp., International Business Machines Corp., MediaTek Inc., Microchip Technology Inc., NVIDIA Corp., NXP Semiconductors NV, Qualcomm Inc., SambaNova Systems Inc., Samsung Electronics Co. Ltd., SenseTime Group Inc., Taiwan Semiconductor Manufacturing Co. Ltd., and Tesla Inc, NVIDIA Corporation, Advanced Micro Devices, Inc., Intel Corporation, Micron Technology, Inc., Google, SK HYNIX INC., Qualcomm Technologies, Inc., Samsung, Huawei Technologies Co., Ltd., Apple Inc., Imagination Technologies, Graphcore, Cerebras, Mythic, Kalray, Blaize, Groq, Inc., HAILO TECHNOLOGIES LTD., GreenWaves Technologies, SiMa Technologies, Inc
Regions Covered
North America, Europe, APAC, South America, and Middle East and Africa
Region Outlook
North AmericaEuropeAsiaRest of World
1. North America – North America is estimated to contribute 51%. To the growth of the global market. The Artificial Intelligence (Ai) Chips Market report forecasts market growth by revenue at global, regional & country levels from 2017 to 2027.
The AI chip market in North America is experiencing significant growth due to increasing investments in autonomous vehicle technology. Advanced systems such as ADAS, HUD, LiDAR, and RADAR, integrated into these vehicles, generate and process vast amounts of real-time data. In response, chip manufacturers are heavily investing in research and development of AI chips tailored for autonomous vehicles. Major automotive original equipment manufacturers (OEMs) are working on commercializing autonomous vehicles, creating lucrative opportunities for AI chip manufacturers to capitalize on this emerging market.
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Segmentation Overview
Product 1.1 ASICs1.2 GPUs1.3 CPUs1.4 FPGAsEnd-user 2.1 Media and advertising2.2 BFSI2.3 IT and telecommunication2.4 OthersGeography 3.1 North America3.2 Europe3.3 APAC3.4 South America3.5 Middle East and Africa
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1.1 Fastest growing segment:
Artificial Intelligence (AI) chips, specifically Application-Specific Integrated Circuits (ASICs), are becoming increasingly popular in data center applications due to their superior performance and speed. ASICs are customized, non-configurable chips that offer an instruction set and libraries for local data processing, acting as an accelerator for parallel algorithms. Google’s Tensor Processing Unit (TPU) is a prime example, designed for deep neural networks and already in use for Google Search and Google Street View. ASICs provide faster performance than GPUs, FPGAs, and CPUs, making them a preferred choice for data centers. TPUs have an instruction set that allows TensorFlow programs to be modified and new algorithms to be developed, making them a valuable asset for managing data effectively. The use of ASIC-based AI chips is expected to witness significant growth in the forecast period.
Research Analysis
Artificial Intelligence (AI) Chips Market: The global AI Chips Market is experiencing significant growth due to the increasing adoption of AI technologies in various industries. Deep learning and machine learning algorithms are driving the demand for AI chips, which are specialized hardware components designed to accelerate AI computations. These chips are essential for robotics, quantum computing, and advanced AI applications. The market includes CPU, FPGA, GPU, System on Chip (SoC), and Multichip Module (MCM) solutions. AI chips are finding applications in sectors like healthcare, retail, finance, automotive, autonomous vehicles, IoT devices, and more. High-performance AI chips are crucial for training generative AI models and powering supercomputers. Ethical concerns surrounding AI are also fueling the development of specific integrated circuits. Key technologies include highbandwidth memory and Trainium2 chip. The market is evolving with the shift from cloud to edge computing.
Market Overview
Artificial Intelligence (AI) Chips Market: Overview The AI Chips Market is witnessing significant growth due to the increasing demand for advanced AI technologies such as deep learning and machine learning in various industries. AI chips are specialized hardware components designed to accelerate AI algorithms and technologies, including neural networks, quantum computing, and cognitive computing. These chips are essential for powering AI applications in robotics, computer vision, natural language processing, and other fields. The market for AI chips includes various types of hardware components, such as CPUs, GPUs, FPGAs, ASICs, DSPs, and microcontrollers. Companies are investing heavily in the development of AI chip lines, including Nvidia’s A100 chip, Ascend 910B chipset, and H200 chipset, to meet the growing demand for energy-efficient and high-performance AI solutions. AI applications are widespread across industries, including healthcare, retail, finance, automotive, and manufacturing. The use of AI in healthcare for health monitoring, health information access, personalized health, and treatment devices is gaining popularity, especially for the elderly population. In retail, AI is used for customer behavior analysis, inventory management, and personalized marketing. In finance, AI is used for fraud detection, risk assessment, and algorithmic trading. The automotive industry is also adopting AI technologies for autonomous vehicles, advanced driver assistance systems, and connected cars. The use of AI in manufacturing machines, smart homes, and IoT devices is increasing, leading to the growth of AI data centers and edge computing. However, ethical concerns surrounding AI and the potential for system failure or malfunctioning are major challenges for the market. The development of specific integrated chips and multichip modules is a potential solution to address these challenges. The AI Chips Market is expected to continue growing due to the increasing demand for real-time applications, low latency, and big data processing. The market is also being driven by the development of generative AI, large language models, and other advanced AI technologies. The use of AI in mobile applications, gaming consoles, and personal computers is also expected to drive market growth. In conclusion, the AI Chips Market is a rapidly growing market, driven by the increasing demand for advanced AI technologies and applications across various industries. The market is expected to continue growing due to the development of energy-efficient and high-performance AI solutions, the increasing use of AI in various industries, and the growing demand for real-time applications and low latency. However, ethical concerns and the potential for system failure or malfunctioning are major challenges that need to be addressed.
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Key Topics Covered:
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation
7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Venodr Landscape
11 Vendor Analysis
11.1 NVIDIA Corporation
11.2 Advanced Micro Devices, Inc
11.3 Intel Corporation
11.4 Micron Technology, Inc
11.5 Google, SK HYNIX INC
11.6 Qualcomm Technologies, Inc
11.7 Samsung, Huawei Technologies Co., Ltd
11.8 Apple Inc
11.9 Imagination Technologies
11.10 Graphcore
11.11 Cerebras
11.12 Mythic
11.13 Kalray
11.14 Blaize
11.15 Groq, Inc
11.16 HAILO TECHNOLOGIES LTD
11.17 GreenWaves Technologies
11.18 SiMa Technologies, Inc
12 Appendix
About Technavio
Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.
With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.
Contacts
Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/
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SOURCE Technavio
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HashKey On-Chain and RD Technologies Form Deep Partnership to Support On-Chain Testing for RDUSD
Published
40 minutes agoon
November 2, 2026By
On-Chain Ecosystem Drives Institutional Adoption of RDUSD Across Cross-Border Trade, Financing, and Corporate Payments
HONG KONG, Nov. 1, 2026 /PRNewswire/ — HashKey On-Chain, an on-chain financial infrastructure provider, announced a major strategic partnership with RD Technologies. The two parties will engage in a series of technical and ecosystem explorations centered around RDUSD. Leveraging HashKey On-Chain’s full-stack comprehensive strengths in connecting on-chain infrastructure with institutional financial service ecosystems, the collaboration will span digital asset on-chain trading, settlement, treasury management, and asset tokenization. Together, they aim to drive the expansion of the US dollar stablecoin RDUSD from digital asset trading into real-world business scenarios such as cross-border trade, corporate payments/collections, and institutional finance.
HSK Chain Plans to Support RDUSD On-Chain Testing
RDUSD is a US dollar stablecoin supported by RD Technologies and issued by Anchorage Digital Bank N.A., a US federally regulated bank. Anchorage Digital Bank N.A. is the first federally chartered digital asset bank in the US, specializing in providing secure digital asset custody and financial services for institutional clients. RDUSD is designed to comply with the regulatory framework under the US GENIUS Act. As a digital US dollar settlement instrument, it is committed to satisfying institutional clients’ needs to optimize treasury management in real-world operations while providing fiat-anchored support for asset tokenization.
As a core component of this collaboration, RDUSD will be deployed on HSK Chain. HSK Chain is an institutional-grade Ethereum Layer 2 that provides auditable, high-performance infrastructure support for the on-chain deployment, circulation, and smart contract execution of RDUSD. Currently, the HSK Chain ecosystem features over 200 projects with an on-chain RWA (Real World Asset) size exceeding US$300 million, covering asset classes such as money market funds, ETFs, and precious metals. It has also established a CeDeFi partnership with Morpho to explore institutional fund onboarding and on-chain yield opportunities. Following the deployment and launch of RDUSD, both parties will further drive its integration into HSK Chain’s existing ecosystem, exploring technical applications in native scenarios such as on-chain lending, trading, RWA subscriptions, and settlement. HSK Chain will also provide technical development support for RDUSD’s deployment and multi-platform integration.
RDUSD to Be Implemented Across HashKey On-Chain’s Diverse Scenarios
Relying on HashKey On-Chain’s three core technical application platforms, RDUSD will gradually be integrated into the following scenarios:
HashKey Trading Portal (HTP): In asset trading scenarios, RDUSD will be used for the trade settlement of various tokenized RWA products, providing stable and efficient settlement support for the on-chain circulation of real-world assets.
HashKey On-Chain Trade Finance Platform: RDUSD is expected to serve as a medium aimed at delivering 24/7, more efficient, and cost-effective on-chain clearing and settlement for cross-border import and export enterprises. Combined with the tokenization of trade assets (such as electronic bills of lading), it will support smart contract-driven Delivery vs. Payment (DvP) and act as a settlement tool for licensed financial institutions conducting disbursements and repayments for trade financing based on real trade backgrounds.
HashKey Settlement Platform (HSP): Both companies will explore further integrating RDUSD into relevant settlement protocols to provide global enterprises and cross-border payment service providers with payment, collection, and settlement services, as well as cash pooling and disbursement channel support. In addition to enhancing international corporate treasury management efficiency, this will reserve capacity for emerging scenarios such as automated AI agent payments.
These scenarios will also address the needs of RD Technologies and its partners in cross-border trade payments and treasury management, bridging corporate payments with on-chain finance to serve the real-economy operations of Asia-based cross-border institutions.
Rita Liu, CEO of RD Technologies, stated:
“The close collaboration between HashKey On-Chain and RD Technologies has always been a key focus for both parties. RDUSD brings a fresh highlight to this partnership. We look forward to combining our respective strengths in cross-border payments and digital assets to propel the technical application of RDUSD across diverse scenarios—such as on-chain trading, settlement, and treasury management—to better serve corporate demands and the real economy.”
Rachel Qiu, Head of Business Development at HashKey Group and COO of HashKey On-Chain Business Group, stated:
“The upcoming deployment of RDUSD on HSK Chain marks the first step in our collaboration. Moving forward, leveraging HashKey On-Chain’s extensive experience in on-chain business, we will partner with RD Technologies to drive the gradual integration of compliant stablecoins into real-world commercial and financial activities, providing institutional users with more comprehensive digital asset services. In areas such as cross-border trade and corporate payments, HashKey On-Chain is well-equipped to provide the requisite technology and application platforms to support efficient, compliant on-chain clearing and settlement, ultimately fostering the growth of the on-chain ecosystem.”
This strategic collaboration surrounding RDUSD represents a vital step for HashKey On-Chain as it continuously enhances its institutional-grade digital asset infrastructure. In the future, HashKey On-Chain will continue to join forces with industry partners like RD Technologies to explore the long-term value of stablecoins in cross-border payments, global treasury management, and real-world asset tokenization. By extending stablecoins deeper into the real economy and institutional finance, the partnership aims to deepen the integration between traditional finance and the on-chain economy, jointly building next-generation financial infrastructure.
About HashKey On-Chain
HashKey On-Chain is the core business group of HashKey Group dedicated to building and operating full-stack on-chain financial infrastructure. By coordinating five major business matrices—tokenized asset issuance (HIP), trading (HTP), payments (HSP), public chain (HSK Chain), and on-chain staking (HashKey Cloud)—it leverages a high-efficiency technical foundation to deliver end-to-end solutions for institutional clients, forging a solid bridge between traditional financial capital and the crypto economy.
About RD Technologies
RD Technologies is a Hong Kong-based global fintech group providing innovative digital financial services to enterprises through its licensed entities. The group is dedicated to building next-generation financial infrastructure that connects traditional finance (Web2) with Web3. As one of the first participants in the Hong Kong Monetary Authority’s (HKMA) Stablecoin Issuer Sandbox, RD Technologies consistently balances compliance with innovation. To date, the group has raised over US$90 million in total funding. Its investors include prominent industry and strategic figures such as HashKey Group, HSG (Sequoia China), ZA Global, Solana Foundation, Guotai Junan International, China Harbour, Bright Venture Capital, Hivemind Capital, Eternal Digital, Junshi Investment, and Aptos Labs.
Disclaimer
This material is provided for general information only and does not constitute an offer, solicitation, recommendation or investment advice in respect of any securities, tokenised assets, stablecoins or financial products, nor a public offering, solicitation or invitation to invest in any jurisdiction. It is intended only for professional investors meeting applicable legal and regulatory requirements (where applicable). Non-professional investors should not rely on its contents in making any investment decisions. Regulated activities that require a licence are provided only by entities within the group holding the relevant licences within the scope permitted by their licences, and are subject to applicable laws and regulations. The on-chain infrastructure, protocol frameworks, technology platforms and related collaboration arrangements described herein are technical infrastructure or technical service platforms; they are not licensed corporations of the Hong Kong Securities and Futures Commission, and their activities do not themselves constitute regulated activities under the Securities and Futures Ordinance. Any reference to a platform, product, service, business scenario or collaboration arrangement is for illustration only and should not be regarded as any commercial commitment, service assurance or future business arrangement; descriptions of application scenarios such as cross-border trade, corporate payments, treasury management, trade finance, corporate treasury management, on-chain settlement and on-chain finance reflect only potential application directions or technical exploration. Whether the relevant projects can be implemented depends on technical conditions, market demand, collaboration arrangements and regulatory requirements. The issuance, reserve management, redemption and related compliance matters of any stablecoin referred to herein (where applicable) are the responsibility of the relevant issuer and service providers; the HashKey Group and its related entities do not participate. Stablecoins, tokenised assets and digital assets all involve risks; their prices and values may fluctuate significantly, and investors may lose all or part of their principal. Past performance is not a guarantee of future performance. Before making any investment decision, investors should review the relevant product documents and risk disclosures and seek independent professional advice. This material has not been reviewed or approved by any regulatory authority. In the event of any ambiguity or inconsistency between the Chinese and English versions, the Chinese version shall prevail.
View original content:https://www.prnewswire.com/news-releases/hashkey-on-chain-and-rd-technologies-form-deep-partnership-to-support-on-chain-testing-for-rdusd-302925965.html
SOURCE HashKey Holdings Limited
Technology
Ceva Extends Wireless Connectivity IP Leadership as AI Moves to Connected Devices
Published
40 minutes agoon
November 2, 2026By
IPnest ranks Ceva #1 in wireless interface IP with approximately 68% market share, 12 times that of the next-largest vendor, as the category grows approximately 14%
HSINCHU COUNTY, Taiwan, Nov. 2, 2026 /PRNewswire/ — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that powers the Smart Edge, today announced that it retained the #1 position in wireless interface IP in IPnest’s September 2026 Design IP report. As AI expands across billions of connected devices, reliable, ultra-low-power wireless connectivity becomes essential for sharing data and context across them.
The category grew approximately 14% in 2025, and Ceva held 68% market share by IP revenue, 12 times that of the next-largest vendor. The result continues Ceva’s leadership as documented in prior IPnest reports, which showed 67% share for 2023 and 68% for 2024. Ceva estimates that its wireless connectivity IP is used in approximately 30% of the world’s Bluetooth-enabled IoT devices and 15% of Wi-Fi-enabled IoT devices shipped annually.
Through its Ceva-Waves portfolio, Ceva licenses Bluetooth, Wi-Fi, UWB, 802.15.4 and cellular IoT IP to semiconductor companies and OEMs building differentiated products. Its Bluetooth IP has more than 100 licensees, its Wi-Fi IP more than 60, and more than 30 customers have adopted both. Ceva is building on that reach by advancing Bluetooth High Data Throughput (HDT), developing Wi-Fi 8, and broadening its connectivity portfolio with PentaG-Edge, a 5G-Advanced modem IP subsystem for edge devices. These investments help customers bring intelligent, connected products to market across consumer electronics, automotive, industrial, PC and IoT applications, where devices increasingly need to exchange data with one another, networks and the cloud.
Wireless IP is an essential pillar of Ceva’s Connect, Sense, and Infer strategy. Combined with Ceva’s sensing IP and NeuPro NPUs, it gives chipmakers system-level IP for Physical AI, where the right AI model runs in the right place at the right time. Local inference handles latency- and power-sensitive work, while connectivity links each device to its peers and the cloud.
“AI is becoming an experience that follows people from one device to the next,” said Ziv Hammer, Executive Vice President, Connectivity & Sensing Division at Ceva. “Each of those devices needs to exchange data and context, perceive its surroundings, and interpret what it perceives locally. Our sustained leadership position in wireless IP reflects the trust customers place in Ceva, and our multi-standard portfolio gives companies throughout the industry the connectivity they need to build the next generation of intelligent products.”
Ceva will share its wireless connectivity and Physical AI roadmap at its technology symposium events in Hsinchu, Taiwan, on November 2 and in Shanghai, China, on November 5. For more information on Ceva-Waves wireless connectivity IP, visit https://www.ceva-ip.com/product/ceva-waves-links/.
Market share and vendor comparison are based on wireless interface IP revenue estimates in IPnest’s September 2026 Design IP report.
About Ceva
Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.
With more than 22 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today’s most advanced smart edge products – from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra‑low‑power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva’s IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.
Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.
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SOURCE Ceva, Inc.
Technology
Ceva and Mobilint Advance Physical AI with REGULUS Edge AI SoC
Published
40 minutes agoon
November 2, 2026By
First production deployment of Ceva’s NeuPro NPU family combines NeuPro-Nano with SensPro AI DSP to deliver advanced sensing and inference capabilities for Physical AI devices
ROCKVILLE, Md. and SEOUL, South Korea, Nov. 2, 2026 /PRNewswire/ — As AI becomes embedded across the physical world, workloads are increasingly being processed where they can run most effectively and efficiently, from the cloud to the device itself. For Physical AI systems that must sense, interpret and respond to their surroundings in real time, this is driving greater intelligence directly into power-constrained edge devices. Ceva, Inc. (NASDAQ: CEVA), the leader in silicon and software IP for the Smart Edge, today announced that Mobilint, a leading AI semiconductor company, has deployed Ceva’s SensPro™ AI DSP and NeuPro-Nano™ NPU in its REGULUS edge AI System-on-Chip (SoC), marking the first production deployment of Ceva’s NeuPro NPU family.
Designed as a standalone processor for on-device AI, REGULUS integrates Ceva’s SensPro AI DSP and NeuPro-Nano NPN32 NPU within Mobilint’s highly integrated processing architecture. Delivering 10 TOPS of AI performance at under 3W and supporting up to 8GB of memory, REGULUS is designed for real-time AI across power- and space-constrained applications including robotics, drones, machine vision, smart cameras and IoT devices.
The multi-engine architecture enables different sensing and AI workloads to run on the processing engine best suited to the task. SensPro provides programmable processing for sensing and signal-processing workloads, while NeuPro-Nano provides highly efficient neural processing for always-on inference use cases. Together, these technologies complement Mobilint’s proprietary AI processing architecture, adding flexible sensing and inference capabilities to address the diverse and evolving requirements of Physical AI devices.
“REGULUS brings together the specialized processing capabilities needed to run sophisticated AI workloads directly on the device within very tight power constraints,” said Dongjoo Shin, CEO of Mobilint. “Ceva’s SensPro and NeuPro-Nano add flexible sensing, signal processing and inference capabilities to REGULUS, helping us address the diverse workloads our customers need to build the next generation of intelligent edge devices.”
REGULUS is already enabling commercial products, including Mobilint’s MLD-R1 AI USB accelerator, first previewed at COMPUTEX 2026 and now shipping. Designed to add on-device AI to existing systems, MLD-R1 supports computer vision, video analytics and generative AI workloads for applications including smart factories, robotics, machine vision, security, medical devices and digital signage, with support for widely used AI frameworks and ecosystems including PyTorch, ONNX, Hugging Face, TensorFlow, TFLite and Keras.
“REGULUS marks an important milestone for Ceva as the first production deployment of our NeuPro NPU family, demonstrating the progress we are making in bringing our AI technology into commercial silicon,” said Yaron Galitzky, Executive Vice President and General Manager, AI Division at Ceva. “Together, NeuPro-Nano and SensPro provide efficient, flexible sensing and inference processing that helps address the diverse workloads Physical AI devices need to perform locally and in real time.”
Product information for REGULUS and MLD-R1 is available at https://www.mobilint.com/regulus. For more on Ceva’s Edge AI portfolio, visit https://www.ceva-ip.com/solutions/edge-ai/
About Mobilint
Founded in 2019 and headquartered in Seoul, Korea, Mobilint is a fabless AI semiconductor company specializing in high-performance, energy-efficient NPUs and AI SoCs for edge and on-device AI applications. The company owns proprietary NPU IP and AI SoC design technologies, with proven deployments across smart city, healthcare, autonomous driving, security, industrial AI, and mobile AI device applications. Learn more: www.mobilint.com.
About Ceva, Inc.
Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.
With more than 22 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today’s most advanced smart edge products – from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra‑low‑power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva’s IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.
Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.
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SOURCE Ceva, Inc.
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