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Telit Cinterion ME310M1-W1 IoT Module Unlocks Global Deployment Opportunities for Next-Generation Cellular LPWA Solutions

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Featuring Sony’s Altair ALT1350 chipset, the Telit Cinterion ME310M1-W1 is certified by two major U.S. MNOs, opening new possibilities for LTE-M IoT deploymentsFlexible embedded connectivity options, such as Telit Cinterion NExTTM global connectivity and eSIM provisioning, simplify device deployment and subscription management throughout the entire project lifecycle

IRVINE, Calif., Jan. 6, 2025 /PRNewswire/ — Telit Cinterion, an end-to-end IoT solutions enabler, receives approval for the ME310M1-W1 module by two major U.S. MNOs. The certifications enable IoT specialists and their customers to begin using the ME310M1-W1 immediately — not only in the United States but also worldwide — thanks to its comprehensive global band support. For more information about the ME310M1 series, visit https://www.telit.com/devices/me310m1-series/.

With support of multiple technologies, including licensed and unlicensed spectrum, as well as future satellite connectivity in a single package, the ALT1350 enables faster development, lower power, smaller size and new use cases. A variety of capabilities make the ME310M1 ideal for smart utility meters, asset tracking, industrial sensors, precision agriculture and other IoT applications whose decade-plus service life exceeds what traditional designs can provide:

Best-in-class power consumption. This extends the service life of battery powered IoT devices enabling smaller devices with longer battery expectations and eliminates the expense of periodically replacing batteries.

Flexible embedded connectivity options. Available with an embedded SIM (eSIM) in the module package and hardware-ready integrated SIM (iSIM) it allows for streamlined manufacturing, fast product deployments, as well as enterprise-grade security based on integrated Secure Element (iSE). Telit Cinterion’s NExT global connectivity plan and remote SIM provisioning services allow for connectivity enablement and subscription management over the full project lifecycle.

Short range radio support to enable easy integration with mesh networks and seamless operation across multiple air interface technologies. This flexibility provides added deployment options, both at the time of installation and in the future.

Support for multiple location technologies, including Wi-Fi scan and GNSS. This maximizes flexibility when choosing technologies for indoor and outdoor positioning applications such as tracking high-value medical equipment around a hospital campus.

Roadmap for compliance with 3GPP Release 15/ 16/ 17 features such as IoT data communication over non-terrestrial networks (NTN). This provides users with future-proof flexibility to fallback to satellite technology when cellular coverage is not available.

Value added services and application hosting capabilities. This lowers total cost of ownership (TCO) and eases design and operation over the lifecycle.

“The certification of the ME310M1-W1 module by two major US mobile network operators marks a significant advancement in the IoT landscape,” said Dima Feldman, VP Product & Marketing at Sony Semiconductor Israel. “Our partnership with Telit Cinterion leverages the groundbreaking ALT1350 chipset to deliver a low-power, highly integrated solution that enables a new era of connected devices. With support for multiple technologies, the ME310M1-W1 empowers developers and enterprises to create innovative IoT applications that are efficient, versatile, and future-ready.”

“The global approval of the ME310M1-W1 module reinforces Telit Cinterion’s leading position in delivering advanced IoT technologies that meet our customers’ long-term needs,” said Marco Stracuzzi, VP of Product Management, Cellular IoT at Telit Cinterion. “With its ultra-efficient operation and flexible connectivity options, the ME310M1 supports a diverse range of global IoT applications, giving our customers confidence that their LPWA IoT solutions will seamlessly adapt to emerging connectivity standards, including 3GPP Release 17 NTN protocol and sub-1 GHz licensed and unlicensed spectrum.”

To learn more about the ME310M1-WI module, visit the Telit Cinterion booth (North Hall #10363) at CES, January 7-10, in Las Vegas.

About Telit Cinterion
Telit Cinterion is a global end-to-end IoT enabler providing complete solutions that reduce time to market and costs, delivering custom designed, ready for market connected devices in addition to maintaining the industry’s broadest portfolio of enterprise-grade wireless communication and positioning modules, cellular MVNO connectivity plans and management services, edge-cloud software and data orchestration, and IoT and industrial IoT platforms. As the largest western provider pioneering IoT innovation, Telit Cinterion delivers award-winning and highly secure IoT solutions, modules and services for the industry’s top brands.

For more information, follow us on YouTube, X, LinkedInFacebook, visit Telit.com or subscribe to receive our marketing communications.

Copyright © 2025 Telit IoT Solutions Holding Ltd. and/or its affiliated companies. All rights reserved. Telit Cinterion, Telit, OneEdge, Cinterion, and all associated logos are trademarks and/or registered trademarks of Telit Communications S.p.A, Telit Communications LTD, Telit IoT Solutions Holding Ltd. and/or their affiliated companies in the United States and/or other countries. Other names used herein may be trademarks of their respective owners.

Media Contacts

Leslie Hart
Telit Cinterion
+1 919-415-1510
Leslie.Hart@Telit.com

Casey Bush
GRC for Telit Cinterion
+1 949-608-0276
telit@globalresultspr.com

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SOURCE Telit Cinterion

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Jtibot Showcases Autonomous Outdoor Sweeping Innovation at Interclean Amsterdam 2026, Accelerating European Market Expansion

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AMSTERDAM, April 24, 2026 /PRNewswire/ — Jtibot, a developer of autonomous outdoor cleaning solutions, concluded a successful showcase at Interclean Amsterdam 2026, highlighting its focus on large-scale, AI-driven sweeping for industrial, municipal, and campus environments.

At Hall 8, Booth 538, Jtibot presented its autonomous outdoor sweeper designed for environments exceeding 10,000 sqm. Positioned between traditional equipment and emerging robotics, the system addresses the growing demand for more efficient and less labor-dependent outdoor cleaning operations.

During the exhibition, Jtibot attracted strong interest from European distributors and facility management professionals seeking scalable solutions for large-area maintenance. The company was also featured in an official media interview at the event, reflecting increasing attention toward autonomous technologies in the cleaning industry.

Jtibot’s approach centers on human-machine collaboration. By reducing repetitive manual work while maintaining operational flexibility, its systems support more sustainable and efficient facility management practices. This aligns with broader ESG (Environmental, Social, and Governance) priorities, including improved resource efficiency and enhanced working conditions.

Building on its presence at Interclean, Jtibot is currently advancing discussions with multiple European partners for regional distribution and deployment. The company is also in the final stage of a fleet procurement agreement valued at approximately $1.4 million, signaling early commercial traction in large-scale applications scenarios.

“As outdoor environments continue to grow in scale and complexity, automation is becoming essential,” said Steven, VP at Jtibot. “Our goal is not to replace people, but to empower them—making operations more efficient and labor more sustainable.”

Following Interclean Amsterdam 2026, Jtibot is actively expanding its European partner network and preparing for broader market deployment across key regions, as it accelerates its global commercialization strategy.

About Jtibot
Jtibot specializes in autonomous outdoor sweepers designed for large-scale environments. By combining AI-driven navigation with industrial-grade hardware, the company enables efficient, scalable, and sustainable cleaning operations worldwide.

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2U Refinances and Raises Growth Capital

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ARLINGTON, Va., April 24, 2026 /PRNewswire/ — Many education technology companies spent 2024 and 2025 scaling back. New university partnerships slowed as institutions built internal capacity. Against that backdrop, 2U completed a growth recapitalization, with its existing owners putting growth capital into the business alongside a refinancing of its current credit facilities.

The question worth asking is: why now, and what did they see?

2U operates edX, a global online learning platform originally co-founded by Harvard and MIT that now reaches more than 100 million people through over 5,300 programs with 250-plus institutional and enterprise partners. Employees from more than 60% of Fortune 500 companies use edX for professional development. To date, over 76,000 people have graduated from 2U-powered degree programs from leading institutions, including UC Berkeley, Howard University, and Georgetown. The company has been privately held since completing a financial reorganization in 2024, and Kees Bol has served as CEO since January 2025.

Lincoln International, which advised 2U on the transaction exclusively, described the refinancing outcome: extended credit maturities, improved capital structure, and financial flexibility to continue executing on 2U’s long-range plan. Managing Director Alex Stevenson said the deal “reflects the confidence of 2U’s owners in the long-term value of the business.”

Confidence in what, exactly? The AI workforce training market. Skills in AI-affected roles are evolving 66% faster than average according to PwC research, and IDC has estimated that unfilled AI skills gaps could cost the global economy $5.5 trillion. Universities and enterprises are both trying to solve that problem, and both are looking for platforms with the breadth and accreditation backing to do it credibly.

2U’s partnerships are designed for exactly that. IBM’s six technical microcredentials on edX train the engineers and data scientists who build AI systems. Microsoft’s CxO Edge program, launched in late 2025, targets the C-suite executives who need to move from AI pilots to enterprise-wide adoption, part of a Microsoft presence on edX that has drawn over 40,000 learners in the past six months alone.. Oxford’s Faculty of Law program addresses governance: what board members and legal advisors need to understand about AI liability, compliance, and fiduciary responsibility. UC Berkeley’s Master of Information and Data Science (MIDS) online program prepares learners to shape the future of AI and data science with human-centered values and focuses on solving the world’s most pressing data challenges. Each program exists because a specific employer community identified a specific gap.

That’s the differentiation investors are backing. Generic online courses are abundant. Programs designed in partnership with IBM, Microsoft, UC Berkeley, and Oxford’s Faculty of Law and delivered on a platform with proven Fortune 500 adoption are not.

Credentials earned on 2U’s edX platform carry the academic standing of the issuing partner institutions. Its programs span executive education, professional certificates, microcredentials, and accredited online degree programs, all powered by 2U’s infrastructure but conferred by partner universities and institutions with their own accreditation.

HolonIQ data puts the broader trend in context: microcredentials grew from 7% of global online program offerings in 2022 to 19% by 2025. The shift toward stackable, job-aligned credentials, in addition to traditional degrees,  is real and accelerating. The global online education market is projected to exceed $200 billion as that trend matures. 2U’s decision to build depth in short-form, employer-designed AI training aligns directly with where learner demand is heading.

None of this is abstract for the organizations that use edX at scale. When a company needs to certify 500 engineers on AI development, or prepare its entire C-suite for a board presentation on AI governance, the platform’s reach and credential quality both matter. A certification backed by IBM and a degree from institutions such as Berkeley carries weight with hiring managers in a way a generic online course does not.

The refinancing extends 2U’s ability to keep building that catalog and the partnerships behind it. Stevenson framed it as giving the management team “the financial foundation to keep executing on its mission.” The mission, under Bol’s leadership, is straightforward: help universities and enterprises close the AI skills gap by meeting learners where they are, at the pace the market demands.

The investors who contributed growth capital made a bet that a platform that reaches 100 million people and has 250-plus partners, including IBM, Microsoft, UC Berkeley, and Oxford in its program portfolio, is better positioned to close that gap than any platform that would need to build from scratch.

Media Contact:
Kees Bol
social@2u.com 

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Autonomous Resource Corporation and Oak Ridge National Laboratory Partner to Accelerate AI-Enabled Defense Manufacturing at National Scale

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Strategic partnership combines ORNL’s supercomputing and advanced manufacturing expertise with ARC’s autonomous production platform to address critical defense industrial base shortfalls

OAK RIDGE, Tenn. and NEW YORK, April 24, 2026 /PRNewswire/ — Autonomous Resource Corporation (ARC), a Delaware corporation, and Oak Ridge National Laboratory (ORNL), the U.S. Department of Energy’s largest multi-program science and energy laboratory, today announced a Memorandum of Understanding (MOU) establishing a strategic public-private partnership to accelerate the on-demand manufacture of qualified, mission-critical components for U.S. national security applications.

The partnership combines ORNL’s HPC and manufacturing capability with ARC’s ARCNet distributed AI-manufacturing platform

The partnership — known as the Exascale Foundry — will combine ORNL’s computing and manufacturing capabilities with ARC’s ARCNet distributed manufacturing platform to create a closed-loop system for AI-enabled materials and manufacturing qualification and autonomous production at defense-relevant scale.

“The United States faces an urgent need to rebuild its manufacturing capacity for critical defense components,” said Bryan Wisk, CEO of ARC. “By combining ORNL’s world-leading computational, materials science, and manufacturing capabilities with our autonomous production infrastructure, we can compress manufacturing and qualification timelines from years to months and deliver manufactured parts at the volumes the warfighter needs.”

Partnership Highlights

Under the MOU, ARC will deploy advanced manufacturing equipment organized into seven production nodes connected to ORNL via ARC’s secure ARCNet infrastructure. ARC will expand capability through ORNL’s high-performance computing (HPC) resources.

ORNL will provide access to HPC expertise for simulation-driven materials characterization and qualification, along with technologies developed at the Manufacturing Demonstration Facility (MDF), the Department of Energy’s only large-scale, open-access advanced manufacturing facility. ORNL’s Peregrine AI software, which has analyzed over 1.9 million additive manufacturing layers, will be integrated into ARC’s production nodes for real-time adaptive control and quality assurance.

This partnership also supports DOE’s Genesis Mission, a national initiative to build the world’s most powerful scientific platform to accelerate discovery science, strengthen national security and drive energy innovation. ARC and ORNL’s collective capabilities will help reenvision advanced manufacturing and industrial productivity, accelerate defense production and qualification, and secure critical supply chain elements.

“ORNL’s advanced manufacturing and computing capabilities are uniquely positioned to help accelerate the transition of laboratory-proven technologies into production-scale defense manufacturing,” said Moe Khaleel, ORNL associate laboratory director for National Security Sciences. “Partnering with ARC ensures we are transitioning our research into real production outcomes.”

The initial implementation will focus on high-temperature nickel superalloy turbine components for autonomous air vehicle engines using metal binder jetting technology, directly addressing demonstrated production bottlenecks in the U.S. defense supply chain.

ORNL Chief Manufacturing Officer Craig Blue added, “This partnership exemplifies the type of relationship necessary to build and grow domestic supply chains for our national security.”

About Autonomous Resource Corporation

ARC is a New York–headquartered corporation building and operating an AI-enabled, autonomous manufacturing platform for national security and critical infrastructure applications. ARC’s Autonomous Resource Controller Network (ARCNet) connects distributed production cells into a secure, federated manufacturing grid capable of producing qualified components at scale. ARC’s leadership team brings deep experience across defense technology, capital markets, materials science, and additive manufacturing at production scale.

About Oak Ridge National Laboratory

Oak Ridge National Laboratory is the largest U.S. Department of Energy science and energy laboratory, conducting basic and applied research to deliver transformative solutions to compelling problems in energy and security. DOE’s Manufacturing Demonstration Facility at ORNL partners with more than 300 companies, spurring over $5.5 billion in economic growth. ORNL is managed by UT-Battelle, LLC for the U.S. Department of Energy’s Office of Science.

Media Contacts:

ARC: Bryan Wisk, Chief Executive Officer | bryan@autonomousresource.com | 929-523-3953

ORNL: Eric Swanson, National Security Sciences Communications Lead | swansonej@ornl.gov | 865-206-5794

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SOURCE Autonomous Resource Corporation

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