Connect with us

Technology

Realtek Launched Worldwide First USB-IF Fully Certified (TID: 11930) Multi-Port USB4 Hub Controller (RTS5490), Integrating USB Type‑C/PD Functionality

Published

on

HSINCHU, Feb. 24, 2025 /PRNewswire/ — Realtek Semiconductor Corp. (Taiwan Stock Exchange: 2379.TW), one of the world’s leading network and multimedia IC providers, launched the world’s first multi-port USB4 hub controller (RTS5490), integrating USB Type-C/PD functionality and passing USB-IF full certification (TID: 11930).

Realtek’s RTS5490 boasts a revolutionary speed upgrade, increasing the bandwidth from USB 3.2’s 20Gbps to USB4’s 40Gbps. It integrates protocols such as USB 3.2, USB-C, USB PD, PCIe, and DisplayPort while remaining backward compatible with existing USB 3.2 and USB 2.0 devices. With the RTS5490 USB4 hub controller, users can effortlessly expand their computer’s ports with just a USB-C cable, offering ultra-fast data transfer, multi-display capabilities, and 240W rapid charging.

Realtek’s RTS5490 highly integrated USB4 solution provides customers with unmatched design flexibility and compatibility with existing Thunderbolt 3 devices and includes:

One upstream USB4 port, two downstream USB4 portsTwo USB 3.2 Gen 2×2 downstream portsDisplayPort 2.1 with one input port and one output port

Benefiting from the downstream port’s support for USB4, the RTS5490 enables emerging applications such as AI acceleration using USB4/Thunderbolt external graphics cards and high-speed data sharing between computers using inter-domain transfer technology. This highly integrated SoC solution features a high-performance 32-bit processor, a USB 2.0/3.2 hub, a DisplayPort controller, a PCIe switch, and a USB 3.2 host controller. The RTS5490 is currently one of the most competitive USB4 hub controller solutions on the market.

“Our RTS5490 is the only fully USB-IF Certified USB4 hub product on the market to integrate USB Type-C and USB PD 3.2 controllers. This significantly simplifies the complexity of design in products like PCs, docks, and displays, greatly shortening the product development cycle,” said Yee-Wei Huang, Realtek’s Vice President and Spokesman. “We will continue to innovate and drive continuous progress and development of data transfer technologies.”

About Realtek
Realtek Semiconductor Corporation is a world-leading IC provider that designs and develops a wide range of IC products for connected media, communications networks, computer peripherals, multimedia, and smart interconnect applications. Products include 10/100/1000M/2.5G/5G/10G Ethernet Controllers/PHYs, 10/100/1000M/2.5G/10G/25G/100G Ethernet Switch Controllers/Media Converter Controllers/Gateway Controllers, Wireless LAN Controllers & AP/Router SoCs, xDSL, VoIP Solutions, Bluetooth, xPON, IoT Solutions, Automotive Ethernet Solutions, High Fidelity Audio Solutions for Consumer and PC Applications, Card Reader Controllers, USB 3.2/USB4 Hub Controllers, Type-C PD/Redriver Controllers, PC Embedded Controllers, Fingerprint Recognition with Hardware Encryption Controllers, Web/IP Camera Controllers, LCD Monitor Controllers, Display Hub/Retimers/Translators, Smart TV SoCs, and Digital Home Center Controllers. With advanced design expertise in RF, analog, and mixed-signal circuits, and with superb system knowledge, Realtek offers full-featured, high-performance, low-power, and competitive total solutions. More information on Realtek can be found on the website: www.realtek.com.

Editorial Contact
press-room@realtek.com 

Realtek is a trademark of Realtek Semiconductor Corporation. Other trademarks or registered trademarks mentioned in this release are the intellectual property of their respective owners.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/realtek-launched-worldwide-first-usb-if-fully-certified-tid-11930-multi-port-usb4-hub-controller-rts5490-integrating-usb-typecpd-functionality-302383124.html

SOURCE Realtek Semiconductor Corporation

Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Technology

Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

Published

on

By

SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

Continue Reading

Technology

Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

Published

on

By

SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

Continue Reading

Technology

Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

Published

on

By

New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

Continue Reading

Trending