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MediaTek Introduces M90 5G-Advanced Modem with AI and 12Gbps Peak Speed

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New modem provides industry-leading throughput, power efficiency, and connectivity capabilities to next-generation devices

BARCELONA, Spain, Feb. 25, 2025 /PRNewswire/ — At Mobile World Congress 2025, MediaTek is introducing the M90 5G-Advanced cellular modem solution, which aligns with 3GPP Release 17 and the forthcoming Release 18 specifications. The MediaTek M90 delivers exceptional downlink performance of up to 12Gbps and boosts uplink performance by up to 20% with 3GPP Release 17 2T-2T Uplink TX switching. This new modem supports both sub-6GHz (FR1 with up to 6CC-CA) and mmWave (FR2 with up to 10CC-CA) connectivity and offers dual 5G SIM dual-active support with dual data capabilities.

Built into the MediaTek M90 modem, the new MediaTek Modem AI (MMAI) technology introduces AI models designed to enhance power efficiency and device performance. These models include features such as identifying data traffic patterns to optimize power consumption and latency, as well as detecting device orientation and usage scenarios to maximize connectivity experience. As part of MMAI, MediaTek’s Smart Antenna technology leverages AI to train high-performance models using aggregate massive antenna impedance and signal data. This enables precise key operating environment identification with 99.5% accuracy and boosts data throughput by up to 24% with an optimized user connectivity and mobility experience.

“The advanced AI and 5G features in our M90 modem make it possible for OEMs to offer differentiated performance with more design flexibility, as well as a highly integrated and optimized total solution for the best possible user experience across devices,” said Mingxi Fan, Senior General Manager of Wireless Technology Group at MediaTek. “MediaTek has pushed the limits in 5G-Advanced connectivity, and we are already behind the scenes developing technologies enabling next generation networks evolving towards 6G.”

The M90 modem also integrates satellite (NTN) connectivity, featuring 3GPP IoT-NTN for low data rate applications and NR-NTN technology for high data rate services. This capability underscores MediaTek’s commitment to providing comprehensive connectivity solutions that extend beyond terrestrial networks.

Additionally, the M90 utilizes MediaTek UltraSave technology, which reduces average power consumption by up to 18% compared to the previous generation modem. This extends battery life and optimizes overall device performance.

MediaTek continues to actively develop its global ecosystem of cellular partners in all fields of the industry, including the 3GPP standards body, device makers, infrastructure vendors, operators, front-end and test equipment suppliers. The MediaTek M90’s global capabilities not only push the envelope of what cellular connectivity can achieve; devices can also seamlessly integrate into global cellular systems, bringing users faster, more reliable next-generation 5G experiences.

Examples of key MediaTek M90 achievements include:

Attained simultaneous 5G NRDC FR1+FR2 connectivity at 11.6Gbps download speed, in partnership with Keysight.Conducted 5G FR1 SA 6CC carrier aggregation trials, achieving 5.5Gbps peak download speeds over virtualized RAN with Verizon Wireless and Samsung.Achieved simultaneous 5G NRDC FR1+FR2 connectivity with near 10Gbps download speed in a live network, in collaboration with Telstra and Ericsson.

MediaTek M90 has been tested against industry standards and engineering samples are expected to be available in the second half of 2025. To learn more about MediaTek’s 5G modem portfolio at MWC 2025, please visit the MediaTek booth #3D10, or visit: https://www.mediatek.com/technology/5g/5g-modem 

About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

Contact Information: 

Kevin Keating
pr@mediatek.com

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NovoLINC Demonstrates 400 W/cm² Cooling on Warped Silicon with MaxLINC™

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MaxLINC™ sustains 400 W/cm² heat flux and 3,300 W total power on production-representative silicon with ~150 µm warpage, demonstrating a path to overcoming a critical thermal barrier for next-generation AI accelerators.

PITTSBURGH, Oct. 6, 2026 /PRNewswire/ — NovoLINC, a provider of advanced thermal solutions for AI computing, today announced a significant high-power demonstration of its MaxLINC™ thermal interface material, achieving 400 W/cm² uniform heat flux and 3,300 W total power on a production-representative silicon test die with approximately 150 µm of warpage.

The demonstration was conducted using a specialized single-phase direct liquid cooling cold plate from CoolIT, an Ecolab Company. Throughout the test, the complete thermal stack maintained the silicon junction temperature below 90°C, demonstrating MaxLINC’s ability to provide highly effective heat transfer even when significant die warpage creates challenging mechanical and thermal interface conditions.

As AI processors move toward higher power and larger package sizes, silicon and package warpage are becoming increasingly important thermal design challenges. Even small variations in flatness can create uneven contact at the interface between the semiconductor and cooling system, increasing thermal resistance and potentially creating localized hot spots.

MaxLINC is engineered to address this challenge through NovoLINC’s proprietary nanostructured composite architecture, combining ultra-low thermal resistance with mechanical compliance. The technology is designed to maintain effective thermal contact across non-flat surfaces, enabling efficient heat transfer from high-power semiconductor devices into advanced cooling systems.

“NovoLINC is actively working with companies across single-phase direct liquid cooling, two-phase direct liquid cooling, and immersion cooling,” said Dr. Sheng Shen, CTO of NovoLINC. “These results demonstrate a clear thermal roadmap: combining NovoLINC’s advanced thermal interface technology with today’s and future liquid cooling systems can provide a pathway to enabling advancement of higher-power chips and AI server architectures.”

“Data center operators are making long-term infrastructure decisions today, and they need confidence that the cooling they deploy will keep up with future silicon,” said Ben Sutton, Product Marketing Manager at CoolIT™. “Pairing CoolIT’s advanced cold plate technology with NovoLINC’s MaxLINC shows that single-phase DLC can handle high-heat-flux processors well into the next decade, without the cost and complexity of switching cooling architectures.”

The demonstration reached 3,300 W of total device power, highlighting the ability of MaxLINC to address the rapidly increasing thermal demands of next-generation GPUs, CPUs, ASICs, and other AI accelerators.

“AI compute is advancing toward multi-kilowatt processors, but extracting that heat efficiently from increasingly large and mechanically complex packages is becoming one of the industry’s most difficult challenges,” said Dr. Ning Li, CEO of NovoLINC. “Our goal with MaxLINC is to remove the thermal interface as a limiting factor, and to give chip designers, system designers, and cooling partners greater freedom to push compute performance and power density to the next level.”

The 400 W/cm² demonstration builds on NovoLINC’s development of MaxLINC for high-performance semiconductor thermal interfaces. The platform is designed for use across the thermal pathway, from direct chip-to-cooling interfaces and chip-to-package heat spreaders to interfaces between packaged devices and cold plates or other advanced cooling hardware.

MaxLINC samples are available for customer evaluation and qualification.

About NovoLINC

NovoLINC is a Pittsburgh-based advanced materials company developing next-generation thermal interface solutions for AI computing and other energy-dense electronic systems. Spun out of Carnegie Mellon University, NovoLINC has developed a proprietary nanostructured materials platform and a scalable manufacturing process designed to overcome thermal bottlenecks in high-performance computing, data centers, automotive electronics, aerospace systems, and power electronics.

NovoLINC works with leading companies across the semiconductor, hyperscaler, AI server OEM/ODM, and cooling systems industries to enable higher computing performance while improving the energy efficiency and sustainability of next-generation computing infrastructure. The company’s technology development has been supported by the U.S. National Science Foundation and the U.S. Department of Energy’s ARPA-E COOLERCHIPS program.

www.novolinc.com

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SOURCE NovoLINC, Inc.

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GEP NAMED AS A LEADER IN SUPPLY CHAIN PLATFORMS EVALUATION, RECEIVES HIGHEST SCORE POSSIBLE IN INNOVATION CRITERION

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GEP recognized for its investments in AI-native architecture, agentic AI, and autonomous decision-making supplier networksRecognition follows recent leadership positions from Gartner, IDC and The Hackett Group across procurement, direct spend and supply chain technology

CLARK, N.J., Oct. 7, 2026 /PRNewswire/ — GEP®, a leading provider of AI-powered procurement and supply chain platforms and services to Fortune 500 and Global 2000 enterprises worldwide, today announced that it has been named a Leader in The Forrester Wave™: Supply Chain Platforms, Q3 2026, a recognition that GEP believes places it among the leading providers in the broader enterprise supply chain technologies.

Forrester evaluated 13 of the most significant supply chain platform providers and named GEP a Leader. GEP also received the highest possible score of 5 out of 5 in the Innovation criterion.

Forrester specifically cited GEP’s investments in agentic AI, knowledge graphs, autonomous decision-making and AI-native architecture. It also recognized GEP’s superior network participant authentication, and demand signal and forecast collaboration.

 “We have invested in building an AI-native platform because the real value of AI comes only when it is embedded across the work, the data and the decisions to identify new value, reduce risk, and drive competitive compete,” said Subhash Makhija, CEO and co-founder, GEP. “GEP Quantum Intelligence provides our customers a fundamentally different advantage: one intelligent platform connecting sourcing, suppliers, risk, demand and execution, rather than adding a thin layer AI on top of fragmented systems.”

Forrester said GEP is best suited to large enterprises seeking a unified procurement and supply chain platform with strong agentic AI, network collaboration, autonomous decision-making and multienterprise orchestration capabilities. Customers interviewed by Forrester also praised GEP’s service and transparency and expressed positive repurchase intent.

GEP believes this recognition extends its leadership from procurement and direct materials into the broader supply chain platform market. It also follows a series of major independent analyst assessments placing GEP at the forefront of enterprise procurement and supply chain technology:

Gartner® named GEP a Leader in the 2026 Magic Quadrant™ for Source-to-Pay Suites.

The Hackett Group named GEP a Leader in its Fall 2026 SolutionMap, with GEP the only provider at the top of the “Sophisticated & Holistic” category across all 15 evaluated areas.

IDC MarketScape named GEP a Leader in its 2026 assessment of AI-enabled direct spend.

Together, for GEP, the assessments recognize a common set of strengths: Its comprehensive source-to-pay capabilities, unified platform and data, AI and agentic innovation, and deep procurement expertise.

GEP Quantum Intelligence™ brings procurement and supply chain capabilities together on an AI-native platform, connecting sourcing, supplier intelligence, multi-tier visibility and risk management with demand signals, supply collaboration and execution.

Forrester does not endorse any company, product, brand, or service included in its research publications and does not advise any person to select the products or services of any company or brand based on the ratings included in such publications. Information is based on the best available resources. Opinions reflect judgment at the time and are subject to change. This report is part of a broader collection of Forrester resources, including interactive models, frameworks, tools, data, and access to analyst guidance. For more information, read about Forrester’s objectivity here .

About GEP

GEP® delivers AI-native procurement and supply chain Quantum Intelligence platform, consulting and services that help global enterprises become more agile and resilient, operate more efficiently and effectively, gain competitive advantage, boost profitability and increase shareholder value. Our customers are the world’s best companies, including more than 550 Fortune 500 and Global 2000 industry leaders who rely on GEP to meet ambitious strategic, financial and operational goals. A leader in multiple Gartner Magic Quadrants, GEP’s AI-native Quantum Intelligence platform consistently win awards and recognition from industry analysts, research firms and media outlets, including Gartner, IDC, ISG, and Spend Matters. GEP is also regularly ranked a top procurement and supply chain consulting and strategy firm, and a leading managed services provider by ALM, Everest Group, NelsonHall, IDC, ISG and HFS, among others. Headquartered in Clark, New Jersey, GEP has offices and operations centers across Europe, Asia, Africa and the Americas. To learn more, visit www.gep.com.

Media Contact

Derek Creevey
GEP
derek.creevey@gep.com

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Drainage Planning and Flood Planning Examined In HelloNation, Featuring Land Surveying and Drainage Engineer Expert Michael Cuppy

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The article explains how early water management decisions protect building site stability and reduce costly construction risks.

PUEBLO, Colo., Oct. 6, 2026 /PRNewswire/ — What role should drainage planning and flood planning play before construction begins on a building site? HelloNation has published the answer in an article, featuring insights from Engineering & Surveying Expert Michael Cuppy of Pueblo, Colorado.

 

The HelloNation article explains that drainage planning is a critical part of preparing any building site, yet it is often overlooked during early construction decisions. Water management affects everything from grading to long-term structural performance, making it essential to evaluate how runoff will move across the property. Without proper drainage planning, water can collect in unwanted areas, leading to erosion, foundation damage, and limited site access during storms.

The article describes how a well-designed drainage planning approach maps the natural flow of runoff and identifies low points across a building site. Engineers use this information to guide grading decisions and develop systems such as swales, retention areas, or underground piping. These elements help control water management and ensure that runoff is directed away from structures, roads, and utilities. By aligning site layout with natural water flow, construction projects can avoid preventable complications.

Flood planning expands on drainage planning by addressing more extreme weather conditions. The article notes that flood planning considers how a building site will respond during heavy rainfall or seasonal flooding events. This process allows engineers to adjust grading, elevate structures when necessary, and reinforce vulnerable areas. Without proper flood planning, construction projects face increased risks that can lead to costly repairs and long-term damage.

The article emphasizes that even small miscalculations in runoff patterns can create major issues for a building site. Poor drainage planning can result in standing water, soil instability, or basement flooding. These problems often extend beyond the original construction area, affecting neighboring properties and increasing liability. Engineering & Surveying Experts highlight that early analysis of grading and water management helps prevent these outcomes and supports a more stable site layout.

In addition to protecting structures, the article explains that effective drainage planning improves the performance of infrastructure over time. Roads, landscaping, and utility systems all depend on proper water management to function correctly. When runoff is controlled through thoughtful grading and design, maintenance needs are reduced, and long-term durability improves. This makes drainage planning an essential part of both short-term construction success and long-term property value.

Flood planning also plays an important role in regulatory and insurance considerations. The article notes that local municipalities often require drainage planning and flood planning documentation before approving construction permits. Insurance providers may also evaluate flood risk when determining coverage requirements. Addressing these factors early helps streamline the construction process and reduces the likelihood of delays.

The article further explains that integrating drainage planning into site layout decisions leads to more efficient construction outcomes. When grading, utilities, and road placement are designed with water management in mind, builders can avoid costly redesigns. Engineering & Surveying Experts emphasize that proactive planning allows construction teams to work with natural site conditions rather than against them.

Ultimately, the HelloNation article presents drainage planning and flood planning as essential components of responsible construction. Ignoring water management may seem like a shortcut, but it often leads to complex, expensive challenges. By focusing on runoff control, grading accuracy, and thoughtful site layout, builders can create safer, more resilient building site conditions.

Why Drainage and Flood Planning Matter Before You Build features insights from Michael Cuppy, Engineering & Surveying Experts of Pueblo, Colorado, in HelloNation.

About HelloNation
HelloNation is a premier media platform that connects readers with trusted professionals and businesses across various industries. Through its innovative “edvertising” approach that blends educational content with storytelling, HelloNation delivers expert-driven, good-news articles that inform, inspire, and empower. Covering topics from home improvement and health to business strategy and lifestyle, HelloNation highlights leaders making a meaningful impact in their communities.

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