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Fleet Space Acquires HiSeis: Introducing A New Era of End-To-End Exploration Services

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ADELAIDE, Australia, March 5, 2025 /CNW/ — Fleet Space Technologies, Australia’s leading space exploration company, today announced its acquisition of HiSeis, the world’s leading provider of active seismic exploration technology to the minerals industry. By consolidating leading-edge exploration technologies and capabilities, this strategic acquisition of HiSeis will strengthen Fleet Space’s world-leading, end-to-end exploration services, streamlining the global mining industry’s journey from data acquisition to AI-enabled drill targeting across the mineral value chain. With the integration of HiSeis advanced seismic solutions, Fleet Space’s end-to-end exploration platform, ExoSphere, will accelerate the acquisition and processing of high-quality passive and active seismic datasets into AI-enabled insights worldwide.

Step Change in Data-Driven Mineral Exploration

“Fleet Space’s acquisition of HiSeis marks a transformative leap into the future of data-driven exploration,” said Flavia Tata Nardini, CEO and Co-Founder of Fleet Space Technologies. “To unlock the potential of real-time exploration and AI, we must consolidate, standardise, and integrate high-quality datasets to maximise the predictive capabilities of frontier AI systems.”

“By combining Fleet Space’s vertically integrated exploration platform with HiSeis’ seismic exploration solutions and imaging expertise, we are taking a vital step to generate exabytes of high-quality exploration data needed to unlock faster exploration outcomes and enhance shareholder value for the global mining industry. We’re proud to welcome the HiSeis team, and their deep experience in active seismic deployment, processing, and interpretation, on our journey to build the tools needed to unlock the next wave of new discoveries for Earth’s clean energy future.”

HiSeis: Global Leader in Active Seismic Solutions

HiSeis specializes in hard rock seismic technology, offering high-resolution subsurface imaging that aids in the identification of mineral deposits. To navigate the increasing complexity of drilling down into finer and finer scales, exploration companies come to HiSeis when they need the highest resolution geological picture possible with current technology. Leveraging active seismic solutions, HiSeis sends seismic energy into the ground and measures the energy returned to the surface after bouncing off of geological features deep underground.

Next, HiSeis uses state-of-the-art processing tools to create a coherent image of the reflected energy to interpret the metre-scale complexity of mineral deposits and assist with drill-targeting selection. By folding HiSeis data acquisition methods into the ExoSphere platform – combining Fleet Space’s satellite network, patented smart sensors, and proprietary multimodal AI models – HiSeis’ hard rock seismic data will be rapidly processed, standardised, and integrated with other multiphysics datasets, enhancing 3D understanding of mineral systems and data-driven drill targeting while reducing environmental impact at scale.

Passive & Active Seismic Integration: Unleashing Real-Time Exploration’s Potential

“With this acquisition, Fleet Space is poised to radically transform seismic imaging on a global scale. By integrating HiSeis’ innovative seismic solutions with our state-of-the-art, real-time data processing and transmission system – ExoSphere – we will greatly expand scalability while further reducing the time and environmental impact associated with acquiring high-resolution active seismic data,” added Chief Technology & Product Officer, Dr. Hemant Chaurasia. “Downstream, this will enable more adaptive field operations and accelerate decision-making with faster access to actionable data-rich insights while on campaign.”

A deeper integration of passive and active seismic methodologies represents one of the largest untapped opportunities to enhance exploration outcomes at scale. Passive seismic, which captures naturally occurring seismic waves, enables large-scale regional insights, depth penetration, and rapid scale reduction for priority target selection. Active seismic, which involves controlled seismic sources, delivers high-resolution mineral system imaging. By combining these methodologies, Fleet Space will offer a data-rich, multi-layered approach that improves subsurface characterization, enhances targeting accuracy, and drives an exponential acceleration in decision-making across the exploration and mining lifecycle.

Fleet Space’s acquisition of HiSeis follows its recent USD$100M Series D funding round, more than doubling the company’s valuation to over USD$525M, and fueling the expansion of ExoSphere’s end-to-end capabilities. To enhance global service capacity for ExoSphere, already used by 40+ leading mining companies like Rio Tinto, Barrick, Ma’aden, and Gold Fields worldwide, Fleet Space launched its most advanced exploration satellites – Centauri 7 and Centauri 8 – on SpaceX’s Transporter 12 mission in January. The integration of HiSeis into Fleet Space’s operations will commence immediately, with joint projects and collaboration already underway.

About Fleet Space Technologies

Fleet Space Technologies, Australia’s leading space exploration company, is revolutionizing critical mineral discovery with its end-to-end mineral exploration solution, ExoSphere, which combines satellite connectivity, 3D multiphysics, and AI to image mineral systems in real-time. Over 40 leading exploration companies like Rio Tinto, Barrick, Gold Fields, and Ma’aden have used ExoSphere’s real-time 3D subsurface imaging on projects across five continents. In 2024, Fleet Space was recognised as the winner of the Innovation category at the Mining Technology Excellence Awards and received the Climate Impact Technology Award by the Banksia Foundation.To learn more about ExoSphere, please reach out to the Fleet Space team here.

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

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