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Thin Film Lithium Niobate (TFLN) Modulator Market to Hit USD 3.8 Billion by 2031 – Driven by Optical Communication, Data Centers, and 5G | Valuates Reports

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BANGALORE, India, April 4, 2025 /PRNewswire/ — Thin Film Lithium Niobate (TFLN) Modulator Market is Segmented by Type (Thin Film Lithium Niobate Phase Modulator, Thin Film Lithium Niobate Intensity Modulator), by Application (Optical Communication, Cable Television, Data Center, Microwave Photon, Fiber Optic Gyroscope, Fiber Optic Sensing, Video Transmission).

The Global Market for Thin Film Lithium Niobate (TFLN) Modulator was valued at USD 356 Million in the year 2024 and is projected to reach a revised size of USD 3829 Million by 2031, growing at a CAGR of 41.0% during the forecast period.

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Major Factors Driving the Growth of Thin Film Lithium Niobate (TFLN) Modular Market:

The TFLN Modulator Market advances steadily as industries embrace high-performance photonic devices for faster, more energy-efficient communications. Vendors differentiate through specialized solutions, integrating TFLN designs into optical modules, data centers, and wireless infrastructure. Continuous R&D enhances device lifespan and lowers production costs, encouraging new entrants and fueling competition. End users benefit from improved bandwidth, minimized latency, and robust reliability in applications ranging from telecom networks to sensing systems. Strategic collaborations further accelerate product innovation, allowing broader adoption across industrial, consumer, and defense segments. As global data demand escalates, TFLN modulators prove indispensable for scaling capacity and preserving signal quality. Consequently, the market thrives under strong demand and technological evolutions, promising long-term opportunities for both established and emerging players.

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TRENDS INFLUENCING THE GROWTH OF THE THIN FILM LITHIUM NIOBATE (TFLN) MODULATOR MARKET:

Thin Film Lithium Niobate phase modulators stimulate the TFLN Modulator Market by delivering superior modulation efficiency in compact footprints. Their ability to manipulate the phase of optical signals precisely is essential for next-generation communication systems and advanced photonic circuits. These modulators reduce signal degradation and power consumption, aligning with industry demands for sustainability and cost-effectiveness. By integrating easily into high-speed networks, they enable faster data transfers while maintaining signal integrity. Their lightweight, stable nature also suits harsh environmental conditions, making them valuable in aerospace and defense applications. As miniaturization trends accelerate, these phase modulators fit seamlessly into smaller, more complex devices. Together, these qualities make them a vital component, spurring continuous adoption across diverse technology sectors.

Thin Film Lithium Niobate intensity modulators amplify the TFLN Modulator Market by offering high extinction ratios and broad bandwidths for advanced signal processing. These devices adjust the amplitude of light signals, allowing refined control in optical communication systems. Their low driving voltage and stable performance meet the demands of emerging data centers and 5G infrastructures. Manufacturers benefit from streamlined integration into existing platforms, reducing overall design complexity. Furthermore, the modulators’ inherent electro-optic properties minimize energy loss and enhance thermal stability, promoting reliable operation under varied conditions. By enabling precise intensity control, these solutions support flexible data routing and secure transmissions. They also open opportunities for cutting-edge applications in sensing and imaging, expanding the market’s scope and investment potential.

Optical communication accelerates the TFLN Modulator Market by demanding high-speed, low-loss signal transmission for global data networks. TFLN modulators play a key role in shaping and routing light pulses with remarkable clarity, boosting throughput and connectivity. As internet usage and cloud computing surge, operators require scalable, energy-efficient solutions, positioning these modulators as strategic assets. Their compact size aligns with the need to condense infrastructure into smaller footprints while maintaining reliability. Additionally, TFLN devices support longer-distance transmission without repeated signal regeneration, reducing equipment costs and complexity. This efficiency becomes increasingly vital for emerging applications, such as quantum communications and edge computing. By enhancing bandwidth and reliability, optical communication spurs innovation, cementing TFLN modulators as integral enablers of future networks.

Global networks demand accelerated data rates to support streaming, telemedicine, and remote collaboration. TFLN modulators address this urgency by delivering higher bandwidth and reduced latency. Their efficient electro-optic properties enable faster light modulation, satisfying performance requirements in data centers and 5G networks. Users benefit from swift content delivery and real-time data analytics, driving sustained interest in these solutions. Additionally, growth in cloud services and online platforms perpetuates the need for reliable, ultra-fast communication channels. As businesses compete globally, robust connectivity becomes a strategic imperative, spurring investments in advanced modulator technology. By consistently surpassing older modulation methods, TFLN modulators fulfill critical speed criteria for diverse sectors, firmly placing them at the forefront of high-speed data demand worldwide.

Rapid 5G deployments and surging cloud services underscore the crucial function of TFLN modulators. They offer ultra-low loss and high linearity, supporting complex signal formats essential to modern telecommunications. When integrated with 5G base stations, these modulators accommodate dense data requirements while conserving power. Cloud service providers also leverage TFLN technology to maintain seamless data transfers, enabling resource-intensive operations like artificial intelligence and virtual reality. By optimizing bandwidth usage, these devices reduce operational overhead, improving network efficiency. Moreover, TFLN modulators’ small footprint fosters easier placement in congested environments where hardware space is scarce. As 5G and cloud computing continue evolving, the capability of these modulators to enhance performance cements their role in future infrastructure expansions.

Escalating energy costs and sustainability goals elevate the importance of TFLN modulators, known for their power-saving design. Because lithium niobate exhibits strong electro-optic effects, relatively low voltages achieve substantial modulation depth. This energy-efficient approach benefits operators striving to reduce greenhouse gas emissions and operational expenses. Data-heavy applications, such as online gaming and media streaming, emphasize the value of minimized power usage without compromising performance. Governments and stakeholders increasingly promote “green” tech solutions, further propelling interest in TFLN platforms. Over time, businesses adopting these modulators enjoy decreased heat generation and simpler thermal management, lowering maintenance demands. By combining high performance with reduced resource consumption, TFLN modulators reinforce modern environmental imperatives and foster market expansion.

The broader photonics ecosystem flourishes alongside the TFLN Modulator Market, creating symbiotic growth. Innovators developing lasers, waveguides, and detectors rely on compatible modulators to achieve optimal device performance. As end users seek integrated photonic solutions, TFLN-based components become instrumental in bridging discrete technologies. This collaborative environment encourages standardization, streamlining production and boosting cost competitiveness. Researchers continually refine lithium niobate thin films, pushing boundaries in doping techniques and waveguide engineering. By improving device functionality, these advancements unlock emerging markets, including lidar sensing and microwave photonics. Consequently, expanded photonics applications translate to heightened demand for TFLN modulators. This interlinked ecosystem ensures that innovations in one photonic domain amplify opportunities across the entire chain.

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LITHIUM NIOBATE (TFLN) MODULATOR MARKET SHARE:

North America leads with strong funding for photonics research and widespread telecom infrastructure upgrades, paving the way for rapid adoption.

Europe follows closely, emphasizing collaborative R&D projects and stringent performance standards that spur innovation.

Key Companies:

●       Thinfilm

●       Srico, Inc.

●       Photonic Systems

●       Advanced Fiber Resources

●       Ori-Chip

●       Eoptolink Technology

●       Linktel Technologies

●       HyperLight

●       Verics

●       Tianjin Liniom

●       Guangzhou Niobao Optoelectronics

●       Tianjin H-Chip Technology Group

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DISCOVER MORE INSIGHTS: EXPLORE SIMILAR REPORTS!

–          Thin Film Lithium Niobate Optical Modulator Market was valued at USD 446 Million in the year 2023 and is projected to reach a revised size of USD 1248 Million by 2030, growing at a CAGR of 15.7% during the forecast period.

–          Lithium Niobate Phase Modulator Market

–          Lithium Niobate (LN) Modulators Market

–          Lithium Niobate Market was valued at USD 158 Million in the year 2024 and is projected to reach a revised size of USD 184 Million by 2031, growing at a CAGR of 2.2% during the forecast period.

–          Lithium Niobate Phase Modulator Market

–          Mg-Doped Lithium Niobate Wafer Market

–          Lithium Niobate Electro-optical Phase Modulator Market

–          Magnesium Oxide Doped Lithium Niobate (MgO:LiNbO3) Crystal Market was estimated to be worth USD 42 Million in 2023 and is forecast to a readjusted size of USD 58 Million by 2030 with a CAGR of 4.8% during the forecast period 2024-2030.

–          Lithium Market

–          Large Size Lithium Niobate Wafer Market

–          Lithium Niobate on Insulator (LNOI) Modulators Market

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Mixx Technologies Acquires Sophic Silicon Technologies and Announces Manufacturing Collaboration with Kaynes Semicon

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A landmark dual announcement signals India’s emergence as a vertically integrated force in global AI semiconductor infrastructure, spanning design to deployment

BENGALURU, India, July 23, 2026 /PRNewswire/ — Mixx Technologies, Inc., a US based venture-backed deep-tech company building the interconnect layer for hyperscale AI infrastructure, today announced two simultaneous strategic moves that together mark a defining moment in India’s semiconductor journey. First, the acquisition of Sophic Silicon Technologies, a Bengaluru-based semiconductor IP design firm, beneficiary of India’s DLI and whose analog mixed-signal design expertise is now integral to Mixx’s co-packaged optics platform. Second, a manufacturing collaboration with Kaynes Semicon Private Limited, an Outsourced Semiconductor Assembly and Test (OSAT) specialist and beneficiary of India’s Production Linked Incentive (PLI) scheme, to establish a test and assembly facility that will support Mixx’s optical IC packaging roadmap. Taken together, the two announcements represent the first time an international deep-tech company has anchored both the design and manufacturing layers of a next-generation AI silicon platform in India, turning the country’s policy ambition into commercial reality.

The Acquisition: Completing the Full-Stack Foundation for Co-Packaged Optics
Every major cloud provider is deploying GPUs at a pace and scale that would have seemed implausible three years ago. But raw compute density is only half the equation. The harder problem is making sure those GPUs are working to its full potential and not waiting. In large AI clusters, accelerators spend a significant fraction of their time stalled on data waiting to move between chips fast enough to keep compute fed. The interconnect, not the GPU itself, is increasingly the binding constraint on utilization. And utilization directly determines the cost of a token and the energy burned to produce it. For hyperscalers running inference at billions of queries a day, the economics are unforgiving: every percentage point of GPU idle time is waste at scale. Introducing optics to declutter the data path improves efficiency. Co-packaged optics (CPO), the most effective solution to the interconnect bottleneck, integrates photonic engines directly alongside ASICs and accelerators, moving data at optical speeds and at a fraction of the power of conventional electrical interconnects. It unlocks the bandwidth density required to keep GPUs utilized efficiently and sustainably, bringing down both the cost of a token and the energy consumed to produce it.

The industry is focused, the demand is now, and Mixx is ready for real-world deployments.

Delivering CPO at hyperscale, however, requires precision across the full electronic-photonic stack; the hardest layer to design is the analog mixed-signal interface between the photonics and the digital system. That is precisely what Sophic Silicon Technologies has designed using advanced CMOS process nodes. Their IP now forms the electronic IC foundation of Mixx’s HBxIO™ platform – a multi-terabit, ultra-high-radix optical interconnect architecture purpose-built for large-scale AI inference and training. The acquisition brings Sophic Silicon’s full team and IP portfolio into Mixx, effective immediately.

“Our vision has always been to build the complete electronic-photonic stack. Sophic Silicon brings critical analog mixed-signal expertise that reinforces HBxIO and moves us closer to deploying optical connectivity at hyperscale.”

        — Vivek Raghuraman, CEO, Mixx Technologies

Sophic Silicon’s founders and core engineers, with backgrounds spanning advanced CMOS process design, EDA and IP development, and high-speed networking, will join Mixx’s core product development organization and continue expanding R&D operations in India.

“Sophic Silicon exists because optical connectivity at hyperscale demands more – lower power, higher bandwidth, seamless multi-protocol integration, and latency that lets networks perform at their absolute best. Mixx gives us the platform, the ecosystem, and the global reach to take that work where it was always meant to go. What we built in Bengaluru is now part of the infrastructure that the world’s largest computing deployments will run on.”

         — Deepak Pancholi, Founder, Sophic Silicon Technologies

The Collaboration: From Design to Deployment with Kaynes Semicon
Designing world-class semiconductor IP in India is a milestone. Manufacturing and testing it there is a transformation. Mixx Technologies’ collaboration with Kaynes Semicon Private Limited, a leading Indian OSAT provider and PLI beneficiary, is precisely that second step.

The collaboration brings together Kaynes Semicon’s advanced OSAT capabilities and Mixx’s optical IC design expertise to build a dedicated test and assembly capability for next-generation optical integrated circuits. Kaynes Semicon brings deep process knowledge in semiconductor assembly, packaging, and test, backed by the capital investment and institutional credibility of a PLI-supported program. For Mixx, the partnership creates a tightly integrated domestic manufacturing pathway for components of the HBxIO™ platform, enabling faster development cycles, closer collaboration between design and production teams, and the kind of end-to-end control that is essential when pushing the limits of optical IC performance.

“This multi-year collaboration with Mixx Technologies is a strong signal of where India’s semiconductor manufacturing ecosystem is headed. We have built the infrastructure and the process depth to support advanced optical IC packaging. Working with Mixx brings a world-class design partner into that ecosystem, demonstrating that PLI-backed Indian manufacturers can play at the leading edge of the global AI hardware supply chain.”

          — Raghu Panicker, CEO, Kaynes Semicon Private Limited

From India, for the World: A New Model for Semiconductor Globalization
Mixx Technologies has maintained R&D operations in India since its founding, alongside its San Jose headquarters and Taiwan facilities. The acquisition of Sophic Silicon deepens that presence significantly, embedding a team with leading-edge analog mixed-signal and photonics design experience into Mixx’s core product organization. The collaboration with Kaynes Semicon adds a manufacturing dimension: for the first time, a next-generation optical interconnect platform will have both its design and its assembly and test operations anchored in India. This is not an offshoring story. It is a story about India becoming a primary node in the global AI semiconductor value chain, with design, manufacturing, and IP origination happening here, at global scale.

“Mixx Technologies is committed to developing next-generation silicon photonics IP and system designs in India, contributing to the country’s ambition of becoming a global hub for semiconductor design and advanced manufacturing. The talent here is exceptional. The policy environment has matured to support it. And today’s announcements are what happens when both come together.”

           — Vivek Raghuraman, CEO, Mixx Technologies

The Road Ahead: Building the AI Interconnect Layer, in India
Sophic Silicon’s mixed-signal IPs is now being integrated across the HBxIO™ platform stack. Mixx is actively engaged with cloud service providers to qualify the platform across both scale-up and scale-out network, connecting servers and clusters across data center fabric.

The Kaynes Semicon collaboration is underway, focused on qualifying advanced optical IC assembly and test processes that meet the stringent performance and reliability standards hyperscale deployments demand. Mixx continues to expand its India R&D organization, with Bengaluru at the center of its global analog mixed-signal and photonics IC development.

The global AI chip market is projected to exceed $400 billion by 2030. The interconnect layer, tracking how data moves between chips, between accelerators and between clusters, is where the next wave of differentiation will be won. Mixx Technologies is building that layer. And it is building it in India.

About Mixx Technologies
Mixx Technologies, Inc. is venture-backed deep-tech company founded by the team that commercialized many zero-to-one silicon photonics products. The company is solving the data-movement bottleneck for AI compute infrastructure through its HBxIO™ platform, a multi-terabit, ultra-high-radix co-packaged optical interconnect architecture enabling cloud service providers to deploy large-scale AI inference at the speed and efficiency hyperscale demands. Headquartered in San Jose, California, with R&D operations in India and Taiwan. Visit: www.mixxtech.io.

About Sophic Silicon Technologies
Sophic Silicon Technologies is a Bengaluru-based semiconductor IP design firm specializing in analog mixed-signal, wireless and photonics ICs for AI-scale infrastructure. A beneficiary of India’s Design Linked Incentive (DLI) Scheme under the India Semiconductor Mission, the company developed its IP at leading-edge CMOS process nodes to address the electro-optic interface challenges central to co-packaged optics and next-generation AI scale-up interconnects. Sophic Silicon Technologies is now part of Mixx Technologies.

About Kaynes Semicon Private Limited
Kaynes Semicon Private Limited is an Indian OSAT (Outsourced Semiconductor Assembly and Test) company and beneficiary of the Government of India’s Production Linked Incentive (PLI) scheme for semiconductors. With infrastructure and advanced assembly capabilities at its Sanand, Gujarat facility, Kaynes Semicon is building India’s domestic semiconductor manufacturing ecosystem for next-generation packaging and test requirements.

Media Contact
Ramya Barna
Marketing and Investor Relations, Mixx Technologies, Inc
info@mixxtech.io

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Logo – https://mma.prnewswire.com/media/2834697/Mixxblack_Logo.jpg

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Hydra X Launches HX Gateway API to Advance Institutional Adoption on the Canton Network

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The HX Gateway API supports financial institutions and developers building on Canton, reducing go-to-market timelines by up to 80% and deployment time by 50%.

SINGAPORE, July 23, 2026 /PRNewswire/ — Hydra X, a regulated market infrastructure operator for tokenised capital markets, today announced the launch of HX Gateway API, a REST API layer that supports financial institutions and application developers building on the Canton Network without requiring specialised expertise in Daml, Canton’s underlying programming language.

The API provides a straightforward integration layer that maps directly to familiar business workflows – onboarding participants, issuing and managing assets, and executing transfers. Now, institutions can go from decision to deployment without needing to build infrastructure from the ground up.

Built on Production Experience on the Canton Network

The HX Gateway API is built on Hydra X’s own production experience operating on the Canton Network. The firm has tokenised over US$100 million in assets for institutional clients across multiple regulatory frameworks on Canton through DA Registry – a secure tokenisation solution with regulatory-grade compliance built by Digital Asset, creators of the Canton Network.

That operational depth informed the design of the API, resulting in measurable gains for institutional deployments:

Rapid Go-to-Market: Up to an 80% acceleration in go-to-market timelines.Faster Path-to-Production: A 50% reduction in deployment time.Flexible Integration: Available as a hosted service or as an external deployment for clients with existing validator infrastructure.

“The HX Gateway API was designed to advance institutional adoption on the Canton Network.  It is built on the same infrastructure we run in production for regulated clients, and it means that banks, asset managers and exchanges no longer need to treat Canton integration as a specialist engineering project. It is a business decision now, and the timelines reflect that,” said Mark Tang, VP of Client Solutions, Hydra X.

A Broader Shift in Tokenised Capital Markets

The launch marks a broader shift in how regulated financial institutions can engage with the Canton Network. As tokenised capital markets around the world move from pilot programmes to production deployments, the ability to integrate quickly and reliably into shared network infrastructure is becoming a competitive differentiator. The HX Gateway API is designed to meet that moment, providing institutional-grade tooling that significantly accelerates the path from deciding to build on the Canton Network to achieving a live deployment.

About Hydra X

Hydra X is a regulated market infrastructure operator for tokenised capital markets, with live deployments across Asia-Pacific. The firm builds and operates the full lifecycle of digital capital market infrastructure, spanning tokenisation, distribution, trading, custody and settlement. Hydra X serves financial institutions seeking to issue, trade and custodise digital assets on regulated, institutional-grade infrastructure.

www.hydrax.io

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Unfold Your Passions with a $0 Galaxy on StarHub 5G Unlimited+ Plans

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Pre-order the new Samsung Galaxy Z Fold8 Ultra, Galaxy Z Fold8 and Galaxy Z Flip8 with StarHub to unlock exclusive perks

SINGAPORE, 23 July 2026 /PRNewswire/ — Your next Galaxy upgrade just got easier. Whether it’s streaming Premier League action on the go, multi-tasking on a larger foldable display or enjoying immersive entertainment, StarHub is making it easier than ever to own Samsung’s latest Galaxy foldables.

From today, customers can pre-order the new Samsung Galaxy Z Fold8 Ultra, Galaxy Z Fold8, and Galaxy Z Flip8 on StarHub’s 5G Unlimited+ Plans, enjoying up to $1,688 in device savings, up to $2,880 in DeviceDollars (over 36 months) to offset interest-free device instalments, bringing the cost of owning Samsung’s latest foldables down to as low as $0.

More Value with Every Upgrade

Designed to make upgrading easier and more rewarding, StarHub’s 5G Unlimited+ Plans combine exclusive pre-order offers with perks, so customers get even more from Samsung’s latest Galaxy foldables:

Up to $2,880 in DeviceDollars (over 36 months) to offset interest-free instalments, with flexible payment options across 12, 24 or 36 monthsUpfront pay later device discounts with 5G Unlimited+ PlansUp to $350 off device for new lines and port-insGuaranteed $300 trade-in bonus on top of device’s base trade-in valueComplimentary Premier League Annual Pass worth $380 with Galaxy Z Fold8 Ultra or Fold8Complimentary storage upgrade to 512GB at the price of 256GB worth $300, with 5G Unlimited+ Plus Plans and aboveComplimentary 3 months SmartSupport (worth $42.78) to lock in the 50% trade-in guarantee on your new Galaxy Z Foldable[1]$38 e-voucher for customers who registered their interestWatch add-on savings of up $250 off Galaxy Watch Ultra2 and $100 off Galaxy Watch9

More Freedom with 5G Unlimited+ Plans

Beyond the device, StarHub’s 5G Unlimited+ Plans include unlimited data, built-in global roaming across 165 destinations, and unlimited calls and SMS, giving customers greater peace of mind whether they’re staying connected at home or travelling overseas.

Pre-Order Details

Customers can pre-order the new Samsung Galaxy Z Series, Galaxy Watch Ultra2 and Galaxy Watch9 on StarHub’s 5G Unlimited+ Plans from 23 July 2026, 9am to 13 August 2026, 11.59pm via the StarHub App and online at starhub.com/samsung. Customers who prefer to pre-order in person can do so at StarHub Shops from 4 August 2026, during operating hours.

The Samsung Galaxy Z Series will be available for walk-in purchase at StarHub shops from 14 August 2026, 11am, and online via the StarHub eShop from 14 August 2026, 12am, while stocks last.

For more information, visit: starhub.com/samsung.

[1] Terms and conditions apply, please refer to starhub.com/samsung

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SOURCE StarHub

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