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Hybrid Bonding Technology Market to Reach USD 756 Million by 2031, Driven by Demand for AI, 5G, and High-Performance Computing | Valuates Reports

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BANGALORE, India, April 11, 2025 /PRNewswire/ — Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor (CIS), NAND, DRAM, High Bandwidth Memory (HBM)).

The Global Market for Hybrid Bonding Technology was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during the forecast period.

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Major Factors Driving the Growth of Hybrid Bonding Technology Market:

The Hybrid Bonding Technology Market is transitioning from early‑adopter phase to high‑growth mainstream adoption. Capacity announcements, multi‑year equipment backlogs, and expanding design‑win pipelines signal robust double‑digit revenue growth through the forecast horizon. As heterogeneous integration becomes indispensable for AI, 5G, automotive autonomy, and ultra‑high‑resolution imaging, hybrid bonding emerges as the de facto interconnect standard, eclipsing micro‑bump and TSV‑centric approaches. Continued process refinements and cost reductions will open mid‑tier and IoT segments, further enlarging addressable demand. Overall, hybrid bonding stands poised to redefine advanced packaging economics and performance benchmarks, anchoring a vibrant ecosystem of materials, tools, and service providers.

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TRENDS INFLUENCING THE GROWTH OF THE HYBRID BONDING TECHNOLOGY MARKET:

Wafer‑to‑wafer hybrid bonding is emerging as a pivotal manufacturing step because it enables full‑surface metal‑oxide interconnects that virtually eliminate the parasitic resistance and capacitance associated with‑silicon vias. By stacking fully processed wafers with nanometer‑level alignment accuracy, manufacturers can co‑integrate logic, memory, photonic, and sensor layers into one monolithic three‑dimensional package, delivering massive bandwidth and lower energy per bit. These measurable system advantages have made wafer‑to‑wafer architectures indispensable for high‑performance computing, mobile processors, and AI accelerators, spurring capacity expansions by foundries and OSATs. Equipment vendors are likewise benefiting, booking orders for plasma activation tools, bonding aligners, and cluster systems. The resulting cycle of demand, investment, and ecosystem maturation propels sustained, robust growth in the Hybrid Bonding Technology Market worldwide today.

Die‑to‑wafer hybrid bonding unlocks heterogeneous integration by allowing known‑good die from disparate process nodes to be placed precisely onto a target wafer, eliminating costly yield penalties linked with full wafer stacking. This pick‑and‑place flexibility lets designers mix advanced logic, high‑density memory, and specialty analog functions inside a single 3D package, tailoring performance while shrinking footprint. The approach is particularly attractive for chiplet architectures powering data‑center GPUs, network switches, and AI accelerators where interposer limitations bottleneck bandwidth. As system companies embrace the chiplet paradigm, demand for die‑to‑wafer processes is skyrocketing, prompting capital spending on bond aligners, plasma cleaners, and metrology. Collaborative standards such as UCIe reinforce ecosystem confidence, amplifying orders. Consequently, die‑to‑wafer adoption expands revenue within the Hybrid Bonding Technology Market.

CMOS Image Sensors (CIS) are driving a share of hybrid bonding demand because the technology dramatically improves pixel‑level interconnect density, enabling smaller pitch, higher resolution, and superior signal‑to‑noise ratios. By hybrid‑bonding the photodiode wafer to a dedicated logic wafer, manufacturers separate light‑sensitive and processing functions, maximizing fill factor while embedding advanced AI engines beneath each pixel. This architecture is essential for smartphone cameras, automotive ADAS modules, security systems, and emerging AR/VR devices that require multi‑megapixel performance without thermal or power penalties. Major CIS foundries in Japan, South Korea, and Taiwan are investing heavily in hybrid bonding lines, negotiating long‑term supply agreements with handset and automotive OEMs. Their outlays translate into expanding tool shipments, bolstering Hybrid Bonding Technology Market growth trajectories.

Data‑center operators and cloud service providers are deploying ever‑larger AI training clusters and exascale supercomputers that crave higher memory bandwidth, lower latency, and reduced power consumption. Traditional 2.5D interposers and wire‑bonded packages cannot keep pace with the throughput requirements of transformer models and graph analytics. Hybrid bonding overcomes these bottlenecks by providing direct copper‑to‑copper interconnects at pitches below ten microns, allowing logic and HBM stacks to exchange terabytes per second while staying within stringent energy budgets. As hyperscalers commit billions to next‑gen accelerators, they push chip suppliers toward aggressive adoption roadmaps, thereby amplifying equipment, material, and service revenues across the Hybrid Bonding Technology ecosystem worldwide. The virtuous demand cycle intensifies competition and innovation momentum further.

Consumers expect thinner smartphones, smartwatches, and augmented reality glasses that deliver desktop‑class functionality without sacrificing battery life. Achieving such compactness requires stacking logic, memory, RF front‑ends, and power management circuits vertically rather than expanding the PCB footprint. Hybrid bonding enables this architecture by allowing fine‑pitch interconnects between heterogeneous wafers and dies, eliminating the height penalties of micro‑bumps. OEM roadmaps from Silicon Valley to Shenzhen explicitly reference hybrid bonding for next‑generation application processors and camera modules, triggering early production ramps at foundries. Component miniaturization also frees board area for larger batteries and novel sensors, creating additional differentiation. Consequently, handset competition acts as a persistent catalyst that widens the addressable Hybrid Bonding Technology Market, boosting volume shipments.

Automotive OEMs are integrating lidar, radar, high‑resolution cameras, and domain controllers to achieve advanced driver‑assistance and eventual autonomous operation. These sensor arrays generate enormous data streams that must be processed in real‑time under harsh thermal and vibration conditions. Hybrid bonding facilitates compact, ruggedized 3D stacks that combine logic, memory, and sensor dies, improving bandwidth and reducing latency while maintaining reliability. Government safety regulations such as Euro NCAP and China NCAP push adoption of ADAS features, creating predictable, multi‑year demand for high‑performance automotive semiconductors. Tier‑1 suppliers consequently sign capacity reservations with foundries, driving equipment purchases for hybrid bonding lines and reinforcing market growth.

 Initial hybrid bonding lines suffered from particle‑induced voids and alignment errors, but iterative advances in plasma activation chemistry, wafer‑handling robotics, and in‑line inspection have driven dramatic yield gains. Higher yields translate directly into lower cost‑per‑connection, making hybrid bonding economically competitive with micro‑bump solutions at high volumes. OSATs now advertise greater than 99 percent bonding yield for both wafer‑to‑wafer and die‑to‑wafer flows, convincing cautious fabless customers to convert existing 2.5D programs. As unit costs fall, hybrid bonding becomes viable for mid‑range mobile and IoT chips, expanding the addressable market. Continuous process optimization therefore serves as a reinforcing growth driver, unlocking new design‑win opportunities.

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HYBRID BONDING TECHNOLOGY MARKET SHARE:

Asia‑Pacific dominates the Hybrid Bonding Technology Market, led by Taiwan’s advanced‑node foundries, South Korea’s memory giants, and Japan’s CMOS image‑sensor specialists. China is rapidly scaling domestic capacity through state‑backed programs, while Southeast Asia’s OSAT clusters in Singapore and Malaysia add assembly breadth. North America follows, buoyed by U.S. logic IDMs and government‑funded packaging pilot lines. Europe leverages research institutes and automotive demand, whereas Israel anchors niche aerospace and defense applications.

Key Companies:

IntelApplied MaterialsHuaweiEV Group (EVG)SUSS MicroTecAdeia

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DISCOVER MORE INSIGHTS: EXPLORE SIMILAR REPORTS!

–          Hybrid Bonding Equipment Market was valued at USD 123 Million in the year 2023 and is projected to reach a revised size of USD 618 Million by 2030, growing at a CAGR of 24.7% during the forecast period.

–          Wafer Hybrid Bonding Equipment Market was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during the forecast period.

–          Wafer Bonding Equipment Market was valued at USD 321 Million in the year 2024 and is projected to reach a revised size of USD 449 Million by 2031, growing at a CAGR of 5.0% during the forecast period.

–          Hybrid Wedge Bonders market was valued at USD 54 Million in 2023 and is anticipated to reach USD 70 Million by 2030, witnessing a CAGR of 3.0% during the forecast period 2024-2030.

–          Chip Bonding Adhesive Market was valued at USD 355 Million in the year 2023 and is projected to reach a revised size of USD 510 Million by 2030, growing at a CAGR of 5.3% during the forecast period.

–          Optical Bonding Service Market

–          Temporary Bonding and Debonding Systems Market

–          Wafer Bond Alignment System Market was valued at USD 249 Million in the year 2023 and is projected to reach a revised size of USD 423 Million by 2030, growing at a CAGR of 7.9% during the forecast period.

–          Die Bonding Materials Market

–          Automotive Glass Bonding Market

–          Bonding Wire for Semiconductor Packaging Market

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webAI Launches webAI App for On-Device AI With No Per-Token Charges

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The webAI app lets anyone build teams of AI experts that work across Slack, DocuSign, Hugging Face, Apple apps and more, while their files stay on their Mac.

AUSTIN, Texas, Nov. 5, 2026 /PRNewswire/ — webAI today released the webAI app for Mac to the public for the first time. The app runs webAI’s new small reasoning models on the user’s own computer, so people can use AI on private work without sending files to the cloud or paying per token.

Most AI runs in the cloud, where usage is metered by tokens or capped by plan, and every document goes to someone else’s servers. webAI runs the model on the Mac itself. A user can work through a sensitive client proposal or an unfinished business plan, revise it as many times as they want, and never hit a token limit.

“With the webAI app, we’re making cloud AI optional,” said David Stout, CEO and co-founder of webAI. “Why should you have to send a private document to an online service just to get help with it? Your Mac can do the work. You keep control of what you share, and you can ask as many follow-up questions as you need without watching a token meter.”

In the app, users create Personas: AI experts with a role, knowledge and tools the user chooses. Several Personas can work together on the same task. A consultant could have one pull client requirements from project notes, a second draft the proposal and a third check the draft for anything missed.

Connectors work with the apps you already use, including Slack, DocuSign, Hugging Face and Apple apps. You control what each Persona can access and what actions it can take. A Persona can pull a client’s latest decisions from Slack, see which contracts are still unsigned in DocuSign, and draft follow-ups for your approval. You spend less time hunting for context and copying details between apps.

Watch the demo: https://www.webai.com/blog/webai-launches-webai-app-for-on-device-ai-with-no-per-token-charges 

Availability: The webAI app is available now for Mac at webAI.com.

About webAI

webAI builds technology that lets people create, run, and control AI on their own devices.

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SOURCE webAI

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Cheche Group Announces Extraordinary General Meeting

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BEIJING, Nov. 5, 2026 /PRNewswire/ — Cheche Group Inc. (NASDAQ: CCG) (“Cheche” or the “Company”), China’s leading auto insurance technology platform, today announced that an extraordinary general meeting of the Company (the “Meeting”) will be held at 10 A.M. on November 25, 2026, Beijing time (9 P.M. on November 24, 2026, U.S. Eastern time) at 8/F, Desheng Hopson Fortune Plaza, 13-1 Deshengmenwai Avenue, Xicheng District, Beijing 100088, China. The Company has established the close of business on November 5, 2026, Eastern time (the “Record Date”), as the record date for determining shareholders entitled to notice of, and to vote at, the Meeting and any adjournments or postponements thereof. The purpose of the Meeting includes, among others:

(1) to approve by ordinary resolution the creation of a new class of ordinary shares of the Company designated as class C ordinary shares, each with a par value of US$0.00035 (the “Class C Ordinary Shares”), with the rights and restrictions set forth in the proposed third amended and restated memorandum and articles of association of the Company (the “New M&A”), including 300 votes per Class C Ordinary Share;

(2) to approve by ordinary resolution that the authorized share capital of the Company be amended:

(i) FROM: US$50,000 divided into 142,857,143 shares comprising (i) 114,285,714 class A ordinary shares of a par value of US$0.00035 each, and (ii) 28,571,429 class B ordinary shares of a par value of US$0.00035 each,

(ii) TO: US$50,000 divided into 142,857,143 shares comprising (i) 114,285,714 class A ordinary shares of a par value of US$0.00035 each; (ii) 18,571,429 class B ordinary shares of a par value of US$0.00035 each; and (iii) 10,000,000 class C ordinary shares of a par value of US$0.00035 each;

(3) to approve by ordinary resolution that 10,000,000 authorized but unissued class B ordinary shares of the Company of a par value of US$0.00035 each be re-classified as 10,000,000 class C ordinary shares of the Company of a par value of US$0.00035 each with the rights attached to it in the New M&A; and

(4) to approve by special resolution the amendment and restatement of the Company’s second amended and restated memorandum and articles of association currently in effect (the “Current M&A”) be replaced in their entirety with the New M&A to provide for, among other things, the creation and rights of the Class C Ordinary Shares.

Copies of the notice of the Meeting and the form of proxy are available on the Company’s corporate investor relations website at https://ir.chechegroup.com/.

Safe Harbor Statements

This press release includes “forward-looking statements” within the meaning of the “safe harbor” provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as “estimate,” “plan,” “project,” “forecast,” “intend,” “will,” “expect,” “anticipate,” “believe,” “seek,” “target” or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements also include, but are not limited to, statements regarding existing and new partnerships and customer relationships, projections, estimation, and forecasts of revenue and other financial and performance metrics, projections of market opportunity and expectations, the Company’s ability to scale and grow its business, the Company’s advantages and expected growth, and its ability to source and retain talent, as applicable. These statements are based on various assumptions, whether or not identified in this press release, and on the current expectations of the Company’s management and are not predictions of actual performance. These statements involve risks, uncertainties, and other factors that may cause the Company’s actual results, levels of activity, performance, or achievements to materially differ from those expressed or implied by these forward-looking statements. Further information regarding these and other risks, uncertainties, or factors is included in the Company’s filings with the U.S. Securities and Exchange Commission. Although the Company believes that it has a reasonable basis for each forward-looking statement contained in this press release, the Company cautions you that these statements are based on a combination of facts and factors currently known and projections of the future, which are inherently uncertain. The forward-looking statements in this press release represent the views of the Company as of the date of this press release. Subsequent events and developments may cause those views to change. Except as may be required by law, the Company does not undertake any duty to update these forward-looking statements.

About Cheche Group Inc.

Established in 2014 and headquartered in Beijing, China, Cheche is a leading auto insurance technology platform with a nationwide network of around 108 branches licensed to distribute insurance policies across 25 provinces, autonomous regions, and municipalities in China. Capitalizing on its leading position in auto insurance transaction services, Cheche has evolved into a comprehensive, data-driven technology platform that offers a full suite of services and products for digital insurance transactions and insurance SaaS solutions in China. Learn more at https://www.chechegroup.com/en.

Cheche Group Inc.:
IR@chechegroup.com

Crocker Coulson
crocker.coulson@aumadvisors.com
(646) 652-7185

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Hyperliquid Strategies Inc Reports Financial Results for the Quarter Ended September 30, 2026

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NEW YORK, Nov. 5, 2026 /PRNewswire/ — Hyperliquid Strategies Inc (NASDAQ: PURR) (“HSI” or the “Company”), the premier digital asset treasury platform focused on the Hyperliquid ecosystem, today reported its financial and operational results for the quarter ended September 30, 2026.

“We deployed $802 million this quarter and filed an application to become a futures commission merchant,” said David Schamis, CEO of Hyperliquid Strategies Inc. “Those two moves are the same bet. Hyperliquid is winning the parts of onchain finance that generate real fees, and nearly all of that value flows back to HYPE holders through programmatic buybacks. Owning HYPE is how we aim to capture economics associated with the Hyperliquid protocol; setting up an FCM is how we intend to help bring markets deployed on Hyperliquid onshore.”

Key Highlights (as of or for the Quarter Ended September 30, 2026):

Raised $911 million in equity capital under our committed equity facility.Deployed $802 million; $785 million to acquire 9.1 million HYPE tokens, increasing the treasury from 29.3 million tokens at June 30, 2026 to 38.5 million tokens at September 30, 2026 and $17 million to repurchase 2.7 million PURR shares.Maintained strong balance sheet, with $254.6 million in cash and cash-like instruments and zero debt.Hyperliquid Strategies x Unit validator is now the largest non-Foundation validator on the network.

Hyperliquid Ecosystem Momentum1
Momentum continues to build around the adoption of the blockchain by the global financial system, with much of that momentum represented within the Hyperliquid ecosystem.

As Hyperliquid pursues its vision of becoming the infrastructure to house all of finance, the Hyperliquid protocol continues to generate an increasingly diversified stream of fees (with about $834 million in value accruing to the Hyperliquid ecosystem for the twelve months ended September 30, 2026), processing billions in daily trading volumes, with much of the value generated by the Hyperliquid ecosystem directly accruing to the HYPE token through programmatic HYPE token buybacks.

Hyperliquid recently announced its intention to add additional deployer functionalities under the name HIP-3*. These optional additional features would allow deployers to build and launch permissioned markets on Hyperliquid’s onchain infrastructure. Independent operators would run their own market in a compliant manner, while the chain underneath would stay a neutral infrastructure layer.

In support of these developments, a subsidiary of HSI has filed an application to become a futures commission merchant (“FCM”). Subject to regulatory approval, the FCM would carry US client accounts for permissioned markets deployed on Hyperliquid under HIP-3*, allowing HSI to play a role in bringing perpetual futures to US customers within a regulated framework. There can be no assurance as to the timing or outcome of the application or regulatory approval of permissioned HIP-3* markets.

HSI Financial Highlights for the Quarter Ended September 30, 2026:

Balance Sheet:Total assets of $3,764.3 million as of September 30, 2026, including $254.6 million in cash and cash-like instruments and $3,505.3 million in HYPE tokens (based on a September 30, 2026 HYPE price of $90.99 per HYPE token, representing approximately 38.52 million tokens held).Strong balance sheet with $3,403.0 million in stockholders’ equity and no debt.Income Statement (quarter ended September 30, 2026):$12.3 million in staking revenue and validator commissions from HYPE holdings.$1.0 million in interest income.$7.6 million in SG&A and R&D expenses.$620.6 million in net income.Net income primarily comprised of:$803.0 million in net unrealized gains on HYPE tokens.$15.3 million in primarily non-cash expense recognized in connection with the committed equity facility.$172.3 million in provision for income taxes.

Update on Treasury Strategy Progress (as of October 28, 2026):

Capital Deployment2:$1,583.2 million deployed to accumulate ~25.9 million HYPE tokens at an average cost of $61.13, bringing total HYPE token holdings (including staking and validator rewards earned)  to 38.9 million at a blended cost of $56.35 per token.$27.9 million deployed to repurchase ~5.8 million PURR shares at an average cost of $4.81 per PURR share.Capital Raising:$1,578.4 million raised at an average issue price of $10.36 per PURR share under our committed equity facility.Cash balance:$245.3 million in remaining cash and cash-like instruments.

Webcast:
The Company will host an audio webcast with Q&A on Thursday, November 5, 2026, at 5:15 p.m. ET, featuring CEO David Schamis and CFO Brett Beldner. Register in advance here: https://hyperliquid-strategies-earnings-call-q1-2027.open-exchange.net/registration.

Advance questions may be submitted to investors@hypestrat.xyz.

A replay will be available after the event at www.hypestrat.xyz.

About Hyperliquid Strategies Inc
Hyperliquid Strategies Inc (NASDAQ: PURR) is a digital asset treasury company whose primary focus is to maximize shareholder value through accumulating HYPE, the native token of Hyperliquid, a high-performance blockchain custom-built to house all of finance. HSI aims to provide capital-efficient and productive access to the HYPE token for U.S. and institutional investors, generating compounding shareholder returns that individual holders may not be able to replicate through staking, yield optimization, and active ecosystem engagement. HSI is currently the largest HYPE-focused digital asset treasury vehicle capitalizing on Hyperliquid’s rapid growth and providing exposure to one of the largest and fastest growing revenue pools in digital assets. For more information, please visit www.hypestrat.xyz.

Website Information:
The Hyperliquid Strategies Inc website (www.hypestrat.xyz) includes, among other information, a dedicated section tracking the Company’s “Adjusted Net Asset Value” (the Company’s stockholders’ equity adjusted for, among other things, movements in cash, the value of the HYPE token and the number of HYPE tokens held).

This section is updated regularly, enhancing transparency for the Company’s stockholders and aligning with HSI’s commitment to provide transparent, capital efficient and productive access to the HYPE token.

We use our website as a means of disclosing information that may be considered material, non-public information (including the information regarding our Adjusted Net Asset Value) and for complying with our disclosure obligations under Regulation FD. Accordingly, investors should monitor our website, in addition to following our press releases, Securities and Exchange Commission (“SEC”) filings, public conference calls, presentations and webcasts.

We may also use social media channels to communicate with our investors and the public about us and other matters, and those communications could be deemed to be material information. The information contained on, or that may be accessed through, our website or social media channels is not incorporated by reference into, and is not a part of, this document.

Forward-Looking Statements
This press release contains certain statements which are not historical facts, which are forward-looking statements within the meaning of the federal securities laws, for the purposes of the safe harbor provisions under The Private Securities Litigation Reform Act of 1995. These forward-looking statements include certain statements made with respect to the Company’s business, strategy and future plans, including plans to become a futures commission merchant, as well as certain statements regarding expected growth and developments with respect to Hyperliquid. These forward-looking statements generally are identified by the words “believe,” “project,” “expect,” “anticipate,” “estimate,” “intend,” “strategy,” “future,” “opportunity,” “potential,” “plan,” “may,” “should,” “will,” “would,” “will be,” “will continue,” “will likely result,” and similar expressions. Forward-looking statements are predictions, projections and other statements about future events or conditions that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties that could cause the actual results to differ materially from the expected results. These risks and uncertainties include, but are not limited to: changes in business, market, financial, political and regulatory conditions; risks relating to HSI’s operations and business, including the highly volatile nature of the price of HYPE tokens; the risk that HSI’s stock price will be highly correlated to the price of HYPE tokens and the price of HYPE tokens may decrease; risks related to increased competition in the industries in which HSI operates; risks relating to significant legal, commercial, regulatory and technical uncertainty regarding HYPE tokens; risks relating to the treatment of crypto assets for U.S. and foreign tax purposes; risks that HSI experiences difficulties managing its growth and expanding operations; challenges in implementing HSI’s business plan including HYPE token-related financial and advisory services, due to operational challenges, significant competition and regulation; and those factors discussed in the annual report on Form 10-K filed by HSI with the SEC on August 27, 2026, and in subsequent filings and reports made by HSI with the SEC from time to time. While HSI may elect to update these forward-looking statements at some point in the future, HSI specifically disclaims any obligation to do so.

1 Information in this section is based on public information and has not been independently verified by HSI.
2 Capital raising and deployment cover the period from inception (December 2, 2025) until August 28, 2026.

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SOURCE Hyperliquid Strategies Inc

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