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Smartkem Collaborates with Manz Asia for Advanced Computer and AI Chip Packaging Solutions

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Manz Asia will be demonstrating its advanced inkjet metallization using Smartkem’s advanced dielectric materials at SEMICON® SEA 2025 in Singapore, May 20-22, 2025.

Visit Manz Asia at Booth no. L1314.

MANCHESTER, England, May 19, 2025 /PRNewswire/ — Smartkem (Nasdaq: SMTK), which is seeking to change the world of electronics with a new class of transistor technology, today announced that it has entered into a collaboration with Manz Asia, a developer of production solutions for semiconductor advanced packaging manufacturing sectors. The collaboration includes the demonstration of inkjet printable dielectric layers for use in advanced computer and AI chip packaging solutions at this year’s SEMICON® SEA in Singapore, May 20-22, 2025.

Smartkem Chairman and CEO, Ian Jenks, commented: “We’re thrilled to be working with Manz Asia to address a fast-growing opportunity in the market for advanced computer and AI chip packaging. As the demand for AI leads to increasingly complex servers, our materials combined with Manz Asia’s printing technology have the potential to enable large area panel chip packaging beyond the existing constraints of today’s 300mm wafer packaging. Panel level packaging is a market expected to grow to approximately $600 million in 2030, a 27% compound annual growth rate from 2024. “[1]

Manz Asia General Manger, Robert Lin, commented: “Manz Asia is committed to advancing green manufacturing and smart production through the development of high-precision inkjet printing equipment. Our maskless inkjet technology enables accurate material deposition and supports a wide range of inks, making it suitable for various substrates—including PI, ABF, EMC, silicon, and glass—in both wafer and panel formats. The collaboration with Smartkem marks a significant step in demonstrating how our inkjet platform, combined with next-generation dielectric materials, can deliver scalable and sustainable solutions for semiconductor advanced packaging.”

Building on the UV curable dielectric layer chemistry developed at Smartkem’s R&D facility for thin film transistor fabrication, Smartkem has designed ink formulations suitable for use in advanced computer and AI chip packaging applications. These inks have been co-developed with Manz Asia to be compatible with its existing inkjet-based semiconductor production equipment.

Panel level packaging on rectangular wafers offers key advantages over traditional packaging on circular wafers, including:

Higher throughput, as a larger print area means more chips can be packaged simultaneously;Lower cost per chip from economies of scale with use of printed circuit board like manufacturing equipment;Better material utilization from less edge loss compared to circular wafers; andImproved integration supported by complex fan-out wafer-level packaging at a larger scale.

About Smartkem 
Smartkem is seeking to change the world of electronics with a new class of transistors developed using its proprietary advanced semiconductor materials. Our TRUFLEX® semiconductor polymers enable low temperature printing processes that are compatible with existing manufacturing infrastructure to deliver low-cost, high-performance displays. Our semiconductor platform can be used in a range of display technologies including MicroLED, LCD and AMOLED, as well as in applications in advanced computer and AI chip packaging, sensors, and logic. 

Smartkem designs and develops its materials at its research and development facility in Manchester, UK and provides prototyping services at the Centre for Process Innovation (CPI) in Sedgefield, UK. It operates a field application office in Hsinchu, Taiwan, close to collaboration partner, The Industrial Technology Research Institute (ITRI). Smartkem is developing a commercial-scale production process and Electronic Design Automation (EDA) tools to demonstrate the commercial viability of manufacturing a new generation of displays using its materials.

The company has an extensive IP portfolio including 138 granted patents across 17 patent families, 16 pending patents and 40 codified trade secrets. For more information, visit our website or follow us on LinkedIn.

About Manz Asia
Manz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the CoPoS (CoWoS panelization) technology framework for panel-level packaging.

We offer comprehensive equipment solutions encompassing wet chemistry, plating, digital printing, automation, and proprietary software integration for Redistribution Layer (RDL) process—from lab-scale to mass production. Our technologies support key applications in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, covering critical stages of semiconductor packaging.

By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence. 

For more information, please visit website or follow us on LinkedIn.

About SEMICON® Southeast Asia
Forward-thinking semiconductor organizations are implementing practices to reduce the environmental impact of their businesses and manufacturing operations to ensure their resiliency when disruptive events such as geopolitical conflicts, climate-related disasters, and public health crises strike. Initiatives focused on reducing greenhouse gas emissions and water use, deploying renewable energy systems, and improving the energy efficiency of chipmaking equipment are growing in importance.

To thrive in the coming decade and beyond, companies must look beyond short-term performance and focus on building resilience to better withstand unpredictable disruptions to their businesses, the semiconductor industry and global economies. Visit the website for more information.

Forward-Looking Statements 
All statements in this press release that are not historical are forward-looking statements, including, among other things, its market position and market opportunity, expectations and plans as to its product development, manufacturing and sales, and relations with its partners and investors. These statements are not historical facts but rather are based on Smartkem, Inc.’s current expectations, estimates, and projections regarding its business, operations and other similar or related factors. Words such as “may,” “will,” “could,” “would,” “should,” “anticipate,” “predict,” “potential,” “continue,” “expect,” “intend,” “plan,” “project,” “believe,” “estimate,” and other similar or elated expressions are used to identify these forward-looking statements, although not all forward-looking statements contain these words. You should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties, and assumptions that are difficult or impossible to predict and, in some cases, beyond the Company’s control. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including those described in the Company’s filings with the Securities and Exchange Commission. The Company undertakes no obligation to revise or update information in this release to reflect events or circumstances in the future, even if new information becomes available.

Industry Representatives and Media
Selena Kirkwood
Head of Communications for Smartkem
T: +44 (0) 7971 460 364
s.kirkwood@smartkem.com

Analysts and Investors
David Barnard, CFA
Alliance Advisors Investor Relations
T: 1 415 433 3777
dbarnard@allianceadvisors.com

[1] Yole Intelligence: Panel Level Packaging 2025 https://www.yolegroup.com/product/report/panel-level-packaging-2025/

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Rocket Alumni Solutions Puts Recognition at the Center of School Community Engagement

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Interactive storytelling gives students, families and alumni a way to discover the people, achievements and traditions that shape their school.

BOSTON, Nov. 9, 2026 /PRNewswire/ — Rocket Alumni Solutions helps schools turn their history and achievements into a shared community experience. Serving 1,500+ schools and organizations, the company provides interactive recognition software that brings alumni stories, student accomplishments, school records and yearbooks together on campus touchscreens and the web.

A school’s story includes the students who set records, the teachers who shaped generations, the volunteers who supported a program and the graduates who carried its traditions forward. Rocket gives schools a place to tell those stories with the photographs, biographies and historical context behind each name.

The company’s approach centers community engagement on something personal: giving people a way to find their connection to a school and explore the contributions of others. Its recognition engine makes room for both established traditions and the achievements being added to that history today.

Recognition that reflects the whole school

Rocket’s History Showcase supports recognition across academics, athletics, the arts, alumni, staff, donors and community service. Schools can organize collections around their own priorities, from a hall of fame or scholarship program to an archive of student leadership and performing arts.

Searchable profiles let visitors explore the people behind an award. Team collections can bring together rosters, photographs and season stories. Donor recognition can explain the people behind a scholarship, building or program, while alumni profiles can show students where a graduate’s path began.

This flexibility gives school leaders a practical way to broaden the stories they share. An athletic induction can sit alongside academic honors, an educator tribute or a volunteer’s contribution, with each collection reflecting a different part of the same community.

A shared history on campus and beyond

Rocket makes recognition available where people gather and where they live. A compatible touchscreen gives visitors a place to explore during a campus visit, reunion or induction ceremony. The web-based showcase lets alumni and families revisit those stories without returning to the building.

Digital yearbooks and photo archives add another way to discover a school’s past. A returning graduate can look for a class photograph, a student can explore an earlier generation’s activities, and a family can browse the history of a team or tradition. Those possibilities give schools concrete ways to use their collections throughout the year.

The archive also gives an event a lasting home. Schools can prepare profiles for an induction or assemble historical material for an anniversary, then keep the collection available after the celebration ends.

A collection that grows with the community

Rocket lets staff maintain recognition content through a browser, adding new honorees, updating records and building out historical collections over time. Unlimited content gives schools room to keep expanding the archive as more material becomes available.

A project does not require every decade of school history to be organized before work begins. Schools can start with one meaningful collection, such as an upcoming induction class, a set of yearbooks or a group of alumni profiles, and establish a plan for what comes next.

Rocket offers complimentary data entry, content preparation and project support to help bring that first collection into use. Its team works with schools on source materials, responsibilities and display setup, with 24/7 support available as the recognition program continues.

From preserving a story to sharing it

Recognition is part of Rocket’s wider School Engagement System. Alongside History Showcase, Rocket offers Media Management to organize source material, Digital Signage for timely campus messages and Social Media Graphics for branded visual communications. Hardware and Data Entry & Project Management support the work of bringing a project to campus.

These offerings address different parts of a school’s storytelling effort: maintaining the archive, finding the right photograph, sharing a current achievement and giving visitors a place to explore. Schools can choose a starting point around the people they want to recognize and the material they already have.

About Rocket Alumni Solutions

Rocket Alumni Solutions partners with more than 1,500 schools and organizations, including the PGA Tour, New York University, Arizona State University and Virginia Tech. The company helps communities celebrate achievements, preserve their history and recognize the people who shaped them.

Rocket Alumni Solutions’ touchscreen software maintains an 80 Net Promoter Score, reflecting exceptional ease of use and customer satisfaction. Its interactive touchscreen software helps schools create digital Halls of Fame, donor recognition walls, record boards and campus recognition displays that celebrate community achievements and preserve institutional history.

Rocket Alumni Solutions serves schools and organizations of all sizes. The platform offers pre-built templates and remote content management. Schools receive ongoing support as their recognition collections grow.

CONTACT: press@rocketalumnisolutions.com 

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SOURCE Rocket Alumni Solutions

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Lemonade Announces Online Viewing Details for 2026 Investor Day

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NEW YORK, Nov. 11, 2026 /PRNewswire/ — Lemonade, Inc. (NYSE: LMND) will hold its third Investor Day on Tuesday, November 17, 2026, in New York City. The program begins at 9:00 a.m. ET.

Attendees can join in person or virtually through a live webcast. In-person attendance is by invitation only, and advance registration is required.

The live webcast of the event will be available on the Lemonade Investor Relations website, investor.lemonade.com, and on YouTube. A replay will be posted after the event.

To register for the online webcast, click here.

About Lemonade
Lemonade offers renters, homeowners, car, pet, and life insurance. Powered by artificial intelligence and social impact, Lemonade’s full stack insurance carriers in the US and the EU replace brokers and bureaucracy with AI, aiming for zero paperwork and instant everything. A Certified B-Corp, Lemonade gives unused premiums to nonprofits selected by its community, during its annual Giveback. Lemonade is currently available in the United States, Germany, the Netherlands, France, and the UK, and continues to expand globally.

Follow Lemonade on X and Instagram for updates.

Forward-Looking Statements
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. All statements contained in this press release that do not relate to matters of historical fact should be considered forward-looking statements, including statements regarding the timing and contents of our Investor Day presentation. These statements are neither promises nor guarantees, but involve known and unknown risks, uncertainties and other important factors that may cause our actual results, performance or achievements to be materially different from any future results, performance or achievements expressed or implied by the forward-looking statements. These and other important factors are discussed under the caption “Risk Factors” in our Annual Report on Form 10-K for the fiscal year ended December 31, 2025, and in our other subsequent filings with the SEC. These factors could cause actual results to differ materially from those indicated by the forward-looking statements made in this press release. Any such forward-looking statements represent management’s beliefs as of the date of this press release. While we may elect to update such forward-looking statements at some point in the future, we disclaim any obligation to do so, even if subsequent events cause our views to change.

NEWS & INFORMATION DISCLOSURE
Investors should note we may use our website (investor.lemonade.com), blog (lemonade.com/blog), X (@Lemonade_Inc), and LinkedIn as a means of disclosing information and for complying with our disclosure obligations under Regulation FD. The information we post through these channels may be deemed material. Investors should monitor these channels in addition to reviewing our press releases, SEC filings, and public conference calls.

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SOURCE Lemonade, Inc.

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Integris Composites Joins International Sea Power Conference Aboard HMS Prince of Wales

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Silver Partner at the Royal Navy’s flagship maritime conference highlights lightweight composite armor that protects ships and crews without the weight of steel

OSLO, Norway, Nov. 11, 2026 /PRNewswire/ — Integris Composites, a global engineering company specializing in composite armor and survivability systems, is attending the SEA POWER and the Atlantic Future Forum conferences hosted on HMS Prince of Wales in Oslo, Norway.

Integris armor solutions are protecting surface combatants, patrol craft and the crews who operate them — work that includes ballistic protection for Finland’s new Pohjanmaa-class corvettes and support for the upkeep program for the Royal Navy’s Type 45 destroyers.

Integris is a Silver Partner of the International Sea Power Conference (ISPC 2026), which took place yesterday aboard the Royal Navy aircraft carrier HMS Prince of Wales. ISPC, the Royal Navy’s annual flagship conference, brings together naval leaders, policymakers and industry to consider how maritime nations can deter aggression and protect the sea lanes.

Integris executives are attending the Atlantic Future Forum, which follows aboard the same ship Nov. 11-12.

“As navies add uncrewed, autonomous vessels in the drive for innovation, protection of the crewed ships that now carry more sensors and more weapons cannot be an afterthought,” said Andrew Bonham, president and CEO of Integris Composites. “Integris’ European naval teams have spent years engineering protection into ships, ensuring survivability does not cost a vessel its speed, range or payload.

“ISPC is where the people who will shape the next generation of fleets meet, and we are glad to be part of that conversation,” Bonham said.

A CHANGING THREAT AT SEA

The threat to ships has widened. Attacks on commercial shipping in the Red Sea have shown how drones and missiles can put pressure on a global chokepoint, and Ukraine’s campaign in the Black Sea has shown how quickly uncrewed systems can change the balance between fleets and coastal forces. In the High North and the Arctic, allied navies are operating more often, for longer and in harsher conditions.

“Each of those trends raises the same question: How can you protect vessels, aircraft, land vehicles and sensor technologies and reduce the signature on all of them without adding weight? The answer is an increasing adoption of lighter composite armor systems,” Bonham said.

Integris systems integrate ceramics, ultra-high-strength polyethylene and aramid fibers, high-performance unidirectional (UD) laminates — and at times steel — to provide protection at a fraction of the weight of current armor systems. Lower weight supports speed and maneuverability, fuel economy, mission range and payload flexibility, Bonham said. Integris’ naval protection solutions are deployed on a wide range of vessels worldwide, including patrol craft, corvettes, amphibious platforms and command vessels. The company is also experimenting with emerging materials such as graphene and new high-strength fibers.

PROVEN ON NAVAL PROGRAMS

Integris is supplying its naval ballistic protective systems for four next-generation vessels being built by Rauma Marine Constructions for Finland’s major naval modernization project, Squadron 2020. The Pohjanmaa-class corvettes are intended to secure year-round maritime defense in the icy Baltic Sea.

“We worked together with the shipbuilder to fully integrate the protection into the ship design, meeting survivability requirements without compromising speed, range or payload,” said David Cordova, chief commercial officer of Integris Composites USA.

For the Royal Navy’s Type 45 destroyer upkeep program, Integris is supplying new and replacement ballistic protection systems in collaboration with BAE Systems.

“The lesson of the last few years is that not only does protection have to move at the speed of the threat, but we need to develop intelligent armor that can lower the platform signature,” Cordova said. “Drones and uncrewed systems are changing what ships, vehicles and crews have to survive, and they are changing it in months, not decades.

“We are here, and at other major defense events to bring those of us who design protection closer to those who depend on it. This is key to how we’ll shorten the path from a new threat to a fielded solution,” Cordova said.

Integris has operations in North America, Europe and Asia, with manufacturing in Denmark, France and the United States and offices in the Netherlands and the United Kingdom. The company took part in the Pacific Future Forum aboard HMS Prince of Wales in Tokyo in August 2025.

ABOUT INTEGRIS COMPOSITES

Integris Composites is a global engineering company specializing in composite armor for land vehicles, aircraft, naval vessels, protective housings for optronics and other sensitive technologies, and personal protection. With more than 30 years of experience, the company has earned Tier 1 supplier status with major aerospace original equipment manufacturers, including Bell, Boeing, Airbus and Embraer. Known as TenCate Advanced Armor until it was renamed Integris Composites in 2023, the business has built a reputation for innovative survivability solutions across military, law enforcement and security applications worldwide.

PHOTO: SYMBOL OF PEACE THROUGH DEFENSE: Pleasure craft in front of HMS Prince of Wales, moored in Oslo to host the International Sea Power Conference (Nov. 10) and the Atlantic Future Forum (Nov. 11-12). Photo by David Cordova, Integris Composites.

Media Contact:
David Cordova, Chief Commercial Officer
Integris Composites, Inc.
david.cordova@integriscompositesus.com

Photos:
https://www.prlog.org/13182520

Press release distributed by PRLog

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SOURCE Integris Composites, Inc.

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