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TekStream to Showcase Proactive, Autonomous Cyber Defense at AWS Summit Washington, D.C.

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Company will join Carahsoft to discuss how public sector organizations can move beyond reactive security operations

ATLANTA , June 24, 2026 /PRNewswire/ — TekStream, the digital resilience leader helping organizations modernize, secure and optimize their digital environments, today announced it will attend AWS Summit Washington, D.C., June 30 – July 1, 2026, at the Walter E. Washington Convention Center. TekStream will join Carahsoft at booth 147 to meet with public-sector, education, and enterprise technology leaders to discuss the next era of proactive, autonomous cyber defense.

TekStream is also sponsoring the Carahsoft Networking Reception on June 30 from 6 – 8 p.m. at the Planet Word Museum, where attendees can connect with TekStream, Carahsoft and AWS ecosystem leaders following the first day of the summit.

As AI accelerates the speed and sophistication of cyberattacks, organizations can no longer rely solely on reactive monitoring and response. Security teams need to continuously hunt for adversary activity, reduce exploitable exposure, strengthen detection, and coordinate intelligence across fragmented cloud, identity, endpoint, and infrastructure environments before incidents occur.

At AWS Summit Washington, D.C., TekStream will highlight its proactive cyber defense capabilities powered by Cosmos, the company’s cyber defense intelligence platform. Cosmos helps correlate adversary behavior, exposure intelligence, operational telemetry and detection insights across complex environments to support continuous threat hunting, detection engineering, adaptive deception and operational hardening.

“Security teams are defending against threats moving at machine speed, but too much of security operations still happens at human speed,” said Rob Jansen, CEO of TekStream. “Proactive cyber defense is about changing that model. Organizations need a way to strengthen their existing investments, reduce exposure earlier, and continuously adapt defenses before incidents become business disruptions.”

TekStream’s model is designed to work alongside existing security investments, including MDR/XDR providers, SIEM platforms, cloud security environments, endpoint tools and incident response workflows. The approach helps organizations improve visibility, prioritization and coordination without requiring platform replacement or operational disruption.

“Our work with AWS and Carahsoft helps make advanced cyber defense capabilities more accessible to public-sector organizations that need them most,” said Jonathan Stephan, Managing Director and AWS alliance lead at TekStream. “Carahsoft has been a trusted partner of TekStream for many years, helping government organizations source the services and solutions they need through established contract vehicles. Together with AWS, we’re helping agencies and institutions strengthen their cloud environments, modernize their security operations, and move toward a more proactive cyber defense model.”

TekStream supports public sector and education organizations, including Louisiana State University, New Jersey Institute of Technology, The Ohio State University, George Washington University, NC State University, Southern Methodist University, the University of Alabama, the University of Colorado Boulder, UC Berkeley and Houston City College.

To connect with TekStream during AWS Summit Washington, D.C., visit booth 147 in the Carahsoft Pavilion or attend the Carahsoft Networking Reception on June 30 from 6-8 p.m. at the Planet Word Museum.

About TekStream
Headquartered in Atlanta, Georgia, TekStream is a digital resilience company that helps organizations modernize, secure and optimize their technology environments. Recognized as a Representative Vendor in the 2025 Gartner® Market Guide for Co-Managed Security Monitoring Services, TekStream supports commercial, government and education organizations across complex, hybrid environments. TekStream delivers cloud migration and modernization, managed detection and response (MDR), Security Operations Center (SOC), and workforce consulting services. The company is intentionally vendor-inclusive, integrating and operationalizing the platforms customers already rely on while combining automation with experienced engineering and security teams.

TekStream is known for exceptional customer satisfaction and reliable, on-time and on-budget delivery across hundreds of successful engagements, reflected in a 95+ Net Promoter Score (NPS) and a 98% customer retention rate. In the public sector, TekStream’s unique Whole-of-State cybersecurity approach addresses systemic vulnerabilities through collaboration, shared intelligence and workforce development. The model combines co-managed security operations with workforce development and cost-deferment strategies, enabling organizations to build sustainable programs and maintain long-term ownership of their cybersecurity capabilities.

Media Contact 
Colleen Murphy
Trevelino/Keller
cmurphy@trevelinokeller.com

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SOURCE TekStream

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Smart City Expo 2026 speeds up towards urban solutions that yield real impact

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BARCELONA, Spain, Sept. 8, 2026 /PRNewswire/ — Smart City Expo World Congress (SCEWC), the leading international event on cities and smart urban solutions organized by Fira de Barcelona, will hold its 2026 edition from November 3 to 5 at Barcelona’s Gran Via venue, bringing together 1,000 cities, more than 25,000 attendees, over 1,000 exhibitors and 600 speakers. Under the theme “Urban Solutions, Real Impact,” this year’s edition will place special focus on housing, one of the most pressing challenges facing cities worldwide, while showcasing technologies designed to deliver tangible, scalable impact.

The congress program is structured around seven tracks — Enabling Technologies, Energy & Environment, Mobility, Governance & Economy, Living & Inclusion, Infrastructure & Building, and Blue Economy — spanning digital transformation, artificial intelligence, green energy, governance and social equity.

Over 600 experts will take part in the sessions, including Nikolas Badminton, Chief Futurist and Think Tank leader at Futurist.com, who will share his vision on the future of cities. An artificial intelligence expert, Badminton helps companies and institutions build strategic foresight capabilities, identify the trends shaping the world, anticipate unforeseen risks, and prepare for complex, evolving environments through long-term thinking and scenario planning.

Ayumi Moore Aoki, founder of Women in Tech Global, will also participate in the congress. Her work focuses on the importance of diversity and inclusion as key drivers of innovation in the urban context. Moore Aoki underscores how inclusive leadership can support sustainable urban development at scale. The conference also features Bibiana Aido of UN Women, Bilel Jamoussi of the ITU, and Chiara Corazza of the Women’s Economic Forum, among others.

SCEWC will host the first edition of HOWS Barcelona, a new housing world summit that will focus on topics such as urban planning and land policy, housing regulation, social and affordable housing, and building renovation and reuse, opening a debate on the foundations of a new residential paradigm.

The exhibition floor will host global companies including Google, Microsoft, NVIDIA, Dell Technologies and Deutsche Telekom IoT, alongside a wide range of country and city pavilions and the new “Terra50” showcase, unveiling the world’s top 50 sustainability solutions in the urban field.

SCEWC 2026 will run jointly with Tomorrow.Mobility World Congress, Tomorrow.Blue Economy, HOWS Barcelona, Barcelona Deep Tech Summit, and Barcelona Cybersecurity Congress, consolidating Barcelona as a global meeting point for urban innovation this November.

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SOURCE Fira de Barcelona

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C-TOUCH & DISPLAY SHENZHEN 2026 to Showcase Breakthroughs in Micro LED Optical Interconnects, AI+AR Smart Glasses and TGV Glass Substrates

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SHENZHEN, China, Sept. 7, 2026 /PRNewswire/ — As the global display and smart interaction industry enters a new phase of technological convergence and application expansion, C-TOUCH & DISPLAY SHENZHEN 2026 is set to spotlight emerging technologies and high-growth applications from October 27-29, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an), Halls 10, 12, 14 and 16.

With its 29-edition legacy, the 2026 show occupies 180,000 sqm of exhibition space, 3,600+ exhibitors, 170,000+ professional visitors and 5,000+ overseas buyers.

The exhibition will connect the global display ecosystem with new opportunities spanning Micro LED optical interconnects, AI+AR smart glasses, TGV glass substrates, smart cockpits, OLED flexible displays and advanced semiconductor packaging.

Register Now to network with featured suppliers and gain insights into the latest industry trends: https://isclick.cn/81228

Three Emerging Technology Zones Highlight Next-Generation Growth

A major highlight of the 2026 edition will be three dedicated technology zones designed to connect emerging technologies with commercial applications.

The AI+AR Smart Glasses Zone will bring together leading companies across optical display modules, chips, materials, complete-device development and AI interaction solutions. With AI, spatial computing and lightweight wearable devices rapidly converging, the zone will demonstrate new applications in AR/VR, intelligent mobility, industrial inspection and healthcare.

The Micro LED AI Optical Interconnection & Glass Substrate Advanced Packaging Technology Zone will explore the convergence of display, photonics and AI computing. Technologies including Micro LED optical interconnect chips, CPO optical-module glass substrates, TGV equipment and materials, and intelligent manufacturing solutions will showcase emerging pathways for next-generation data centers and high-speed optical communication.

The TGV Glass Substrate Manufacturing Demonstration Line will provide a visual representation of the complete TGV manufacturing process, covering precision through-glass via technologies, thin-glass processing and advanced manufacturing. The initiative aims to accelerate collaboration among equipment suppliers, material providers, semiconductor packaging companies and end users.

From Display Innovation to Smart Applications

Beyond emerging technologies, C-TOUCH & DISPLAY SHENZHEN 2026 will cover the broader display and touch ecosystem, including Mini/Micro LED, OLED, commercial displays, automotive displays, smart cockpits, electronic paper, touch technologies, semiconductor packaging and consumer electronics manufacturing.

Leading industry players are expected to participate, creating opportunities for global buyers to identify suppliers, evaluate technologies and explore partnerships across multiple segments.

More than 20 professional forums and industry events will be held alongside the exhibition, covering new display technologies, commercial displays, automotive displays, AI+AR smart glasses, Micro LED optical communication and TGV technologies. These programs will provide insights into technology roadmaps, market trends and commercialization opportunities.

Connecting Global Buyers with Asia’s Technology Supply Chain

As a global sourcing and business platform, C-TOUCH & DISPLAY SHENZHEN 2026 connects international buyers with leading technologies, products and supply-chain solutions from across Asia’s display and semiconductor industries.

Through on-site business matchmaking, one-to-one sourcing meetings, international industry exchanges and expert-led discussions, global buyers will be able to efficiently identify qualified suppliers, evaluate advanced solutions, explore new sourcing opportunities and establish valuable business partnerships.

For more information, please visit our website: https://www.quanchu.com.cn/en-gb.html.

RX Kuozhan, a joint venture between Reed Exhibitions and Kuozhan Exhibition Services (Shanghai) Limited, was established in 2015. The company organizes leading B2B trade shows in Shenzhen, including C-TOUCH & DISPLAY SHENZHEN, FILM & TAPE EXPO, COMMERCIAL DISPLAY, AUTOMOTIVE DISPLAY SHENZHEN, ADHESIVES & CHEMICALS EXPO, and HIGHLY-FUNCTIONAL MATERIAL EXPO.

Committed to building one-stop platforms for sourcing, product discovery and industry exchange, RX Kuozhan connects global professionals with innovative technologies and solutions across display and touch, high-performance materials, consumer electronics, automotive electronics, new energy, smart manufacturing, printing and packaging.

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SOURCE RX Kuozhan

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FILM & TAPE EXPO 2026 to Connect Global Buyers with Asia’s Advanced Film, Tape and Coating Technologies

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SHENZHEN, China, Sept. 7, 2026 /PRNewswire/ — Held by Kuozhan Exhibition Services (Shanghai) Limited, as part of ASIA MATERIAL WEEK, FILM & TAPE EXPO 2026 will also benefit from cross-industry connections spanning high-performance materials, adhesives, chemical raw materials and CMF technologies. As demand for high-performance materials accelerates across new energy, consumer electronics, automotive, semiconductors and advanced manufacturing, FILM & TAPE EXPO 2026 will return to Shenzhen from October 27-29, 2026, offering a comprehensive sourcing and technology platform for the global functional film, adhesive tape, coating and converting industries.

Covering 80,000 square meters, the 2026 edition is expected to bring together 1,200+ exhibitors and brands, 60,000+ professional buyers, 30+ technical forums and more than 200 new product launches. The exhibition will showcase the complete industry chain, from functional films and adhesive tapes to adhesives, chemical raw materials, high-performance materials, coating and converting equipment, testing technologies and supporting components.

Register Now to network with featured suppliers and gain insights into the latest industry trends: https://isclick.cn/57DB2

One Platform, Multiple High-Growth Applications

A key feature of FILM & TAPE EXPO 2026 is its application-driven approach, connecting material technologies with real-world procurement needs across major growth sectors.

In new energy and battery applications, exhibitors will showcase battery separator films, aluminum-plastic films, tab adhesives and other materials designed for high safety and energy-density requirements.

The automotive sector will feature TPU paint protection films, window films, color-changing films and advanced battery materials supporting vehicle lightweighting, electrification and intelligent mobility.

For display and touch applications, technologies including TAC films, PMMA films, OCA optical adhesives and optical films for backlight modules will address the evolving requirements of foldable displays, automotive displays and polarization technologies.

The consumer electronics and semiconductor sectors will feature release films, protective films, PI films, thermal-management materials, electronic tapes, wafer tapes and other precision materials supporting smartphones, wearables, electronic components, advanced packaging and semiconductor manufacturing.

Additional solutions will cover PCB/FPC, die-cutting, printing and labeling, flexible packaging, medical applications and industrial materials, enabling buyers to source across multiple applications at a single event.

Complete Supply Chain, From Materials to Manufacturing

The exhibition will bring together four major technology categories: functional films, adhesive tapes, adhesives and chemical raw materials, and converting equipment and components.

Product showcases will span PET, BOPET, BOPP, TPU, optical films, protective and release films, PI films, battery and photovoltaic films, automotive films, electronic and semiconductor tapes, OCA and thermal-management adhesives, coating and laminating systems, die-cutting and slitting equipment, inspection and measurement technologies, and other advanced manufacturing solutions.

With thousands of materials, equipment and processing solutions expected on site, the event provides international buyers with an efficient environment to compare technologies, identify suppliers and explore new applications.

Procurement-Focused Business Matching

Beyond exhibition displays, FILM & TAPE EXPO 2026 will place strong emphasis on measurable business outcomes. The exhibition’s Targeted Attendee Program (TAP) will facilitate more than 3,000 one-to-one business matchmaking meetings, connecting exhibitors with qualified buyers based on specific sourcing requirements.

Professional buyers from functional film and tape manufacturing, die-cutting, consumer electronics, automotive, display and touch, lithium batteries, semiconductors, PCB/FPC, printing and packaging are expected to participate, creating direct opportunities for supplier discovery and business collaboration.

30+ Forums to Explore the Next Wave of Materials Innovation

More than 30 conferences and technical forums will bring together industry experts and senior technology executives to discuss emerging opportunities in advanced PI films, automotive films, semiconductor adhesives, thermal-management materials, battery materials, coating and die-cutting technologies, MLCC materials, robotics and new material applications.

As part of ASIA MATERIAL WEEK, FILM & TAPE EXPO 2026 will also benefit from cross-industry connections spanning high-performance materials, adhesives, chemical raw materials and CMF technologies.

By bringing materials, technologies, applications and buyers together, FILM & TAPE EXPO 2026 aims to help global industry professionals discover new suppliers, identify emerging technologies and unlock the next wave of growth across Asia’s advanced materials supply chain.

For more information, please visit our website: https://www.film-expo.com/en-gb.html

FILM & TAPE EXPO 2026
October 27-29, 2026
Shenzhen World Exhibition & Convention Center (Bao’an), China

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SOURCE Kuozhan Exhibition Services (Shanghai) Limited

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