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SK hynix Unveils First HBF Standard Specifications with Sandisk, Presenting AI Memory Solutions at ‘FMS 2026’

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–  First HBF standard showcased within six months of consortium launch, expanding the ecosystem with participation from Google, Tenstorrent
–  Keynote by SK hynix Executive Vice President Kim Chun-sung and Vice President Kang Uk-song on opening day, offering solutions for next-generation AI infrastructure based on ‘Tiered Memory’
–  Panel discussion with Google DeepMind•Sandisk on ‘Breaking the Memory Wall with HBF’
–  Tenth-generation (V10) 375-layer 4D NAND unveiled for the first time at exhibition booth, offering a 2.5 times increase in power efficiency
–  “Expanding the boundaries of memory and storage through HBF technology… contributing to new architectures that boost system efficiency”

SEOUL, South Korea, Aug. 3, 2026 /PRNewswire/ — SK hynix Inc. (or “the company”, www.skhynix.com) announced today (GMT+9) in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth Flash (HBF), a next-generation storage technology.

The announcement coincides with the opening of ‘FMS (Future of Memory and Storage) 2026,’ held at the Santa Clara Convention Center in California from August 4 to 6 (local time). The company is set to present HBF as a key technology to overcome memory bottlenecks in the AI era through keynote speeches and panel discussions during the event.

HBF technology is a new memory layer between HBM and SSDs. It enables high-speed data transfer similar to HBM while significantly expanding capacity by leveraging NAND technology. With the expansion of AI inference driving a surge in data volumes to process, HBF is gaining attention as a technology that simultaneously resolves bandwidth and capacity scalability challenges.

This milestone comes about six months after launching the consortium in February this year, following the initial standardization partnership with Sandisk in August 2025. Capacity specifications cover up to 512GB based on two stack configurations (8-high and 16-high NAND dies). Bandwidth is categorized into three grades (Grade1~3), delivering scalable performance from approximately 0.4TB/s to 3.0TB/s.

A key highlight is the interconnect linking HBF technology and processors. HBF technology adopts UCIe1, an industry standard connection interface, laying the groundwork to flexibly integrate HBF technology across different processor types, including GPUs and CPUs.

1 UCIe (Universal Chiplet Interconnect Express): An open standard interface specification designed for high-speed interconnection of heterogeneous semiconductor chiplets.

The standard also outlines connection interfaces and electrical characteristics, reliability and packaging guidelines for HBF die stack process, software I/O guidelines.

The specification was disclosed through the Open Compute Project (OCP), world’s largest open data center technology initiative, positioning it as an open standard for the entire industry rather than a proprietary technology.

SK hynix plans to leverage this release to expand the adoption of HBF technology in the AI storage market and foster the surrounding ecosystem. With Google and Tenstorrent currently participating in the HBF consortium, the consortium aims to expand its reach while enhancing technical maturity and market acceptance based on open collaboration.

On the opening day of FMS 2026 (August 4, local time), SK hynix Executive Vice President Kim Chun-sung (Head of Solution Development) and Vice President Kang Uk-song (Head of Next Generation Product Planning) will deliver a joint keynote address, titled ‘Orchestrating Efficient AI Infrastructure through Tiered Memory in the Era of Agentic AI.’

As Agentic AI2 rapidly commercializes, the volume of data to process is surging alongside growing demands for higher speed and efficiency. Recognizing that a single memory type cannot address these complex challenges, both speakers will present the necessity and future direction of a next-generation architecture based on ‘Tiered Memory’, a framework that connects and optimizes diverse memory types into a unified system.

2 Agentic AI: Advanced Agent AI systems capable of autonomously setting goals, formulating plans, and executing tasks without human intervention.

On August 6, SK hynix Vice President Lim Eui-cheol (Head of Solution AT), Sandisk Vice President Rajeev Nagabhirava and Google DeepMind Senior Staff Engineer Xiaoyu Ma will join a panel discussion titled ‘Breaking the Memory Wall with High Bandwidth Flash.’ Bringing together key leaders across memory, storage and AI, the session will examine fundamental shifts in memory architecture across AI infrastructure and highlight the potential and role of HBF as a transformative solution.

Furthermore, SK hynix will host an exhibition booth throughout FMS 2026, featuring a Partnership Zone, a Next-Generation Tech Zone and Tech Sessions.

Notably, the company will publicly reveal for the first time its tenth-generation (V10) 375-layer 4D NAND wafer and products, which are currently under development. The 375-layer 4D NAND improves performance per watt by 2.5 times compared to the previous generation, making it optimized for AI infrastructure environments like data centers that demand high power efficiency and performance. The company plans to initiate mass production of high-performance, high capacity eSSDs based on the 375-layer 4D NAND early next year to reinforce its leadership in the AI NAND market.

SK hynix will also display a versatile product lineup spanning mobile, PC, automotive and robotics, showcasing the company’s competitive edge in memory technology and its collaborative achievements with customers in the AI era.

“With the rapid spread of AI applications, we are at a point where overall data processing structures must be redesigned,” said SK hynix Executive Vice President and Head of Solution Development Kim Chun-sung, adding, “Through HBF, SK hynix will expand the boundaries between memory and storage and contribute to building new architectures that enhance overall system efficiency.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”) and flash memory chips (“NAND flash”) for a wide range of distinguished customers globally. The Company’s common shares are traded on the Korea Exchange, its American Depositary Shares are traded on NASDAQ, and its Global Depository Shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Forward-Looking Statements

This press release may contain forward-looking statements, which involve risks and uncertainties. These statements are generally identified words such as “may,” “will,” “intend,” “should,” “believe,” “expect,” “anticipate,” “project,” “estimate” and similar expressions, or the negative of such expressions. Forward-looking statements are not guarantees of future performance and are subject to inherent risks, uncertainties, and other factors that could cause actual results to differ materially from those expressed or implied. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. SK hynix undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law.

This press release is for informational purposes only and does not constitute an offer to sell or a solicitation of an offer to buy any securities in any jurisdiction. No part of this press release should form the basis of, or be relied upon in connection with, any contract, commitment, or investment decision.

 

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SOURCE SK hynix Inc.

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Play Yellow Tees Up as Charity Beneficiary of Inaugural Austin Championship to Support Children’s Healthcare

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November 11, 2026

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Delta Air Lines to sponsor Play Yellow Sunday, celebrating local patient families and supporting Dell Children’s Medical Center through Children’s Miracle Network

AUSTIN, Texas, Nov. 11, 2026 /PRNewswire/ — Play Yellow, a fundraising program of Children’s Miracle Network (CMN), is excited to be part of the inaugural Austin Championship presented by Compliance Solutions, bringing its mission of supporting children’s healthcare to the course and the local community. Proceeds from the tournament will benefit Play Yellow and provide significant support to the local children’s hospital, Dell Children’s Medical Center, and the surrounding community.

Play Yellow unites the golf community to support children’s healthcare across the U.S. and Canada. Founded through a partnership between Jack and Barbara Nicklaus, Children’s Miracle Network and the PGA Tour, Play Yellow invites golfers, tournaments and fans to turn their passion for the game into life-changing care.

“Our partnership with the PGA Tour and events like the Austin Championship presented by Compliance Solutions reminds us what’s possible when a community comes together for kids,” said Becca Evans, National Director of Play Yellow, Children’s Miracle Network. “We’re grateful for every golfer, fan, and partner who helps make big change for all kids.”

Delta Air Lines Sponsors Play Yellow Sunday

Delta Air Lines is sponsoring Play Yellow Sunday. By wearing yellow and fundraising through golf, the Play Yellow community elevates the level of care at local children’s hospitals.

Ten patient families will join Children’s Miracle Network on the course, wearing caddie bibs featuring the Delta Air Lines logo. Some children will have the opportunity to walk a hole alongside a PGA Tour professional, while others will join the action by helping as honorary caddies on the 18th green. Among the participating children is Jett Payne, the local Children’s Miracle Network champion.

After a difficult delivery, Jett began experiencing seizures and was transferred to Dell Children’s Medical Center, where an MRI revealed multiple strokes that likely occurred before or during birth. He spent 12 days in the Neuro-NICU, where specialized care helped stabilize his seizures and support his recovery. Today, Jett is a thriving 2-year-old who is walking, talking, and exceeding milestones. He will be joined by his parents, Ryann and Brad Payne, and his brother, Briggs, age 9.

Supporting Dell Children’s Medical Center

Dell Children’s, a hospital within Children’s Miracle Network, has partnered with CMN for nearly 40 years. Since opening in 2007, Dell Children’s Medical Center has served as Central Texas’s only freestanding pediatric Level I trauma center, bringing world-class children’s healthcare to families in their own community. From pediatric heart and bone marrow transplants to expanding access to pediatric mental health care, Dell Children’s continues to advance what’s possible for children across Central Texas.

“Every day at Dell Children’s, we see the difference that access to specialized pediatric care makes in the lives of children and their families,” said Megan Campuzano, Senior Director, Annual Giving, Dell Children’s Medical Center. “The generosity of our community supports that care, allowing us to expand what we can do for children across Central Texas. We are grateful to Play Yellow, Children’s Miracle Network, the PGA Tour, and every supporter making this event a reality. It is meaningful to see our patient families recognized on such a special stage and to have our community unite behind a brighter future for all kids.”

Play Yellow Ambassadors Lead the Way

Helping bring the CMN mission to life on the course, Play Yellow’s ambassadors Patrick Fishburn, Hank Lebioda, Justin Lower, Kevin Roy, Max McGreevy, Peter Malnati, and Neal Shipley will also take the course in Austin, continuing to use their platforms to rally golfers, fans, sponsors, and communities around the shared mission of supporting children’s healthcare.

To learn more about Play Yellow, explore its ambassadors, start your own golf fundraiser, or find ways to get involved, visit playyellow.cmn.org.

About Children’s Miracle Network:

For more than 40 years, Children’s Miracle Network® has been a symbol of hope, elevating possibilities for every child in need of care. As the leading charity impacting children’s healthcare, we unite people, partners and programs to raise urgently needed funds for children’s hospitals across the U.S. and Canada.

Wherever you see our iconic balloon, you’ll find donors, corporate partners and fundraising programs joining forces to help hospitals meet their most critical needs—from life-changing care and advanced equipment to innovative research and family support. Every dollar raised benefits the local children’s hospital, bringing brighter futures within reach for all kids.

Learn more at cmn.org.

About Play Yellow:

Play Yellow, a Children’s Miracle Network program in partnership with Jack and Barbara Nicklaus and the PGA Tour, unites the golf community to turn their passion for the game by raising funds for life-changing care for all kids.

Media Contact:
Christina Vitale | cvitale@cmn.org | 908-839-2152

On-Site Contact:
Samantha Edwards | sedwards@cmn.org |812-243-2159

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SOURCE Children’s Miracle Network

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Gushine Brings Global Manufacturing Capabilities and Custom Battery Solutions to electronica 2026

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November 11, 2026

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MUNICH, Nov. 11, 2026 /PRNewswire/ — Gushine Electronics, a specialist in custom lithium battery solutions, is showcasing its battery engineering expertise and international manufacturing capabilities at electronica 2026, held November 10–13 in Munich, Germany. At Hall A5, Booth 275, the company is presenting custom battery solutions for robotics, industrial automation, medical equipment, and industrial handheld devices.

Manufacturing Operations Across China and Vietnam

Founded in 2011 and headquartered in Zhuhai, China, Gushine provides custom battery pack development and manufacturing services for OEM customers worldwide.

Building on its established R&D and manufacturing operations in China, Gushine began production operations in Vietnam in 2025. The facility continues to develop its production processes and manufacturing capabilities, focusing on battery packs for handheld terminals and smart devices while complementing the company’s operations in China.

Custom Battery Solutions for Robotics and Industrial Applications

As automation expands across manufacturing, warehousing, and commercial services, equipment manufacturers face increasingly diverse requirements for battery runtime, performance, safety, and system integration.

At electronica 2026, Gushine is highlighting custom battery solutions for automated guided vehicles (AGVs), autonomous mobile robots (AMRs), warehouse automation equipment, and commercial service robots.

The company is also showcasing battery solutions for robotic lawn mowers, cleaning robots, medical carts, rugged handheld terminals, and surveying instruments.

Gushine’s engineering capabilities span cell selection, mechanical design, battery management system (BMS) development, and communication integration. This approach enables battery systems to be tailored to the operating conditions and technical requirements of different applications.

Strengthening Long-Term Partnerships in Europe

Europe’s diverse innovation ecosystem, particularly in industrial manufacturing, automation, medical technology, and specialized equipment, offers opportunities for long-term technical collaboration.

“European companies demonstrate strong engineering expertise and a commitment to innovation. We believe meaningful innovation begins with understanding real-world application needs. By working closely with our customers, we aim to help turn their ideas into reliable, market-ready products through customized battery engineering,” said Jack Yu, Vice President at Gushine.

Gushine remains committed to strengthening relationships with European OEMs, building lasting technical partnerships, and supporting the development of next-generation equipment and technologies.

Visit Gushine at electronica 2026: Hall A5, Booth 275, Messe München, November 10–13.

View original content to download multimedia:https://www.prnewswire.co.uk/news-releases/gushine-brings-global-manufacturing-capabilities-and-custom-battery-solutions-to-electronica-2026-302936635.html

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AICPA & CIMA’s first-ever China’s ENGAGE Asia Conference 2026 concludes the future of accounting and finance will be defined by trust, talent, and human judgement

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November 11, 2026

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SHANGHAI, Nov. 12, 2026 /PRNewswire/ — ENGAGE Asia Conference 2026 brought together 600 business, finance and technology leaders from across Asia and around the world to explore the trends, opportunities and challenges shaping the future of organisations and the accounting and finance profession.

Under the theme The Next Wave – Transformative Innovation, discussions covered the impact of AI on finance; business and leadership; the future of talent and workforce transformation; long-term value creation; China’s global ambition; and the growing importance of trust in an increasingly complex world.

Throughout the two-day conference, speakers and delegates also examined how organisations can harness technology while strengthening human judgment, adaptability and ethical leadership, reinforcing the critical role accounting and finance professionals play in driving innovation, resilience and sustainable growth in a rapidly changing global economy.

Mark Koziel, CPA, CGMA, President & CEO of AICPA & CIMA said, “The ENGAGE Asia Conference 2026 has demonstrated the tremendous energy, innovation and leadership emerging from China and Asia’s business community. The conversations, together with the insights from our RISE2040 initiative, reinforce that the future of accounting and finance will be defined not only by technological advancement, but by our ability to combine AI with trust, talent and human judgment. Accounting and Finance professionals have a vital role to play in creating sustainable value and helping businesses thrive. The ideas and connections sparked here in Shanghai will help shape the next wave of leadership and progress.”

Vicky Li, Vice President, North Asia, AICPA & CIMA, said, “Hosting the ENGAGE Asia Conference in Shanghai for the first time, in conjunction with CIMA China’s 20th anniversary, reflects both the growing importance of both China and Asia in the global economy and the region’s commitment to innovation and talent development. Over the past two days, we have brought together diverse perspectives from business, accounting, finance, technology and academia to explore how organisations can thrive in a rapidly changing world. We are proud to provide a platform that equips professionals with the insights, skills and connections needed to lead with confidence in the future.”

In August 2027, the Engage Asia Conference moves to Malaysia.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/aicpa–cimas-first-ever-chinas-engage-asia-conference-2026-concludes-the-future-of-accounting-and-finance-will-be-defined-by-trust-talent-and-human-judgement-302936798.html

SOURCE AICPA & CIMA

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