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Para Light Launches ThermaFlat™ SiC MOSFETs to Break the Thermal Barrier in High-Power Applications

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Breakthrough ultra-low RDS(on) drift technology delivers higher efficiency, greater power density, and enhanced reliability for next-generation power systems.

NEW DELHI, Aug. 5, 2026 /PRNewswire/ — Para Light Electronics today announced the official launch of its ThermaFlat™ SiC MOSFET family (ThermaFlat™ I and ThermaFlat™ II), targeting a fundamental thermal challenge in next-generation high-power design. Powered by Para Light’s Ultra-Low RDS(on) Drift Technology, the new semiconductor portfolio breaks through one of the industry’s most persistent technical bottlenecks—delivering exceptional thermal stability, reduced conduction losses, and unmatched reliability across rapidly expanding electrification markets.

Solving Power Electronics’ Most Persistent Bottleneck

The global transition toward electrification—driven by artificial intelligence (AI), high-performance computing (HPC), renewable energy, electric vehicles (EVs), and energy storage—is forcing power systems to deliver higher output within smaller, cooler, and more efficient footprints.

Yet conventional silicon and SiC MOSFETs face a built-in constraint: temperature-dependent RDS(on) drift. As junction temperatures rise in standard devices, escalating on-resistance can trigger a costly cycle of higher conduction losses, excessive heat generation, and expanded cooling requirements, ultimately degrading system efficiency and long-term reliability, while potentially increasing thermal management costs.

~8% Resistance Drift: Redefining Thermal Stability

Para Light’s ThermaFlat™ technology directly redefines this thermal dynamic. Unlike standard SiC MOSFETs, ThermaFlat™ devices maintain virtually flat on-resistance across wide operating temperatures while sustaining exceptionally low switching losses.

In benchmark testing of Para Light’s 650 V, 21mΩ TO-247 device, RDS(on) changes by only approximately 8% as junction temperature swings from -25°C all the way to +125°C. By drastically outperforming conventional SiC temperature coefficients, this ultra-stable performance allows designers to preserve high efficiency under heavy load, simplify thermal management, boost power density, and reduce overall system costs without sacrificing reliability. The 1200 V ThermaFlat™ family applies a similar ultra-low temperature coefficient to mission-critical, high-power conversion architectures.

ThermaFlat™ I & II: Architecture-Ready Versatility

To support diverse design topologies, Para Light has structured the portfolio into two specialized series:

ThermaFlat™ I Series: Offers 650 V and 1200 V options in industry-standard packages, compatible with mainstream converter topologies to accelerate development cycles and simplify integration.ThermaFlat™ II Series: Integrates Ultra-Low RDS(on) Drift with a High VGS(th) architecture for enhanced noise immunity and false turn-on prevention. Operating without the need for a negative gate-off voltage supply, ThermaFlat™ II enables engineers to streamline gate-driver circuitry, cut component count, lower BOM costs, and enhance system robustness.

For the full product portfolio specifications, please visit our official website at https://www.para.com.tw/en/news/%e5%85%89%e9%bc%8e%e9%9b%bb%e5%ad%90%e6%8e%a8%e5%87%ba-thermaflat-sic-mosfet-%e7%b3%bb%e5%88%97/ 

Accelerating High-Growth Power Applications

The ThermaFlat™ lineup empowers power systems R&D engineers to not only streamline system design but also lower overall costs across medium- to high-power applications, including AI data center and server power supplies, BBU and UPS systems, EV charging stations, grid-connected energy storage systems (ESS), photovoltaic (PV) inverters, variable frequency drives (VFD), and industrial automation. Para Light is continuously expanding the portfolio with additional voltage classes, current ratings, and package configurations.

Integrated Manufacturing & Global Supply Resiliency

Para Light’s expansion into advanced power semiconductors is anchored by three strategic strengths:

Superior Manufacturing Quality: High wafer yields, dedicated in-house packaging, and stringent process controls ensure exceptional product consistency and proven long-term field reliability.Lower Total Cost of Ownership: Vertical integration across device design, packaging, and supply chain management delivers premium power performance at optimized overall system costs.Uninterrupted Global Supply: Strategic production planning, safety inventory frameworks, and responsive logistics minimize supply-chain risk for international customers.

Building on Decades of Operational Excellence

Leveraging extensive expertise in device design, wafer collaboration, advanced packaging, and supply chain management, Para Light has established a comprehensive range of IGBT and SiC MOSFET solutions. Expanding on decades of manufacturing leadership in the LED industry, the company operates a robust global footprint across Taiwan, China, the United States, India, and Myanmar.

As demand for intelligent power conversion escalates, Para Light remains committed to advancing semiconductor innovation—partnering with global OEMs to power the next generation of AI infrastructure, clean energy, and high-efficiency power systems.

# Media & Sales Contact:

India –  Abhinav Jha: (+1) 5196710998 | abhinav.jha@para-india.com 
            Sunil Kumar: (+91) 892-047-8061 | bd1@para-india.com

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UK digital pathology provider Source BioScience chooses Sectra to enable seamless pathology collaboration across the NHS

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LINKÖPING, Sweden, Sept. 21, 2026 /PRNewswire/ — International medical imaging IT and cybersecurity company Sectra (STO: SECT B) has signed an agreement with Source BioScience UK Ltd (Source BioScience) in the UK to deliver its service for advanced share and collaborate workflows. As the first Sectra customer in this domain, Source BioScience will now be able to support NHS organisations that need to send pathology cases to external specialists. This lays the foundation for national telepathology networks in the UK, and for improved access to specialist pathologists.

The service, Sectra Image Exchange Portal (Sectra IEP), is a cloud-based, vendor-neutral platform for exchanging and collaborating around medical images. It is already used by more than 500 institutions, mainly within radiology. Recently, the service has undergone substantial modernisation which now makes it possible for healthcare providers to benefit from new advanced workflow functionality, for the service to be used by specialties other than radiology and for customers to move beyond image sharing to managing workflows between organisations.

“This milestone integration will give the NHS a seamless digital pathway to external specialists, with diagnoses delivered straight back into its own records – reducing turnaround times, easing consultant shortages and tackling reporting backlogs,” says Nick Bills, Healthcare Director at Source BioScience.

Source BioScience is a UK laboratory services provider specialising in histopathology and genomics. Its pathology business supports more than 85 NHS trusts alongside a network of private healthcare clinics, with histopathology delivered from laboratories in Nottingham, Chichester and Cambridge.

NHS pathology services are handling growing case volumes with a limited number of reporting consultants, and increasing subspecialisation means the pathologist best suited to a case is often at another organisation. Sending work to external capacity providers today typically relies on bespoke arrangements between individual laboratories, including the transportation of physical glass slides. This slows reporting times and creates administrative overhead for both the sending and receiving laboratories. With Sectra’s service, a case can be created as a job directly from a laboratory’s worklist, delegated to a receiving organisation, and the completed report returned to the referring organisation’s own records.

“IEP is the backbone of image sharing across the NHS. With our modernised platform, we are introducing advanced workflows between healthcare organisations, and extending that trusted national network into pathology. Connecting trusts directly with external specialists like Source BioScience means cases and completed reports move seamlessly across organisational boundaries. It is a step towards an NHS where expertise is always within reach, and where work moves between organisations as easily as it moves within them,” says Jane Rendall, Managing Director for Sectra UK and Ireland.

The three-year contract was signed in the second quarter of Sectra’s 2026/2027 fiscal year. Up to 60,000 cases are expected during the first year, scaling up in subsequent years.

Source BioScience Media Contact:
Klaudyna Johnstone, Commercial Director, klaudyna.johnstone@sourcebioscience.com 

CONTACT:

For further information, please contact: Dr. Torbjörn Kronander, CEO and President Sectra  AB, 46 (0) 705 23 52 27
Marie Ekström Trägårdh, Executive Vice President Sectra AB and President Sectra Imaging IT Solutions, 46 (0)708 23 56 10

This information was brought to you by Cision http://news.cision.com

https://news.cision.com/sectra/r/uk-digital-pathology-provider-source-bioscience-chooses-sectra-to-enable-seamless-pathology-collabor,c4398521

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askelie® opens its Operational AI Platform to customers and partners

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New platform makes proven AI capabilities available for MSPs, software vendors and business users to configure and compose

LONDON, Sept. 21, 2026 /PRNewswire/ — askelie® today announced the launch of its Operational AI Platform, opening the proven technology behind its enterprise AI solutions to MSPs, software vendors and business users.

The platform enables customers and partners to configure and compose AI-powered solutions using proven, reusable askelie capabilities. Rather than building an AI foundation from scratch, organisations can combine existing capabilities to address real business needs — providing a practical route from AI ambition to business value, with faster time to value, lower cost and less risk.

“We’ve spent years using askelie to rapidly deliver enterprise-grade AI solutions. What we’re doing now is opening that capability up,” said Derek Kilroe, CEO and Founder, askelie. “For the first time, MSPs, software vendors and business users can take proven AI capabilities and configure and compose their own solutions for real business operations — without having to build the underlying AI platform themselves.”

Built around Understand • Decide • Act • Control, the platform brings together AI intelligence, data, knowledge, workflows, enterprise integrations, security and governance.

At launch, customers and partners can configure and compose existing capabilities to create and adapt AI-powered Assistants and Automations around specific business needs. The platform provides the foundation for increasingly sophisticated AI applications, including Digital Workers and Autonomous Applications.

“Customers shouldn’t have to assemble an AI technology stack before they can solve a business problem,” said Ian Halliday-Pegg, Chief Product Officer, askelie. “askelie brings the capabilities needed for operational AI together in a platform that can be combined and reused for different needs.”

The platform is designed to be practical, affordable and trusted. Proven, reusable capabilities reduce the need to build enterprise AI from scratch; model choice and consumption-based pricing help control costs; and security, governance, human oversight and auditability are built into the platform.

The platform also enables MSPs to configure and reuse AI-powered services across customers, while software vendors can extend existing products, enhance them with external data and context, and configure new AI-powered capabilities.

The askelie Operational AI Platform is available from 21 September 2026.

For more information, visit www.askelie.io

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SOURCE AskELIE Limited

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Huawei Upgrades Stellar AI WAN Solution to Drive All Intelligence Across Industries

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SHANGHAI, Sept. 21, 2026 /PRNewswire/ — At HUAWEI CONNECT 2026, Huawei unveiled its upgraded Stellar AI WAN Solution. Centered on ultimate computing efficiency and multi-dimensional security, this solution addresses cross-region computing challenges in efficiency, cost, and security, driving all intelligence across industries in the AI era.

Stellar AI WAN for Intelligent Connectivity

Amid the rapid expansion of AI computing power, deploying new compute infrastructure in the West has made remote invocation the new norm. However, traditional networks face three critical issues relating to cross-region computing.

Severe efficiency loss: Invoking computing power across 1,000 km can incur a 37% efficiency loss from a mere 0.073% packet loss.High on-premise costs: Local compute deployment costs from 1 million RMB per branch.Expensive private lines: Enterprises spend around 1.2 million RMB annually on 10G private lines.

To address this, Leon Wang, President of Huawei’s Data Communication Product Line, introduced the Stellar AI WAN Solution, enabling lossless delivery of computing power over 1,000 km for a local-like remote computing experience. The XH computing-network appliance uses a unique layerwise model partitioning algorithm to run the initial and final layers of inference locally while offloading intermediate layers to remote infrastructure. With the network transmitting only high-dimensional vectors, raw data remains on-premises. The appliance requires just two xPUs to match a traditional 8-xPU setup, slashing xPU costs by 75%. The updated Starnet lossless algorithm cuts bandwidth idle time by over 80% and reduces required bandwidth fivefold, further lowering cross-region computing costs.

Stellar AI WAN for Security

As global security threats intensify, novel vectors like APTs and HNDL attacks continue to emerge. To address these, Huawei provides a three-layer defense for WANs.

Device layer: Intrinsic security boards detect and block intrusions in real time, tracing threats within minutes at over 95% accuracy.Link layer: Built-in QKD delivers robust quantum security without extra devices or fibers, slashing costs by over 60%. An adaptive noise suppression algorithm extends QKD transmission past 80 km.Network layer: APN6-based data fencing enables network-wide control over traffic paths, ensuring data travels exclusively within secure networks with intrinsic security and quantum encryption deployed.

Looking ahead, Huawei will continually upgrade the Stellar AI WAN Solution, deepening its computing-network synergy and multi-dimensional security. Together with partners, Huawei aims to reinforce the intelligent network foundation and accelerate all intelligence across enterprises.

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SOURCE Huawei

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