The beloved kitchen appliance brand launches four powerhouse tools designed to bring flexibility, performance, and portability to everyday cooking

NEW YORK, Aug. 6, 2026 /PRNewswire/ — Dash, the kitchen appliance brand that has made homemade cooking accessible and joyful for millions, is cutting the cord and changing the game with its first-ever Cordless Collection: four powerful, battery-powered tools designed to free you from outlet-dependent cooking. Whether you’re blending by the pool, chopping at the counter, or mixing anywhere inspiration strikes, these appliances deliver professional-grade performance with the freedom to move.

Explore the all-new lineup:

Cordless Mini Chopper (SMP $79.99): Prep faster, clean faster. The Dash Cordless Mini Chopper delivers sharp, efficient performance without the bulk of a traditional food processor. The ultra-sharp stainless steel blade slices through ingredients with precision, while the included Whisking Plate handles delicate work, like guacamole, with a softer touch.Cordless Immersion Blender (SMP $79.99): Blend anything anywhere with the Dash Cordless Immersion Blender, bringing professional blending performance wherever you need it. The ergonomic handle and one-handed operation work seamlessly in pots, pitchers, or bowls. The included Blending Cup & Lid lets you blend and store in one vessel. Soups, smoothies, sauces, whipped cream and more are just a blend away.Cordless Hand Mixer (SMP $79.99): All the power, none of the cord. The Dash Cordless Hand Mixer delivers up to 37 minutes of continuous mixing on a single charge – enough for fluffy whipped cream, thick pancake batter, and everything in between. The Turbo Button gives you an extra burst of speed when you need it, while the lightweight design makes it easy to maneuver around bowls and countertops.Cordless Personal Blender (SMP $79.99): Think smoothies anywhere, any time. The Dash Cordless Personal Blender whips up 17 ounces of smoothies, shakes, and frozen drinks in seconds – from your kitchen to the patio to the gym. Its ultra-sharp stainless-steel blades tackle soft fruits and ice alike, while the included Travel Cup & Lid lets you blend and sip on the go.

Every appliance in the Cordless Collection is powered by a rechargeable Lithium-Ion Battery — included with each purchase — that’s compatible across all four tools, so you can swap batteries between devices and keep your cordless momentum going.

You can also purchase all four powerhouse tools and charger through the Cordless Collection Bundle, available at a special bundle price of $299.99 (SMP). Additional chargers are available separately for customers who want to keep a backup on hand.

“The Cordless Collection represents what we’re hearing from our customers: they want kitchen tools that work as hard as they do and fit seamlessly into their lives,” said Evan Dash, CEO of StoreBound. “That’s exactly why we cut the cord. So, a student can blend a smoothie in their dorm before class, a tailgate crew can whip up frozen drinks in the parking lot, and friends can stay out on the patio while preparing dinner on the grill and making drinks. Freedom like that really changes how you cook.”

The Cordless Collection is available now at ByDash.com and Amazon. To explore the full Dash lineup, discover cordless recipe inspiration, and shop the collection, follow @byDash on Instagram and TikTok.

ABOUT DASH
Dash is committed to helping people make healthy, unprocessed food at home. Grounded in the belief that taking small steps every day to live a healthier life and eating whole, natural foods can make a big impact, Dash provides the tools and content to help consumers make delicious and healthy meals at home.

ABOUT STOREBOUND
StoreBound is a family of brands bound by innovation. Leveraging a fully integrated model of concept development, engineering, manufacturing, logistics, sales, marketing, and business management, StoreBound develops quality products and manages their performance at key retailers. With thoughtful, well-designed home and housewares products, StoreBound’s aim is to win the hearts of customers worldwide.

MEDIA CONTACT: StoreBound@golin.com 

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SOURCE StoreBound

Professional conference and Student AI Challenge will explore how communications organizations are preparing for an AI-powered future

COLUMBIA, S.C., Aug. 6, 2026 /PRNewswire/ — The University of South Carolina’s School of Journalism and Mass Communications will bring together some of the nation’s leading voices in media, advertising, public relations and corporate communications this fall for a two-day event examining how artificial intelligence is transforming communications.

The conference – AI in Media, Advertising & Public Relations – will be held Friday, Oct. 9, at the Russell House University Union on the University of South Carolina campus.

A companion Student AI Challenge will take place Saturday, Oct. 10, giving university students from across South Carolina the opportunity to collaborate in interdisciplinary teams, tackle a real-world communications challenge using artificial intelligence and compete for cash prizes totaling $15,000.

Featured speakers include:

Andrew Robertson, Chairman, BBDO WorldwideValerie Vargas, Senior Vice President, Creative Content & Advertising, AT&TPorter Berry, President & Editor-in-Chief, FOX News DigitalBenjamin Vaughan, Head of AI Research, Vurvey LabsRobby Thomas, Vice President and General Manager, WIS-TV / Gray MediaStephen Brown, President, Cookerly PRPeter LaMotte, President of Strategic Communications, Chernoff NewmanUniversity of South Carolina faculty experts in artificial intelligence, creativity and strategic communications

The conference will examine how organizations are integrating AI into newsrooms, creative agencies, corporate communications and marketing organizations while preparing their workforce for an AI-powered future.

Interactive workshops, executive conversations and industry discussions will provide attendees with practical insights into leadership, creativity, human-AI collaboration and organizational transformation.

“The communications professions are experiencing one of the most significant periods of change in their history,” said Tom Reichert, dean of the College of Information and Communications. “This conference brings together leaders who are navigating that change every day. Our goal is to create meaningful conversations that help professionals, educators and students better understand how AI is reshaping journalism, advertising and public relations while reinforcing the importance of creativity, ethics and human judgment.”

The conference is designed for professionals working in journalism, advertising, public relations, marketing, corporate communications, media and higher education, as well as university students preparing for careers in those fields.

The Student AI Challenge on Saturday will challenge teams to solve a real-world communications problem using artificial intelligence, research, strategy and creativity while receiving mentorship from industry professionals.

The top three teams will be awarded prizes. The first-place team will receive $7,500 to be shared among the individuals. No coding or technical skills are needed to participate.

The conference is presented in partnership with the South Carolina Research Authority (SCRA), Google, Vurvey Labs and other industry partners.

For more information and to register, visit: https://sc.edu/study/colleges_schools/cic/initiatives/ai/ai_conference/

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SOURCE University of South Carolina School of Journalism and Mass Communications

Smart IOPS Unobtanium™ T50 SSD and H3 Platform’s GPU-centric appliance bring compute, networking and ultra-high-IOPS flash together for NVIDIA Storage-Next™ and SCADA-enabled AI infrastructure

MILPITAS, Calif. and NEW TAIPEI CITY, Taiwan, Aug. 6, 2026 /PRNewswire/ — Smart IOPS, Inc., a provider of high-performance enterprise storage solutions, and H3 Platform, a pioneer in AI and composable IT infrastructure, today announced world’s first one billion IOPS capable AI Compute Storage solution. The solution integrates Smart IOPS Unobtanium™ T50 solid-state device with a new H3 Platform appliance built for the recently announced NVIDIA AI infrastructure, NVIDIA networking technologies.

The solution is being engineered for the emerging class of data-intensive AI Inference applications that require GPUs to access very large datasets through fine-grained, highly parallel I/O. It is designed to support NVIDIA’s Storage-Next initiative and the NVIDIA SCADA (Scaled Accelerated Data Access) programming model. NVIDIA Storage-Next and NVIDIA SCADA enable GPU-initiated storage access for workloads whose working sets extend beyond local GPU memory. By shortening the path between GPU compute and NVMe storage, the companies aim to reduce CPU control-path overhead, keep accelerators supplied with data and improve infrastructure utilization for AI inference and data analytics.

At the center of the announcement is the Smart IOPS AI Compute Storage™ or ACS device, Unobtanium™ T50. The PCIe Gen6 x4, NVMe 2.0 ACS device in an E3.S form factor is slated to deliver up to 50 million random-read IOPS and up to 10 million random-write IOPS at a highly granular 512-byte block size, together with up to 28 GB/s sequential reads and 24 GB/s sequential writes. Four such T50 devices can provide an aggregate device-level target of up to 200 million random-read IOPS—to align with the I/O capability of next-generation PCIe Gen6 x16 GPUs like NVIDIA Rubin. Actual system performance will depend on workload, software, topology, configuration and other system-level factors.

A pathbreaking attribute of the Smart IOPS TruRandom® controller architecture is its use of broadly available TLC NANDs operated in pseudo-SLC mode to deliver the extreme IOPS. Because the standard TLC NAND can be sourced from multiple qualified suppliers, Smart IOPS ACS device benefits from the flash industry’s manufacturing scale, supply-chain resilience, and cost efficiencies. ACS devices, however, can also support specialized low-latency NANDs, where a workload or customer requirement is justified over the cost.

H3 Platform is developing an air-cooled appliance that brings these storage devices into a deployable GPU-centric system. The planned platform combines four NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs, four NVIDIA ConnectX-8 and 20 E3.S 2T storage slots, each designed to support up to 60 watts. This allows up to a billion IOPS to be delivered from 20 storage slots each supporting up to 50 million IOPS. The appliance is designed to provide balanced connectivity across compute, networking, and storage resources, giving customers a practical platform for evaluating and deploying GPU-initiated, small-block storage workloads in production environments.

“AI infrastructure is entering a phase in which storage must behave less like a passive repository and more like an active extension of the compute fabric,” said Ashutosh Das, CEO of Smart IOPS. “With the Unobtanium™ T50 ACS device, our goal is to deliver 50 million IOPS in a compact PCIe Gen6 x4 E3.S form factor using standard TLC NAND. This approach combines extreme performance with flash-industry’s economies of scale making the ACS devices suitable for large scale deployment. H3 Platform complements that innovation with the system architecture needed to place high-IOPS storage close to NVIDIA AI infrastructure and networking.”

The planned H3 Platform delivers the highest IOPS performance ever achieved in the smallest datacenter footprint by integrating Smart IOPS ACS devices across 20 E3.S slots. The Air-cooled appliance design combines GPUs, high-speed network cards, and E3.S storage device slots that support up to 60W of power and thermal requirement per slot to handle the demands of high-performance storage devices like Smart IOPS ACS.

“The next wave of AI systems must be designed as an integrated data path—not as disconnected compute, network and storage components,” said Brian Pan, CEO of H3 Platform. “Our appliance is being developed to combine NVIDIA accelerated computing and networking with 20 high-power E3.S slots in an efficient, air-cooled platform. Smart IOPS’ ACS device is a strong complement to this design, helping us turn the concept of GPU-accelerated memory/storage into a system customers can evaluate, optimize and deploy.”

Why High IOPS Matters for AI Infrastructure

AI workloads are increasingly combining intensive computation with irregular, data-dependent access patterns. Graph neural networks, vector search, recommendation systems, retrieval-augmented generation, embedding stores and other sparse analytics can generate large numbers of small, random requests from many GPU threads. Conventional CPU-orchestrated I/O can add synchronization, queueing and control-path overhead, while bandwidth-oriented SSD specifications alone may not describe how well a system serves these fine-grained accesses.

Storage-Next and SCADA address this shift by enabling GPUs to initiate and orchestrate storage activity at scale. High-IOPS, low-latency SSDs are relevant because they can service more concurrent fine-grained requests, helping use PCIe bandwidth efficiently and reducing the risk that expensive GPU resources wait for data. The combined Smart IOPS and H3 Platform solution is intended to provide an integrated environment for this new storage architecture.

Smart IOPS ACS — Unobtanium™ T50

H3 Platform High IOPS Appliance

Availability

Smart IOPS and H3 Platform expect evaluation samples and systems to be available in the first quarter of 2027, with production availability planned for the second quarter of 2027. Product specifications, configurations and schedules are preliminary and may change without notice. Customer qualification, ecosystem software readiness and NVIDIA validation or approval are separate processes and are not implied by this announcement.

About Smart IOPS

Smart IOPS provides enterprise-class SSD solutions designed for the extreme demands of AI-driven and data-intensive workloads. The company’s SSD controller architecture is powered by TruRandom® technology to deliver high random-I/O performance, bandwidth and consistent quality of service. Smart IOPS solutions help cloud service providers, high-performance computing environments and enterprise data centers address storage I/O bottlenecks across AI/ML, analytics, databases, caching and other demanding applications. For more information, visit https://www.smartiops.com

About H3 Platform

Founded in 2014 and headquartered in New Taipei City, Taiwan, H3 Platform is a global pioneer in AI and composable IT infrastructure solutions. With more than a decade of expertise in PCIe switch fabric and CXL technologies, H3 Platform develops solutions for enterprise memory scaling, resource allocation and composable infrastructure. The company is advancing GPU-accelerated memory and storage architectures that establish direct, GPU-centric data paths, helping AI-native data centers improve accelerator utilization, scale demanding workloads and reduce total cost of ownership. For more information, visit https://www.h3platform.com

Forward-Looking Statements

This press release contains forward-looking statements regarding products under development, expected performance, interoperability, customer benefits and availability. Words such as “aim,” “design,” “develop,” “expect,” “intend,” “plan,” “target,” “will” and similar expressions identify forward-looking statements. These statements are based on current expectations and assumptions and are subject to risks and uncertainties that could cause actual results to differ materially, including development and validation results, component and software availability, ecosystem readiness, customer qualification, manufacturing schedules and changes in market requirements. Smart IOPS and H3 Platform undertake no obligation to update these statements except as required by law.

Trademarks

NVMe is a trademark of NVM Express, Inc. TruRandom® and Unobtanium™ are trademarks and/or claimed marks of Smart IOPS, Inc. All other company names, product names and service names may be trademarks of their respective owners.

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SOURCE Smart IOPS, Inc.; H3 Platform