TAIPEI, Aug. 10, 2026 /PRNewswire/ — ASPEED Technology, the global leader in Baseboard Management Controllers (BMC), today announced that it will showcase two major next-generation technical highlights at the upcoming OCP APAC Summit from August 11 to 12, including the Open Boot and Management Framework (OBMF) open server management architecture and the OpenPRoT (Open Platform Root of Trust) platform security architecture. ASPEED Technology continues to play a pivotal role in the industry by joining forces with ecosystem partners to deliver live demonstrations. These showcases validate the exceptional capabilities of next-generation data centers in high-efficiency management and firmware protection, driving comprehensive innovation across the open server ecosystem.

As cloud computing and AI high-performance computing (HPC) architectures become increasingly complex, system integration costs and cross-platform software compatibility have emerged as core operational challenges for data centers. The OBMF architecture showcased by ASPEED Technology in collaboration with ecosystem partner centers on standardized interfaces that enable BMCs and host platforms to exchange information more efficiently and execute management functions. This significantly reduces platform integration costs while enhancing software portability and cross-platform compatibility.

During the summit, ASPEED Technology is demonstrating several core OBMF technical capabilities. These include the PIROM (I²C) feature, which reads CPU platform information via standardized access mechanisms to provide essential foundational data for platform initialization and system management. Additionally, it supports OpenBMC Serial-over-LAN (SOL) remote console functionality to assist developers with remote debugging and issue analysis, as well as controlling system LEDs and status signals via SGPIO interfaces to effectively integrate system management approaches.

Furthermore, server firmware protection is particularly critical, encompassing a comprehensive security architecture that covers device authentication, firmware attestation, encrypted communication, and supply chain trust. ASPEED Technology’s next-generation security SoC will support post-quantum cryptography (PQC), empowering data centers to proactively prepare for cybersecurity challenges in the upcoming quantum computing era. Joining forces with ecosystem partners, ASPEED Technology is exhibiting the OpenPRoT SPDM (Security Protocol and Data Model) security attestation workflow based on the AST1060 security SoC. By adopting the MCTP architecture, OpenPRoT achieves cross-platform compatibility, further advancing the Platform Root of Trust toward openness and standardization.

Visit ASPEED’s booth #PR05 (4F, TaiNEX 2) to experience our live demonstrations. Learn more about our latest solutions at www.aspeedtech.com.

About ASPEED Technology

Founded in 2004 and headquartered in Hsinchu, Taiwan, ASPEED Technology is a leading fabless IC design company. As a pioneer in innovative SoC solutions, ASPEED focuses on niche markets, with Cloud Enterprise Solutions as its core development driver. Its product portfolio encompasses Baseboard Management Controllers (BMC), Satellite Management Controllers (SMC), I/O Expanders, and Platform Root of Trust (PRoT) SoCs. Over the years, ASPEED has been dedicated to innovative R&D to swiftly address customer demands. In 2016, the company acquired Broadcom’s Emulex Pilot™ BMC business, solidifying its position as the world’s No. 1 BMC supplier. Since 2014, ASPEED has been named 12 times to Forbes Asia’s “200 Best Under a Billion” list. From 2024 to 2026, the company was recognized as a “Most Honored Company” and “Best Management Team (Asia Small & Mid-Cap Semiconductors)” by Extel (formerly Institutional Investor), with its leadership awarded “Best CEO” (2024–2025). In 2025, ASPEED was honored with the GSA Award for “Best Financially Managed Semiconductor Company.” For more information, please visit www.aspeedtech.com.

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SOURCE ASPEED Technology Inc.

PANAMA CITY, Aug. 10, 2026 /PRNewswire/ — XAUE and ListaDAO today announced the launch of a 60-day slisXAUE Rewards Campaign, offering eligible users enhanced yield opportunities on tokenized gold through DeFi.

Running from August 10 to October 8, the campaign offers up to 8% combined APY potential which rewards long-term participation through a time-weighted holding mechanism while further expanding the utility of gold-backed digital assets within the on-chain ecosystem.

Yield-Bearing Gold, Built for DeFi

XAUE is a yield-bearing layer built on top of Tether Gold (XAU₮), enabling tokenized gold to generate on-chain yield.

At the center of the campaign is slisXAUE, a yield-bearing gold token issued by ListaDAO in partnership with XAUE Protocol. Users can deposit XAU₮ through Lista RWA to receive slisXAUE, maintaining gold-linked exposure while accessing XAUE’s yield capabilities through a transferable tokenized position.

Subscribe and Hold to Unlock Up to 8% APY

Participation follows three steps: deposit XAU₮ through Lista RWA to receive slisXAUE, hold slisXAUE during the campaign, and meet the final holding and ranking requirements.

Rather than relying on a single balance snapshot, participant rankings are determined by time-weighted average holdings throughout the 60-day campaign, encouraging consistent participation over short-term positioning.

At the end of the campaign, addresses with a time-weighted average holding of at least 20 slisXAUE that rank among the top 10 will qualify for rewards. Each qualifying address will receive an additional 5% APY, capped at $1,000 in XAU₮. Together with slisXAUE’s approximately 3% native yield, eligible participants may unlock up to 8% combined APY potential.

Rewards will be distributed automatically after eligibility verification, with no manual claim required.

Making Tokenized Gold Productive On-Chain

The campaign reflects XAUE’s continued commitment to expanding tokenized gold across DeFi through ecosystem partnerships. By combining XAUE’s yield-bearing gold layer with ListaDAO’s RWA access and distribution capabilities, the collaboration makes yield-bearing gold more accessible and demonstrates how tokenized gold can function as a productive and composable on-chain asset.

Through slisXAUE, users can maintain gold-linked exposure while accessing additional yield opportunities—improving capital efficiency and encouraging sustainable, long-term on-chain participation.

The campaign is now live. Users can visit the official campaign page for eligibility requirements, campaign rules, and participation details.

View original content:https://www.prnewswire.com/news-releases/xaue-and-listadao-launch-60-day-slisxaue-rewards-campaign-offering-up-to-8-apy-302847001.html

SOURCE XAUE

SYDNEY and MELBOURNE, Australia, Aug. 10, 2026 /PRNewswire/ — Fibocom, a global leading provider of wireless communication modules and AI solutions, recently joined Future Electronics at the Future Supplier Tech Fest Australia 2026 in Sydney and Melbourne. Through product demonstrations, technical presentations, and customer discussions, the two companies strengthened engagement with IoT companies, device manufacturers, and solution providers across Australia and New Zealand.

As Fibocom’s key distribution partner in the region, Future Electronics leverages its local network and market expertise to support customer engagement, while Fibocom provides product selection, solution evaluation, and design-in assistance through its local sales and technical teams.

At the events, Fibocom showcased its wireless connectivity portfolio, including 5G, 5G RedCap, LTE, GNSS, and smart modules, along with PCBA solutions, development kits, and terminal demos. The solutions support applications such as asset tracking, environmental monitoring, smart metering, industrial sensing, and mobile broadband terminals.

Athula Kumara, Senior Field Application Engineer for Fibocom’s ANZ region, delivered a presentation titled “One Module, Big Savings: Rethinking IoT Power, Cost, and Design with OpenCPU.” The session highlighted how OpenCPU architecture enables applications to run directly on cellular modules, helping reduce system complexity, simplify PCB design, and optimize power consumption and cost. Fibocom’s LE270-EU and LE271-GL LTE Cat 1 bis OpenCPU modules were introduced as solutions for cost- and power-sensitive IoT applications.

Steve Albuquerque, Director- Regional Business Development at Future Electronics, said:

“Thrilled to have Fibocom as one of our supplier partners at both our Sydney and Melbourne Tech Fests. These events are all about connecting our customers with leading edge technology to provide pathways for them to differentiate their product, enable quicker time to market and leverage lower total solutions costs. There was a definite buzz around the booth in the low-power features of the LE271-GL cellular module and the MGB208-A GNSS module. Looking forward to working with the team again at our October events in New Zealand.”

Ronald Chan, VP of APAC Sales Department at Fibocom, said:

“Australia and New Zealand are important markets in Fibocom’s APAC strategy. By partnering with Future Electronics and leveraging its local network, Fibocom’s product portfolio, and support capabilities, we are strengthening customer engagement and providing responsive design-in support to accelerate connected product development and deployment across the region.”

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/fibocom-and-future-electronics-deepen-collaboration-in-australia-and-new-zealand-to-accelerate-iot-innovation-302847006.html

SOURCE Fibocom Wireless Inc.