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Silicon Line®, an EverProX® brand, Launches new Ultra-Low-Power SerDes Chipset MSDL™ (MIPI Serial Data Link), Extending 20 Gbps MIPI D-PHY Connectivity to Tens of Meters

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New optical/electrical solution aggregates two simultaneous MIPI-DPHY camera streams, at up to 10 Gbps each, over two serialized links while consuming less than 100 mW per link, eliminating bulky cable bundles with optical fiber or differential copper connectivity. Discover more: https://silicon-line.com/msdl

MUNICH, Sept. 3, 2026 /PRNewswire/ — EverProX Technologies Munich GmbH, under its Silicon Line® brand—a pioneer in ultra-low-power optical and electrical interconnect technology—today announced the launch of “MSDL™ 20G” which is the first product in the new MSDL™ family, an end-to-end interconnect chipset comprising the SL8582x serializer and SL8581x de-serializer. Engineered to overcome the bandwidth, EMI, and reach limitations of traditional MIPI D-PHY signals, the dual-port chipset delivers up to two simultaneous 10 Gbps serialized links for next-generation vision systems.

Breaking Physical Cabling Bottlenecks

As high-resolution multi-camera systems and high-frame-rate displays drive rapidly increasing bandwidth requirements, traditional copper cabling is increasingly constrained by limited reach and susceptibility to electromagnetic interference (EMI). The “MSDL™ 20G” chipset, comprising SL8582x serializer and SL8581x de-serializer resolves this by aggregating multi-stream video over optical fibers or differential copper pairs, extending link distances to tens of meters while eliminating bulky, shielded cable bundles. The highly integrated architecture delivers ultra-low-power consumption in both optical and electrical modes, with total SerDes power well below 100 mW per 10 Gbps link.

Executive Perspective

“Physical AI is changing the way electronic systems are built. We are seeing more and faster cameras, more sensors, and greater intelligence distributed across devices,” said Yifeng Liann, CEO and Managing Director of EverProX Technologies Munich GmbH. “As systems get smarter, moving high-bandwidth data between devices reliably and in real time becomes increasingly challenging. Engineers must balance the flexibility to connect across different subsystems, the reliability that mission-critical applications cannot always get from wireless, and the ultra-low power needed to make it all practical. That’s the problem the Silicon Line® team set out to solve: making high-bandwidth connectivity more energy-efficient, more reliable, and easier to integrate into the next generation of intelligent systems.”

Key Technical Highlights

Dual-Port Multi-Camera Aggregation: Supports up to two simultaneous transmissions of single- or stereo-camera streams over one or two serialized links, with one transmission per linkOptical or Copper Connectivity: Integrated VCSEL drivers and TIA enable optical links over tens of meters, while supporting differential copper links up to 2 metersUltra-Low Power: Consumes just 71 mW per optical link and 87 mW per electrical link, excluding the integrated Sideband SerDes:Optical Mode: Serializer 17 mW, De-serializer 54 mW (Typical)Electrical Mode: Serializer 27 mW, De-serializer 60 mW (Typical)Integrated Bidirectional Sideband SerDes: Transports I²C, GPIO, digital audio, SPI/control signals and sensor clocks alongside MIPI data, reducing cable count, connector complexity, and system components. Target Applications: AR/VR: Enables lighter, more flexible tethering and greater mobility  Medical Endoscopy: Supports 4K/8K imaging, ultra-low heat generation, and thin optical connectivity Industrial Robotics and Machine Vision: Delivers reliable, EMI-immune high-speed vision connectivity in electrically noisy environmentsDefense and UAVs: Provides lightweight, low-power multi-camera connectivity that reduces cable weight and increases battery life

Availability & Ecosystem Support

The MSDL™ 20G (SL8582x&SL8581x) are sampling now with early-access customers in bare die or compact 4×4 mm µBGA-78 packages. Evaluation Kits (EVKs) are available now for link validation. Backed by EverProX’s turnkey assembly, customers can transition seamlessly from IC design to mass production. For more information, visit https://www.silicon-line.com/ or contact sales@silicon-line.com.

About EverProX Technologies Munich GmbH and Silicon Line®

Silicon Line® — a brand of EverProX Technologies Munich GmbH — is a leading IC developer of ultra-low-power optical and electrical interconnect solutions for high-speed video and data transmission. Based in Munich, Germany, the Silicon Line® portfolio includes ultra low power MIPI SerDes ICs (from MSDL™ 2G up to MSDL™ 20G), TIA&VCSEL drivers that enable ultra-thin, lightweight, and EMI-immune active optical cables (AOCs) and embedded optical links for VR/AR, medical, industrial, robotics, defense and consumer markets.

Media Contact:

Emre Oralli
Product Marketing Manager 
EverProX Technologies Munich GmbH / Silicon Line® 
Email: emre.Oralli@silicon-line.com
Phone: +49 151 20620735

 

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SOURCE EverProX Technologies Munich GmbH

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USI Launches AI Smart Camera Solution to Accelerate Smart Manufacturing

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NANTOU, Sept. 8, 2026 /PRNewswire/ — USI today announced its next-generation AI Smart Camera solution, a comprehensive edge AI and vision platform that empowers manufacturers to accelerate digital transformation through AI-driven quality inspection, process automation, logistics optimization, and smart factory initiatives.

Moving beyond conventional camera hardware, USI’s AI Smart Camera integrates a high-performance, low-power edge computing platform, high-resolution imaging technology, and proprietary AI vision software to deliver real-time image analysis and actionable insights at the edge. Designed for modern manufacturing environments, the solution enables automated inspection, early defect detection, and faster, more consistent quality decisions. By reducing inspection costs, improving production efficiency, and enhancing product quality, it helps manufacturers accelerate their transition toward smarter and more autonomous production operations.

For manufacturers, the journey to AI-powered vision extends beyond object detection and defect identification. Success depends on turning AI from a proof-of-concept project into a production-ready solution that delivers consistent performance, scales efficiently, and seamlessly adapts to evolving manufacturing requirements.

USI addresses this challenge with an integrated AI Smart Camera platform that supports the complete AI development lifecycle—from data collection and dataset generation to model training and deployment. Its no-code/low-code AI model training platform further simplifies development, enabling customers to develop and deploy vision applications with greater efficiency and less dependence on specialized AI expertise.

Key features of USI AI Smart Camera include:

Real-Time Edge AI Processing: Performs image analysis and AI inference at the edge, enabling fast visual decisions and timely responses without relying solely on centralized computing.High-Quality Imaging for Industrial Inspection: Combines a high-resolution, low-lux-capable camera module with powerful Edge AI computing to support demanding inspection and machine vision applications.Faster AI Deployment: Integrates hardware, embedded software, and AI vision development tools into a production-ready platform, helping customers shorten development cycles and accelerate the transition from proof of concept to production.Flexible AI Vision Applications: Supports object detection, defect identification, OCR, key-part positioning and tracking, assembly verification, product classification, and operation behavior detection and analysis.Seamless Integration with Industrial Environments: Ruggedized design with industrial-grade interfaces, including Ethernet, Power over Ethernet (PoE), HDMI, and MicroSD, ensuring seamless compatibility with existing equipment, machine vision systems, and automation platforms.

By automating visual inspection and defect identification, the AI Smart Camera can reduce reliance on manual QA operations while improving inspection consistency. Its real-time visual intelligence can also provide actionable data to help manufacturers quickly identify process deviations, reduce defect rates, and lower production costs. The platform can further serve as an intelligent visual decision layer for automated production, providing real-time visual guidance and feedback to robotic systems. This enables manufacturers to move beyond inspection automation toward more responsive and autonomous production processes.

“Demand for AI-powered vision applications is growing rapidly across the manufacturing sector. Today’s manufacturers are seeking more than just camera hardware. They need complete, end-to-end solutions that can be deployed quickly and deliver measurable business value,” said Justin Chang, Director of the Vertical Mobility Solution Center at USI. “By combining advanced Edge AI capabilities with our integrated vision platform, we enable customers to accelerate the adoption of smart manufacturing, quality inspection, and industrial automation applications. Our solution helps bring AI from proof of concept to production faster and more efficiently.”

As a global ODM partner, USI combines expertise in product design, manufacturing, and Edge AI integration to deliver complete solutions tailored to customer requirements. The AI Smart Camera is already deployed within USI’s own manufacturing operations, providing a production-proven reference platform for industrial AI vision applications.

Building on this experience, USI can customize AI vision solutions around customers’ specific production environments and business requirements, helping shorten development time, reduce implementation risks, and accelerate their smart manufacturing journey.

 

View original content:https://www.prnewswire.com/apac/news-releases/usi-launches-ai-smart-camera-solution-to-accelerate-smart-manufacturing-302871089.html

SOURCE USI

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Media’s future tense in AI-driven world

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BEIJING, Sept. 7, 2026 /PRNewswire/ — This is an op-ed from China Daily.

Philip K. Dick’s 1969 novel Ubik imagined a door that demands payment before opening — a fantasy then, but eerily prescient in today’s AI-driven world. While Elon Musk predicts AI will bring global abundance, for traditional media that abundance has already arrived — with devastating consequences.

The question is no longer whether AI changes media, but what role professional journalism can play when information is plentiful, yet truth, context and reality grow scarce.

Dick’s own life — overlooked, depressed and penniless — belied his extraordinary foresight. In The Man in the High Castle, he imagined alternate realities. Today, personalized algorithms, misinformation and AI-generated content make such alternate realities all too real.

Yet Dick’s vision also offers hope through an unexpected link with the ancient Chinese I Ching (Book of Changes). Both suggest reality is not fixed, but a pattern of ever-shifting possibilities. The I Ching asks not “What will happen?” but “What situation am I in, and how should I respond to its changing pattern?” That, arguably, is precisely the role media must adopt in the AI age: providing orientation, credibility and meaning when information itself has lost its scarcity and economic value.

Not all sci-fi is dystopian. Isaac Asimov’s Three Laws of Robotics embodied faith that humans could impose rules on technology — yet today’s AI race is far more complex. Gene Roddenberry’s Star Trek imagined a moneyless, post-scarcity civilization; AI may be bringing that closer, just as Google’s free search and maps once upended the world.

So where does this leave traditional media? In a Dickian dystopia, media could become a modern-day I Ching — helping people navigate uncertainty, distinguish illusion from reality, and make informed choices when no single truth prevails. In a Roddenberry-esque future, media could guide humanity on how to live wisely with AI-driven abundance.

The practical challenge remains: financing itself in the first scenario and inspiring itself in the second. As Dick warned in The Man in the High Castle, humanity’s “destiny lies in the hands of a few men.” We can only hope some of them are traditional media editors.

View original content:https://www.prnewswire.com/apac/news-releases/medias-future-tense-in-ai-driven-world-302871740.html

SOURCE China Daily

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New agentic AI platform sounds death knell for manual presentation tools

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Sembly AI launches Sembly 3.0 in biggest evolution since 2019

SYDNEY, Sept. 8, 2026 /PRNewswire/ — Today, Sembly AI launches Sembly 3.0, an agentic AI platform that transforms an organisation’s documents, meetings, and CRM content into finished, fully branded presentations, proposals, case studies and reports in minutes in over 45 languages.

The launch marks the company’s biggest evolution since it was founded in 2019, repositioning Sembly as an “AI execution layer” for businesses. It turns everyday business knowledge into the finished materials companies use to sell, deliver and communicate.

Users simply need to specify their goal (eg, “Sell my services”) and the client’s website, then watch Sembly get to work: pulling information from business materials, deriving appropriate branding, researching the customer, and producing a bespoke on-brand pitch deck.

“Prompts make people think about how to talk to AI. But dialogue lets them focus on what they want to accomplish,” said Gil Makleff, CEO and co-founder of Sembly AI. “That makes creating business documents faster and more efficient, turning time saved into real business impact.”

“Manually creating presentations is a thing of the past,” said Artem Koren, Chief Product & Technology Officer and co-founder of Sembly AI. “Business materials are the substrate of decision-making: they are how companies communicate, persuade and decide. Sembly 3.0 changes how they are made entirely.”

“Your customers want to hear how you serve them in their specific world and their specific situation, and Sembly makes that possible for every customer,” Koren added. “With Sembly 3.0, your results are as good as how clearly you can state your goal. That’s all you’re limited by.”

Early users of Sembly 3.0 report saving two to three weeks of work on reports and presentations that traditionally pass through multiple hands before they are delivery-ready.

Heorhii Tulchyi, Chief Technology Officer at market research company, Bell & Holmes, is one of those early users of Sembly 3.0.

He said: “Sembly has fundamentally changed how I prepare presentations and client communications. It has saved my team and me weeks of work and dramatically accelerated how we turn ideas and information into polished deliverables. I haven’t seen anything else on the market quite like it.”

Sembly 3.0 is available from today at www.sembly.ai.

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SOURCE Sembly AI

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