Technology

NovoLINC Demonstrates 400 W/cm² Cooling on Warped Silicon with MaxLINC™

Published

2 hours ago

October 6, 2026

MaxLINC™ sustains 400 W/cm² heat flux and 3,300 W total power on production-representative silicon with ~150 µm warpage, demonstrating a path to overcoming a critical thermal barrier for next-generation AI accelerators.

PITTSBURGH, Oct. 6, 2026 /PRNewswire/ — NovoLINC, a provider of advanced thermal solutions for AI computing, today announced a significant high-power demonstration of its MaxLINC™ thermal interface material, achieving 400 W/cm² uniform heat flux and 3,300 W total power on a production-representative silicon test die with approximately 150 µm of warpage.

The demonstration was conducted using a specialized single-phase direct liquid cooling cold plate from CoolIT, an Ecolab Company. Throughout the test, the complete thermal stack maintained the silicon junction temperature below 90°C, demonstrating MaxLINC’s ability to provide highly effective heat transfer even when significant die warpage creates challenging mechanical and thermal interface conditions.

As AI processors move toward higher power and larger package sizes, silicon and package warpage are becoming increasingly important thermal design challenges. Even small variations in flatness can create uneven contact at the interface between the semiconductor and cooling system, increasing thermal resistance and potentially creating localized hot spots.

MaxLINC is engineered to address this challenge through NovoLINC’s proprietary nanostructured composite architecture, combining ultra-low thermal resistance with mechanical compliance. The technology is designed to maintain effective thermal contact across non-flat surfaces, enabling efficient heat transfer from high-power semiconductor devices into advanced cooling systems.

“NovoLINC is actively working with companies across single-phase direct liquid cooling, two-phase direct liquid cooling, and immersion cooling,” said Dr. Sheng Shen, CTO of NovoLINC. “These results demonstrate a clear thermal roadmap: combining NovoLINC’s advanced thermal interface technology with today’s and future liquid cooling systems can provide a pathway to enabling advancement of higher-power chips and AI server architectures.”

“Data center operators are making long-term infrastructure decisions today, and they need confidence that the cooling they deploy will keep up with future silicon,” said Ben Sutton, Product Marketing Manager at CoolIT™. “Pairing CoolIT’s advanced cold plate technology with NovoLINC’s MaxLINC shows that single-phase DLC can handle high-heat-flux processors well into the next decade, without the cost and complexity of switching cooling architectures.”

The demonstration reached 3,300 W of total device power, highlighting the ability of MaxLINC to address the rapidly increasing thermal demands of next-generation GPUs, CPUs, ASICs, and other AI accelerators.

“AI compute is advancing toward multi-kilowatt processors, but extracting that heat efficiently from increasingly large and mechanically complex packages is becoming one of the industry’s most difficult challenges,” said Dr. Ning Li, CEO of NovoLINC. “Our goal with MaxLINC is to remove the thermal interface as a limiting factor, and to give chip designers, system designers, and cooling partners greater freedom to push compute performance and power density to the next level.”

The 400 W/cm² demonstration builds on NovoLINC’s development of MaxLINC for high-performance semiconductor thermal interfaces. The platform is designed for use across the thermal pathway, from direct chip-to-cooling interfaces and chip-to-package heat spreaders to interfaces between packaged devices and cold plates or other advanced cooling hardware.

MaxLINC samples are available for customer evaluation and qualification.

About NovoLINC

NovoLINC is a Pittsburgh-based advanced materials company developing next-generation thermal interface solutions for AI computing and other energy-dense electronic systems. Spun out of Carnegie Mellon University, NovoLINC has developed a proprietary nanostructured materials platform and a scalable manufacturing process designed to overcome thermal bottlenecks in high-performance computing, data centers, automotive electronics, aerospace systems, and power electronics.

NovoLINC works with leading companies across the semiconductor, hyperscaler, AI server OEM/ODM, and cooling systems industries to enable higher computing performance while improving the energy efficiency and sustainability of next-generation computing infrastructure. The company’s technology development has been supported by the U.S. National Science Foundation and the U.S. Department of Energy’s ARPA-E COOLERCHIPS program.

www.novolinc.com

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SOURCE NovoLINC, Inc.

Technology

GIGABYTE Unveils Amazon Prime Big Deal Days Offers with Savings Up to $130

Published

4 minutes ago

October 6, 2026

CITY OF INDUSTRY, Calif., Oct. 6, 2026 /PRNewswire/ — GIGABYTE Technology, a global leader in PC hardware, today announced its Amazon Prime Big Deal Days promotions, available exclusively to Prime members for 48 hours only, from October 6 through October 7, 2026. As the fall gaming season kicks off, the event lowers the entry barrier for next-generation PC building—putting 240Hz esports displays within reach from just $79.99 and delivering savings of up to $130 on Wi-Fi 7 and PCIe 5.0-ready motherboards on Amazon.

Empower Your Build: Next-Gen AMD Platforms Built for Every Gamer

As Wi-Fi 7 routers and PCIe 5.0 graphics cards and SSDs move into the mainstream, GIGABYTE is making the platforms built for them accessible across every budget segment. Headlining the promotion is the X870 AORUS ELITE WIFI7, which democratizes multi-gigabit Wi-Fi 7 speeds and PCIe 5.0 graphics readiness for high-demand gaming at a promotional price of $209.99. For mainstream builders transitioning to the latest AMD Ryzen processors without overspending, the B850 EAGLE WIFI6E delivers essential next-gen connectivity and thermal efficiency for just $149.99. Meanwhile, gamers building a clean white rig around a Ryzen X3D processor can secure the X870E AORUS ELITE X3D ICE at $259.99. Its X3D Turbo Mode 2.0 tunes X3D chips in real time for extra gaming performance, and at $130 off, it carries the event’s largest single discount.

Smooth Esports Visuals Starting Under $80

Alongside platform upgrades, GIGABYTE is bringing 240Hz refresh rates—long the benchmark for competitive play—down to entry-level price points. Budget-conscious esports players and students can minimize motion blur and screen tearing with the 24.5-inch GS25F2A, a 240Hz, 1ms FHD monitor available for an ultra-accessible $79.99. For FPS competitors who want the same 240Hz speed on a height-adjustable ergonomic stand, the G25F2A drops to $89.99, making high-FPS dual-monitor configurations exceptionally cost-effective for modern gaming rooms.

Promotional Pricing Summary

All featured motherboards and gaming monitors eligible for Prime Big Deal Days savings on October 6–7, 2026, are detailed below:

Model

Features

Promo Price

X870 AORUS ELITE WIFI7

Next-gen AMD platform with Wi-Fi 7 & PCIe 5.0

$209.99

X870E AORUS ELITE X3D ICE

White AMD X870E board with X3D Turbo Mode 2.0 & Wi-Fi 7

$259.99

X870E AORUS PRO ICE

Premium all-white AMD X870E enthusiast platform

$279.99

B850 AORUS ELITE WIFI7 ICE

Sleek white B850 platform with Wi-Fi 7 speeds

$169.99

B850 EAGLE WIFI6E

Mainstream ATX platform featuring Wi-Fi 6E & PCIe 5.0

$149.99

B850M EAGLE WIFI6E

Compact Micro-ATX build with Wi-Fi 6E

$139.99

B550 GAMING X V2

Budget-friendly AM4 classic for entry gaming rigs

$84.99

Z790 AORUS ELITE AX

Intel Z790 DDR5 board with Wi-Fi 6E for 12th–14th Gen Core

$169.99

G25F2A

25″ 240Hz high-FPS competitive esports monitor

$89.99

GS25F2A

25″ 240Hz gaming display under $80

$79.99

GS27F2

27″ 240Hz FHD gaming display

$99.99

About GIGABYTE

GIGABYTE is a developer, manufacturer, and distributor of high-performance hardware solutions. From award-winning monitors and graphics cards to advanced data center infrastructure, GIGABYTE remains committed to its mission of “Upgrade Your Life” through innovative technology and exceptional build quality.

Media Contact

GIGABYTE USA PR Team

City of Industry, California

gbtusa_marketing@gigabyteusa.com

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SOURCE GIGABYTE

Technology

QuickLogic Announces Inducement Grant Under Nasdaq Listing Rule 5635(c)(4)

Published

4 minutes ago

October 6, 2026

SAN JOSE, Calif., Oct. 6, 2026 /PRNewswire/ — QuickLogic Corporation (NASDAQ: QUIK) (“QuickLogic” or the “Company”), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened and Antifuse FPGAs and ruggedized programmable logic solutions, today announced that the Compensation Committee of its Board of Directors granted restricted stock unit awards for 51,502 shares of the Company’s common stock (the “New-Hire RSUs”) to James Sullivan, the Company’s new Senior Vice President of Finance and Chief Financial Officer. The award was previously announced on September 21, 2026 and granted by the Compensation Committee on October 5, 2026, as an inducement material to his entering into employment with the Company, pursuant to Nasdaq Listing Rule 5635(c)(4).

The New-Hire RSUs will be granted outside of the Company’s 2019 Equity Incentive Plan and will vest over a three-year period, with 1/3rd vesting on October 5, 2027 and 1/6th vesting each six months thereafter, subject to Mr. Sullivan’s continued employment with the Company.

About QuickLogic
QuickLogic Corporation is a fabless semiconductor company specializing in eFPGA Hard IP, Strategic Radiation Hardened and Antifuse FPGAs and ruggedized programmable logic solutions. QuickLogic’s unique approach combines cutting-edge technology with open-source tools to deliver highly customizable, low-power solutions for aerospace and defense, industrial, computing, and consumer markets. For more information, visit www.quicklogic.com.

QuickLogic and logo are registered trademarks of QuickLogic. All other trademarks are the property of their respective holders and should be treated as such.

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SOURCE QuickLogic Corporation

Technology

MIT Technology Review Unveils 2026 List of 10 Climate Tech Companies to Watch

Published

4 minutes ago

October 6, 2026

The annual list highlights businesses developing innovative solutions to positively impact climate change.

CAMBRIDGE, Mass., Oct. 6, 2026 /PRNewswire/ — MIT Technology Review released its annual list of 10 Climate Tech Companies to Watch for 2026 today. The list reveals the early-stage startups and multinational corporations developing cutting-edge solutions to lower emissions, address major climate concerns, and protect our planet.

MIT Technology Review’s award-winning newsroom used their advanced knowledge and resources to develop a robust list of 10 global businesses that are reinventing how we create energy, manufacture products, address climate risks, and develop cleaner transportation.

Drawing on feedback from researchers, investors, analysts and academics, the team vetted dozens of companies to confirm their success in driving innovations that tackle the most urgent climate issues. Following months of deliberation, they selected 10 notable businesses that they believe have the best chance at addressing these threats.

The online-exclusive list is now live at www.technologyreview.com/climatetech2026, and features in-depth profiles on how each company is making meaningful strides across energy storage, nuclear power, transportation, and more.

The honorees represent a wide range of industries, from clean energy and nuclear fission to flood barriers and electric vehicles. This year’s list includes Energy Dome and their energy storage systems on the grid, WeLion’s semi-solid-state batteries for EVs, and WaveSave’s portable rubber dam.

To read every honoree profile from the 10 Climate Tech Companies to Watch list, become an MIT Technology Review subscriber today at www.technologyreview.com/subscribe.

Members of the press may obtain additional information and access by emailing press@technologyreview.com.

About MIT Technology Review

Founded at the Massachusetts Institute of Technology in 1899, MIT Technology Review is the world’s leading authority on technology and its influence. Through award-winning journalism and premium events, we break down complex innovations and analyze their commercial, social, and political impact. From AI and biotech to climate tech and computing, we deliver trusted insights and expert analysis, empowering a global audience to navigate the emerging technologies shaping our future.

We are the destination for those seeking to better understand where technology is headed next. Subscribe. Attend. Follow: Facebook, LinkedIn, Instagram, Reddit.

Media Contact:

MIT Technology Review press@technologyreview.com

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SOURCE MIT Technology Review