Ventral AI brings advanced physical world AI capabilities to Voxel’s operational intelligence platform

SAN FRANCISCO, Oct. 13, 2026 /PRNewswire/ — Voxel, the industrial intelligence company reenvisioning how real-world work gets done, today announced the addition of Ventral AI, an advanced AI and computer vision engineering firm specializing in industrial automation and complex computer vision applications, to the Voxel team.

The update furthers Voxel’s position as the pioneer of System of Reality, a new enterprise software category that layers proprietary AI over existing camera infrastructure to turn passive hardware into real-time operational intelligence. By integrating the Ventral AI team into Voxel’s engineering organization, Voxel advances its core AI capabilities while supporting its growing international customer base.

Voxel and Ventral AI have worked together over the past year in a strategic partnership focused on engineering custom enterprise capabilities. Ventral AI was co-founded by Matko Kulaš and Luka Žagar, and the team brings proven technical expertise in:

Dynamic Camera Environments: Deploying real-time computer vision and vision language models on moving equipment and transport fleets.Infrastructure and Data Center Construction: Deploying computer vision models tailored specifically to data center buildouts, high-precision construction sites, and heavy industrial environments.

“As industrial leaders navigate supply chain volatility, labor constraints, and rising throughput demands, they need a single source of truth, a System of Reality, for their entire physical footprint,” said Vernon O’Donnell, CEO of Voxel. “The Ventral AI team gives us even greater engineering horsepower to meet that demand head on. Their expertise in complex computer vision further accelerates the evolution of our operational intelligence platform.”

“From our earliest collaboration, we saw the incredible potential of uniting our expertise with Voxel’s leading operational intelligence platform,” said Žagar, Co-Founder and CEO of Ventral AI. “Together, we are unlocking a new level of real-time intelligence for physical operations, enabling enterprise teams to solve complex frontline challenges faster while also bringing applied AI innovation into the physical world.”

Building on strong momentum with enterprise customers across Europe, this expansion enables Voxel to respond faster to customer needs while tapping into elite talent from Europe’s top-ranking technical universities.

This news comes as Voxel experiences exceptional growth and market momentum. The company was awarded as Inc. 5000 fastest growing company, coming in at #71 and recently announced new executive hires.

To learn more about Voxel visit voxelai.com.

About Voxel
Voxel is reenvisioning how real-world work gets done with its operational intelligence platform, designed to help organizations identify and mitigate risks in industrial environments. Voxel layers its proprietary AI over existing camera infrastructure to transform it into continuous operational intelligence; diagnosing root causes in real-time and directing teams to act both in the moment and ongoing. Voxel partners with businesses across industries such as warehousing, manufacturing, distribution, and insurance.

View original content to download multimedia:https://www.prnewswire.com/news-releases/voxel-advances-system-of-reality-capabilities-and-fuels-global-expansion-with-addition-of-ventral-ai-302907377.html

SOURCE Voxel

FLORHAM PARK, N.J., Oct. 13, 2026 /PRNewswire/ — Datacor, Inc., a leading provider of software for engineers, process manufacturers, and chemical distributors, today announced the acquisition of MySep, a developer of simulation software for the design and performance analysis of process separators.

The acquisition expands Datacor’s engineering portfolio, which includes CHEMCAD for chemical process design, its flow simulation suite (formerly Applied Flow Technology), and GoldSim for probabilistic risk analysis. MySep adds rigorous separator modeling to that portfolio, extending the range of engineering analysis Datacor supports.

Since its founding in 2013, MySep has focused on separation challenges in the oil and gas industry, with software used across upstream production, gas processing and LNG, refining, and petrochemicals. Headquartered in Singapore, MySep also strengthens Datacor’s presence across Asia Pacific and the Middle East.

“MySep has built its software on more than a decade of dedicated research, and engineers across oil and gas have come to treat it as the reference for separator design and performance,” said Tom Jackson, president of Datacor. “This acquisition reflects our continued investment in specialized software and the depth of expertise behind it.”

Engineers rely on MySep to design and analyze the performance of their separators,” said Guy Hellinx, founder of MySep. “By joining Datacor, we can combine MySep’s expertise with Datacor’s broader software capabilities, enabling us to offer our customers more comprehensive solutions to their engineering challenges.”

About Datacor

Datacor is a leading provider of industry-specific solutions that help engineers, process manufacturers, and chemical distributors grow, run, and elevate their business. Backed by deep industry experience and a commitment to continuous improvement, we go beyond software to act as true partners in solving complex process challenges. For those seeking greater visibility and control, Datacor is the trusted source for proven technology and expertise to achieve great outcomes, together. Learn more at www.datacor.com.

About MySep

MySep develops simulation software for the design and performance analysis of process separators. Its solutions, MySep Studio and MySep Engine, apply proprietary modeling and research-based correlations to predict separation efficiency, pressure drop, and carryover. Engineers worldwide use MySep to design new separators, evaluate installed equipment, and improve process reliability. Learn more at www.mysep.com.

Media Contact
Caitlin O’Donnell
VP, Marketing
ceodonnell@datacor.com 
(973) 822-1551

View original content:https://www.prnewswire.com/news-releases/datacor-acquires-mysep-a-leader-in-process-separator-simulation-302907036.html

SOURCE Datacor, Inc.

Recognition Highlights Company’s Leadership in Enabling Advanced Heterogeneous Integration and AI-Driven Semiconductor Innovation

FORT WASHINGTON, Pa., Oct. 13, 2026 /PRNewswire/ — Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa,” “K&S” or the “Company”) today announced that it has been selected as the recipient of the 2026 SEMI Award for North America, one of the semiconductor industry’s highest honors recognizing exceptional technical and commercial contributions to semiconductor manufacturing.

The award recognizes Kulicke & Soffa’s pioneering formic acid in-situ bonding technology, an innovative Fluxless Thermo Compression bonding (FTC) solution that addresses critical interconnect scaling challenges and is actively enabling the next generation of heterogeneous integration architectures supporting artificial intelligence, high-performance computing, and advanced photonics applications.

Presented during the CEO Summit Keynotes at SEMICON West, the award underscores the growing industry adoption and significance of K&S’s advanced packaging portfolio, including its industry-leading APTURA™ platform.

“As semiconductor performance is now critically dependent on advanced packaging and heterogeneous integration, the industry’s ability to scale interconnect density efficiently and economically becomes more important than ever,” said Raj Talluri, Chief Executive Officer of Kulicke & Soffa. “We are honored to receive this recognition from SEMI. This award reflects the ingenuity, dedication, and relentless execution of our global teams, who continue to develop innovative solutions which enable customers to overcome the industry’s most complex manufacturing challenges.”

Traditional Thermo-Compression bonding often requires a post-bond flux cleaning processes that becomes increasingly difficult at finer interconnect pitches. At the same time, hybrid bonding solutions, while highly capable, can introduce significant manufacturing complexity and cost. Kulicke & Soffa’s proprietary Fluxless Thermo-Compression bonding technology combines advanced plasma pre-cleaning and in-situ formic acid oxide reduction to deliver high-yield, ultra-fine-pitch interconnect capabilities while simplifying the manufacturing processes and reducing production costs.

FTC technology has become a foundational element of the Company’s advanced packaging roadmap and enables customers to pursue interconnect pitches below 10 microns while supporting applications across wafer-level, substrate-level, and panel-level manufacturing environments.

“This recognition validates our innovation-driven strategy of selecting differentiated technologies that solve real customer challenges,” said John Molnar, VP & General Manager, Advanced Solutions. “By enabling hybrid-bonding-class performance with more accessible manufacturing, we are accelerating the adoption of advanced packaging solutions required for next-generation AI, high-performance computing, silicon photonics, and other rapidly growing semiconductor markets.”

The award further reinforces Kulicke & Soffa’s position as a leading provider of semiconductor interconnect solutions. The company’s advanced packaging portfolio spans thermocompression bonding, hybrid bonding enablement technologies, wedge bonding, and vertical interconnect solutions that support some of the industry’s most complex heterogeneous applications.

As semiconductor complexity continues to increase, interconnect and packaging innovations are now a requirement in delivering system-level performance across the semiconductor space. This award highlights the critical role Kulicke & Soffa is playing to shape the industry’s future.

About Kulicke & Soffa

Kulicke & Soffa is a global leader in semiconductor assembly technology, advancing device performance across automotive, compute, industrial, memory and communications markets. Founded on innovation in 1951, K&S is uniquely positioned to overcome increasingly dynamic process challenges – creating and delivering long-term value by aligning technology with opportunity.

About SEMI

SEMI® is the global industry association connecting over 4,000 companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more. 

Contacts

Kulicke & Soffa
Marilyn Sim
Public Relations
P: +65-6880-9309
msim@kns.com

Kulicke & Soffa  
Joseph Elgindy
Investor Relations
P: +1-215-784-7500
investor@kns.com

View original content:https://www.prnewswire.com/news-releases/kulicke–soffa-receives-semi-award-for-north-america-for-breakthrough-fluxless-thermocompression-bonding-technology-302906596.html

SOURCE Kulicke & Soffa Industries, Inc.