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3D TSV and 2.5D Market to Reach USD 21.50 Billion by 2035 as High-Bandwidth Memory Stacks Advance

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LONDON, Oct. 19, 2026 /PRNewswire/ — The global 3d tsv and 2.5d market was valued at USD 9.46 billion in 2025 and is projected to reach USD 21.50 billion by 2035, according to Credence Research. The report states a 8.50% compound annual growth rate for 2026-2035. North America held the largest regional share at 35.0% in 2025, while Middle East and Africa is the fastest-growing region at a modeled 9.96% annual rate. Market sizes, segment shares and regional allocations are Credence Research estimates.

Key Takeaways

Credence Research estimates market value at USD 9.46 billion in 2025 and USD 21.50 billion by 2035, with a reported 8.50% CAGR for 2026-2035.North America held 35.0% of modeled 2025 value. Middle East and Africa has the fastest forecast regional growth at 9.96%.HBM and other memory accounted for 46.0% of 2025 application revenue.2.5D integration led technology categories with 38.0% of 2025 value.Data centers and high-performance computing held 55.0% of end-use spending.Die-to-wafer integration accounted for 48.0% of value, reflecting established stacking processes.

Scope & Segmentation – 3D TSV and 2.5D Market

The market measures through-silicon-via stacking and silicon-interposer packaging work used in HBM, logic, image sensors, MEMS and RF devices. It covers relevant 2.5D integration, 3D TSV stacks and die bonding services. It excludes the value of semiconductor dies, fabrication equipment, bridge-only packages without TSVs and fan-out packages without vias.

By technology: 2.5D integration; 3D TSV stacking; Chip-on-wafer and chip-on-wafer-on-substrate; Heterogeneous integration.By application: HBM and memory; Processors and AI accelerators; CMOS image sensors; MEMS; RF devices.By end use: Data centers and HPC; Consumer electronics; Automotive; Telecommunications; Industrial.By integration: Die-to-wafer; Wafer-to-wafer; Die-to-die and chiplet.By material: Silicon; Metal interconnects; Dielectrics; Organic and glass interposers.By provider: Integrated device manufacturers; Foundries; Outsourced assembly and test providers.

Read the full report and request a sample: https://www.credenceresearch.com/report/3d-tsv-and-2-5d-market  

Why This Report Matters

Chip designers and cloud infrastructure buyers can assess packaging constraints alongside memory supply when planning AI accelerator procurement.Foundries, memory manufacturers and outsourced assembly firms can distinguish TSV and silicon-interposer services from broader advanced packaging categories.Investors can evaluate the impact of HBM stack height, yield and packaging capacity without double-counting the value of the underlying semiconductor dies.

Market Overview

Through-silicon vias are vertical conductive paths etched through thinned silicon dies. They enable memory layers to be stacked into high-bandwidth memory packages and help connect complex systems through silicon interposers. These structures support AI accelerators that require wide memory interfaces and high data throughput.

The market is narrower than all advanced packaging. Its value is tied to via formation, interposers and stacking services, not the full price of a GPU or memory device. HBM4 and larger AI packages raise technical demands for wafer thinning, bonding, defect inspection and thermal management.

Market Insights

HBM and other memory accounted for 46.0% of 2025 application revenue.2.5D integration led technology categories with 38.0% of 2025 value.Data centers and high-performance computing held 55.0% of end-use spending.Die-to-wafer integration accounted for 48.0% of value, reflecting established stacking processes.North America led demand at 35.0% in 2025, while Asia Pacific held 33.0% and hosts much of the production capacity.

Key Attributes

Attribute

Details

Historical reference

2018-2025 (source report)

Base year

2025

Market size, 2025

USD 9.46 billion

Market size, 2026 (source estimate)

USD 10.32 billion

Market size, 2035

USD 21.50 billion

Reported CAGR and measurement interval

8.50% (2026-2035)

Largest regional share

North America (35.0%, 2025)

Fastest-growing region

Middle East and Africa (9.96%)

Segments covered

Technology, Application, End use, Integration, Material, Provider

Geographic coverage

North America, Europe, Asia Pacific, Latin America, Middle East and Africa

Market Segmentation

The segmentation below follows the current report taxonomy and separates products, applications and buyers to avoid overlapping revenue definitions.

By technology: 2.5D integration; 3D TSV stacking; Chip-on-wafer and chip-on-wafer-on-substrate; Heterogeneous integration.By application: HBM and memory; Processors and AI accelerators; CMOS image sensors; MEMS; RF devices.By end use: Data centers and HPC; Consumer electronics; Automotive; Telecommunications; Industrial.By integration: Die-to-wafer; Wafer-to-wafer; Die-to-die and chiplet.By material: Silicon; Metal interconnects; Dielectrics; Organic and glass interposers.By provider: Integrated device manufacturers; Foundries; Outsourced assembly and test providers.

Market Drivers

AI accelerators use multiple HBM stacks beside processor dies, creating demand for more vias and larger interposers per package. Memory bandwidth has become a central constraint in AI system design.

Chiplet architectures let designers combine dies made on different processes. Dense interconnects and stacking improve performance but increase the need for precise alignment, bonding and testing.

Packaging investment in the United States and Asia is expanding capacity, although new plants require long qualification periods and can face construction delays. Long-term commitments from large customers influence utilization.

Regional Analysis

The following regional shares represent Credence Research estimates of 2025 market value. They are not independently audited supplier sales totals.

North America | 35.0% share in 2025

U.S. AI accelerator designers and cloud buyers account for a large share of demand, even when assembly occurs in Asia. Domestic packaging investment is expanding.

Asia Pacific | 33.0% share in 2025

Taiwan, South Korea and Japan host major HBM producers, foundries and outsourced packaging capacity. The region remains central to production and yield learning.

Europe | 22.0% share in 2025

Automotive, industrial and research buyers consume advanced packaged devices, with limited regional volume stacking capacity.

Middle East and Africa | 6.0% share in 2025

AI data center investment supports the fastest modeled demand growth from a relatively small base, primarily through imported accelerators.

Latin America | 4.0% share in 2025

Imported servers, electronics and industrial systems drive consumption rather than a large local TSV manufacturing base.

Market Challenges

TSV fabrication requires etching, insulation, metal filling, wafer thinning and bonding. Each step creates yield risk, and one failed die can reduce the value of a complex multi-die package.

Heat removal and mechanical stress become harder with taller stacks. Alternative bridge and organic-interposer approaches can also displace TSV-intensive designs in products where full silicon interposers are too expensive.

Future Outlook

HBM stack height and package complexity should keep TSV demand tied closely to AI computing. Memory makers and OSATs that improve yields and secure customer commitments are positioned to capture value.

The principal risks are concentration among a small group of AI buyers, plant timing and the cost of new bonding and thermal processes. Mature image-sensor and MEMS applications provide a more stable but slower-growing base.

Competitive Landscape

SK hynix, Samsung Electronics and Micron are leading HBM stacking manufacturers. TSMC provides silicon-interposer integration, while ASE Technology Holding and Amkor Technology perform advanced assembly and test. Intel and JCET participate in adjacent packaging approaches, but the current report does not establish their specific TSV revenue; they are therefore not treated as direct TSV market-share leaders. Commercial competition centers on stacking yield, capacity, thermal performance and customer qualification rather than published stand-alone TSV revenue.

Key Players

SK hynixSamsung ElectronicsMicron TechnologyTaiwan Semiconductor Manufacturing Co.ASE Technology HoldingAmkor Technology

Recent Developments

June 16, 2026: TSMC and Amkor announced a 10-year agreement for advanced packaging and testing services in Arizona. The arrangement establishes a framework for U.S. capacity and does not disclose financial terms.

Feb. 12, 2026: Samsung Electronics announced that it had begun mass production and commercial shipments of HBM4, reflecting the technical importance of multilayer memory stacks.

Report Coverage

The study analyzes market size, the base-year product and application mix, regional demand, technology adoption, competitive positioning, constraints and dated industry developments. It also examines commercialization, customer economics and the factors that could change the pace of adoption through 2035.

Forecasts and regional shares are proprietary Credence Research model estimates. Company announcements and regulatory materials are used for industry context; they do not independently validate the modeled global revenue totals. The report’s market definition and exclusions should be considered when comparing it with broader adjacent industries.

Read the full report and request a sample: https://www.credenceresearch.com/report/3d-tsv-and-2-5d-market  

Related Reports

2.5D and 3D Semiconductor Packaging Market3D IC and 2.5D IC Packaging MarketAdvanced Semiconductor Packaging MarketChiplet Packaging Technology MarketChiplet-Based ASIC Market

About Us

Credence Research Inc. is a global market intelligence and consulting firm founded in 2015. It provides quantitative market research, competitive intelligence and strategic advisory services to organizations assessing new products, investment decisions and regional opportunities. The firm combines primary and secondary research with industry interviews and structured market models.

Its research spans industrial technology, semiconductors, energy, health care, consumer markets and other sectors. Credence Research evaluates market size, segmentation, growth drivers, supply-chain risks, regional policy and competitive positioning to help clients make evidence-led decisions.

Contact Us

Credence Research Inc.
Tower C-1105, S 25, Akash Tower
Vishal Nagar, Pimple Nilakh, Haveli
Pune – 411027, India
Europe: +44 7453 598 606 | North America: +1 6282 627 656
Email: sales@credenceresearch.com 

Website: Credence Research

 

 

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Sapient Insights Group Reveals the HR Technology Solutions Ranking Highest in Vendor Satisfaction and User Experience for 2026

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Voice of the Customer badges awarded across 23 HR technology categories, based on 10,000 responses to Sapient’s 2026-2027 Annual HR Systems Survey

LAS VEGAS, Oct. 21, 2026 /PRNewswire-PRWeb/ — Sapient Insights Group today revealed the HR technology solutions ranking highest in vendor satisfaction and user experience in its 2026-2027 HR Systems Survey, now in its 29th year. This year Sapient awarded 630 Voice of the Customer badges across 23 technology categories and three company sizes. The rankings are based on responses from HR professionals representing 6,038 organizations.

Stacey Harris, Chief Research Officer and Managing Partner at Sapient Insights Group, presents the HR technology solutions ranking highest in vendor satisfaction and user experience for 2026.

To help buyers find the providers that fit their organization, the rankings are split into three company sizes: small, mid-sized, and enterprise. Respondents rate their satisfaction with their current solution in each technology category on a scale of 1 to 5, with attention to support and service. Sapient also ranks solutions on user experience. The top five solutions in each category and size earn a badge for vendor satisfaction and a badge for user experience. Three categories with smaller sample sizes (Time Labor Budgeting, Contingent Workforce Management, and Skills Management) are ranked in aggregate across all company sizes.

The survey continues to grow with the HR technology market. New this year, the survey adds Compliance Management to the HR Blueprint, application-level outcome questions, payment models for applications and AI, and finance applications covering Core, Expense, and Planning. It also asks more “why” questions throughout, so the results show not just what organizations are doing but the reasons behind their choices.

“Our Voice of the Customer rankings come straight from HR practitioners, with no sponsorship involved, which is why buyers and vendors both pay attention to them,” said Stacey Harris, chief research officer and managing partner at Sapient Insights Group. “This year we expanded the rankings to cover more of the HR technology landscape, which gives buyers a clearer view of how solutions perform for the specific work they need done, not just at the suite level. It also gives vendors honest feedback from the people who use their products every day.”

The highest-ranking solutions for vendor satisfaction are listed below. Rankings include point solutions, modules within technology suites, and in some cases service providers.

Payroll
Dayforce – Enterprise
isolved – Mid-sized
BambooHR – Small

HR Management
Dayforce – Enterprise
HiBob – Mid-sized
BambooHR – Small

Benefits
Businessolver – Enterprise
Fidelity NetBenefits/PSW – Mid-sized
HiBob – Small

HR Service Delivery: Portal
Dovetail – Enterprise
Workday Help – Mid-sized
isolved – Small

HR Service Delivery: Content Management
Dovetail – Enterprise
DocuSign – Mid-sized
isolved – Small

HR Service Delivery: Employee Help Desk
Dovetail – Enterprise
ServiceNow – Mid-sized
isolved – Small

HR Service Delivery: Engagement Survey
Dovetail – Enterprise
isolved – Mid-sized
BambooHR – Small

Time and Attendance
Darwinbox – Enterprise
isolved – Mid-sized
isolved – Small

Absence Management
Darwinbox – Enterprise
isolved – Mid-sized
BambooHR – Small

Leave Management
Darwinbox – Enterprise
isolved – Mid-sized
isolved – Small

Workforce Scheduling
Darwinbox – Enterprise
isolved – Mid-sized
isolved – Small

Labor Budgeting
isolved – All sizes

Learning
Cornerstone – Enterprise
OpenSesame – Mid-sized
isolved – Small

Recruiting
Indeed – Enterprise
Greenhouse – Mid-sized
BambooHR – Small

Onboarding
Dayforce – Enterprise
isolved (ApplicantPro) – Mid-sized
BambooHR – Small

Performance
Dayforce – Enterprise
HiBob – Mid-sized
BambooHR – Small

Compensation
Dayforce – Enterprise
Payscale Payfactors – Mid-sized
Insperity – Small

Succession
Dayforce – Enterprise
Microsoft Glint – Mid-sized
Paylocity – Small

Rewards and Recognition
Awardco – Enterprise
isolved – Mid-sized
Gifted – Small

Analytics
Visier – Enterprise
Visier – Mid-sized
UKG People Analytics – Small

AI/ML
Visier Vee – Enterprise
Grammarly – Mid-sized
Anthropic Claude – Small

Contingent Workforce Management
ServiceNow – All sizes

Skills Management HiBob – All sizes

The complete Voice of the Customer results, including the top five solutions for vendor satisfaction and user experience in every category and company size, are available here (https://sapientinsights.com/top-vendors/).

Sapient Insights Group will publish detailed survey findings and analysis in its annual HR Systems Research Report on November 6, 2026. The report will be available to purchase here (https://sapientinsights.com/shop/).

About the 2026-2027 HR Systems Survey

Now in its 29th year, Sapient’s HR Systems Survey is the longest-running, most comprehensive survey of the HR technology landscape, and the only fully objective, non-sponsored study of its kind. This year, HR professionals representing 6,038 organizations around the globe took part. The survey now covers 23 technology categories. The annual report includes an in-depth look at each category, along with current and future adoption rates, customer retention, replacement plans, and projected vendor growth.

For more information about the survey and report, schedule a call (https://calendly.com/summerorellano/schedule-a-call-with-sapient-insights-group).

About Sapient Insights Group Sapient Insights Group is a certified women-owned, privately-owned consulting, research, and advisory firm. The company works with organizations in the areas of HR and finance technology; HR strategy and transformation; leadership and culture; change management; talent management; mergers and acquisitions; and project management. The company’s HR Systems Survey is the HR profession’s most trusted source for objective data on the HR technology market and insights to guide buyer investments and vendor product development and marketing. For more information, visit www.sapientinsights.com.

Media Contact

Allison Williams, Sapient Insights Group, 1 4043044748, Info@sapientinsights.com, https://sapientinsights.com/

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SOURCE Sapient Insights Group

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SAJ Debuts First CEC-Approved Systems under Australia’s New Battery Standard at All Energy 2026

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EK70 HS5 and EK90 HS5 on show at Stand M143, with Australia’s Strongest Man at Stand E01 and the SAJ range across three distributor stands

MELBOURNE, Australia, Oct. 22, 2026 /PRNewswire/ — SAJ will exhibit at All Energy Australia 2026 at the Melbourne Convention and Exhibition Centre on 28–29 October. At Stand M143, installers can get their first hands-on look at the EK70 HS5 and EK90 HS5, the first products approved under Australia’s new SA TS 5398 standard.

At 2pm on Wednesday 28 October, DEKRA and CCS will present SAJ with the CEC certificates for the EK70 HS5 and EK90 HS5 on the stand, making SAJ the first brand listed under SA TS 5398. SAJ and DEKRA will also sign a strategic cooperation agreement covering safety, quality and compliance.

On the stand

EK70 HS5 – the all-in-one home energy system, combining hybrid inverter, LFP battery and whole-home backup in one unit. Modular 6, 7 and 9 kWh battery blocks stack to suit the household.EK90 HS5 – the premium tier, with 12,000-cycle cells, nine-layer safety protection, edge AI and a 15-year warranty.B2S and H2 – modular storage and the latest from SAJ’s residential range.elekeeper 5.0 – SAJ’s energy management app, with AI-assisted design, five-minute app commissioning and remote diagnosis.C&I – SAJ’s latest commercial and industrial solutions.

Live demonstrations of the EK70 HS5 and EK90 HS5, elekeeper 5.0 and the C&I range run at 10am on both days and again at 3pm on Wednesday.

Visitors can also play the claw machine on the stand throughout both days to win tennis balls signed by SAJ brand ambassador Alex de Minaur.

Beat Australia’s Strongest Man of 2026 at Stand E01

At Stand E01, near the hall entrance, visitors can take on Bradman Houston, Australia’s Strongest Man 2026, on the high striker. Bradman will be there each day. Anyone who beats his score wins!

Bradman recently partnered with SAJ and Sydney Solar & Electrical on a video series about lifting technique and fitness for solar installers, now on SAJ’s Instagram.

SAJ across the floor

The SAJ range is also on show with the company’s three national distribution partners, for stock, pricing and account conversations:

One Stop Warehouse – Stand EE113, with the EK90 HS5 on displaySupply Partners – Stand L135Tradezone – Stand S113

“All Energy is where the industry sees what’s next, and for SAJ that’s the EK70 HS5 and EK90 HS5,” said Alan Li, the Sales Director of SAJ Electric Australia. “Installers told us they want one integrated system that’s faster to install and that they can stand behind. Being the first brand listed under SA TS 5398 is the proof. We’d love installers to see both systems up close at Stand M143, and to try their luck against Bradman at E01 while they’re there.”

Visit SAJ

Where: Stand M143 (Beat the Strongest Man at Stand E01), Melbourne Convention and Exhibition CentreWhen: Wednesday 28 – Thursday 29 October 2026More information: au.saj-electric.com

About SAJ

Founded in Guangzhou in 2005, SAJ (Guangzhou Sanjing Electric Co., Ltd.) is a specialist in smart energy storage, delivering integrated solutions across solar generation, battery storage, energy management and EV charging for residential and commercial customers. SAJ has operated in Australia since 2013 and works with three national distribution partners – One Stop Warehouse, Supply Partners and Tradezone – backed by local technical support and warranty infrastructure.

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SOURCE SAJ

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Starvia Automotive Expands Used-Car Exports to Afghanistan and Iran

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GUANGZHOU, China, Oct. 22, 2026 /PRNewswire/ — Starvia Automotive has added Afghanistan and Iran to the destinations covered by its used-car export business, the company said on Oct. 21, as it focuses on used vehicles built to Chinese-market specifications. Buyers in both markets can now request an assessment of a specific vehicle before an order is confirmed.

What the review covers

For a used vehicle, the model name alone does not determine whether an export order can proceed. Year of manufacture, vehicle identity, condition, ownership documents and destination import rules are reviewed for each request, together with carrier acceptance, transit requirements and payment restrictions, according to the company.

Starvia cited two listings in its online used-car catalog as examples of the process: a 2023 Volkswagen Polo and a 2021 Volkswagen Tharu. The company said the listings show published stock and do not confirm that either unit is available or eligible for import into both markets. Stock, vehicle records and destination suitability are confirmed before a model is presented as an order option.

How an inquiry is handled

Inquiries are submitted through the company’s online form, which asks for destination city, importer details, preferred vehicle, quantity and purchasing timeframe. Starvia said the information is used to identify suitable vehicles, check documentation and seek a transport option, and that alternatives can be discussed if the first model does not meet the requirements.

An Arabic-language version of the site is available at https://www.starviaauto.com/ar?utm_source=prnews for buyers who prefer Arabic.

Any vehicle offer, freight estimate or shipment timing remains subject to commercial, regulatory and logistics checks, the company said. Buyers should obtain destination-side import approval before committing to a purchase.

About Starvia Automotive

Starvia Automotive is a Guangzhou-based exporter of new and used vehicles. Its online catalog lists used cars with vehicle history and inspection information for buyers in multiple regions.

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