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At APEC 2024, AmberSemi to Demonstrate Its Silicon-based AC to DC Power Conversion Technology

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AmberSemi’s exhibition will include multiple hands-on demos of its technology, as well a show-wide seminar presentation by CEO Thar Casey on the benefits of AC to DC Power Conversion in silicon

DUBLIN, Calif., Feb. 23, 2024 /PRNewswire/ — Amber Semiconductor, Inc. (AmberSemi™), a fabless semiconductor company and leading technology developer of patented, innovative technologies for AC Direct digital management of electricity in silicon chip architecture, is announcing its participation and plans for APEC 2024, the leading conference for power electronics professionals. At APEC 2024, AmberSemi will publicly showcase its AC Direct DC Enabler power management device for the first time ever. The AC Direct DC Enabler is AmberSemi’s first commercial silicon chip and is currently in customer evaluation for integration into their end products as early as Q4 2024. Those interested in experiencing the technology first-hand can visit AmberSemi at APEC Booth #639 at the Long Beach Convention Center from February 26-28th, 2024.

AmberSemi’s novel discoveries in semiconductor-based management of electricity include a portfolio of technologies with applications across industries on a global scale. To showcase the viability and broad-ranging impact of its AC Direct DC Enabler power conversion technology in silicon, the AmberSemi team will present three semiconductor demonstrations at its APEC booth. AmberSemi will specifically showcase different power levels for resistive and inductive loads, including 4-Watt, 2-Watt, and 1-Watt demos, all with various power densities. The company will also demonstrate two demos of its second technology, the AC Direct Switch controller platform, in the form of solid-state smart outlets, dimmer switches, and circuit breaker prototypes – all powered by AmberSemi. These demonstrations will serve as additional public validation for the technology, which has already been tested and validated at nearly 30 key electrical products and semiconductor company sites across Europe, the US, and Asia.

“We’re incredibly excited to display our AC Direct DC Enabler in silicon for the very first time to the broader industry, as it marks the most tangible step yet in our path to commercialization,” said Thar Casey, CEO of AmberSemi. “In the last year alone, we’ve advanced rapidly from the tapeout phase of siliconization to the design-in testing stage of our technology with Alpha customers, including multiple industry-leading partners in the semiconductor industry. As early as the end of this year, we anticipate that AmberSemi’s technology will formally be introduced to the marketplace through collaborative reference designs and integrations with these partners. In addition, end products, powered by AmberSemi, are expected to be in the market from our product partners starting in 2025. With all of that now in motion, we believe the sky’s the limit for our technology.”

AmberSemi’s AC Direct DC Enabler extracts DC directly from AC Mains without the use of rectifier bridges, transformers, and high-voltage, bulk capacitors and addresses the needs of a wide range of global markets in a new, highly integrated architecture. The product enables the smallest form factor for DC power delivery technology by requiring only half the external components used in today’s standard, comparable systems, creating opportunities to expand product features, significantly reduce product form factor, increase MTBF, and improve efficiency. This paves the way for highly integrated and intelligent IoT/IIoT/AIoT applications for the smart home, smart building, appliances, industrial automation, smart city, and other markets.

In addition to showcasing its breakthrough technologies at Booth #639, AmberSemi’s CEO, Thar Casey, will lead an education seminar titled “Bringing AC to DC Power Conversion to the 21st Century: Siliconizing Power to Eliminate the Challenges in AC to DC Power Conversion,” during the conference. The presentation will take place on Tuesday, February 27, 2024, 2:15 PM2:45 PM PST at Exhibitor Presentation Theater 3 in the Long Beach Convention Center. Those interested in attending can register at APEC-Conf.org.

About AmberSemi
Amber Semiconductor, Inc is a leading developer of patented, innovative solid-state power management technologies for the digital control of electricity. The company’s disruptive breakthroughs change the electrical landscape forever for industrial, commercial and residential building products, powered appliances, and semiconductor solutions worldwide. With 38 patents secured around the company’s core breakthroughs, its technologies upgrade power management from 1950’s era electro-mechanical standards to safer, more reliable silicon architecture with embedded intelligence. Based in Dublin, California, the company is a voting member of the National Electrical Manufacturers Association, and the Global Semiconductor Alliance (The GSA). The company was honored with numerous industry awards, such as Time Magazine’s Best Inventions of 2021, Fast Companies’ Next Big Thing in Tech 2022 and the coveted Edison Gold Award for Innovation in 2023, The GSA’s top four global Startups to Watch 2023, among many others. For more information visit www.ambersi.com.

Media Contact
Ruben Marinbach
GreenRoom Agency
Senior Account Director
ruben.m@grnrm.com  
646-285-8375

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SOURCE AmberSemi

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Agenda for the 4th Hong Kong Clinical-driven Robotics and Embodied AI Technology (CREATE) Symposium Officially Released

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Leading Experts from Medicine, Research, Industry and Investment Revealed

HONG KONG, Sept. 11, 2026 /PRNewswire/ — Scheduled for September 22–23, 2026, the 4th Hong Kong Clinical-driven Robotics and Embodied AI Technology (CREATE) Symposium will be held at the Charles K. Kao Auditorium in Hong Kong Science Park. The Centre for Artificial Intelligence and Robotics (CAIR), Hong Kong Institute of Science & Innovation, Chinese Academy of Sciences (CAS), organizes the event, with co-organization by the Hong Kong Science and Technology Parks Corporation (HKSTP).

The CREATE Symposium is dedicated to building a platform for in-depth dialogue between clinical medicine and cutting-edge technology. Having been held successfully for multiple editions, it has become a flagship international symposium on embodied intelligence in healthcare. This year’s event will focus on the practical clinical needs of more than ten specialties, including neurology, neurosurgery, respiratory intervention, otolaryngology, ultrasound imaging, and sleep medicine. It will bring together world-leading academicians, hospital directors, department leaders, and innovative scholars at the intersection of medicine and engineering to explore clinical applications and translation pathways of AI and robotics technologies, accelerating innovation and industrialization in global healthcare technology.

Symposium Highlights

This year’s symposium features a special “Hospital Presidents’ Roundtable” session. Eight hospital leaders from the Greater Bay Area will engage in in-depth discussions on integrating medicine and engineering, smart hospital development, and practical applications of medical AI.

The distinguished panel includes:

Linbo CAI, President of Guangdong 999 Brain Hospital, Chief Physician, and Doctoral Supervisor at Jinan University.

Kenneth Man-Chee CHEUNG, President and Hospital Chief Executive of The University of Hong Kong – Shenzhen Hospital, The Jessie Ho Professor in Spine Surgery and Chair Professor, Department of Orthopedics and Traumatology, HKU.

Kin-lai CHUNG, CEO of The Chinese University of Hong Kong (CUHK) Medical Centre.

Xiquan HU, Director, Management Committee of Lingnan Hospital; Director and Chief Physician, Department of Rehabilitation Medicine, The Third Affiliated Hospital, Sun Yat-sen University; President-Elect, Chinese Society of Physical Medicine and Rehabilitation, Chinese Medical Association.

Lijian JIN, Dean of Faculty of Dentistry, Modern Dental Group Professor in Clinical Dental Science, HKU.

Wing-yee SO, Hospital Chief Executive of North District Hospital, Hospital Authority.

Kenneth Hing Lim TSANG, Regional CEO of IHH Healthcare North Asia, CEO of Gleneagles Hospital Hong Kong.

Yi XIONG, Executive Director of Shenzhen Luohu District People’s Hospital.

The symposium will also launch CARES 4.0, a multi-modal medical AI large model and intelligent agent system for healthcare scenarios. Concurrently, a dedicated MedTech innovation exhibition will showcase cutting-edge medical hardware, AI algorithms, and other innovative achievements, demonstrating the latest capabilities in embodied intelligent healthcare.

As a co-organizer of this year’s symposium, HKSTP will host a special session titled “Empowering Founders, Enabling Growth: HKSTP’s Entrepreneurship Journey from Idea to Commercialization”. The session will introduce HKSTP’s life and health technology ecosystem and startup community, share The Road to Commercialization: Insights and Success Stories from HKSTP Startups, and feature the Roundtable Discussion: Empowering Value Creation and Growth through Strategic Partnerships.

Notably, the CREATE Symposium will debut a new “Roadshow Session” on September 23. The session will connect top-tier investment institutions with innovative companies. Participating companies will showcase products and technologies while receiving professional feedback from leading investors.

Investors from renowned institutions including Guangyuan Investment, Jiuguang Capital, Allwinner Technology, Yuexiu Group, Yanghe Investment, CICC Capital, Jianyuan Tianhua etc. have been invited to serve as judges. Invitations are also being extended to institutions such as Shenzhen Angel Fund of Funds, CCB International etc.

This year’s symposium will fully integrate MEDLing, CAIR’s proprietary intelligent conference assistant. The system has been customized and optimized for medical terminology, providing real-time speech transcription in Mandarin, English, and Cantonese, as well as high-precision transcript recording and simultaneous translation throughout the event. This will enable attendees from diverse fields and countries to communicate seamlessly and enjoy an enhanced conference experience.

Conference Information

Date: September 22–23, 2026 (Tuesday–Wednesday)
Venue: Charles K. Kao Auditorium, Hong Kong Science Park
Event Details and Latest Schedule: https://www.cair-cas.org.hk/article/662
Registration Link: https://forms.office.com/r/ePnu6HMySU?origin=lprLink

This year’s symposium features a dedicated healthcare technology exhibition area in the Atrium Link of Hong Kong Science Park. During the event, multiple guided tours will be organized to facilitate exchanges among attendees, academic experts, and industry representatives, fostering in-depth cross-sector collaboration.

Currently, only a limited number of booths remain available in the corporate exhibition area. Interested companies are invited to review partnership options

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SOURCE Centre for Artificial Intelligence and Robotics (CAIR), Hong Kong Institute of Science & Innovation, Chinese Academy of Sciences

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Scholarship America Marks 25th Anniversary of 9/11 by Honoring Its Support for the Families of Freedom Scholarship Fund

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NEW YORK, Sept. 11, 2026 /PRNewswire/ — Scholarship America today marks the 25th anniversary of the Families of Freedom Scholarship Fund, which it established and has administered since the fund’s founding in the direct aftermath of the September 11th attacks.

On September 11, 2001, the unthinkable happened, and the nation was forever changed. Thousands of children, including those of Ground Zero first responders, lost a parent or watched one become permanently disabled. In response, Scholarship America helped establish the Families of Freedom Fund to protect the dreams of these students, which it has proudly administered for more than two decades.

In the years since, the Fund’s scope has expanded to include the children of rescue and rebuilding workers who developed long-term and chronic illnesses tied to their service, nearly doubling the number of students eligible for support. Meeting that growing need has required an equally significant response: more than 20,000 individuals, corporations, foundations, and organizations – including longtime supporters Citi and Strada Education Foundation – have contributed to the Fund, helping award $193 million to 3,877 students who lost a parent or had one permanently disabled as a result of the September 11th attacks and the recovery efforts that followed.

“From the moment the horrific attacks unfolded, we knew the impact would echo across generations,” said Brandee McHale, Head of Community Investing and Development at Citi and President of the Citi Foundation. “We are proud of the work we did with organizations across the country to create this Fund, making a lasting commitment to support the educational needs of the children of victims.”

The Fund’s commitment will carry through 2030, when its youngest beneficiaries complete their undergraduate education.

“Twenty-five years later, we still remember how this Fund began—born out of one of the worst days in our nation’s history in an effort to ensure that these victims’ children wouldn’t lose their futures along with their loved ones,” said Mike Nylund, President and CEO of Scholarship America. “A promise was made to these students, and Scholarship America has been honored to help keep it for the past twenty-five years. Watching them graduate, build careers, and give back to their own communities has been one of the great privileges of this organization’s history.  On behalf of every student this Fund has supported, I am incredibly grateful for the generosity that made it possible.”

About Scholarship America

Since 1958, Scholarship America has been committed to breaking down financial barriers to higher education, turning the generosity of donors into life-changing opportunities for students across the country. To date, the organization has distributed more than $6 billion in scholarships to over 3.5 million students, making it the nation’s leading nonprofit scholarship administrator. Scholarship America also partners with individuals, foundations, small businesses, and nearly half of today’s Fortune 500 companies to deliver end-to-end scholarship program management for students pursuing degrees and certifications at technical, vocational, and two- and four-year colleges and universities.

Contacts:

Claire Berge Schmidt
Scholarship America
cbergeschmidt@scholarshipamerica.org

Logan Flynn
Hiltzik Strategies
lflynn@hstrategies.com

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SOURCE Scholarship America

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The 26th CIFIT Opens in Xiamen, Merchants from 129 Countries and Regions Seek Business Opportunities

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XIAMEN, China, Sept. 11, 2026 /PRNewswire/ — A report from IQINGDAO:

The 26th China International Fair for Investment and Trade (CIFIT) opened in Xiamen on September 8. More than 1,200 government agencies and business delegations from 129 countries and regions as well as 30 international organizations gathered at the event to explore opportunities for two‑way investment and cooperation.

As a landmark platform for “Invest in China”, this year’s CIFIT revolves around three major sections: “Invest in China”, “Chinese Investment” and “International Investment”. For the first time, it features Finland and Saudi Arabia as dual Guest Countries of Honor, and Guangdong and Qinghai as dual Guest Provinces of Honor.

Both the exhibition area and the number of exhibitors in the financial zone have doubled at this edition. A special zone for the Cross‑border Interbank Payment System (CIPS) makes its debut at CIFIT. A new special zone for new quality productive forces has been set up, focusing on cutting‑edge sectors including artificial intelligence and low‑altitude economy.

Over 40 key investment‑promotion events will be held during the fair, alongside nearly 100 supporting activities such as capital matchmaking and special‑topic roadshows. The Online CIFIT platform pools resources including investment‑attraction projects, corporate financing and industrial funds. Empowered by digital technologies, it enables easier project sourcing and more efficient capital matching.

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SOURCE Iqingdao

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