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120 Teams of Young Innovators Shine at the Hong Kong Science Fair

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Annual Event Showcases the Power of Creativity and the Innovation of Next Generation Technology in Hong Kong

HONG KONG, May 27, 2024 /PRNewswire/ — The Hong Kong Innovation Foundation (‘HKIF’) is thrilled to announce that the annual Hong Kong Science Fair (‘Science Fair’), will take place from 8 to 9 June at the Hong Kong Convention and Exhibition Centre. The Science Fair offers a dynamic platform for Hong Kong’s young innovators to showcase their creativity, with this year’s theme encouraging them to ‘Think Big Be Innovative’. 120 teams of local primary and secondary school students will share their outstanding innovative projects, while visitors to the fair can look forward to exploring six interactive zones, including the most popular ‘Laboratory Series’ workshops. Participants can delve into the fascinating world of food science, enjoy a sensory engagement session through changing the form and colour of sand, as well as utilise technology to transform physical drawings into a virtual imaginary world where they can roam among the stars. In addition, the Science Fair will also feature innovative technological advancements from local universities and institutions and invite local technology experts to share their latest scientific research. Online registration is now open, and admission is free for the public.

The Hong Kong Innovation Foundation is dedicated to fostering innovation and technology development in Hong Kong by cultivating an innovative spirit from an early age. As part of its commitment, HKIF arranged for the gold award-winning teams from the previous Science Fair to participate in the prestigious International Exhibition of Inventions Geneva in Switzerland in April. This exhibition is one of the largest global events exclusively devoted to inventions, students and teachers from Bishop Hall Jubilee School, St. Stephen’s Girls’ College, and C.&M.A. Chui Chak Lam Memorial School had the unique opportunity to exchange ideas with inventors from around 40 countries and regions. Two of their research projects, ‘AI Guardian’ and ‘Plantis’, received bronze awards at the exhibition.

Mr. Daryl Ng, Chairman of the Hong Kong Innovation Foundation, said, ‘With the strong support of the Central Government and the HKSAR Government, Hong Kong’s innovation and technology continues to thrive and gain international recognition. The Hong Kong delegation won over 350 awards at this year’s “International Exhibition of Inventions Geneva”, exceeding past achievements. Seeing former Hong Kong Science Fair participants succeed on the global innovation stage was truly inspiring. The Science Fair gives primary and secondary students a platform to showcase their creativity, and I am grateful for the ongoing support from all sectors. I encourage the public to experience first-hand the innovative energy of our youth and, together, to promote a culture of innovation and technology.’

The Hong Kong Science Fair attracts thousands of visitors annually and showcases Hong Kong’s passion for innovation and technology. Six interactive zones will be featured in this year’s Science Fair for families to enjoy interactive experience and workshops, including the ‘Laboratory Series’ workshops that are well received by children. In the ‘Magic Vit-C’ workshop, participants can explore the chemical interactions between vitamin C and fresh cut fruits and deepen their understanding of food science; the ‘Sand-sitivity’ workshop will offer a creative learning experience by manipulating the texture and colour of sand to stimulate the senses; in ‘Draw Me to the Stars’, technology will be used to transform physical drawings into a virtual imaginary world, allowing visitors to embark an exciting tour with space creatures; in ‘HKSF Odyssey’, visitors can explore the entire exhibition hall and collect the exquisite astronaut postcards. This year’s fair will also present the latest scientific and technological research advancements from local universities and institutions. Experts from different institutions will also be on hand to discuss the real-world applications of innovative technologies and their development, fostering collaboration between industry, academia, and the public.

This year’s Science Fair received nearly 330 project submissions from over 1,400 students and teachers representing 130 local and international schools, with students ranging from Primary 4 to Secondary 6. Among the participants, approximately 50 schools are joining the fair for the first time. A preliminary judging panel composed of experts and scholars from various industries has selected 120 finalist teams. These finalists will present their research projects, focusing on four main categories: ‘Smart City & Smart Home’, ‘Medical & Healthcare’, ‘Sustainability’, and ‘Education’. The public can also participate by voting for the ‘Most Popular Award’ on-site, supporting and encouraging these young inventors as they continue to explore their creative potential.

The Third Hong Kong Science Fair and Award Presentation Ceremony Details

Date:

8 – 9 June 2024 (Saturday to Sunday)

Time:

10:00 am to 6:00 pm

Location:

Hong Kong Convention and Exhibition Centre, Hall 3FG

Online Registration:

https://www.reghksciencefair.org.hk/public/

 

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SOURCE Hong Kong Innovation Foundation

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Nexteer’s Global First Steer-by-Wire Goes into Production

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BEIJING, April 26, 2026 /PRNewswire/ — Nexteer Automotive helped a leading Chinese new energy vehicle (NEV) manufacturer bring the world’s first production passenger vehicle with a full drive‑by‑wire chassis to market. The vehicle features Nexteer’s steer‑by‑wire (SbW) system as a key enabler.

The SbW featured in this vehicle marks Nexteer’s first SbW system in mass production, representing a major step forward for the technology — moving from development and validation to full-scale production. Certified in late 2025, this system achieved the world’s first ASIL D functional safety approval from DAkkS (German Accreditation Body) through close collaboration with the OEM. This certification reflects global top-tier performance in fault diagnosis, redundancy, and safety monitoring. Key features include:

Multi-layered redundancy design: Dual controllers, dual power supplies, multiple communication links, and dual actuation paths — achieving redundancy at system, hardware, and software levels. This ensures that in the event of a single fault, the backup path takes over within milliseconds with no loss of steering function.Full‑scenario functional safety mechanism: Multi‑level monitoring and fault handling strategies covering sensors, controllers, actuators, and communication links.Variable steering ratio: Automatically adjusts steering angle and effort based on vehicle speed and driving mode, balancing agility and comfort.Intuitive road‑feel simulation technology: Software‑defined steering feedback delivers a more responsive and precise driving experience, adaptable to a wide range of driving scenarios.Open interface for autonomous driving: As a key actuation layer for ADAS and autonomous driving systems, it provides real‑time, precise control capabilities, supporting the development of intelligent transportation systems.

Steer-by-Wire: Electronic Signals Replace Mechanical Links, Flexible Configurations for Diverse Needs

By decoupling the mechanical link between the hand wheel and the road wheels, steer-by-wire replaces conventional mechanical connections with electronic signals and actuators — and is quickly becoming a foundational technology for next-generation intelligent chassis and autonomous driving platforms. As a motion control technology company with 120 years of engineering heritage, Nexteer offers a flexible, off-the-shelf portfolio of steering feel simulators and road wheel actuators. This modular approach allows us to meet the diverse needs of different vehicle models and driving scenarios efficiently and cost-effectively.

From Steering to Braking: Expanding Full-Stack Motion Control Capabilities

Building on its deep expertise in steering systems, Nexteer has expanded into braking with its Brake-by-Wire solution, the Electro-Mechanical Brake (EMB). EMB has completed full development and rigorous validation and is ready for mass production. Together with SbW, Brake-by-Wire (EMB), Rear-Wheel Steering, and the MotionIQ™ Software Suite make up Nexteer’s broader Motion-by-Wire™ portfolio.

With Nexteer, OEMs get more than steer-by-wire and brake-by-wire components: they get a complete, proven, production-ready and cost-effective drive-by-wire chassis motion control solution that’s shaping the future of the software-defined chassis and enabling faster development, lower costs and safter, smarter and more exciting driving experiences.

During Auto China 2026, we cordially invite you to visit Nexteer at Booth W1B03, Hall W1, China International Exhibition Center (Shunyi) in Beijing, to experience firsthand the breakthrough innovations of steer-by-wire and Motion-by-Wire™ technologies.

ABOUT NEXTEER AUTOMOTIVE

Nexteer Automotive (HK 1316) is a global leading motion control technology company accelerating mobility to be safe, green and exciting. Our innovative portfolio supports Motion-by-Wire™ chassis control, including electric and hydraulic power steering systems, steer-by-wire and rear-wheel steering systems, steering columns and intermediate shafts, driveline systems, software solutions and brake-by-wire. Celebrating 120 years of automotive innovation in 2026, Nexteer builds on a strong legacy of engineering excellence while continuing to shape the future of mobility. The company solves motion control challenges across all megatrends – including electrification, software/connectivity, ADAS/automated driving and shared mobility – for global and domestic OEMs around the world including BMW, Ford, GM, RNM, Stellantis, Toyota and VW, as well as automakers in India and China including BYD, Xiaomi, ChangAn, Li Auto, Chery, Great Wall, Geely, Xpeng and others. www.nexteer.com  

Links to Nexteer Media Center

Logo – https://mma.prnewswire.com/media/2368187/5937537/nexteer_Logo.jpg

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World IP Day 2026: PitchMark launches Ideas.Exchange to help creators safeguard and license ideas in the age of AI

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SINGAPORE, April 26, 2026 /PRNewswire/ — To mark World IP Day 2026, PitchMark® today launched Ideas.Exchange, a first‑of‑its‑kind platform designed to help creators assert intellectual property rights, license ideas, and formalise creative conversations in an increasingly AI‑driven economy.

Unveiled at Safeguard Your IP in the Age of AI, a media briefing hosted by CNBC’s Sri Jegarajah, the platform responds to growing concern that ideas are routinely used, reused or absorbed without attribution, consent or compensation—often with limited legal or commercial recourse.

“AI has amplified both the reach and the risk for creators,” said Mark Laudi, Managing Partner of PitchMark LLP. “Ideas.Exchange gives creators a way to protect themselves while still participating confidently in the market for ideas.”

At its core, the platform focuses on three interventions for creators:

Asserting IP rights by establishing proof of authorship and precedenceLicensing ideas without giving them away for freeFormalising conversations so pitches and evaluations are governed rather than informal

Ideas.Exchange is powered by three proprietary resources developed by PitchMark. These include a blockchain‑driven clearing house where ideas and creative works can be listed and licensed; smart contracts that automate usage terms and reduce disputes; and an IP Governance Certification Program designed to signal responsible handling of ideas, particularly in enterprise and AI contexts.

The result, PitchMark says, is three concrete outcomes: deterrence of idea theft, new ways to monetise ideas through structured licensing and price discovery, and a more level playing field that allows creators to pitch to clients and platforms on equal terms.

The launch comes amid renewed scrutiny of how intellectual property is treated in the AI era. While idea theft is rarely reported, its impact is significant. Beyond visible financial losses, organisations and creators often absorb hidden costs through talent attrition, innovation suppression and abandoned market opportunities.

“Most idea theft occurs informally and never reaches the courts,” said Prof David Llewelyn, Professor Emeritus of Law at Singapore Management University. “Introducing governance, traceability and standards is a meaningful step toward addressing that gap.”

Spokespeople including Prof Llewelyn, technology lawyer Bryan Ghows, and Mark Laudi are available for interview.

About PitchMark

PitchMark® deters idea theft and enables creatives to get paid by providing a trusted way to share and license ideas with prospects and clients.

 

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SOURCE PitchMark

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SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

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SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM Contributed to the global AI computing ecosystem via stable mass production across all HBM generationsCompany committed to becoming a premier leader in AI innovation through collaboration with global customers and partners

SEOUL, South Korea, April 25, 2026 /PRNewswire/ — SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it received the Corporate Innovation Award at the ‘2026 IEEE1 Honors Ceremony’ held in New York on the 24th (local time).

IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Established more than a century ago, the IEEE Awards Program recognizes individuals and teams whose innovations have advanced technology and improved the human condition.

The IEEE Corporation Innovation Award, part of the Recognitions category, has been presented since 1986 to companies that have significantly contributed to the advancement of industry and society through innovative technology. This marks the first time SK hynix has received this honor.

SK hynix attributed the honor to its contribution to the global AI computing ecosystem by ensuring the stable mass production of all High Bandwidth Memory (HBM) generations. Looking ahead, the company aims to solidify its position as a trusted partner in the global AI market by providing memory solutions that are critical to overcoming the performance limitations of AI platforms.

The recognition highlights SK hynix’s achievements in driving the expansion of AI computing through HBM innovation and application. Central to this success was the company’s ability to preemptively offer innovative HBM solutions and respond timely to customer demands in the global AI market.

Industry observers also credit this achievement to the strategic direction of SK Group Chairman Chey Tae-won, who has long emphasized securing long-term technological competitiveness. Under his leadership, the company has consistently expanded its AI infrastructure partnerships with global Big Tech firms in the United States.

Ahn Hyun, President and Chief Development Officer (CDO), attended the ceremony as the company representative to accept the award.

“It is an honor to receive this award on behalf of our employees, who have tirelessly challenged the limits of technology,” said Ahn. “By collaborating closely with our global customers and partners, we will stay ahead in creating the value the market demands and continue to be a premier company leading AI innovation.”

About SK hynix Inc.
SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”) and flash memory chips (“NAND flash”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

About IEEE
IEEE is the world’s largest technical professional organization and a public charity dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice in a wide variety of areas ranging from aerospace systems, computers, and telecommunications to biomedical engineering, electric power, and consumer electronics. Learn more at https://www.ieee.org.

View original content:https://www.prnewswire.com/news-releases/sk-hynix-receives-2026-ieee-corporate-innovation-award-for-driving-ai-computing-expansion-with-hbm-302753615.html

SOURCE SK hynix Inc.

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