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Toshiba and SpeQtral to Present Cutting-Edge Quantum Security Solutions for Singapore Enterprises at ATxSG 2024

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SINGAPORE, May 29, 2024 /PRNewswire/ — Toshiba Asia Pacific Pte. Ltd. (TAPL), a subsidiary of Toshiba Corporation, and SpeQtral, a leading quantum communications technology company, are set to present their latest quantum key distribution (QKD) products and services at the highly anticipated Asia Tech Singapore (ATxSG) 2024 event. TAPL is supporting the strategic partnership[1] between Toshiba Digital Solutions Corporation (Toshiba Digital Solutions) and SpeQtral, to equip enterprises in Singapore with cutting-edge quantum-safe data communications, fortifying their digital infrastructure against emerging cybersecurity threats.

In November 2023, the Infocomm Media Development Authority of Singapore (IMDA) appointed SpeQtral and SPTel[2], a reliable and secure business digital services provider, to jointly build the National Quantum-Safe Network Plus (NQSN+), Singapore’s first nationwide quantum-safe network.

As part of the NQSN+, SpeQtral and SPTel will leverage Toshiba’s leading fibre-based Quantum Key Distribution (QKD) and Quantum Key Management System (Q-KMS) product suite to support the deployment. The NQSN+ has entered its first phase of implementation and testing of the QKD-as-a-Service platform to safeguard against emerging cybersecurity threats and foster a safer digital environment.

Toshiba, a leading developer in the field of quantum cryptography, harnesses global expertise in deploying quantum-safe use cases through collaborations with leading telecom players such as BT Group, KT, NTT[3], Orange and Softbank Corp., and network encryption vendors such as Adtran, Adva Network Security, Ciena, PacketLight Networks, ST Engineering’s Cyber business and Thales. By leveraging this deployment expertise and partnerships, Toshiba can customize quantum security solutions to meet the specific demands of local markets, together with SpeQtral and SPTel.

Beyond terrestrial-based fibre QKD solutions, SpeQtral also offers a full range of satellite QKD hardware, software and services to drive the commercialization of space-based QKD for long distance, intercontinental quantum-safe data transmission. Together with a network of partners globally, SpeQtral is advancing its vision to create integrated satellite and terrestrial QKD services to enable global quantum-secure digital communication.  

Furthermore, Toshiba and SpeQtral will launch a series of workshops at the Quantum Networks EXperience Centre (QNEX) to create awareness and foster a deeper understanding among enterprises in Singapore about quantum security solutions. These workshops will delve into the complexities of quantum security, equipping businesses with the knowledge and expertise to harness the power of quantum technology and navigate the rapidly evolving quantum landscape with precision and confidence.

ATxSG 2024 attendees will have the opportunity to learn about the latest advancements in quantum-safe communications and experience the capabilities of Toshiba and SpeQtral’s QKD solution, which enables secure data transmission and protection against increasingly sophisticated cyber threats.

Join Kentaro Taira, Chief Specialist of Toshiba Digital Solutions’ QKD Business Promotion Department, and Chune Yang Lum, Co-Founder and CEO of SpeQtral, at the session “Shaping Tomorrow: Leading The Charge in Quantum Security Solutions” during the TechXLR8’s Quantum Technology Summit at Asia Tech x Singapore (ATxSG) held at Singapore Expo Hall 4 Stage 4 on May 30, 2024, at 11:30 SGT. They will share expert insights and strategies for quantum security readiness, explicitly tailored for Singapore enterprises to help them stay ahead of the curve in the rapidly evolving quantum landscape.

1.     Toshiba and SpeQtral Forge Deeper Partnership: https://asia.toshiba.com/news-release/press-release/toshiba-and-speqtral-forge-deeper-partnership-amidst-landmark-national-quantum-safe-network-plus-nqsn-project
2.     SpeQtral and SPTel appointed to build NQSN+:  https://speqtralquantum.com/newsroom/speqtral-and-sptel-appointed-to-build-nqsn-singapores-first-nationwide-quantum-safe-network
3.     https://www.global.toshiba/jp/company/digitalsolution/news/2021/1105.html

About Toshiba Asia Pacific Pte. Ltd.

Toshiba Asia Pacific Pte. Ltd. (TAPL), a subsidiary of Toshiba Corporation, was established in 1995 as Toshiba’s regional headquarters for operations in Southeast Asia, India and Oceania. Apart from its head office in Singapore, Toshiba Asia Pacific has overseas offices in Bangladesh and Vietnam. TAPL supports Toshiba companies in the Asia Pacific region with a strong focus on expanding our business in Energy Systems, Social Infrastructure Systems, Devices & Storage and Digital solutions. TAPL’s commitment aligns with Toshiba’s unwavering drive to solve global social issues by advancing the quest for carbon neutrality and resilient infrastructure by creating integrated value-add solutions.

Find out more about TAPL at https://asia.toshiba.com/

About SpeQtral:

SpeQtral is a pioneer in quantum communications, with a vision to build and deploy global quantum networks. SpeQtral develops quantum-secure products and services designed to protect sovereign and enterprise telecommunication networks against classical, as well as future quantum based cyber-attacks. Combining both terrestrial and space-based solutions, SpeQtral aims to secure the world’s networks against the threats posed by the imminent quantum revolution and drive innovation in quantum communications that will serve as the building blocks for the future quantum internet.

For more information, visit: https://speqtralquantum.com/

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SOURCE Toshiba Asia Pacific Pte. Ltd.

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

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