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Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process

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Production-Ready Design Flows, Multi-Die Solution, and Synopsys IP Deliver a Proven Path to Unparalleled Power and Performance for AI and HPC Designs

Highlights

Test chip tapeouts validate product readiness of certified digital and analog design flows for Samsung Foundry SF2/SF2Z processCollaboration on design techniques for SF2, including backside power and nanosheet optimization delivers more efficient power distributionSynopsys IP, now available and silicon proven on Samsung SF2, reduces integration risk and accelerates silicon successQualified multi-die design reference flow and UCIe IP for SF2 process accelerates 2.5D/3D heterogeneous integrationExpanded collaboration on Synopsys.ai includes Synopsys ASO.ai for accelerated analog design migration with new analog design migration reference flow for Samsung’s GAA processes

SUNNYVALE, Calif., June 12, 2024 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry’s SF2 process with multiple test chip tapeouts. The reference flows, powered by the Synopsys.ai™ full-stack EDA suite, enhance PPA, boost productivity, and accelerate analog design migration for Samsung Foundry’s latest Gate-All-Around (GAA) process technologies. The Samsung SF2 process was optimized using Synopsys’ AI-driven design technology co-optimization (DTCO) solution which delivered significantly superior performance, power, and area (PPA) for the process compared to optimization without the use of AI. Building on this success, the same co-optimization techniques will be applied for Samsung’s advanced SF1.4 process.

“The demand for custom SoCs in the era of pervasive intelligence requires extensive ecosystem collaboration to help customers accelerate their innovation and silicon success on Samsung’s SF2 and next-generation SF1.4 processes,” said Sanjay Bali, vice president of product management and strategy for the EDA Group at Synopsys. “Achieving certification and multiple successful tapeouts of our digital and analog flows, powered by Synopsys.ai, on the SF2 process, combined with proven Synopsys IP provides designers with a trusted path to meeting their aggressive design goals for a faster time to market.”

“Synopsys and Samsung have worked closely for decades to help our mutual customers achieve their most complex design requirements,” said Sangyun Kim, Vice President and head of Foundry Design Technology Team at Samsung Electronics. “This latest collaboration milestone with Synopsys on AI-driven EDA flows and broad IP portfolio development is a testament to our ongoing efforts to address the industry’s growing demand for high performance computing with significant PPA gains. Working together we validated our PPA results using Synopsys’ certified digital flow, achieving 12% higher performance, 25% reduction in power, and 5% area reduction compared to the base design.”

Collaboration on AI-driven EDA Flows
Synopsys and Samsung are closely collaborating on AI-driven flows, including Synopsys DSO.ai™ for design productivity and PPA optimization, and Synopsys ASO.ai™ for faster analog design migration. This collaboration has resulted in a new analog design migration reference flow using Synopsys ASO.ai for Samsung’s FinFET to GAA processes, enabling designers to efficiently migrate Samsung 8nm analog IPs to SF2 process, adding to Synopsys‘ established flows on Samsung’s 14nm to 8nm/SF5 processes.

New Design Techniques and Methodology for Advanced GAA Processes
Synopsys‘ continued innovation helps mutual customers benefit from new design techniques including backside routing, local layout effect-aware methodology, and nanosheet cell design, to help customers meet their design goals for power, performance, and area on Samsung SF2 process family. In addition, integrating backside routing and the super-cell approach using Synopsys‘ digital implementation and signoff tools enables designers to increase transistor performance efficiency and density, optimize power consumption, and reduce area by up to 20% for Samsung’s SF2Z process technology compared to chips without backside routing capabilities. 

Accelerate SoC and Multi-Die Designs
Synopsys IP for Samsung standard and automotive processes from SF2 to SF14LPU delivers a competitive edge for chipmakers looking to reduce integration risk and accelerate time to silicon success for automotive, mobile, high-performance computing (HPC) and multi-die designs. The industry’s broadest portfolio of standards-compliant, silicon-proven interface IP for advanced Samsung processes, including PCIe 6.0/5.0/4.0, DDR5, LPDDR5X/5/4X, MIPI M-PHY G5, eUSB2, USB 3.2/3.1, and DisplayPort enables wide interoperability for commonly used protocols. To accelerate integration of chiplets in multi-die packages, Synopsys UCIe IP has taped out in SF2 and SF4x, and achieved silicon success in SF5A process technologies, to deliver robust die-to-die connectivity with low power and low latency. Synopsys Foundation IP, including embedded memories, logic libraries and GPIOs, is also proven in silicon to deliver leading power, performance, and area in a range of Samsung process technologies.  

Mutual customers can accelerate the development of multi-die designs using Synopsys 3DIC Compiler, a unified exploration-to-signoff platform for 2.5D and 3D heterogeneous integration and advanced packaging. Qualified for Samsung Foundry’s SF2 process, Synopsys 3DIC Compiler supports Samsung’s advanced silicon processes, packaging technologies, and 3DCODE standard. Synopsys is an active member of the Samsung Foundries’ MDI Alliance, helping mutual customers achieve a successful transition to 2.5D and 3D advanced packaging designs.

About Synopsys
Catalyzing the era of pervasive intelligence, Synopsys, Inc. (Nasdaq: SNPS) delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. We partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.  Learn more at www.synopsys.com.

Editorial Contact
Kelli Wheeler 
Synopsys, Inc. 
(650) 584-5000
kelliw@synopsys.com
corp-pr@synopsys.com 

 

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SOURCE Synopsys, Inc.

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Global Wisdom, Shared Future: Inaugural Global Energy Storage Colloquium Held in Xiamen

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XIAMEN, China, Nov. 13, 2026 /PRNewswire/ — The inaugural Global Energy Storage Colloquium was held in Xiamen under the theme “Frontiers in Dialogue•Powering Tomorrow’s Storage.” Hosted by HiTHIUM and co-organized by the Energy Storage Application Branch of China Industrial Association of Power Sources (CESA), the colloquium brought together leading international experts, scholars, and industry representatives. Participants discussed battery materials, energy storage technologies, power electronics, system applications and industrial innovation.

As energy storage develops toward longer durations, diverse technologies, larger capacity and greater system integration, the industry faces scientific and technical challenges involving battery materials, lifetime mechanisms, safety limits and power system integration. The colloquium provided a platform for experts to exchange views on these topics and explore how fundamental research and international collaboration can support continued innovation.

Participants came from Imperial College London, the University of Cambridge, Tsinghua University, Xiamen University, Huazhong University of Science and Technology, City University of Hong Kong and other institutions. Maochun Hong, Academician of the Chinese Academy of Sciences from the Fujian Institute of Research on the Structure of Matter, attended the event. Clare Grey, Dame Commander of the Order of the British Empire, Professor of Chemistry, University of Cambridge; Tim Green, Fellow of the Royal Academy of Engineering and Professor at Imperial College London; Shigang Sun, Academician of the Chinese Academy of Sciences and Professor at Xiamen University; Yong Yang, Distinguished Professor at Xiamen University; and Chongqing Kang, Professor at Tsinghua University served as co-chairs. Yunhui Huang, Professor at Huazhong University of Science and Technology served as chief advisor.

Jeff Wu, Founder and Chairman of HiTHIUM; Yong Liu, Vice Chair of CESA; and Kate Harrisson, His Majesty’s Trade Commissioner for China and Hong Kong, delivered remarks at the Colloquium.

According to Jeff Wu, energy storage is a systemic technology spanning multiple disciplines and sectors, and that its development depends on breakthroughs in fundamental research and international collaboration. He said HiTHIUM hopes to build on the colloquium to expand cooperation with leading universities and research institutions worldwide, deepen engagement between academia and industry, and help translate research into practical contributions. The company will continue supporting the colloquium as a lasting platform for exchange and collaboration.

Academic sessions covered battery mechanisms and characterization, degradation and lifetime prediction for grid-scale lithium-ion batteries, power system stability with high penetration of inverter-based resources, and the development of virtual power plants. Experts also discussed real-time, non-destructive battery testing, early warning of thermal runaway, energy storage opportunities at distribution transformer areas, and revenue streams from electricity market participation.

The three-day colloquium also included thematic sessions on energy storage materials and batteries, power and grids, systems and applications. Scholars visited HiTHIUM’s smart factory in Xiamen to learn about advanced manufacturing and industrial practices in China’s energy storage sector.

HiTHIUM looks forward to working with partners worldwide to advance energy storage technology and the industry’s development, supporting the global energy transition and a clean, sustainable future.

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SOURCE HiTHIUM

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Guangdong and Papua New Guinea: Taking roots across the Pacific

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GUANGZHOU, China, Nov. 13, 2026 /PRNewswire/ — A news report from South:

Few places on Earth feel as wild as Papua New Guinea. Spread across more than 600 islands, the Pacific nation is home to extraordinary cultural and biological diversity. But some of what comes from its waters is now travelling much further—all the way to dinner tables in China.

For local seafood exporter Tony Lan, China has transformed the scale of his business. His company buys wild-caught mud crabs from local fishermen before flying them to Chinese cities including Guangzhou.

“We used to sell a few hundred kilos a week to the local market,” Lan said. “But once we started exporting crabs to China, business just exploded. Now we’re moving 20 to 30 tons a week.”

The impact has spread beyond the company itself. Lan said families involved in the crab trade have been able to build better homes and buy televisions and generators.

But the connections between Papua New Guinea and Guangdong go far beyond seafood.

In Port Moresby, 21-year-old Maureen works as a receptionist for a Chinese company. Finding work is far from guaranteed. “A lot of degree holders, they don’t have jobs,” she said. “But you see me, I don’t have a degree, but I have a job.”

Her story leads back to Butuka Academy, the school she graduated from. Built with support from Shenzhen under its sister-city relationship with Port Moresby, the academy now accommodates around 3,000 students. Maureen says the computer skills she learned there—including Microsoft applications, web skills and Excel—are the same ones she now uses at work.

Another connection has taken root in soil.

Juncao, a grass-based agricultural technology developed in China, was introduced to Papua New Guinea in the 1990s. Initially used for mushroom cultivation, it has since found applications ranging from livestock feed to fibers and bioenergy. Over three decades, the technology has spread to more than 9,000 farming households, benefiting around 30,000 people.

For Georgina, whose family was among the early adopters, Juncao has shaped both family life and career. After struggling to find a job for two years, she returned to mushroom farming and helped local farmers find markets. That experience eventually led to her current work with a Shenzhen company exploring new uses for the grass.

“I want everyone to know about Juncao, the benefits of it,” she said. “It’s part of me.”

For National Capital District Governor Powes Parkop, such exchanges are part of Papua New Guinea’s wider development journey.

“Being a rural-based, traditional economy, now trying to become a modern economy, we can only learn from China,” Parkop said. He also stressed the importance of APEC for smaller economies, saying PNG does not always have the means to engage with economies across the Pacific individually, “and we have the opportunity at APEC.”

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SOURCE South

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Longsys and Lexar Showcase Industrial, Automotive and Edge AI Storage at electronica 2026

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MUNICH, Nov. 13, 2026 /PRNewswire/ — Longsys (301308.SZ/09976.HK) and its International high-end consumer storage brand Lexar are exhibiting at electronica 2026 in Munich, Germany, from November 10 to 13. Under the theme “Integrated Storage Empowering Edge AI,” Longsys is launching an industrial-grade wide-temperature mSSD and showcasing automotive storage and Edge AI solutions for industrial equipment, intelligent vehicles and smart devices.

Industrial Wide-Temperature mSSD

The new XP2390Mi industrial-grade wide temperature mSSD targets demanding edge applications such as industrial AI inspection, edge control, outdoor devices and embodied robotics. Supporting -40°C to 85°C and featuring PCIe Gen4×4 and NVMe 2.0, it offers 128GB to 1TB capacities, with sequential read/write speeds of up to 7,400/6,200MB/s.

Its SiP (System-in-Package) design integrates the controller, NAND flash and passive components in one package, reducing board-level solder joints and associated failure risks. It features IP57-rated dust and water resistance, shock and vibration resistance, anti-sulfuration protection, firmware-level power-loss protection and security features. The 1TB version delivers an endurance rating of 600–800 TBW. The product offers optional thermal management extensions and M.2 form factors, including 2230, 2242 and 2280, providing customers with greater flexibility for different device space and mechanical integration requirements.

Automotive Storage for Intelligent Vehicles

Longsys presents automotive-grade UFS, eMMC and LPDDR, as well as industrial/automotive-grade SPI NAND Flash. UFS 4.1 features Wisemem’s self-developed 5nm WM7400 controller, delivering sequential read/write speeds of up to 4,200/4,000MB/s and capacities from 128GB to 512GB. The portfolio supports in-vehicle systems, data logging and future onboard AI applications.

Longsys’ automotive storage capabilities are supported by AEC-Q100 reliability qualification, in-house packaging and testing, and collaboration with more than 20 chipset platforms, 20 automakers and 60 Tier 1 suppliers. Lexar is showcasing dashcam USB drives, memory cards and industrial-grade SD/microSD cards for sustained in-vehicle recording, including sentry-mode use.

Storage and Memory for Edge AI

For AI PCs, AI Boxes and other edge AI devices, Longsys is demonstrating an AMD-platform AI host powered by XP2380MA AISSD™ and AIDIMM™. The AISSD combines a 128GB Static SLC tier for demanding AI workloads with a 512GB/1.5TB QLC tier for models, applications and general data. With the iSA™ Storage Agent, it enables on-demand MoE expert loading and SSD-based data orchestration, helping extend model deployment beyond limited DRAM/VRAM capacity. AIDIMM, based on LPDDR5x, provides a 256-bit interface and bandwidth of up to 307.2GB/s.

Other highlights include AILPBGA™, a high-bandwidth embedded memory solution; HLCache™ UFS, co-optimized with Allwinner to improve multitasking on memory-constrained devices; and UFS 4.1 with iSA, adapted for Qualcomm’s 6th-generation Snapdragon 8 Super Edition platform. At the Snapdragon Summit, the solution powered local end-to-end inference for a 30B-parameter MoE assistant.

From industrial and automotive applications to AI computing at the edge, Longsys continues to advance integrated storage through product innovation and platform collaboration.

About Longsys

Founded in 1999, Longsys (301308.SZ/09976.HK) is a globally leading branded semiconductor memory enterprise, integrating R&D, design, packaging and testing, manufacturing, and sales services. For more information please visit https://www.longsys.com/, and follow Longsys on LinkedIn and Facebook .

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