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IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory

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BOSTON, July 24, 2024 /PRNewswire/ — Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules. However, these high-speed modules, within their current form factors, pose significant challenges. Issues include the required densities of electrical and optical connectors, as well as escalating power consumption.

To achieve next-generation optical engines supporting 800 Gbps and beyond per module, the communication rate must double to at least 100 Gbps per lane. This increase introduces substantial signal integrity issues across the switch socket, motherboard, and edge connector, leading to heightened power dissipation at SerDes interfaces. In future Ethernet switching, these signal integrity problems may cause I/O power consumption to exceed that of the switch core. Additionally, the integration density of standard pluggable modules is limited by the QSFP/OSFP form factor, necessitating advanced thermal management solutions not yet widely available.

Co-Packaged Optics (CPO) presents a promising solution to these challenges. Unlike traditional pluggable models, CPO integrates optical modules directly onto the switch ASIC substrate, reducing electrical reach and effectively addressing signal integrity issues. This approach has gained traction among major data centers. However, optimizing the packaging strategy for CPO remains a topic of ongoing industry discussion and development. IDTechEx’s latest report, “Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts“, explores these advancements in CPO technology and packaging techniques enabling its adoption.

The importance of advanced semiconductor packaging technologies for Co-Packaged Optics (CPO)

The integration of CPO in data centers aims to boost I/O bandwidth and reduce energy consumption. The way photonic integrated circuits (PICs) are combined with electronic integrated circuits (EICs) and switch ICs, can significantly influence the areal and edge bandwidth density, as well as packaging parasitics. These factors directly affect the transceiver’s I/O bandwidth and energy efficiency, meaning improper integration can negate the advantages of silicon photonics.

For CPO, the integration of photonic and electronic components can be achieved through various methods, each with unique advantages and challenges. The most advanced, and still in the R&D phase, is the 3D monolithic integration. This embeds photonic components within an existing electronic process node with minimal alterations, co-locating active photonics and driving electronics within the same die. This reduces parasitics and simplifies packaging by eliminating the need for interface pads and bumps. However, monolithic integration typically uses older CMOS nodes, resulting in suboptimal photonic performance and higher energy consumption. Despite these limitations, it offers minimal impedance mismatch and simplified packaging.

Conversely, 2D integration places the PIC and EIC side by side on a PCB, connected by wire bonds or flip-chip. This method is straightforward and cost-effective, but introduces significant parasitic inductance, limiting aggregate I/O due to single-edge connections. While 2D integration is easy to package, the reliance on wire bonds constrains the transceiver bandwidth and increases energy consumption, making it less efficient for high-performance applications.

3D hybrid integration offers a more advanced solution by placing the EIC on top of the PIC, via various advanced semiconductor packaging technologies including Through-Si-Via (TSV), high density fan-out, Cu-Cu hybrid bonding, and active photonic interposer, significantly reducing parasitics. The use of advanced semiconductor packaging technologies in 3D integration allows for dense pitch capabilities, enhancing performance. However, thermal dissipation remains a challenge, as the heat generated by the EIC can impact the PIC, necessitating advanced thermal management solutions. Despite these thermal challenges, 3D hybrid integration achieves higher performance due to minimized packaging parasitics.

2.5D integration serves as a compromise, with both the EIC and PIC flip-chipped onto a passive interposer with TSVs. This approach maintains manageable parasitics and dense pitch capabilities similar to 3D integration but adds complexity with the need for interposer traces. While 2.5D integration balances performance, cost, and fabrication turnaround, it incurs higher parasitics than 3D hybrid integration.

In summary, each integration method presents trade-offs between performance, complexity, and cost, with the choice based on specific application requirements and constraints.

Co-Packaged Optics (CPO) market trajectory

According to IDTechEx, the Co-Packaged Optics (CPO) market is projected to exceed $1.2 billion by 2035, growing at a robust CAGR of 28.9% from 2025 to 2035. CPO network switches are expected to dominate revenue generation, driven by each switch potentially incorporating up to 16 CPO PICs. Optical interconnects for AI systems will constitute approximately 20% of the market, with each AI accelerator typically utilizing one optical interconnect PIC to meet increasing demands for high-speed data processing and communication in advanced computing applications.

IDTechEx’s latest report, “Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts”, offers extensive exploration into the latest advancements within Co-Packaged Optics technology. The report delves deep into key technical innovations and packaging trends, providing a comprehensive analysis of the entire value chain. It thoroughly evaluates the activities of major industry players and delivers detailed market forecasts, projecting how the adoption of CPO will reshape the landscape of future data center architecture.

Central to the report is the recognition of advanced semiconductor packaging as the cornerstone of Co-Packaged Optics technology. IDTechEx places significant emphasis on understanding the potential roles that various semiconductor packaging technologies may play within the realm of CPO.

Key aspects of the report include:

Market Dynamics: Examination of key players such as Nvidia, Broadcom, Cisco, Ranovus, and Intel, and the forces shaping the CPO landscape.Innovations in CPO Design: Exploration of advanced CPO designs and their implications for enhancing data center efficiency and shaping future architecture.Semiconductor Packaging Breakthroughs: Insight into the latest advancements in semiconductor packaging, including 2.5D and 3D technologies, and their role in enabling CPO innovation.Optical Engines: Analysis of the drivers behind CPO’s performance and efficiency advantages.CPO for AI Interconnects: Exploration of how optical I/O can address the limitations of copper connections in AI applications, improving efficiency, latency, and data rates.CPO for Switches: Assessment of the potential 25% efficiency gains in high-performance network switches through CPO integration.Challenges and Solutions: Critical review of obstacles to CPO adoption and strategies to overcome them.Future Analysis: Predictions and insights into the next generation of CPO and its anticipated impact on the industry.

The report is based on extensive research and interviews with industry experts and provides valuable insights for anyone interested in gaining a strategic understanding of Co-Packaged Optics’ role in advancing the future of data centers and AI technology.

Market Forecasts:10-year Data Center Population Cumulative Forecast10-year AI Accelerator Unit Shipments Forecast10-year CPO Interconnect for AI (Optical I/O) Unit Shipments Forecast10-year CPO Interconnect for AI (Optical I/O) Market Revenue Forecast10-year CPO-enabled Network Switch Unit Shipments Forecast10-year CPO-enabled Network Switch Market Revenue Forecast10-year Total CPO Market Revenue

For more information on this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/CPO.

For the full portfolio of related research available from IDTechEx please see www.IDTechEx.com/Research/Semiconductors.

About IDTechEx

IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com

Media Contact: 
Charlotte Martin 
Subscriptions Marketing Manager
press@IDTechEx.com 
+44(0)1223 812300

Social Media Links: 
X: https://www.twitter.com/IDTechEx 
LinkedIn: https://www.linkedin.com/company/idtechex/ 

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Caylent’s Valerie Henderson and Ann Carpenter Named to CRN’s 2026 Women of the Channel List

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CEO and CMO recognized amongst an elite subset of CRN’s Women of the Channel list

IRVINE, Calif., May 4, 2026 /PRNewswire/ — Caylent, an AI-first Amazon Web Services (AWS) Premier Tier Services Partner, announced that CRN®, a brand of The Channel Company, has recognized Caylent Chief Executive Officer (CEO) Valerie Henderson and Chief Marketing Officer (CMO) Ann Carpenter, on the 2026 Women of the Channel Power 80 Solution Provider list, an elite subset of influential solution providers chosen from the CRN® 2026 Women of the Channel list.

The annual Power 80 Solution Provider list honors the most influential women in leadership at some of the country’s most prominent IT integrators, managed service providers, value-added resellers and consultants for their channel advocacy and dedication to helping their customers and technology partners thrive.

Val is known for her relentless focus on customer outcomes and for building high-impact teams that deliver measurable business value. As CEO and the leading visionary behind Caylent’s AI-first services, Val has been a driving force behind the company’s growth, completing key acquisitions of Trek10 and Pronetx, and scaling revenue more than five-fold in her current role and previously as president and CRO.

“This honor reflects the transformational work taking place at Caylent, as well as the undeniable force women are becoming across the channel,” said Val Henderson. “Together, we’re not just participating in the future of technology; we’re building it. I’m proud to be included amongst such an accomplished group of leaders.”

As CMO, Ann strengthens collaboration with AWS while positioning Caylent as a leader in cloud migration, modernization, and AI-first services. Her strategic vision combines revenue-focused marketing with partnership optimization, proving critical to Caylent’s growth trajectory.

“It’s inspiring to be included alongside so many influential women in the channel,” said Ann Carpenter. “This acknowledgment speaks to the strength of our partner community and the measurable impact we are creating for customers every day. At Caylent, that’s not aspirational, it’s what we do.”

This recognition reflects Caylent’s longstanding commitment to advancing women in technology and leadership. Women hold four of seven C-level positions at Caylent.

“It’s a privilege to celebrate the remarkable achievements of these women who are driving meaningful change across the IT channel,” said Jennifer Follett, VP of U.S. Content and Executive Editor, CRN at The Channel Company. “Each honoree has demonstrated exceptional leadership and a commitment to bold, innovative strategies that fuel transformation, growth, and success for their organizations and the broader channel. We’re proud to recognize their impact and look forward to seeing how they continue to shape the future of our industry.”

Read more about Val and Ann’s recognition, as well other Women of the Channel honorees at crn.com/wotc.

About Caylent

Since 2015, Caylent has grown alongside organizations modernizing on AWS. Now, it is the operating partner they trust to build, run, and evolve intelligent systems at scale. As an AWS Premier Tier Services Partner, dedicated Anthropic partner, and AWS Managed Services Provider, with 10 Partner of the Year Awards including GenAI, Migration, and Security Consulting Partner of the Year in 2025, Caylent combines deep AWS expertise, proprietary IP, and an agentic delivery system to move organizations from ideas to impact, faster. www.caylent.com

About The Channel Company

The Channel Company (TCC) is the global leader in channel growth for the world’s top technology brands. We accelerate success across strategic channels for tech vendors, solution providers and end users with premier media brands, integrated marketing and event services, strategic consulting, and exclusive market and audience insights. TCC is a portfolio company of investment funds managed by EagleTree Capital, a New York City-based private equity firm. For more information, visit thechannelco.com.

Follow The Channel Company: LinkedIn and X.

© 2026 The Channel Company, Inc. CRN is a registered trademark of The Channel Company, Inc. All rights reserved.

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Display Week 2026: SunLED’s Near-Infrared Technology Turns Screens into Wellness Devices

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SunLED Life Science’s patented near-infrared technology brings the benefits of natural sunlight indoors and can be integrated into laptops, display monitors and smartphone cases, delivering targeted NIR light during screen time to support energy, mood, eye comfort, and overall well-being

LOS ANGELES and AMSTERDAM, May 4, 2026 /PRNewswire-PRWeb/ — SunLED Life Science, a health-centered technology startup, today announced plans to showcase its near-Infrared (NIR) technology that brings the benefits of natural sunlight indoors at Display Week 2026, from May 5-7, 2026, at the LA Convention Center, Exhibit Hall, Booth #446. SunLED’s patented near-infrared (NIR) technology can be easily integrated into computer and laptop screens, webcams, and other everyday devices, delivering a targeted dose of NIR light – the essential part of sunlight absent in indoor light – to users while they work. NIR light supports mood, energy levels, eye comfort, and overall well-being. SunLED Life Science will demo three new prototypes at Display Week 2026, including a display monitor, a laptop, and a smartphone case, demonstrating how SunLED’s patented NIR technology can be integrated into everyday devices.

“Our technology can be integrated into almost any screen-based product to improve the well-being of its users and fundamentally change indoor screen time for everyone, from children and employees to the elderly,” said Dr. Anne Berends, CEO, CTO and founder, SunLED Life Science.

Dr. Anne Berends will also speak at Display Week on May 7 at 9:10 AM during Session 63.3, Displays as Ambient Light Therapy: Health and Wellness Through Invisible NIR Integration, in room 409AB, and in the panel discussion Health Effects of Emissive Color in Displays (Session 65-3), on Thursday, May 7, from 11:10–11:50 AM.

All indoor lighting and displays lack NIR, an essential part of the solar spectrum that makes up 50% of sunlight. The average person spends 90% of their waking hours indoors and has seven hours of screen time, deprived of NIR light, which can lead to adverse health effects. As windows filter out NIR, even sunlight that passes through them cannot help address the growing global health issues caused by modern indoor lifestyles. Near-infrared light boosts cellular energy production by activating mitochondria, the ‘powerplant’ of the cell. Scientific literature has shown a range of health and well-being benefits of NIR, including improved eye comfort and reduced fatigue. SunLED Life Science’s patented NIR light technology is proven in clinical studies to enhance mood and energy, lower inflammation markers, and promote heart health.

SunLED Life Science Technology Integration.

SunLED Life Science’s patented technology integrates with computer and laptop screens, webcams, and car interiors. At Display Week 2026, SunLED Life Science will demo three prototypes that bring its patented NIR technology directly into everyday devices. The first two prototypes include a laptop and an external monitor with NIR LEDs built into the bezel—mirroring how webcams evolved from clip-ons to standard features. The third prototype is a smartphone case prototype that delivers NIR light to users during normal screen time, tapping into the device people use most. Together, the three prototypes demonstrate how SunLED’s NIR technology makes wellness effortless by integrating into the products people already rely on daily.

“Today’s modern lifestyle hinders people from exposure to the very driver of life on Earth – sunlight. Our ancestors spent centuries outdoors in the sun. We are spending time in the office or at home: working, studying, and enjoying our free time while looking at screens, we barely get the amount of sunlight our bodies need,” said Dr. Anne Berends, CTO and co-founder of SunLED. “Our technology can be integrated into almost any screen-based product to improve the well-being of its users and fundamentally change indoor screen time for everyone, from children and employees to the elderly. We envision a world where everyone has access to the benefits of natural sunlight even while indoors at work, at home, or driving in a vehicle.”

At Display Week, SunLED will also showcase SunBooster, an easy-to-use, USB-C-powered device that attaches to computer monitors and laptops. As the first near-infrared device designed for everyday use, SunBooster brings the wellness-supporting qualities of natural sunlight indoors, enabling users to integrate these benefits effortlessly into their daily routines. SunBooster has launched in the EU and will launch in the US market in May.

Contact sunled@wearemgp.com to set up a meeting at Display Week 2026 between May 5-7 in Los Angeles, access the Display Week Press Kit here, or learn more at https://sunled.health.

About SunLED Life Science

SunLED Life Science researches and develops lighting solutions that bring the health benefits of sunlight indoors. Our patented and scientifically proven Near-Infrared technology promotes health and well-being, and easily integrates into various devices, such as screens, luminaires, car dashboards, and more. We envision a world where everyone can access the benefits of natural sunlight indoors.

Founded in 2024, SunLED Life Science is a privately held company headquartered in Amsterdam. Follow SunLED Life Science on LinkedIn or learn more at https://sunled.health.

Media Contact

Mindy M. Hull, Mercury Global Partners for SunLED Life Science, 1 415 889 9977, sunled@wearemgp.com, https://sunled.health

Michael Held-Hernandez, Mercury Global Partners for SunLED Life Science, 1 480 306 1154, sunled@wearemgp.com, https://sunled.health

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New CiviClick Whitepaper: How DoorDash, DraftKings, Uber, and Rivian Are Winning Policy Fights by Mobilizing Real Stakeholders

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Two decades of Congressional Management Foundation research show individualized constituent communication outperforms paid advertising and lobbying – and a new whitepaper from CiviClick details how leading companies are closing the gap

WASHINGTON, May. 4, 2026 /PRNewswire/ — CiviClick, a nonpartisan grassroots advocacy software platform, today released a 48-page whitepaper examining how some of America’s most recognizable companies are winning state and federal policy fights by mobilizing employees, customers, and other real stakeholders to tell authentic stories to lawmakers. 

The whitepaper, titled “How Corporations Win Grassroots Advocacy Campaigns by Telling Authentic Stories,” draws on two decades of Congressional Management Foundation (CMF) research showing that individualized constituent communication is the single most influential form of advocacy on an undecided lawmaker — outperforming paid advertising, form emails, and even meetings with professional lobbyists. 

The research also surfaces a persistent gap. Ninety-one percent of congressional staff say district-specific impact information would help them advise their boss; only nine percent report receiving it frequently. Seventy-nine percent say personal constituent stories would help; only eighteen percent report receiving them regularly. 

“There is a massive gap between what lawmakers want to hear and what they actually receive,” said Chazz Clevinger, founder and CEO of CiviClick. “The companies that close that gap are the ones winning their policy fights. The ones that don’t are the ones writing checks to lobbyists and wondering why the bill still moved.” 

Four extended case studies 

The whitepaper details four corporate grassroots programs that have produced measurable legislative wins:

DoorDash’s DashRoots program has united more than 210,000 delivery professionals, merchants, and consumers across all 50 states. Recent wins include defeating a proposed delivery fee in Illinois and passing first-in-the-nation portable benefits legislation through the Wisconsin legislature.

DraftKings’ New York mobile sports betting campaign combined grassroots customer pressure, executive engagement, and direct lobbying to secure Governor Cuomo’s April 2021 inclusion of mobile wagering in the state budget – a multi-year effort the whitepaper presents as a masterclass in coalition design.

Uber’s city-by-city playbook for ridesharing legalization shows how technology companies can build scalable advocacy infrastructure that adapts to local political conditions across hundreds of municipalities.

Rivian’s 2026 Washington State breakthrough overturned a twelve-year dealer monopoly on direct EV sales after Rivian customers wrote personal messages to legislators about why they should be able to buy vehicles directly. Senate Bill 6354 passed 47-2 in the Senate and 84-9 in the House. The thesis “The common thread across all four case studies is that sustained victory requires more than direct lobbying,” Clevinger said. “It requires a standing network of authentic stakeholder advocates who can be activated quickly, speak credibly to lawmakers in their own words, and mobilize again for the next fight.” 

The whitepaper also examines how companies can bridge political divides by mobilizing stakeholders with different political orientations around shared policy goals, how to integrate corporate social responsibility with civic engagement, and how to overcome the most common participation obstacles in corporate grassroots programs. The full whitepaper is available for download at civiclick.com.

CiviClick is a nonpartisan grassroots advocacy software platform headquartered in Washington, D.C., with offices in Los Angeles. The platform helps organizations build campaign pages where real people can contact their elected and regulatory officials with personalized messages. CiviClick serves diverse groups across the partisan spectrum, including corporations, trade associations, nonprofits, and issue advocacy organizations. 

Founded in 2023 by Chazz Clevinger, a 13-year veteran of civic technology who previously worked at the White House Office of Strategic Initiatives, CiviClick has been recognized with multiple AAPC, Pollie, and Reed Awards for advocacy technology.

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