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Marvell Announces Immediate Availability of Open Ecosystem Software for Teralynx 10 51.2T Switch

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Marvell ® Teralynx ® 10 switch now available in Linux Foundation’s open-source SONiC, capitalizing on market shift to open network platforms

SANTA CLARA, Calif., July 25, 2024 /PRNewswire/ — Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the immediate availability of the Marvell® Teralynx® 10 51.2 Tbps Ethernet switch device in the Linux Foundation’s SONiC (Software for Open Networking in the Cloud) network operating system. With this public release, leading networking vendors can now use and deploy Teralynx 10-based systems in SONiC environments.

The Teralynx 10 device is a programmable 51.2 Tbps switch with the industry’s lowest published latency, providing customers with leading performance for training, inference, general-purpose compute and other workloads to scale cloud data center accelerated infrastructure. (See today’s related announcement on the production release of the Teralynx 10 switch.)

Cloud data center operators have shifted to open-network software platforms as it enables them to tailor their networking systems for their specific use cases, accelerate their development times for new capabilities and deploy a diverse set of silicon vendors. They are mandating open-network software for their platforms, and SONiC provides for this requirement in a single common programming model that can run on different types of hardware.

SONiC is becoming the global network operating system (NOS) of choice, with deployment by seven out of the top 10 cloud service providers. SONiC is growing at a 25% CAGR according to 650 Group, which projects hardware and software revenue from SONiC systems to grow from $4.5 billion in 2024 to $8.0 billion in 2028.

Marvell has been an active member of SONiC, holding a governing board position and seats on multiple technical committees including chairing the platform working group. In addition to the Teralynx switch, other contributions from Marvell include SONiC running on Arm®-based systems, lowering customer TCO by eliminating expensive hardware components and reducing power requirements.

“SONiC has emerged as the clear solution to enable open switch platform interoperability as well as silicon vendor diversity for the world’s largest cloud hyperscalers,” said Nick Kucharewski, senior vice president and GM, Network Switching Business Unit, at Marvell. “Marvell is pleased to deliver support for the latest generation of SONiC on its cloud scale 51.2T switching platform.” 

Strong SONiC Ecosystem Enables Innovation
By working with a broad spectrum of hardware and software developers, Marvell is accelerating innovation and giving customers more choice.

“The Teralynx 10 switch represents a significant advancement in our technology offerings and is a strong contribution to the SONiC community,” said Vishal Shukla, CEO of Aviz Networks.

“PLVision is pleased to see the adoption of SONiC continuing to grow. We have been offering our support and software development services for SONiC along with Marvell Teralynx solutions and are excited to add the Teralynx 10 chip to our toolkit,” said Leonid Khedyk, Chief Technology Officer at PLVision.

About Marvell
To deliver the data infrastructure technology that connects the world, we’re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world’s leading technology companies for over 25 years, we move, store, process and secure the world’s data with semiconductor solutions designed for our customers’ current needs and future ambitions. Through a process of deep collaboration and transparency, we’re ultimately changing the way tomorrow’s enterprise, cloud, automotive, and carrier architectures transform—for the better.

Marvell and the M logo are trademarks of Marvell or its affiliates. Please visit www.marvell.com for a complete list of Marvell trademarks. Other names and brands may be claimed as the property of others.

This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events or achievements. Actual events or results may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the “Risk Factors” section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.

For further information, contact:
Michael Kanellos
pr@marvell.com

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SOURCE Marvell

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Smart City Expo 2026 speeds up towards urban solutions that yield real impact

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BARCELONA, Spain, Sept. 8, 2026 /PRNewswire/ — Smart City Expo World Congress (SCEWC), the leading international event on cities and smart urban solutions organized by Fira de Barcelona, will hold its 2026 edition from November 3 to 5 at Barcelona’s Gran Via venue, bringing together 1,000 cities, more than 25,000 attendees, over 1,000 exhibitors and 600 speakers. Under the theme “Urban Solutions, Real Impact,” this year’s edition will place special focus on housing, one of the most pressing challenges facing cities worldwide, while showcasing technologies designed to deliver tangible, scalable impact.

The congress program is structured around seven tracks — Enabling Technologies, Energy & Environment, Mobility, Governance & Economy, Living & Inclusion, Infrastructure & Building, and Blue Economy — spanning digital transformation, artificial intelligence, green energy, governance and social equity.

Over 600 experts will take part in the sessions, including Nikolas Badminton, Chief Futurist and Think Tank leader at Futurist.com, who will share his vision on the future of cities. An artificial intelligence expert, Badminton helps companies and institutions build strategic foresight capabilities, identify the trends shaping the world, anticipate unforeseen risks, and prepare for complex, evolving environments through long-term thinking and scenario planning.

Ayumi Moore Aoki, founder of Women in Tech Global, will also participate in the congress. Her work focuses on the importance of diversity and inclusion as key drivers of innovation in the urban context. Moore Aoki underscores how inclusive leadership can support sustainable urban development at scale. The conference also features Bibiana Aido of UN Women, Bilel Jamoussi of the ITU, and Chiara Corazza of the Women’s Economic Forum, among others.

SCEWC will host the first edition of HOWS Barcelona, a new housing world summit that will focus on topics such as urban planning and land policy, housing regulation, social and affordable housing, and building renovation and reuse, opening a debate on the foundations of a new residential paradigm.

The exhibition floor will host global companies including Google, Microsoft, NVIDIA, Dell Technologies and Deutsche Telekom IoT, alongside a wide range of country and city pavilions and the new “Terra50” showcase, unveiling the world’s top 50 sustainability solutions in the urban field.

SCEWC 2026 will run jointly with Tomorrow.Mobility World Congress, Tomorrow.Blue Economy, HOWS Barcelona, Barcelona Deep Tech Summit, and Barcelona Cybersecurity Congress, consolidating Barcelona as a global meeting point for urban innovation this November.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/smart-city-expo-2026-speeds-up-towards-urban-solutions-that-yield-real-impact-302871330.html

SOURCE Fira de Barcelona

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C-TOUCH & DISPLAY SHENZHEN 2026 to Showcase Breakthroughs in Micro LED Optical Interconnects, AI+AR Smart Glasses and TGV Glass Substrates

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SHENZHEN, China, Sept. 7, 2026 /PRNewswire/ — As the global display and smart interaction industry enters a new phase of technological convergence and application expansion, C-TOUCH & DISPLAY SHENZHEN 2026 is set to spotlight emerging technologies and high-growth applications from October 27-29, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an), Halls 10, 12, 14 and 16.

With its 29-edition legacy, the 2026 show occupies 180,000 sqm of exhibition space, 3,600+ exhibitors, 170,000+ professional visitors and 5,000+ overseas buyers.

The exhibition will connect the global display ecosystem with new opportunities spanning Micro LED optical interconnects, AI+AR smart glasses, TGV glass substrates, smart cockpits, OLED flexible displays and advanced semiconductor packaging.

Register Now to network with featured suppliers and gain insights into the latest industry trends: https://isclick.cn/81228

Three Emerging Technology Zones Highlight Next-Generation Growth

A major highlight of the 2026 edition will be three dedicated technology zones designed to connect emerging technologies with commercial applications.

The AI+AR Smart Glasses Zone will bring together leading companies across optical display modules, chips, materials, complete-device development and AI interaction solutions. With AI, spatial computing and lightweight wearable devices rapidly converging, the zone will demonstrate new applications in AR/VR, intelligent mobility, industrial inspection and healthcare.

The Micro LED AI Optical Interconnection & Glass Substrate Advanced Packaging Technology Zone will explore the convergence of display, photonics and AI computing. Technologies including Micro LED optical interconnect chips, CPO optical-module glass substrates, TGV equipment and materials, and intelligent manufacturing solutions will showcase emerging pathways for next-generation data centers and high-speed optical communication.

The TGV Glass Substrate Manufacturing Demonstration Line will provide a visual representation of the complete TGV manufacturing process, covering precision through-glass via technologies, thin-glass processing and advanced manufacturing. The initiative aims to accelerate collaboration among equipment suppliers, material providers, semiconductor packaging companies and end users.

From Display Innovation to Smart Applications

Beyond emerging technologies, C-TOUCH & DISPLAY SHENZHEN 2026 will cover the broader display and touch ecosystem, including Mini/Micro LED, OLED, commercial displays, automotive displays, smart cockpits, electronic paper, touch technologies, semiconductor packaging and consumer electronics manufacturing.

Leading industry players are expected to participate, creating opportunities for global buyers to identify suppliers, evaluate technologies and explore partnerships across multiple segments.

More than 20 professional forums and industry events will be held alongside the exhibition, covering new display technologies, commercial displays, automotive displays, AI+AR smart glasses, Micro LED optical communication and TGV technologies. These programs will provide insights into technology roadmaps, market trends and commercialization opportunities.

Connecting Global Buyers with Asia’s Technology Supply Chain

As a global sourcing and business platform, C-TOUCH & DISPLAY SHENZHEN 2026 connects international buyers with leading technologies, products and supply-chain solutions from across Asia’s display and semiconductor industries.

Through on-site business matchmaking, one-to-one sourcing meetings, international industry exchanges and expert-led discussions, global buyers will be able to efficiently identify qualified suppliers, evaluate advanced solutions, explore new sourcing opportunities and establish valuable business partnerships.

For more information, please visit our website: https://www.quanchu.com.cn/en-gb.html.

RX Kuozhan, a joint venture between Reed Exhibitions and Kuozhan Exhibition Services (Shanghai) Limited, was established in 2015. The company organizes leading B2B trade shows in Shenzhen, including C-TOUCH & DISPLAY SHENZHEN, FILM & TAPE EXPO, COMMERCIAL DISPLAY, AUTOMOTIVE DISPLAY SHENZHEN, ADHESIVES & CHEMICALS EXPO, and HIGHLY-FUNCTIONAL MATERIAL EXPO.

Committed to building one-stop platforms for sourcing, product discovery and industry exchange, RX Kuozhan connects global professionals with innovative technologies and solutions across display and touch, high-performance materials, consumer electronics, automotive electronics, new energy, smart manufacturing, printing and packaging.

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SOURCE RX Kuozhan

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FILM & TAPE EXPO 2026 to Connect Global Buyers with Asia’s Advanced Film, Tape and Coating Technologies

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SHENZHEN, China, Sept. 7, 2026 /PRNewswire/ — Held by Kuozhan Exhibition Services (Shanghai) Limited, as part of ASIA MATERIAL WEEK, FILM & TAPE EXPO 2026 will also benefit from cross-industry connections spanning high-performance materials, adhesives, chemical raw materials and CMF technologies. As demand for high-performance materials accelerates across new energy, consumer electronics, automotive, semiconductors and advanced manufacturing, FILM & TAPE EXPO 2026 will return to Shenzhen from October 27-29, 2026, offering a comprehensive sourcing and technology platform for the global functional film, adhesive tape, coating and converting industries.

Covering 80,000 square meters, the 2026 edition is expected to bring together 1,200+ exhibitors and brands, 60,000+ professional buyers, 30+ technical forums and more than 200 new product launches. The exhibition will showcase the complete industry chain, from functional films and adhesive tapes to adhesives, chemical raw materials, high-performance materials, coating and converting equipment, testing technologies and supporting components.

Register Now to network with featured suppliers and gain insights into the latest industry trends: https://isclick.cn/57DB2

One Platform, Multiple High-Growth Applications

A key feature of FILM & TAPE EXPO 2026 is its application-driven approach, connecting material technologies with real-world procurement needs across major growth sectors.

In new energy and battery applications, exhibitors will showcase battery separator films, aluminum-plastic films, tab adhesives and other materials designed for high safety and energy-density requirements.

The automotive sector will feature TPU paint protection films, window films, color-changing films and advanced battery materials supporting vehicle lightweighting, electrification and intelligent mobility.

For display and touch applications, technologies including TAC films, PMMA films, OCA optical adhesives and optical films for backlight modules will address the evolving requirements of foldable displays, automotive displays and polarization technologies.

The consumer electronics and semiconductor sectors will feature release films, protective films, PI films, thermal-management materials, electronic tapes, wafer tapes and other precision materials supporting smartphones, wearables, electronic components, advanced packaging and semiconductor manufacturing.

Additional solutions will cover PCB/FPC, die-cutting, printing and labeling, flexible packaging, medical applications and industrial materials, enabling buyers to source across multiple applications at a single event.

Complete Supply Chain, From Materials to Manufacturing

The exhibition will bring together four major technology categories: functional films, adhesive tapes, adhesives and chemical raw materials, and converting equipment and components.

Product showcases will span PET, BOPET, BOPP, TPU, optical films, protective and release films, PI films, battery and photovoltaic films, automotive films, electronic and semiconductor tapes, OCA and thermal-management adhesives, coating and laminating systems, die-cutting and slitting equipment, inspection and measurement technologies, and other advanced manufacturing solutions.

With thousands of materials, equipment and processing solutions expected on site, the event provides international buyers with an efficient environment to compare technologies, identify suppliers and explore new applications.

Procurement-Focused Business Matching

Beyond exhibition displays, FILM & TAPE EXPO 2026 will place strong emphasis on measurable business outcomes. The exhibition’s Targeted Attendee Program (TAP) will facilitate more than 3,000 one-to-one business matchmaking meetings, connecting exhibitors with qualified buyers based on specific sourcing requirements.

Professional buyers from functional film and tape manufacturing, die-cutting, consumer electronics, automotive, display and touch, lithium batteries, semiconductors, PCB/FPC, printing and packaging are expected to participate, creating direct opportunities for supplier discovery and business collaboration.

30+ Forums to Explore the Next Wave of Materials Innovation

More than 30 conferences and technical forums will bring together industry experts and senior technology executives to discuss emerging opportunities in advanced PI films, automotive films, semiconductor adhesives, thermal-management materials, battery materials, coating and die-cutting technologies, MLCC materials, robotics and new material applications.

As part of ASIA MATERIAL WEEK, FILM & TAPE EXPO 2026 will also benefit from cross-industry connections spanning high-performance materials, adhesives, chemical raw materials and CMF technologies.

By bringing materials, technologies, applications and buyers together, FILM & TAPE EXPO 2026 aims to help global industry professionals discover new suppliers, identify emerging technologies and unlock the next wave of growth across Asia’s advanced materials supply chain.

For more information, please visit our website: https://www.film-expo.com/en-gb.html

FILM & TAPE EXPO 2026
October 27-29, 2026
Shenzhen World Exhibition & Convention Center (Bao’an), China

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SOURCE Kuozhan Exhibition Services (Shanghai) Limited

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