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Automotive Ethernet Market size is set to grow by USD 9.57 billion from 2024-2028, Increasing demand for high bandwidth and lightweight materials to boost the market growth, Technavio

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NEW YORK, Aug. 6, 2024 /PRNewswire/ — The global automotive ethernet market  size is estimated to grow by USD 9.57 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of  30.08%  during the forecast period.  Increasing demand for high bandwidth and lightweight materials is driving market growth, with a trend towards use of ethernet to lay the backbone network of vehicles. However, oems skeptical about adopting ethernet in vehicles  poses a challenge. Key market players include ACTIA PCS, Amphenol Communications Solutions, Broadcom Inc., Cadence Design Systems Inc., Dasan Network Solutions, Infineon Technologies AG, Intrepid Control Systems Inc., Keysight Technologies Inc., Marvell Technology Inc., Microchip Technology Inc., Mouser Electronics Inc., NEXCOM International Co. Ltd., NXP Semiconductors NV, Realtek Semiconductor Corp., Rohde and Schwarz GmbH and Co. KG, Spirent Communications plc, System on Chip Engineering S.L., TE Connectivity Ltd., Tektronix Inc., and Texas Instruments Inc..

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Forecast period

2024-2028

Base Year

2023

Historic Data

2018 – 2022

Segment Covered

Vehicle Type (Passenger cars and Commercial vehicles), Application (Cameras and ADAS, Infotainment, Diagnostics, and Network backbone), and Geography (APAC, North America, Europe, South America, and Middle East and Africa)

Region Covered

APAC, North America, Europe, South America, and Middle East and Africa

Key companies profiled

ACTIA PCS, Amphenol Communications Solutions, Broadcom Inc., Cadence Design Systems Inc., Dasan Network Solutions, Infineon Technologies AG, Intrepid Control Systems Inc., Keysight Technologies Inc., Marvell Technology Inc., Microchip Technology Inc., Mouser Electronics Inc., NEXCOM International Co. Ltd., NXP Semiconductors NV, Realtek Semiconductor Corp., Rohde and Schwarz GmbH and Co. KG, Spirent Communications plc, System on Chip Engineering S.L., TE Connectivity Ltd., Tektronix Inc., and Texas Instruments Inc.

Key Market Trends Fueling Growth

Ethernet’s address-based messaging feature makes it an attractive option for automotive backbone networks. Unlike CAN networks that use gateways for messaging, Ethernet switches can execute the same process without requiring software upgrades when network topologies change. Additionally, Ethernet networks can accommodate an unlimited number of devices, and multiple switches can be interconnected to expand network capacity. While the current 1TPCE standard may not be suitable for vehicle backbone networks, the enhanced RTPGE version can be used for future car designs. This capability to adapt and expand without software upgrades, combined with the increasing use of ethernet in automotive applications, is expected to fuel the growth of the Automotive Ethernet market during the forecast period. 

The Automotive Ethernet market is experiencing significant growth due to the increasing adoption of Ethernet networks in vehicles. Phy transceivers are key components of this technology, enabling high-speed data transfer for infotainment, autonomous vehicles, powertrain, chassis, body and comfort, and high bandwidth applications. Vehicle electromagnetic compatibility and immunity standards are crucial considerations to ensure reliable connectivity. Cost of cable and cabling weight are important factors in the automotive industry, making Ethernet an attractive alternative to traditional harnesses. Navigation systems, telematics, in-vehicle data communications, and IoT solutions are driving the demand for connectivity in vehicles. Automotive manufacturing plants are integrating Ethernet networks into passenger vehicles for safer and more efficient production processes. Autonomous driving requires HD maps, lane sizes, crosswalks, and road signs to be transmitted in real-time, making Ethernet an essential technology. Broadcom Incorporated, NXP Semiconductors NV, Microchip Technology Inc, and Texas Instruments Inc are major players in the Automotive Ethernet market. Safety and security are top priorities, with Euro NCAP and US NHTSA setting standards for connected vehicles. Software-defined vehicles (SDV) and Ethernet ports up to 10 Gbps are future trends. MEMS sensors, vehicle-to-everything (V2X) communications, and electronic control units are also driving the growth of the Automotive Ethernet market. HMI features, GDP growth, and the Indian market are also potential opportunities. 

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Market Challenges

The automotive industry has seen a significant increase in the use of electronics in vehicles, with modern luxury cars containing over 100 microprocessors and executing over 100 million lines of instructions. Electronics now account for 45% of the cost of a premium vehicle, and this figure is projected to reach 50% by 2030. However, the high initial cost of adopting new technologies, such as Automotive Ethernet, is a major concern for Original Equipment Manufacturers (OEMs). OEMs are hesitant to adopt new technologies due to shrinking margins, uncertainty, and the higher cost of ethernet compared to popular technologies like CAN and LIN. Few OEMs, such as Mercedes-Benz, are still using MOST instead of BroadR-Reach ethernet due to the uncertainty associated with a new technology used for critical vehicle functions. These factors may restrict the growth of the Automotive Ethernet market during the forecast period.The Automotive Ethernet market is experiencing significant growth due to the increasing demand for in-vehicle connectivity. Traditional wiring harnesses in automotive parts are being replaced by Ethernet technology for better communication between components. Leading automotive companies are investing in this technology for electric vehicles (EVs) and conventional vehicles alike. The federal government’s initiatives for CO2 emissions reduction and the technological development of chipsets and modules are driving this trend. However, challenges such as cybersecurity assaults and the need for charging infrastructure and lithium-ion batteries add complexity. The market can be segmented into vehicle type, vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication, driver assistance, power train, body & comfort, and hardware sub-segment. Key players include NXP Electronics, and the market is estimated to grow despite the impact of lockdowns on auto manufacturers. Buyers and suppliers are looking forward to the benefits of Ethernet technology in infotainment systems, CAN LIN, and autonomous driving functionalities.

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Segment Overview 

This automotive ethernet market report extensively covers market segmentation by

Vehicle Type1.1 Passenger cars1.2 Commercial vehiclesApplication 2.1 Cameras and ADAS2.2 Infotainment2.3 Diagnostics2.4 Network backboneGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

1.1 Passenger cars-  The passenger car segment leads the global automotive ethernet market due to the rising demand for advanced safety features. With the electrification of mechanical components and the introduction of innovative safety, security, connectivity, and environmental technologies, the number of electronic control units (ECUs) in passenger vehicles has significantly increased. As a result, there is a growing need for reliable and high-speed data communication among these ECUs. Automakers are focusing on enhancing vehicle safety and are adopting advanced safety functions that require secure communications. This trend is driving the demand for automotive ethernet, which is expected to continue during the forecast period.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2018 – 2022)  – Download a Sample Report

Learn and explore more about Technavio’s in-depth research reports

The global Automotive Advanced Driver Assistance System (ADAS) market is experiencing robust growth due to rising demand for safety features in vehicles. Key drivers include technological advancements and stringent government regulations. Concurrently, the global Automotive Wiring Harness Market is also expanding, driven by the increasing adoption of electric vehicles and advancements in automotive electronics. Both markets are witnessing significant investments from major players aiming to enhance vehicle safety, efficiency, and connectivity, making them pivotal in the evolution of the automotive industry.

Research Analysis

The Automotive Ethernet market refers to the use of Ethernet networks in vehicles for in-car communications. Ethernet Phy transceivers enable high-speed data transfer and real-time responses, making them ideal for automotive applications. However, vehicle electromagnetic compatibility and immunity standards pose challenges. The cost of Ethernet cables is higher than conventional wiring harnesses, but the benefits of in-vehicle connectivity, including improved infotainment systems and autonomous vehicle capabilities, outweigh the costs. Automotive parts manufacturers are integrating Ethernet networks into their systems, replacing traditional communication buses like CAN and LIN. Physical network connections are essential for the proper functioning of electronic components and systems within vehicles. The leading automotive companies are investing in Automotive Ethernet to enhance vehicle performance and safety.

Market Research Overview

The Automotive Ethernet market refers to the use of Ethernet networks in vehicles for in-car communications. Ethernet Phy transceivers enable high-speed data transfer, essential for applications like infotainment, autonomous vehicles, and connected services. Vehicle electromagnetic compatibility and immunity standards are crucial considerations to ensure proper functioning. The cost of cable and cabling weight are significant factors, as is the need for high bandwidth applications in vehicle components. In-vehicle data communications include navigation systems, telematics, and in-vehicle HMI features. Automotive manufacturing plants are integrating Ethernet networks into various vehicle systems, from powertrain and chassis to body and comfort. High bandwidth applications, such as HD maps for autonomous driving, require advanced technologies like MEMS and IoT solutions. Safety and security are paramount, with regulatory bodies like Euro NCAP and US NHTSA setting standards. Passenger vehicles, commercial vehicles, electric vehicles (EVs), and even software-defined vehicles (SDVs) are adopting Ethernet technology. The market’s growth is influenced by factors like GDP growth, technological development, and federal government initiatives. Key components include Ethernet ports, chipsets and modules, and lithium-ion batteries for EVs. Cybersecurity and carbon emissions reduction are also important considerations.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

Vehicle TypePassenger CarsCommercial VehiclesApplicationCameras And ADASInfotainmentDiagnosticsNetwork BackboneGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Asian American Engineer of the Year Award and Conference Announces First Phase of 2025-2026 Awardees

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SANTA CLARA, Calif., May 1, 2026 /PRNewswire/ — The Asian American Engineer of the Year Award (AAEOY) Executive Committee announces the AAEOY 2025-2026 first phase awardees as follows:

Distinguished Lifetime Achievement Award

Mr. Lip-Bu Tan, CEO, Intel Corporation

Distinguished Leadership in Science and Technology Award

Dr. Arun Majumdar, Dean of the Stanford Doerr School of Sustainability, Stanford University

Executive of the Year Award

Dr. Xiaodong Che, Chief Technology Officer, Western DigitalDr. Sam Heidari, CEO, LumotiveDr. Jungwon Lee, Corporate Executive Vice President, Samsung ElectronicsDr. Liu Ren, Vice President & Chief Scientist, Bosch ResearchMr. Brandon Wang, Vice President, Synopsys

Engineer of the Year Award

Ms. Vivian Ye, Principal Member of Technical Staff, AT&T

Most Promising Engineer of the Year Award

Mr. Max Fang, Director of Architecture, AmbarellaMr. Johnny Ho, CSO & Co-founder, Perplexity AI

The AAEOY Award has been presented annually since 2002 as a cornerstone of the National Engineers Week program, honoring distinguished Asian American professionals across academia, public service, and industry. Since its inception, the AAEOY has recognized over 300 honorees — including nine Nobel Laureates, pioneering scholars, prominent corporate executives, and an astronaut — serving as a beacon of inspiration for the global STEM community. After a series of impactful ceremonies nationwide, the 2025-2026 AAEOY Award and Conference returns to the heart of innovation in Silicon Valley at the Santa Clara Convention Center on September 18-19, 2026.

For more information regarding the AAEOY program, awardees, and event registration, please visit www.aaeoy.org.

The Chinese Institute of Engineers in USA (CIE-USA), founded in 1917, is a nonprofit professional organization that promotes science, technology, engineering, and mathematics (STEM); supports professional advancement and leadership development; and recognizes the achievements of Asian American professionals through flagship programs such as the Asian American Engineer of the Year (AAEOY) Awards. One of the oldest and most prestigious Chinese American engineering associations in the United States, CIE-USA has seven regional chapters nationwide and hosts events throughout the year.

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SOURCE AAEOY

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Larry Kellerman, Fermi’s Chief Power Officer and Architect of Its 17 GW Energy Infrastructure, Accepts Board Nomination

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DALLAS, May 1, 2026 /PRNewswire/ — Toby Neugebauer, co-founder and largest shareholder of Fermi America (NASDAQ & LSE: FRMI), today announced that he has nominated Larry Kellerman to join the Fermi Board of Directors. Kellerman, who serves as Chief Power Officer at Fermi America, is the architect of the Company’s 17-gigawatt powered data center campus in Amarillo, Texas — the largest private energy grid in America.

Kellerman is co-founder and Managing Partner of Twenty First Century Utilities and brings more than four decades of power industry and finance expertise to the role. His career spans senior leadership positions at Goldman Sachs, El Paso Corporation, and I Squared Capital. Kellerman said he was honored by the nomination and would be pleased to serve if approved by the Board.

“I appreciate everything that Toby has manifested in Fermi and know that no other human could have created the enterprise and its many thoughtfully interconnected elements as quickly, as effectively, and in as value-accretive a manner as Toby’s leadership has been able to deliver.”
— Larry Kellerman, Chief Power Officer and Board Nominee, Fermi America

For Neugebauer, the choice was crystal clear. Kellerman, who has worked alongside Neugebauer since the earliest days of Project Matador knows Fermi’s power story better than anyone.

“When I came up with the idea of Project Matador, I knew that Larry Kellerman was the one person I needed to convert a really great idea into a really great reality. His knowledge of power and the future of powering data centers is unmatched. Larry is uniquely qualified to steward Fermi as a Board member, and I couldn’t be more pleased with his willingness to serve.”
— Toby Neugebauer, Co-Founder, Fermi America

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SOURCE Toby Neugebauer

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EAST SIDE GAMES GROUP ANNOUNCES NON-BROKERED PRIVATE PLACEMENT OF UNITS TO RAISE UP TO $3.5 MILLION

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VANCOUVER, BC, May 1, 2026 /CNW/ – East Side Games Group (TSX: EAGR) (OTC: EAGRF) (the “Company”), Canada’s leading free-to-play mobile game group, announces a non-brokered private placement of 31,818,182  units (a “Unit”) at $0.11 per Unit (the “Unit Price”), for total gross proceeds of up to $3.5 million. 

Each Unit will be comprised of one common share and one full whole warrant (a “Warrant”).  Each whole Warrant will be exercisable at $0.14 per share (the “Exercise Price”) for a period of three years from issuance. The Warrants will be subject to standard anti-dilution adjustments.

The private placement will be offered in reliance on prospectus exemptions, and any securities sold will be subject to a four month statutory hold period.  The private placement is not anticipated to have any material impact on the control of the Company, nor is it anticipated that any new control persons would be created as a result of the private placement.

It is anticipated that Derek Lew, a director of the Company, will participate in the private placement for an amount of $1.0 million for 9,090,909 Units. As at the date of this news release, Mr. Lew holds 1,667,244 common shares of the Company (2.17%). If the private placement is completed as anticipated, Mr. Lew will hold 10,758,153 common shares (representing 9.89% of the common shares anticipated to be outstanding upon completion of the private placement on a partially diluted basis), 9,090,909 Warrants and 250,000 incentive stock options. Upon exercise of his Warrants, Mr. Lew would own 19,849,062 common shares representing 16.84% of the then issued and outstanding common shares assuming no other share issuances.

The TSX Company Manual requires shareholder approval be obtained  for private placements if the maximum number of common shares issuable under the private placement represents an amount that is more than 25% of the total outstanding common shares as at the date of the press release (pursuant to Section 607(g)). Disinterested shareholder approval must be obtained (excluding those shareholders participating in this private placement and their associates and affiliates) if the number of common shares issued and issuable to insiders under a private placement exceeds 10% of the Company’s issued and outstanding common shares as of the date hereof (pursuant to Section 607(g)(ii)).

As: (a) the private placement is for up to 31,818,182 Units (being equivalent to 41.35% of the Company’s outstanding shares as at the date of this press release), (b) Mr. Lew’s subscription for 9,090,909 Units represents an amount that is equivalent to 11.81% of the Company’s outstanding shares as at the date of this press release, and (c) the Warrants comprising the Units have an exercise price of $0.14 per share (and the five day VWAP is $0.144 per share), the Company has obtained written consent from Jason Bailey, the Company’s CEO and a director, in support of the private placement in accordance with Section 604(d) of the TSX Company Manual.  Mr. Bailey holds more than 50% of the Company’s outstanding shares as at the date of this press release.

The net proceeds from the private placement will be used to repay indebtedness owing to the Royal Bank of Canada (RBC) and for operating expenses and general working capital. Mr. Bailey commented, “With this funding in place, we are on solid footing to continue our disciplined approach to completing the business’s turnaround. With our core portfolio of well performing titles, we have a solid foundation to rebuild upon. We feel we have a strong runway, pipeline and team to execute toward a positive 2026,” [and] “I’d like to thank our existing shareholders for their support and guidance through a difficult 2025 and look forward to achieving the results that will allow this Company, our capital markets strategy and employees to reach its potential.”

The Company’s board of directors considers the private placement to be in the best interests of its shareholders, after having taken into account other alternative forms of financing.  In the course of its review, the Company considered other replacement debt financing, the Company’s ongoing cashflow from operations, as well as ongoing operating expenses, one-off necessary expenditures and the Company’s debt load, within the larger context of the analysis detailed in its press release dated March 31, 2026 as to the re-orienting of the Company’s overall business strategy. 

The Company anticipates that the private placement will close on or before May 8, 2026, subject to acceptance by the TSX.

The Company reserves the right to pay finder’s fees in the form of common shares (in lieu of cash fees) and broker warrants to arm’s length finders in connection with the private placement to arm’s length parties, in accordance with TSX policies. No finder’s fee will be paid to any non-arm’s length parties, nor with respect to subscriptions from non-arm’s length parties.  A maximum number of 1,363,636 common shares (to be issued at $0.11 per share for a total value of $150,000) and a maximum number of 1,254,545 broker warrants will be issuable, assuming the private placement is fully subscribed.  Each broker warrant will entitle the holder to acquire one common share at $0.14 per common share (the “Broker Warrant Exercise Price”) for a period of three years form issuance.  

The maximum number of securities issuable under the private placement is 66,254,545 common shares, comprising 31,818,182 common shares comprising the Units, 31,818,182 common shares issuable upon exercise of the Warrants, 1,363,636 common shares to be issued as finder’s fees, and 1,254,545 common shares issuable upon exercise of the broker warrants, which represents an amount equivalent to 86.10% of the total outstanding common shares as at the date of this press release on a non-diluted basis, without taking into effect the private placement itself, or approximately 46.27% of the Company’s total issued and outstanding common shares following completion of the private placement (being 143,200,825 shares anticipated to be outstanding on a partially diluted basis, assuming the private placement is fully subscribed, full issuance of the finder’s fee shares and full exercise of the Warrants and broker warrants). The Unit Price represents a 22% discount to the Company’s five-day volume-weighted trading price of its common shares on the TSX as at the time of submitting the Company’s application to TSX (the “Market Price”). Market Price and the Exercise Price and the Broker Warrant Exercise Price represent a 2.47% discount to the Market Price.

The total number of common shares expected to be issued to insider (Mr. Lew) under the private placement is 18,181,818 (consisting of 9,090,909 common shares and 9,090,909 common shares issuable upon full exercise of Warrants), representing 23.63% of the total outstanding common shares as at the date of this press release on a non-diluted basis, without taking into effect the private placement itself, or 12.70% of the Company’s total issued and outstanding common shares following completion of the private placement (being 143,200,825 shares anticipated to be outstanding on a partially diluted basis, assuming the private placement is fully subscribed, full issuance of the finder’s fee shares and full exercise of the Warrants and the broker warrants).

This press release does not constitute an offer to sell or a solicitation of an offer to buy any securities in the United States.  The securities have not been and will not be registered under the United States Securities Act of 1933, as amended (the “U.S. Securities Act”), or any state securities laws, and may not be offered or sold within the United states or to U.S. persons unless registered under the U.S. Securities Act and applicable state securities laws, or an exemption from such registration is available.

ABOUT EAST SIDE GAMES GROUP

ESGG is a leader in free-to-play mobile gaming, thrilling players with unforgettable experiences that spark lifelong fandom. Fueled by an entrepreneurial spirit, we are driven by creativity, flawless execution, and a laser-focused strategy. We develop and publish both original and licensed IP titles, license our cutting-edge GameKit(s) platforms, and strategically acquire studios or games to expand our family.

Headquartered in Vancouver with around 100 talent-dense team members, we operate over a dozen titles under East Side Games (“ESG”) and LDRLY (Technologies) Inc. (“LDRLY”). Together, we’re crafting, launching, and publishing mobile games across our own studios and an extended Game Kit partner network-reaching players on iOS and Android worldwide.

We power our success through in-app purchases (“IAP”) — offering exclusive, game-enhancing virtual items — and in-game advertising. To keep growing, we focus on captivating audiences, keeping them engaged, and unlocking exciting new ways to monetize. We’ll drive this momentum by launching bold new titles, enriching our current lineup, innovating discovery, expanding into fresh markets, and exploring new distribution platforms.

Additional information about the Company continues to be available under its legal name, East Side Games Group Inc., at www.sedarplus.ca.

Forward-looking Information

Certain statements in this news release constitute forward-looking information or forward-looking statements within the meaning of applicable securities laws. Forward-looking statements are often, but not always, identified by the use of words such as “expects,” “anticipates,” “plans,” “intends,” “believes,” “estimates,” “projects,” “may,” “will,” “would,” “could,” “should,” and similar expressions. Forward-looking statements in this news release include, without limitation, statements regarding the proposed private placement.

Forward-looking statements are based on management’s current expectations, estimates, projections and assumptions. Such forward-looking statements are subject to significant risks, uncertainties and other factors that could cause actual results or events to differ materially from those expressed or implied by such statements, including, without limitation, risks relating to the Company’s ability to complete the proposed private placement as described, and relating to general economic, market and industry conditions. Readers are cautioned not to place undue reliance on forward-looking statements. The forward-looking statements contained in this news release are made as of the date hereof, and the Company undertakes no obligation to update or revise any forward-looking statements, whether as a result of new information, future events or otherwise, except as required by applicable law.

SOURCE East Side Games Group Inc.

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