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Texas Instruments signs preliminary agreement to receive up to $1.6 billion in CHIPS and Science Act proposed funding for semiconductor manufacturing in Texas and Utah

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The U.S. Department of Commerce has proposed up to $1.6 billion for TI in direct funding through the CHIPS and Science Act to support three 300mm semiconductor wafer fabs under construction in Texas and Utah.TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury’s Investment Tax Credit for qualified U.S. manufacturing investments.The company also expects to receive $10 million in proposed funding for workforce development, as it creates over 2,000 new TI jobs and thousands of indirect jobs for construction, suppliers and supporting industries.

LEHI, Utah, and SHERMAN, Texas, Aug. 16, 2024 /PRNewswire/ — Texas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury’s Investment Tax Credit for qualified U.S. manufacturing investments. The proposed direct funding, coupled with the investment tax credit, would help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors.

“The historic CHIPS Act is enabling more semiconductor manufacturing capacity in the U.S., making the semiconductor ecosystem stronger and more resilient,” said Haviv Ilan, president and CEO of Texas Instruments. “Our investments further strengthen our competitive advantage in manufacturing and technology as we expand our 300mm manufacturing operations in the U.S. With plans to grow our internal manufacturing to more than 95% by 2030, we’re building geopolitically dependable, 300mm capacity at scale to provide the analog and embedded processing chips our customers will need for years to come.”

Building geopolitically dependable capacity for analog and embedded processing chips 

Since its founding more than 90 years ago, TI has been advancing technology, pioneering the transition from vacuum tubes to transistors and then to integrated circuits. Today, TI is the largest U.S. analog and embedded processing semiconductor manufacturer. TI chips are essential in nearly every type of electronic device, from cars with advanced safety and intelligence systems to life-saving medical equipment and smart appliances that make homes safer and more efficient.

The proposed direct funding under the CHIPS Act would support TI’s investment of more than $18 billion through 2029, which is part of the company’s broader investment in manufacturing. This proposed direct funding will support three new wafer fabs, two in Sherman, Texas, (SM1 and SM2) and one in Lehi, Utah (LFAB2), specifically to:

Construct and build the SM1 cleanroom and complete pilot line for first production;Construct and build the LFAB2 cleanroom for first production; andConstruct the SM2 shell.

These connected, multi-fab sites benefit from shared infrastructure, talent and technology sharing, and a strong network of suppliers and community partners. They will produce semiconductors in 28nm to 130nm technology nodes, which provide the optimal cost, performance, power, precision and voltage levels required for TI’s broad portfolio of analog and embedded processing products.

“With this proposed investment from the Biden-Harris Administration in TI, a global leader of production for current-generation and mature-node chips, we would help secure the supply chain for these foundational semiconductors that are used in every sector of the U.S. economy, and create tens of thousands of jobs in Texas and Utah,” said U.S. Secretary of Commerce Gina Raimondo. “The CHIPS for America program will supercharge American technology and innovation and make our country more secure – and TI is expected to be an important part of the success of the Biden-Harris Administration’s work to revitalize semiconductor manufacturing and development in the U.S.”

Building a stronger workforce

With a long history of supporting its employees to build long-term, successful careers, TI is also investing in building its future workforce. TI will create more than 2,000 company jobs across its three new fabs in Texas and Utah, along with thousands of indirect jobs for construction, suppliers and supporting industries.

“We are proud to work with Texas Instruments as they build new semiconductor fabs in Sherman and solidify Texas as the best state for semiconductors. Texas Instruments invented the microchip in Texas, and we are honored to be home to TI’s semiconductor manufacturing facilities in Dallas, Richardson and Sherman,” said Texas Gov. Greg Abbott. “With this latest project, TI is building on its more than 90-year legacy in Texas and adding thousands of good-paying jobs for Texans to manufacture critically important technology.”

“By investing in semiconductor manufacturing, we are helping secure this vulnerable supply chain, boosting our national security and global competitiveness, and creating new jobs for Texans,” said U.S. Sen. John Cornyn. “The chipmaking capabilities these resources will enable at Texas Instruments will help the U.S. reclaim its leadership role in the critically important semiconductor industry, and I look forward to seeing more Texas-led advancements in the years to come.”

In order to build a future-ready workforce, TI is enhancing the skills of current employees, expanding internships and creating pipeline programs with a focus on building electronic and mechanical skills. TI has robust engagements with 40 community colleges, high schools and military institutions across the U.S. to develop future semiconductor talent.

“Utah is thrilled that Texas Instruments is expanding its manufacturing presence in the Silicon Slopes, furthering the impact Utahns have on critical semiconductor technology,” said Utah Gov. Spencer Cox. “This investment in semiconductor manufacturing not only creates more jobs, but also brings supply chains back to the United States.”

“This proposed CHIPS funding will further support Texas Instruments’ investment in its new semiconductor fab in Lehi —and enhance Utah’s vital role in our national defense and economic success,” said U.S. Senator Mitt Romney. “I was an original sponsor of the CHIPS and Science Act—which made today’s announcement possible—because in order to compete on the world stage, we must continue to promote innovation, foster scientific talent, and expand research here at home. Texas Instruments’ expanded operations will help make the United States more self-reliant for chips essential to our national security and economy.”

Building sustainable manufacturing

TI has a long-standing commitment to responsible, sustainable manufacturing and environmental stewardship. As part of this commitment, TI continually invests in its fabrication processes and equipment to reduce energy, material and water consumption, and greenhouse gas (GHG) emissions.

The company’s 300mm wafer fabs will be entirely powered by renewable electricity. Additionally, all of TI’s new 300mm fabs are designed to meet LEED Gold standards for structural efficiency and sustainability. TI’s 300mm manufacturing facilities bring advantages in reducing waste and improving water and energy consumption per chip.

TI semiconductors are and will increasingly play a critical role in helping reduce the impact on the environment, helping customers create smaller, more efficient and cost-effective technology solutions that in turn drive continued innovation in electrification and the expanded usage of renewable energy.

Learn more:

TI CHIPS Act press kit (includes images, video b-roll, fact sheet)TI Sherman, TX, press kitTI Lehi, UT, press kit

Notice regarding forward-looking statements

This release includes forward-looking statements intended to qualify for the safe harbor from liability established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements generally can be identified by phrases such as TI or its management “believes,” “expects,” “anticipates,” “foresees,” “forecasts,” “estimates” or other words or phrases of similar import. Similarly, statements herein that describe TI’s business strategy, outlook, objectives, plans, intentions or goals also are forward-looking statements. All such forward-looking statements are subject to certain risks and uncertainties that could cause actual results to differ materially from those in forward-looking statements.

See Item 1A of TI’s most recent Form 10-K for a detailed discussion of risk factors that could cause results to differ materially from the forward-looking statements. The forward-looking statements included in this release are made only as of the date of this release, and we undertake no obligation to update the forward-looking statements to reflect subsequent events or circumstances. If we do update any forward-looking statement, you should not infer that we will make additional updates with respect to that statement or any other forward-looking statement.

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

 

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SOURCE Texas Instruments

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Wenge AI Subsidiary D2 Intelligence Showcases Four AI Products at Hong Kong FinTech Week 2026

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HONG KONG, Nov. 3, 2026 /PRNewswire/ — D2 Intelligence, a subsidiary of Wenge AI (1956.HK), is showcasing at Hong Kong FinTech Week x StartmeupHK 2026. Under this year’s theme “Fintech Nexus: Bridging the World, Building the Future”, Asia’s flagship fintech event brought together more than 45,000 attendees from more than 120 economies. At its exhibition booth, D2 Intelligence showcased four AI products — Decitron, ScienceOra, DocuMind and Checkie — spanning decision intelligence, scientific research, enterprise document intelligence and consumer-grade risk checking.

Decitron — the world’s first general-purpose large decision model.

Released by Wenge AI in June 2026, Decitron was a centerpiece of the showcase. Built on three technical pillars — a World Model, multi-agent reasoning and game solving — the model understands events, deduces possible paths and compares outcomes for complex, open-ended problems. On the internationally recognized PolyBench benchmark, it achieved a Final Forecast Accuracy of 81.20%. Rather than simply answering questions, it generates deduction process reports and comprehensive analysis reports for decision-makers, and continuously tracks evolving situations through its X-Signal global signal capability.

Decitron is available at https://decitron.wenge.com/app.

ScienceOra — an intelligent research decision platform for AI for Science (AI4S).

ScienceOra is built on the ScienceOne Scientific Foundation Model. Recently launched on Tencent WorkBuddy with more than 30 specialist research agents and skills, ScienceOra supports literature analysis, hypothesis development, study design, modeling and simulation, validation and research communication across disciplines. At the booth, ScienceOra demonstrated how, in a drug R&D scenario, a researcher evaluating Fostamatinib can first build a developability evaluation framework, then analyze the compound’s ADMET characteristics together with known bioactivity and toxicity data, and finally receive a proposed follow-up validation plan with key metrics.

ScienceOra is available at https://www.scienceone.ai/portal/.

DocuMind — an enterprise document intelligence and decision platform.

Launched by D2 Intelligence in September 2026, DocuMind serves financial services, insurance and public services, where accuracy, compliance and traceability are critical. Built on Wenge AI’s DOMA architecture (Data, Ontology, Models and Agents), it brings document recognition, information extraction, cross-document verification and risk review into a single, fully traceable workflow. In the HKMA GenA.I. Sandbox, DocuMind processed a trade finance document of up to 10 pages in under 30 seconds — compared with 10 to 20 minutes manually — with extraction accuracy for core fields exceeding 95% and a review automation rate of approximately 85%. Every conclusion retains its rationale, evidence and audit trail, and the platform supports data masking, isolated environments and on-premises deployment.

Checkie — an AI-powered “second opinion” for everyday decisions.

Checkie turns contracts, freelance offers and dating profiles into easy-to-read reality checks. Users upload PDFs or screenshots, and Checkie applies OCR and image analysis to flag unusual details and points worth a second look — from clauses buried in a rental agreement to red flags in a job offer or an online conversation. During the event, Checkie was named a Global Fast Track 2026 Semi-Finalist by Invest Hong Kong. Checkie was also recently nominated as China’s sole representative in the Government and Citizen Engagement category of the World Summit Awards (WSA) 2026, a United Nations-backed global digital innovation award, and will represent China in the upcoming global selection.

Checkie is available at https://checkie-ai.com/.

About D2 Intelligence

D2 Intelligence is a data and decision intelligence company powered by AI LLMs. We provide products and solutions for digital transformation, cross‑modal analytics, AI‑assisted decision optimization, AIGC content creation, financial risk management and investment research. We serve global brands, financial institutions and media companies including Haier, BYD, Kantar, China Construction Bank, China Merchants Bank, Guotai Junan Securities and CMG Asia-Pacific. Our headquarters is in Hong Kong, with R&D teams across major cities in Mainland China. For more information, visit https://www.d2-ai.com/.

About Wenge AI

Wenge AI (1956.HK) is a provider of artificial intelligence technology and service platform products for enterprises. With self-developed large models as its core, the company helps enterprises build practical intelligent platforms and applications. Founded by a team of AI scientists from the Chinese Academy of Sciences, Wenge AI has deep technological expertise in large models, cognitive intelligence and complex-system modeling, and is committed to advancing AI from technological capabilities to enterprise-level applications.

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SOURCE Wenge AI

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Trane Expands Future Climate Engineers Scholarship Program in Indonesia to Broaden Student Access

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BANDUNG, Indonesia, Nov. 4, 2026 /PRNewswire/ — Trane – by Trane Technologies (NYSE: TT), a global climate innovator, has announced the expansion of the Trane Future Climate Engineers Scholarship Program in Indonesia, part of its commitment to help develop the next generation of climate leaders.

Building on a successful inaugural year, Trane is building upon its collaboration with Politeknik Negeri Bandung (POLBAN) and local non-governmental organization Yayasan Generasi Cerdas Iklim (GCI) to equip more emerging professionals with the financial support, technical training and leadership development needed to drive impact in a rapidly evolving industry.

“The HVAC industry needs talent with more than technical knowledge. As the industry evolves, there is growing demand for future-ready professionals who can apply digital tools, improve energy efficiency and help advance sustainability goals,” said Steven Lim, Country Leader of Trane Indonesia. “Through this scholarship program, we are helping bridge the gap between academic learning and industry experience, equipping young people with the skills, exposure and confidence to succeed and make a meaningful impact.”

In response to the evolving skills needs of Indonesia’s climate and energy sectors, the 2026 program is expanding its scope to include additional participants and disciplines. The program will continue its focus on Refrigeration and Air Conditioning Engineering while also welcoming high-potential students from POLBAN’s Mechanical Engineering, Energy Engineering, Electrical Engineering and Business Administration disciplines.

The program’s learning experience has also been enhanced. Co-developed by Trane and GCI, the curriculum now brings together experts in climate resilience, low-carbon development and artificial intelligence to provide students with broader exposure to the issues shaping the future of the industry. Through an intensive leadership and innovation experience, mixed-discipline student teams will develop and implement community mini-projects designed to apply their learning in practical ways.

To further extend the program’s impact, selected online training sessions that were previously available only to scholarship recipients will now be offered free of charge to the public. This open-access approach will enable more young people across Indonesia to explore climate, sustainability and green career pathways.

“The scholarship program gives students the opportunity to learn and grow beyond the classroom, while exposing them to diverse professional and industry perspectives,” said Iwan Ridwan, S.T., M.T., Ph.D., Vice Director for Academic Affairs of POLBAN. “We look forward to continuing this collaboration to strengthen the connection between vocational education and industry needs, helping students better understand how their knowledge can be applied in the workplace and in broader society.”

“Over the first year, the program demonstrated strong interest among young people in climate, energy and sustainability,” said Ikrom Mustofa, S.Si., M.Sc., Founder and Advisor of GCI. “By opening selected sessions to the public, we are expanding access for students from diverse academic backgrounds while continuing to provide scholarship recipients with structured and in-depth development support.”

The Future Climate Engineers Scholarship supports the company’s 2030 Sustainability Commitments, and its efforts to expand access to STEM education and inspire the next generation of learners with the potential to transform our way of life and our world.

About Trane

Trane – by Trane Technologies (NYSE: TT), a global climate innovator – creates comfortable, energy efficient indoor environments for commercial and residential applications. For more information, please visit www.trane.com or www.tranetechnologies.com.

About Trane Technologies

Trane Technologies is a global climate innovator. Through our strategic brands Trane® and Thermo King®, and our portfolio of environmentally responsible products and services, we bring efficient and sustainable climate solutions to buildings, homes and transportation. For more on Trane Technologies, visit tranetechnologies.com.

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SOURCE Trane – by Trane Technologies

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Viettel Group and Vietnam’s Government Cipher Committee Unveil Security Chip Embedding Vietnamese Cryptography in Silicon

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HANOI, Vietnam, Nov. 3, 2026 /PRNewswire/ — Vietnam’s Government Cipher Committee and Viettel Group have unveiled VGC v1.0, a security chip integrating a domestically developed cryptographic algorithm directly into silicon, alongside the country’s first domestically designed secure semiconductor platform.

The project addresses concerns over potential data exposure associated with reliance on imported chips. By embedding cryptographic functions directly into hardware, Vietnam’s Government Cipher Committee and Viettel Group aim to strengthen Vietnam’s control over the design and verification of technologies used to protect sensitive information.

VGC v1.0 contains 300 million transistors in a 10 × 10 mm package and is fabricated using a 28-nanometre CMOS process. In performance tests, it performed encryption and decryption approximately 15 times faster than a software-only solution carrying out the same tasks. The first batch passed technical tests and received certification for socio-economic applications in the first quarter of 2026. Technical safeguards were also applied to protect the design before fabrication, reducing risks of information leakage and reverse engineering.

The Government Cipher Committee’s M2 unit established security requirements, developed the cryptographic algorithm and defined evaluation criteria, while Viettel Semiconductor Center designed and implemented the chip. Based on the open RISC-V instruction set architecture, the underlying platform enables Vietnamese engineers to modify processor designs and reuse established verification processes for future chip generations.

VGC v1.0 has already seen initial deployment in secure USB storage devices for Party, government and defence agencies. Planned applications include supporting Vietnam’s national digital signature certification system, which has more than two million digital certificates in circulation. Other potential uses span financial data protection, connected cameras and sensors, and critical infrastructure systems in electricity, water, oil and gas, and telecommunications. Products intended to protect state secrets would require further testing and certification under applicable standards.

“Researching, designing and developing secure semiconductor chips is a formidable challenge, requiring years of accumulated expertise, technological capabilities and highly skilled talent. Yet we believe that starting later does not mean accepting dependence on others. With the right strategy, focused resources and sustained commitment, we can steadily close the gap and move towards mastering technologies of strategic importance to our country,” said Lieutenant General Tao Duc Thang, Chairman and CEO of Viettel Group.

At the launch, the Vietnam’s Government Cipher Committee and Viettel Group signed an agreement covering plans for volume production, multicore security chips, specialist workforce development and testing on real devices. Viettel is also building a semiconductor fabrication plant in Hoa Lac as part of broader efforts to develop domestic capabilities across chip design, manufacturing and packaging.

Beyond the initial chip, the initiative establishes a foundation for future generations of security hardware, supporting Vietnam’s long-term efforts to reduce technological dependence and strengthen control over critical digital technologies.

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SOURCE Viettel Group

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