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Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

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Optimized EDA and IP Solutions Deliver Enhanced Compute Performance, Power and Engineering Productivity for TSMC N2 and A16 Processes 

Highlights

Production-ready AI-driven EDA flows, powered by Synopsys.ai, on N2 deliver exceptional quality of results and accelerate design node migration for industry leadersDeveloping new backside power delivery capabilities on TSMC’s A16 to enable efficient power distribution and system performanceJoint TSMC, Synopsys and Ansys multi-physics flow supporting CoWoS interposer packaging addresses thermal and power integrity challengesSynopsys 3DSO.ai delivers AI-driven system analysis for maximum quality of results with support for TSMC’s 3DFabricNew development of 40G UCIe, HBM4 and 3DIO IP on advanced TSMC nodes optimizes latency, power, performance and area

SUNNYVALE, Calif., Sept. 25, 2024 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC’s most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs. The relentless computational demands in AI applications require semiconductor technologies to keep pace. From an industry leading AI-driven EDA suite, powered by Synopsys.ai™ for enhanced productivity and silicon results to complete solutions that facilitate the migration to 2.5/3D multi-die architectures, Synopsys and TSMC have worked closely for decades to pave the path for the future of billion to trillion-transistor AI chip designs.

“TSMC is excited to collaborate with Synopsys to develop pioneering EDA and IP solutions tailored for the rigorous compute demands of AI designs on TSMC advanced process and 3DFabric technologies,” said Dan Kochpatcharin, head of the Ecosystem and Alliance Management Division at TSMC. “The results of our latest collaboration across Synopsys’ AI-driven EDA suite and silicon-proven IP have helped our mutual customers significantly enhance their productivity and deliver remarkable performance, power, and area results for advanced AI chip designs.

“For decades, Synopsys has closely collaborated with TSMC, providing mission-critical EDA and IP solutions spanning all generations of TSMC’s most advanced nodes,” said Sanjay Bali, senior vice president of EDA product management at Synopsys. “This partnership has been instrumental in helping our mutual customers accelerate their innovation in the AI era and advance the future of semiconductor designs. Together, we are pushing the boundaries of what’s possible, enabling groundbreaking advancements in performance, power efficiency, and engineering productivity.”

Synopsys AI-Driven EDA Design Flows Boost PPA and Engineering Productivity
Industry leaders have embraced Synopsys AI-driven EDA flows, powered by Synopsys.ai for their advanced chip designs on N2.

“Synopsys’ certified Custom Compiler and PrimeSim solutions provide the performance and productivity gains that enable our designers to meet the silicon demands of high-performance analog design on the TSMC N2 process,” said Ching San Wu, Corporate VP at MediaTek. “Expanding our collaboration with Synopsys makes it possible for us to leverage the full potential of their AI-driven flow to accelerate our design migration and optimization efforts, improving the process required for delivering our industry-leading SoCs to multiple verticals.”

In addition, Synopsys is collaborating with TSMC on the new backside routing capabilities supporting TSMC’s A16 process in the Synopsys digital design flow to address power distribution and signal routing for design performance efficiency and density optimization. Interoperable process design kits (iPDKs) and Synopsys IC Validator™ physical verification runsets are available for design teams to handle the increasing complexity of physical verification rules and efficiently transition designs to TSMC N2 technology.

To further accelerate chip design, Synopsys and TSMC have enabled Synopsys EDA tools on the cloud through TSMC’s Cloud Certification, providing mutual customers with cloud-ready EDA tools that deliver accurate quality of results and seamlessly integrate with TSMC’s advanced process technology. Synopsys’ cloud-certified tools include synthesis, place and route, static timing and power analysis, transistor-level static timing analysis, custom implementation, circuit simulation, EMIR analysis and design rule checking.

Advancing Multi-Die Innovation with Comprehensive EDA Solutions
Synopsys, Ansys and TSMC have collaborated to address the complex multi-physics challenge for multi-die designs with a comprehensive system analysis flow by leveraging their prime solutions. The most recent flow based on Synopsys 3DIC Compiler unified exploration-to-signoff platform, which integrates 3DSO.ai, combined with Ansys RedHawk-SC™ power integrity signoff platform for digital and 3D integrated circuits, enhances the thermal and IR-aware timing analysis. Synopsys 3DIC Compiler is a TSMC-certified platform supporting 3Dblox, TSMC’s 3DFabric, which includes TSMC-SoIC® (System on Integrated Chips) and CoWoS packaging technologies.

“Our collaboration with Synopsys and TSMC exemplifies our collective commitment to driving innovation and enabling the future of AI and multi-die chip design,” said John Lee, vice president and general manager, semiconductor, electronics and optics business at Ansys. “Together, we are tackling the multi-physics challenges inherent in multi-die architectures, helping our mutual customers achieve golden signoff accuracy for chip, package, and system-level effects within the Synopsys design environment on the latest TSMC technologies.”

Reduce Risk with Silicon-Proven IP
Synopsys‘ comprehensive multi-die test solutions, available with the Synopsys UCIe and HBM3 IP, ensure multi-die package health during manufacturing test and in-field. In collaboration with TSMC, Synopsys has taped out a test chip utilizing TSMC’s CoWoS interposer technology with full support for test, monitor, debug, and repair capabilities. The diagnosis, traceability, and mission mode signal integrity monitoring allow in-design, in-ramp, in-production, and in-field optimization for purposes such as predictive maintenance. The Monitoring, Test, and Repair (MTR) IP for UCIe PHY provides testability at the die, die-to-die interface and multi-die package levels. 

Synopsys has achieved multiple silicon successes for UCIe and HBM3 IP solutions across N3E and N5 process technologies, accelerating IP integration and minimizing risk. Latest developments of the Synopsys UCIe IP, operating up to 40G, allows maximum bandwidth and energy efficiency without the need for additional area while the HBM4 and 3DIO IP solutions accelerate heterogeneous integration of 3D stacked-dies on TSMC’s advanced processes.

Additional Resources

LinkedIn article: Synopsys-TSMC Successful Tapeout of a Test Chip Featuring a Multi-Die Design Using TSMC’s CoWoS TechnologySynopsys is hosting several demonstrations at the TSMC OIP Ecosystem Forum today in Santa Clara at Booth #204

About Synopsys
Catalyzing the era of pervasive intelligence, Synopsys, Inc. (Nasdaq: SNPS) delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. We partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.  Learn more at www.synopsys.com.

Editorial Contact 
Kelli Wheeler 
Synopsys, Inc. 
(650) 584-5000
corp-pr@synopsys.com

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Raytron Industrial Launches TN660 and TN463 Thermal Cameras for Dynamic Testing and Continuous Condition Monitoring

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YANTAI, China, Oct. 22, 2026 /PRNewswire/ — Raytron Industrial today announced the launch of two new products: the TN660 High Frame Rate Fixed-Mount Thermal Camera and the TN463 Fixed-Mount Thermal Camera. Both offer 640 × 512 imaging with synchronized image and temperature data. The TN660 delivers full-frame 120 Hz acquisition for moving targets and transient thermal processes, while the TN463 provides 60 Hz imaging for routine inline inspection and continuous equipment monitoring.

Full-Resolution Imaging for Different Process Speeds

Featuring a 12 μm uncooled VOx detector, the TN660 achieves 120 Hz at its native resolution without windowing, preserving spatial detail and scene coverage. Frames are approximately 8.33 ms apart, helping engineers examine rapid heating, cooling, and short-duration thermal events in research, industrial automation, and transportation applications.

The TN463 uses the same detector resolution and pixel pitch. Its 60 Hz output supports routine production cycles and long-term temperature trend analysis. To accommodate different installation requirements, the TN463 offers 6.9 mm, 9.1 mm, 19 mm, and 25 mm lenses, while the TN660 is available with 9.1 mm and 25 mm lenses.

From Event-Triggered Capture to Synchronized Analysis

Both cameras support hardware and software triggering to coordinate acquisition with equipment actions. An external signal through the I/O (input/output) interface can initiate capture at a defined process stage. For example, a heat-press start signal can trigger the TN660 to record the thermal sequence, reducing unnecessary recording and review work.

Synchronized output pairs temperature readings with corresponding thermal images. Raytron Industrial’s TI Studio software supports simultaneous preview and analysis of up to four cameras, with temperature and temperature-rise alarms to flag abnormal conditions. Engineers can review recordings, examine and export historical temperature curves, and generate reports, linking equipment events with thermal data for further analysis.

Temperature Measurement and System Integration

Both models measure temperatures from −20°C to 150°C and 100°C to 650°C, with an accuracy of ±2°C or ±2% of the reading, whichever is greater. Ethernet and USB connectivity support data acquisition, while compatibility with industrial protocols such as Modbus TCP allows temperature data to be incorporated into existing control and monitoring systems.

With a choice of 60 Hz and 120 Hz imaging, the TN463 and TN660 allow users to match thermal acquisition to their process requirements, from continuous equipment monitoring to dynamic testing.

For Further Information

Email: sales@raythink-tech.com
Website: https://www.raythink-tech.com/

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4SiGHT Supply Chain Group Welcomes Joanne Strong as Senior Vice President, Delivery Excellence and Innovation

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Industry-recognized WMS leader and AI-driven delivery innovator joins 4SiGHT to lead delivery as one of North America’s largest dedicated Manhattan Active® implementation partners accelerates its growth

WAYNE, N.J., Oct. 22, 2026 /PRNewswire-PRWeb/ — 4SiGHT Supply Chain Group, one of North America’s largest dedicated Manhattan Associates implementation partners, today announced the appointment of Joanne Strong as Senior Vice President of Delivery Excellence and Innovation. Strong joins the executive leadership team and will lead all client delivery across the firm.

4SiGHT has built something rare in its 18 years of operations: deep Manhattan expertise, exceptional talent, industry reputation, singular focus on Manhattan Associates, and a culture that puts client success at the center of everything it does.

The appointment comes during a year of rapid growth for 4SiGHT. Now in its 18th year, the firm has grown to more than 70 full-time associates in 2026 and continues to add Manhattan Active® talent across its warehouse, labor, transportation, and organizational change management practices. Strong’s newly created role is dedicated to ensuring that this growth is matched by an uncompromising standard of quality across every engagement.

“Delivery is our product. Every go-live, every client reference, and every renewal comes down to how well we execute,” said Frank Camean, President and CEO of 4SiGHT. “As 4SiGHT scales, we made a deliberate decision to put a senior executive in charge of one thing: the quality, consistency, and continuous improvement of how we deliver for our clients. Joanne has built and led delivery organizations at real scale, she knows the Manhattan Associates platform from the inside, and she has a proven record of innovation to make implementations faster and more predictable. Joanne is exactly the leader our clients deserve as we enter our next chapter. We are all honored and excited to have her join the team and can’t wait to see what the future brings.”

Strong brings more than a decade of experience with Manhattan Associates and enterprise warehouse management. She most recently served as WMS Practice Lead, directing a multimillion-dollar WMS practice that delivered supply chain transformation programs for Fortune 500 companies in retail, consumer products, and life sciences.

A recognized voice in the supply chain industry, Strong delivered keynote addresses at the 2025 Stratify Executive Forum and at Parcel Forum 2026, has been a featured panelist at MODEX, and has appeared on The New Warehouse and Bloomberg’s Talking Transports podcasts. She holds a B.B.A. in Management Information Systems from the University of Georgia’s Terry College of Business.

“4SiGHT has built something rare in its 18 years of operations: deep Manhattan expertise, exceptional talent, industry reputation, singular focus on Manhattan Associates, and a culture that puts client success at the center of everything it does,” said Strong. “The depth of Manhattan knowledge and real-world implementation experience across the organization is truly unique in the industry. My focus is on elevating an already outstanding client experience by combining that expertise with proven delivery practices, innovative methodologies, implementation accelerators, AI-enabled tools and capabilities. We have an incredible opportunity to help clients achieve faster outcomes, greater confidence in execution, and long-term business value. I’m honored to join the team at such a pivotal moment in its growth and excited for what we will accomplish together.”

About 4SiGHT Supply Chain Group

4SiGHT specializes in supply chain software implementations, with a primary focus on the Manhattan Associates product suite of applications. Our seasoned professionals average more than 19 years of experience helping companies across all industries solve their distribution, fulfillment, and transportation challenges. Together with our strategic partners, our collective team includes more than 100 associates. No other firm in North America brings this depth of Manhattan Active® expertise, and we look forward to expanding our team with additional talent in the months ahead. As a testament to the value our clients place on our expertise, experience, and integrity, 4SiGHT has received multiple industry awards. For more information, please visit 4sight.com or email us at in4mation@4sight.com.

Media Contact

Jenae Cahanes, 4SiGHT Supply Chain Group, 1 9734350025, jenae.cahanes@4sight.com, 4sight.com

LinkedIn

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UL Research Institutes Releases New Report Defining Roadmap for Next-Generation Wildfire Risk Intelligence

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New findings identify critical gaps and opportunities in wildfire risk modeling to strengthen community protection

COLUMBIA, Md., Oct. 22, 2026 /PRNewswire/ — As destructive wildfires increasingly threaten communities across the globe, a new report from UL Research Institutes’ Fire Safety Research Institute examines the strengths and limitations of current wildfire risk models and provides a roadmap for more comprehensive wildfire risk intelligence.

“Wildfire Risk Modeling Evaluation Findings and Community Perspectives” details findings from the 2026 Wildfire Risk Modeling Exercise, a first-of-its-kind collaborative effort that evaluated a diverse set of wildfire risk models using common scenarios and datasets. The exercise included approximately 20 organizations across academia, government, national laboratories, nonprofits, and the private sector.

For fire service leaders, emergency managers, and public safety officials, the report provides a practical framework for evaluating which modeling capabilities are best suited to specific community needs and decisions. Applied effectively, these tools can help practitioners identify where risk is greatest, prioritize mitigation investments, strengthen evacuation and preparedness planning, and make more informed decisions before, during, and after a wildfire.

“The Wildfire Risk Modeling Exercise was a convergent test and evaluation of the diverse models available to characterize wildfire risk today. These results revealed broader insights about the state of the science, prioritized gaps, and the investments needed to advance wildfire risk intelligence,” said Rebecca Harned, principal research scientist for Fire Safety Research Institute and the report’s lead author. “The findings provide a critical foundation for shaping the next decade of research, innovation, and operational capability. This report also serves as an important resource for local and state fire service and public safety agencies, providing an evidence-based framework for selecting wildfire risk modeling capabilities and applying them effectively to assess and manage community risk.”

Key Findings From the Wildfire Risk Modeling Exercise

The results from the exercise demonstrate that no single model can capture the full complexity of wildfire risk, nor should one be expected to. Instead, the report identifies an opportunity to build a new generation of wildfire risk intelligence by connecting complementary models, datasets, and scientific approaches. Doing so can help close critical gaps between modeling wildfire hazard and understanding what ultimately matters to communities — which people, property, and assets are at risk, why they are vulnerable, what the consequences could be, and which actions can most effectively reduce those risks.

To realize that vision, the report recommends building an interoperable modeling ecosystem spanning the full wildfire risk assessment pathway, from ignition and landscape fire spread through structure exposure, community impacts, and economic consequences. It also calls for stronger shared core data and standards, improved transparency and explainability, expanded decision-support tools, and greater use of ensemble modeling. Together, these advances could transform wildfire modeling from a collection of specialized capabilities into an integrated risk intelligence framework that better supports decisions before, during, and after wildfire events.

About the Fire Safety Research Institute

UL Research Institutes’ Fire Safety Research Institute advances fire science and fire safety knowledge to reduce risk, save lives, and protect property. We conduct rigorous research, outreach, and education in collaboration with the fire service, fire safety professionals, policymakers, communities, and an international network of partners. Together, we develop tools, resources, and strategies that improve fire safety outcomes worldwide. To learn more, visit fsri.org. Follow Fire Safety Research Institute on Instagram, Facebook, and LinkedIn.

About UL Research Institutes

UL Research Institutes is a nonprofit research organization dedicated to advancing public safety through scientific discovery. Since 1894, our research has advanced our mission toward a safer, more secure, and sustainable future. Focused on global risks from fire mitigation and air quality to safe energy storage and digital privacy, we conduct rigorous independent research, analyze safety data, and partner with experts to uncover and act on existing and emerging risks to human safety. Discover more at UL.org.

About the Exercise

The 2026 Wildfire Risk Modeling Exercise was designed as an open, collaborative and non-competitive effort. Each model submission was evaluated by multiple reviewers through two complementary evaluation streams: science and technical evaluation and user and practitioner evaluation. Participating organizations applied their models to standardized scenarios representing wildland, wildland-urban interface, and urban environments, with results evaluated by scientific experts and operational practitioners. The exercise was designed not to rank models, but to identify their strengths, limitations, and opportunities for integration.

For more information and to read the full report, visit FSRI.org.

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