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3D Printing in Low-Cost Satellite Market to Grow by USD 39.32 Billion from 2024-2028, Driven by Rapid Satellite Development; Market Evolution Powered by AI – Technavio

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NEW YORK, Sept. 30, 2024 /PRNewswire/ — Report on how AI is driving market transformation – The Global 3D Printing in Low-Cost Satellite Market size is estimated to grow by USD 39.32 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of  75.62%  during the forecast period. Rapid development and deployment of low-cost satellites is driving market growth, with a trend towards increasing number of space exploration missions  However, scalability issues associated with 3D printing in low-cost satellite manufacturing  poses a challenge – Key market players include Airbus SE, EOS GmbH, L3Harris Technologies Inc., Lockheed Martin Corp., Stratasys Ltd., and The Boeing Co..

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3D Printing In Low-Cost Satellite Market Scope

Report Coverage

Details

Base year

2023

Historic period

2018 – 2022

Forecast period

2024-2028

Growth momentum & CAGR

Accelerate at a CAGR of 75.62%

Market growth 2024-2028

USD 39320.3 million

Market structure

Concentrated

YoY growth 2022-2023 (%)

61.87

Regional analysis

North America, Europe, APAC, South America, and Middle East and Africa

Performing market contribution

North America at 47%

Key countries

US, China, UK, Germany, and Japan

Key companies profiled

Airbus SE, EOS GmbH, L3Harris Technologies Inc., Lockheed Martin Corp., Stratasys Ltd., and The Boeing Co.

Market Driver

The space industry witnessed significant advancements in 2023, with multiple space exploration missions launched by renowned organizations such as the European Space Agency (ESA) and the Indian Space Research Organization (ISRO). Notably, ESA’s Jupiter Icy Moons Explorer (Juice) mission was set to reach Jupiter by July 2031, while ISRO’s Chandrayaan-3 mission was successfully launched at a cost under USD100 million. Additionally, SpaceX launched 91 satellites using the Falcon 9 rocket. These milestones were accompanied by groundbreaking developments, including the first-ever 3D-printed rocket launch by SpaceX in Florida and two Starship test launches in Texas. The increasing number of space missions will fuel the demand for cost-effective satellites, thereby propelling the growth of the global 3D printing in low-cost satellite market in the forecast period. 

3D printing is revolutionizing the low-cost satellite market by enabling the production of housing, propulsion systems, and components for Nano and Microsatellites and Small Satellites. Advanced printer technology and materials from material suppliers are reducing satellite production costs for satellite manufacturers and space agencies. Budget-conscious space industry players are adopting 3D printing equipment for waste reduction and efficient production of satellite parts. This trend is particularly relevant for space exploration, satellite constellations, and small satellite missions. Components like antennas, brackets, and shields are being 3D printed for communication, Earth observation, navigation, internet access, telecommunications, broadcasting services, military operations, and more. Overall, 3D printing technology is transforming the space industry by making satellite manufacturing more accessible and cost-effective. 

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Market Challenges

The implementation of 3D printing in low-cost satellite manufacturing presents significant opportunities, but scalability remains a primary challenge. While 3D printing offers cost savings for creating small, complex components, its limitations in large-scale or high-volume production pose concerns. Three main scalability issues include printing speed, material compatibility, and post-processing challenges. 3D printers are slow in producing large and complex satellite parts, making it difficult to meet high-volume requirements within a short timeframe. Additionally, some materials required for low-cost satellite manufacturing are not compatible with 3D printers, reducing the available options. Lastly, post-processing steps, such as polishing, sanding, and painting, are labor-intensive and time-consuming, making it challenging to scale to high-volume production. These challenges may hinder the growth of the low-cost satellite manufacturing market during the forecast period.In the low-cost satellite market, housing, propulsion, and manufacturing challenges persist for Nano and Microsatellites and Small Satellites. Traditional satellite production methods face budget constraints, making 3D printing an attractive alternative. 3D printer technology, materials, and printing techniques offer solutions for satellite manufacturers and space agencies. Material suppliers are crucial for advanced printing technology, ensuring the production of high-quality satellite components. The space industry benefits from waste reduction through 3D printing, enabling space exploration and satellite constellations. Small satellite missions rely on 3D printing for producing essential components like antennas, brackets, and shields. Communication, Earth observation, navigation, internet access, telecommunications, broadcasting services, military operations, and more can be enhanced through satellite-based services made possible by this innovative technology. 3D printing equipment and materials are essential for producing satellite components, reducing costs and increasing efficiency. The use of 3D printing technology in satellite manufacturing is revolutionizing the space industry, enabling the production of complex structures and custom parts for various space applications.

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Segment Overview 

This 3d printing in low-cost satellite market report extensively covers market segmentation by  

Application 1.1 Aerospace and defense1.2 Scientific researchProduct 2.1 Power system2.2 Framework2.3 AntennaGeography 3.1 North America3.2 Europe3.3 APAC3.4 South America3.5 Middle East and Africa

1.1 Aerospace and defense-  The demand for low-cost satellites is escalating in the aerospace and defense sectors due to the growing requirement for affordable and dependable satellite technology for various mission-critical applications. Small satellites, also known as low-cost satellites, offer several advantages over conventional, larger satellites. They have lower manufacturing and launch costs and faster deployment times. The global defense sector is witnessing a consistent increase in spending on defense, creating a significant market opportunity for low-cost satellites. For instance, the US Department of Defense (DoD) is investing in advanced technology and communication, surveillance, and reconnaissance capabilities by developing small satellites equipped with multiple sensors. The US government’s proposed budget for the fiscal year 2022 includes USD1.9 billion in funding for space programs, including low-cost satellite initiatives. One of the significant benefits of 3D printing in low-cost satellite and aerospace applications is the ability to produce parts with complex geometries, which cannot be manufactured using traditional methods. 3D printing also enables on-demand manufacturing, reducing lead times and streamlining supply chain processes. This capability is crucial in the aerospace and defense sector, where timely delivery is essential. For example, SpaceX, the space venture company owned by Elon Musk, has successfully launched Falcon 9 rockets with 3D-printed parts, significantly reducing the cost of its spaceflights. The use of 3D-printed low-cost satellites provides several benefits, including reducing manufacturing costs and timelines and enabling companies to send satellites into orbit more frequently. For instance, NASA launched the world’s first 3D-printed satellite in 2015, and Alba Orbital developed the PocketQube satellite in February 2022. The defense sector is also exploring the use of 3D-printed low-cost satellites. For example, the US Air Force (USAF) is collaborating with Aerojet Rocketdyne and 3D printing company Stratasys to develop 3D-printed rockets for space missions, aiming to reduce manufacturing time and cost to support military operations. In conclusion, the increasing application of 3D-printed low-cost satellites in the aerospace industry will drive the growth of the market during the forecast period. The benefits of 3D printing, such as reduced manufacturing costs and timelines and the ability to produce complex geometries, make it an attractive option for both commercial and defense applications. The global market for 3D printing in low-cost satellite manufacturing is expected to grow significantly in the coming years.

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Research Analysis

The 3D printing technology is revolutionizing the satellite manufacturing industry, offering significant cost savings and design flexibility. This innovation is transforming the space sector, enabling the production of lightweight, customizable satellite components and structures. The technology’s applications in satellite-based services are vast, including communication, Earth observation, navigation, internet access, telecommunications, broadcasting services, and military operations. 3D printers and printer technology are at the heart of this transformation, utilizing advanced printing techniques and materials from material suppliers tailored for space applications. These materials include high-strength composites, alloys, and polymers, ensuring durability and functionality in the harsh space environment. The space industry is embracing this technology, with satellite constellations being developed using 3D printed components. The benefits of 3D printing in satellite manufacturing extend to space exploration, enabling the creation of advanced printing technology for in-space manufacturing and reducing the need for extensive ground-based infrastructure. Overall, 3D printing is driving innovation and cost savings in the satellite market, paving the way for a new era of space applications.

Market Research Overview

The 3D printing technology is revolutionizing the small satellite market by enabling the manufacturing of satellite components with reduced budgets and lead times. This technology is being increasingly adopted for the production of Nano and Microsatellites and Small Satellites due to its potential to produce lightweight and complex structures. 3D printing is being used to create various satellite components such as antennas, brackets, shields, housing, propulsion systems, and more. The space industry is leveraging advanced printing technology to produce satellite constellations for various applications including communication, Earth observation, navigation, internet access, telecommunications, broadcasting services, military operations, and space exploration. The use of 3D printing reduces waste, streamlines production, and allows for customization of satellite components. Material suppliers and printer technology manufacturers are also investing in this space to provide suitable materials and equipment for satellite manufacturing. The space industry, satellite manufacturers, and space agencies are embracing this technology to overcome budget constraints and produce high-quality satellite components for various space applications.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

ApplicationAerospace And DefenseScientific ResearchProductPower SystemFrameworkAntennaGeographyNorth AmericaEuropeAPACSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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MDT Introduces TMR1370 Ultra-Low-Power Magnetic Switch IC Enabling More Than Two Years of Standby Operation in CGM Devices

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— Next-Generation TMR Magnetic Switch with Ultra-Low 50nA Maximum Supply Current Expands MDT’s Proven CGM Sensor Portfolio

ZHANGJIAGANG, China, July 18, 2026 /PRNewswire/ — MultiDimension Technology Co., Ltd. (MDT), a leading supplier of magnetic sensors and a pioneer in Tunneling Magnetoresistance (TMR) technology, today introduced the TMR1370 ultra-low-power magnetic switch IC, the newest addition to MDT’s magnetic sensing portfolio for continuous glucose monitoring (CGM) devices. Building on the proven TMR1367, TMR1368, and TMR1369 family, the TMR1370 delivers significantly lower power consumption, enhanced voltage compatibility, and a smaller package to enable next-generation CGM systems with ultra-long standby life.

Optimized for battery-powered CGM devices, the TMR1370 features a maximum supply current of only 50nA, with approximately 30nA typical at a 3V supply. When combined with the magnetic wake-up mechanism widely adopted in CGM devices, the TMR1370 enables more than two years of standby operation, helping extend product shelf life while preserving battery capacity for continuous glucose monitoring after activation.

The TMR1370’s exceptional power efficiency is enabled by MDT’s proprietary TMR technology platform, which combines advanced magnetic sensor design, optimized device architecture, and proprietary wafer process technology to achieve high magnetic sensitivity together with ultra-low power consumption. Complementing MDT’s existing X-axis and Z-axis CGM magnetic switch portfolio, the TMR1370 gives system designers greater flexibility to optimize sensor orientation and mechanical layout for a wide variety of CGM architectures while enabling easy migration from previous-generation devices.

Key Features

Enables more than two years of standby operation in battery-powered CGM devices.50nA maximum supply current, approximately 30nA typical at 3V.Wide 1.8V to 4.0V operating-voltage range.Maximum operating point below 40 Gauss for reliable magnetic wake-up detection.X-axis magnetic sensing optimized for compact CGM designs.Miniature DFN5L package (1.6×1.6×0.5mm) for thinner and lighter wearable medical devices.Complements MDT’s proven X-axis and Z-axis CGM magnetic switch portfolio for flexible system design and simplified migration.

Samples of the TMR1370 are available through DigiKey and MDT’s online store at www.tmr-sensors.com. For volume pricing, delivery information, and technical specifications, contact MDT Global Sales at sales@dowayusa.com.

About MDT
MultiDimension Technology was founded in 2010 in Zhangjiagang, Jiangsu Province, China, with branch offices in Shenzhen, Chengdu, and Ningbo in China, Singapore, Tokyo, Japan, and San Jose, Calif., USA. MDT has developed a unique intellectual property portfolio, and its self-owned state-of-the-art TMR manufacturing facilities that can support volume production of high-performance, low-cost TMR magnetic sensors to satisfy the most demanding application needs. Led by its core management team of elite experts and veterans in magnetic sensor technology and engineering services, MDT is committed to creating added value for its customers and ensuring their success. For more information about MDT please visit http://www.multidimensiontech.com.

Media Contacts
MDT sales department, sales@dowayusa.com, sales@dowaytech.com
Tel: +1-650-275-2318 (US), +86-189-3612-1156 (China)

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SOURCE MultiDimension Technology Co., Ltd.

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Academy Software Foundation Welcomes CIQ, Evercast, and Rochester Institute of Technology as New Members

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New Academy Software Foundation (ASWF) members join ahead of Open Source Days, July 19-20, strengthening collaboration and advancing open source technologies for the motion picture and media industries

Summary

ASWF new members are CIQ as a Premier Member, Evercast as a General Member and Rochester Institute of Technology as an Associate MemberOpen Source Days is July 19–20, 2026 at the J.W. Marriott L.A. Live in Los Angeles, held alongside SIGGRAPH 2026Bill Ballew, CTO of DreamWorks Animation, to keynote Open Source Days and talk about MoonRay’s development from DreamWorks’ Dragons to ASWF

LOS ANGELES, July 17, 2026 /PRNewswire/ — The Academy Software Foundation (ASWF), the leading open source foundation for advancing open source software in motion pictures, visual effects, and animation, today announced three new member organizations ahead of its annual Open Source Days event, taking place July 19–20, 2026 in Los Angeles. CIQ has joined as a Premier Member, Evercast as a General Member and Rochester Institute of Technology (RIT) as an Associate Member.

“We are pleased to welcome CIQ, Evercast and Rochester Institute of Technology to the Academy Software Foundation,” said David Morin, executive director of the Academy Software Foundation. “Each organization brings valuable expertise that will strengthen our community – infrastructure that scales render farms, real-time review tools that keep artists collaborating across studios, and the academic programs training the next generation on OpenColorIO, ACES, and other open source tools before they ever set foot on a production floor.”

As members of the Academy Software Foundation, CIQ, Evercast, and Rochester Institute of Technology will have opportunities to contribute engineering expertise, participate in technical working groups, collaborate on open source projects and help shape the technical direction of the ASWF. Their participation will expand the community, bringing together technology providers, studios, software vendors and academic institutions to advance the open source tools and standards foundational to modern content creation.

Hosted annually by the Academy Software Foundation, Open Source Days is the leading event dedicated to open source software for visual effects, animation, and digital content creation. This year’s event will take place in Los Angeles on July 19-20, 2026, coinciding with the SIGGRAPH 2026 Conference, and features a keynote address by DreamWorks Animation CTO Bill Ballew on “How to Train Your Renderer: MoonRay’s Journey from DreamWorks’ Dragons to the ASWF.” Space is limited; register here to attend.

Supporting Quotes

“Open source has always been the backbone of production pipelines in film and visual effects, and as AI transforms what those pipelines can do, that foundation matters more than ever. CIQ is proud to join the Academy Software Foundation as a Premier Member and to help the creative industry build on infrastructure that is open, resilient, and built for the scale of what comes next.”
– Bjorn Hovland, President, CIQ

“We’re thrilled to join the Academy Software Foundation. At Evercast, we build high-quality, real-time review solutions that enable creative teams to share content and collaborate within the third-party tools they already use. This software-agnostic approach reflects our belief that open codebases, shared standards, and diverse teams are the best way for software to serve content creators worldwide. We look forward to collaborating with this amazing community at such a unique moment in our industry.”
– Jose Aguerre, VP of Engineering, Evercast

“RIT is pleased to join the Academy Software Foundation and participate in advancing creation and adoption of open source tools for the entertainment industry. Through a long partnership with Linux Foundation and establishment of our own free and open-source center of excellence on campus, we have encouraged students, faculty, and alumni to contribute to important open source projects. The motion picture science, film and animation, and games communities from RIT, in particular, have already been active with ACES, OpenColorIO, O3DE, and other ASWF projects and we are excited to provide our support going forward to this important work.”
– David Long, Director and Professor, RIT MAGIC Center | MAGIC Spell Studios, Rochester Institute of Technology

About the Academy Software Foundation
Developed in partnership by the Academy of Motion Picture Arts and Sciences and the Linux Foundation, the Academy Software Foundation provides a world-class home for open source software developers in the motion picture and broader media industries to share resources and collaborate on technologies for image creation, visual effects, animation and sound. The Academy Software Foundation is home to 22 projects including ACES, MaterialX, OpenEXR, OpenColorI, and OpenVDB. For more information about the Academy Software Foundation, visit https://www.aswf.io/.

Media Contact
Emily Olin, The Linux Foundation/Academy Software Foundation
pr@aswf.io

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SOURCE The Linux Foundation

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Joyson Electronics Unveils Embodied AI Core Component Portfolio, Including Dexterous Robotic Hand and Solid-Liquid Hybrid Battery, at WAIC 2026

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SHANGHAI, July 17, 2026 /PRNewswire/ — Joyson Electronics (600699.SH/0699.HK) announced at the 2026 World Artificial Intelligence Conference (WAIC) a suite of robotic component solutions, including a dexterous robotic hand, solid-liquid hybrid battery, third-generation AI head assembly, electronic skin, and an embodied AI brain – alongside its latest achievements in industrial settings training and application. In addition, the company’s robot controller products are already in volume production and being delivered to leading robotics firms.

Dexterous Robotic Hand Integrates Multiple Industry-Exclusive Technologies; AI Head Assembly Ready for Rapid Mass Production

The dexterous robotic hand is often regarded as the “crown jewel” of robotics – owing to its high level of integration across a broad range of frontier disciplines, among them bionics, flexible sensing, MEMS, and advanced materials – and its significant commercial value.

At WAIC, Joyson Electronics introduced its first fully in-house developed “TeleHand” series of dexterous hand solutions. The TeleHand Professional Edition features an industry-exclusive “in-palm integration + hybrid actuation” architecture, directly addressing key challenges such as standalone integrity, tactile sensing, compliant manipulation, and fine motion control.

With 20 degrees of freedom, the TeleHand integrates three actuation modes – direct drive, tendon-driven, and linkage – within the palm. This design not only combines the precision of direct drive with the compliance of tendon-driven mechanisms, but also delivers higher transmission efficiency and lighter weight, enabling easy adaptation to various robotic platforms.

The TeleHand is equipped with Joyson Electronics’ in-house developed actuators and force-tactile sensing technologies, including:

Ultra-compact, high-torque-density miniature frameless actuators, which reduce volume by nearly 50% and weight by approximately 30% compared to conventional models, while delivering 2–3 times higher torque density than industry-standard hollow-cup motors of the same diameter.In-house developed force and tactile sensing technology (electronic skin), featuring industry-exclusive natively decoupled three-dimensional force sensing, achieving resolution beyond human tactile limits, with high sensitivity, proximity detection, ultra-thin form factor, and flexibility – suitable for diverse dexterous hand and embodied intelligence applications.

The TeleHand PHINO platform’s native unified multimodal fusion architecture minimizes information loss and offers strong generalization capabilities, enabling the TeleHand to perform precision industrial operations while seamlessly supporting service-oriented interactive scenarios. In addition to the Professional Edition, Joyson Electronics also launched a cost-effective Basic Edition, which offers industrial-grade reliability and real-world deployment advantages through in-house factory batch deployment.

Meanwhile, Joyson Electronics unveiled its third-generation AI head assembly, which integrates perception, motion, and system-level capabilities to deliver more natural head movements and emotional expression. Designed with a production-ready mechatronic architecture, it enables rapid support from concept design and prototype validation to mass production. Its modular and platform-based design further allows for agile product customization and iteration to meet diverse customer requirements.

Joyson Electronics Debuts Embodied AI Brain; Controllers Already Shipping to Leading Customers

In the robotics “brain” domain (cerebrum and cerebellum), Joyson Electronics’ automotive-grade edge-side physical AI platform – its robot controller products – has already achieved commercial deployment and is now in volume production for leading robotics customers.

Furthermore, Joyson Electronics unveiled its embodied AI brain solution (EAOS + EAPC) – a unified, software-hardware-integrated platform designed for cross-form-factor and cross-scenario adaptability. The solution aims to make robots “easier to use, truly productive, and capable of autonomous evolution.”

The Embodied AI PC (EAPC) adopts an external form-factor design, built on a fused cerebrum-cerebellum controller architecture, with computing power ranging from 40 TOPS to 2070 TFLOPS, meeting diverse requirements from entry-level to flagship embodied AI systems. The product features a modular, integrated design with a compact footprint and superior thermal efficiency, enabling cross-platform and cross-environment adaptability. Leveraging Joyson Electronics’ automotive supply chain and manufacturing capabilities, the solution also offers significant cost competitiveness.

On the software side, the Embodied AI Operating System (EAOS) comprises three core subsystems:

World Model – responsible for “understanding”, encoding multimodal signals into unified state representations and using dynamic predictors to simulate and preview scenarios within the system.Agentic OS – responsible for “action”, formulating high-level strategies, decomposing complex tasks, dynamically orchestrating sub-agents, invoking skill libraries and tools, and translating decisions into precise motions across dexterous hands, robotic arms, and mobile chassis.Memory System – responsible for “evolution,” managing working memory for real-time context, episodic memory for past experiences, and skill memory for accumulated learned capabilities.

The EAOS enables robots to execute long-horizon, complex tasks and achieve autonomous evolution – translating into tangible productivity gains. To date, Joyson Electronics’ embodied AI brain has been deployed in real-world settings, including select industrial scenarios and automated charging.

Solid-Liquid Hybrid Battery: The Optimal Power Solution for Embodied Intelligence

Conventional energy solutions for embodied intelligence face multiple challenges – limited endurance, large footprint, long recharging times, and insufficient power capacity to support instantaneous high-current discharge. Battery safety also remains a critical factor for widespread adoption. The industry requires a fundamental breakthrough that simultaneously balances energy density, power density, and safety.

Solid-liquid hybrid batteries (semi-solid-state batteries) offer the optimal power solution for embodied intelligence and represent the only technological pathway capable of addressing all the above energy challenges at the current stage. At WAIC, Joyson Electronics introduced its “Crystal Energy” multi-form solid-liquid hybrid battery solution, delivering high performance and reliability:

Energy density significantly increased to 380 Wh/kgOverall endurance improved by approximately 60%Cycle life exceeding 2,000 cyclesWide operating temperature range from -20°C to 60°CSupports both wired and wireless charging, reaching 80% capacity in just 30 minutes

Complementing this is the Crystal Energy Ultra-Control BMS, which operates across a wide temperature range of -40°C to 105°C, featuring real-time cell monitoring, automotive-grade safety protection, and full-lifecycle health management – comprehensively enhancing the safety, durability, and energy efficiency of robotic power systems. Additionally, Joyson Electronics unveiled its first gallium nitride (GaN) motor driver, achieving conversion efficiency exceeding 95% while reducing size by 40% – positioning it at the forefront of the industry.

With robotics standing on the cusp of large-scale commercialization, Joyson Electronics is advancing its “self-development + investment” dual-drive strategy, expanding its presence in embodied intelligence, and accelerating breakthroughs in key technologies. Looking ahead, Joyson Electronics will leverage its global R&D, manufacturing capabilities, and industrial settings to drive the reliable, scalable, and cost-effective commercialization of robotic core components, helping accelerate the industry’s transition to mass adoption.

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SOURCE Joyson Electronics

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