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Sony Semiconductor Solutions to Release the Industry’s First CMOS Image Sensor for Automotive Cameras That Can Simultaneously Process and Output RAW and YUV Images

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Contributing to Simplified Systems by Expanding Single-Camera Applications

ATSUGI, Japan, Oct. 3, 2024 /PRNewswire/ — Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the ISX038 CMOS image sensor for automotive cameras, the industry’s first*1 product that can simultaneously process and output RAW*2 and YUV*3 images.

The new sensor product has proprietary ISP*4 inside and can process and output RAW and YUV images simultaneously. RAW images are required for external environment detection and recognition in advanced driver-assistance systems (ADAS) and autonomous driving systems (AD), while the YUV images are provided for infotainment applications such as the drive recorder and augmented reality (AR).

By expanding the applications a single camera can offer, the new product helps simplify automotive camera systems and saves space, cost, and power.

*1   Among CMOS sensors for automotive cameras. According to SSS research (as of announcement on October 4, 2024).
*2   Image for recognition on a computer.
*3   Image for driver visual such as recording or displaying on a monitor.
*4   Image signal processor – a circuit for image processing.

Model name

Sample
shipment date
(planned)

Sample price
(including tax)

ISX038 1/1.7-type (9.30 mm diagonal)
8.39- effective-megapixel*5
CMOS image sensor

October 2024

¥15,000*6

*5   Based on the image sensor effective pixel specification method.
*6   May vary depending on the volume shipped and other conditions.

The roles of automotive cameras continue to diversify in line with advances in ADAS and AD and increasing needs and requirements pertaining to the driver experience. On the other hand, there is limited space for installing such cameras, making it impossible to continue adding more indefinitely, which in turn has created a demand to do more with a single camera.

The ISX038 is the industry’s first*1 CMOS image sensor for automotive cameras that can simultaneously process and output RAW and YUV images. It uses a stacked structure consisting of a pixel chip and a logic chip with signal processing circuit, with the SSS’ proprietary ISP on the logic chip. This design allows a single camera to provide high-precision detection and recognition capabilities of the environment outside the vehicle and visual information to assist the driver as infotainment applications. When compared with conventional methods such as a multi-camera system or a system that outputs RAW and YUV images using an external ISP, the new product helps simplify automotive camera systems, saving space, costs, and power. 

ISX038 will offer compatibility with the EyeQ™6 System-on-a-Chip (SoC) currently offered by Mobileye, for use in ADAS and AD technology.

Main Features

Industry’s first*1 sensor capable of processing and outputting RAW and YUV images simultaneously
The new sensor is equipped with dedicated ISPs for RAW and YUV images and is capable of outputting two types of images simultaneously with image quality optimized for each application on two independent interfaces. Expanding the applications a single camera can offer helps build systems that save space, costs, and power compared to multi-camera systems or systems with an external ISP.

Wide dynamic range even during simultaneous use of HDR and LED flicker mitigation
In automobile driving, objects must be precisely detected and recognized even in road environments with significant differences in brightness, such as tunnel entrances and exits. Automotive cameras are also required to suppress LED flicker, even while in HDR mode, to deal with the increasing prevalence of LED signals and other traffic devices. The proprietary pixel structure and unique exposure method of this product improves saturation illuminance, yielding a wide dynamic range of 106 dB even when simultaneously employing HDR and LED flicker mitigation (when using dynamic range priority mode, the range is even wider, at 130 dB). This design also helps reduce motion artifacts*7 generated when capturing moving subjects.

*7   Noise generated when capturing moving subjects with HDR.

Compatibility with conventional products*8
This product shares the same compatibility with SSS’ conventional products,*8 which have already built a proven track record for ADAS and AD applications with multiple automobile manufacturers. The new product makes it possible to reuse data assets collected on previous products such as driving data from automotive cameras. This helps streamline ADAS and AD development for automobile manufacturers and partners.

*8 SSS’ IMX728 1/1.7 type 8.39 effective megapixel CMOS image sensor.

Compliant with standards required for automotive applications
The product is qualified for AEC-Q100 Grade 2 automotive electronic component reliability tests by mass production. Also, SSS has introduced a development process compliant with the ISO 26262 road vehicle functional safety standard, at automotive safety integrity level ASIL-B(D). This contributes to improve automotive camera system reliability.

Key Specifications

Model name

ISX038

Effective pixels

3,857×2,177(H×V), approx. 8.39 megapixels

Image size

Diagonal 9.30mm (1/1.72-type)

Unit cell size

2.1μm×2.1μm (H×V)

Frame rate (all pixels)

30fps (RAW&YUV dual output)

Sensitivity (standard value F5.6, 1/30 second
cumulative)

880mV (Green Pixel)

Dynamic range (EMVA 1288 standard)

106 dB (with LED flicker mitigation)

130 dB (dynamic range priority)

Interface

MIPI CSI-2 serial output (Single port with 4-
lanes / Dual port with 2-lanes per port)

Package

192pin BGA

Package size

11.85mm×8.60mm (H×V)

 

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SOURCE Sony Semiconductor Solutions Corporation

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

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