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Semiconductor Fabrication Software Market to Grow by USD 984.91 Million (2024-2028), Driven by Increased Design Complexity, with AI Driving Market Transformation – Technavio

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NEW YORK, Nov. 18, 2024 /PRNewswire/ — Report with the AI impact on market trends – The global semiconductor fabrication software market size is estimated to grow by USD 984.91 million from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of almost 2.77%  during the forecast period. Growing complexity of semiconductor device designs is driving market growth, with a trend towards high need for semiconductor memory devices. However, increasing chip shortage globally  poses a challenge. Key market players include Advanced Micro Devices Inc., Agnisys Inc., Aldec Inc., ANSYS Inc., Applied Materials Inc., Cadence Design Systems Inc., KLA Corp., Lam Research Corp., Onto Innovation Inc., PDF Solutions Inc., Sasken Technologies Ltd., Siemens AG, Synopsys Inc., The PEER Group Inc., Thermo Fisher Scientific Inc., Zuken Inc., Cantier Systems Pte Ltd., Fabmatics GmbH, Mindteck India Ltd., and Tismo Technology Solutions Pvt. Ltd..

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Semiconductor Fabrication Software Market Scope

Report Coverage

Details

Base year

2023

Historic period

2018 – 2022

Forecast period

2024-2028

Growth momentum & CAGR

Accelerate at a CAGR of 2.77%

Market growth 2024-2028

USD 984.91 million

Market structure

Fragmented

YoY growth 2022-2023 (%)

2.34

Regional analysis

APAC, North America, Europe, Middle East and Africa, and South America

Performing market contribution

APAC at 52%

Key countries

US, China, India, Germany, and UK

Key companies profiled

Advanced Micro Devices Inc., Agnisys Inc., Aldec Inc., ANSYS Inc., Applied Materials Inc., Cadence Design Systems Inc., KLA Corp., Lam Research Corp., Onto Innovation Inc., PDF Solutions Inc., Sasken Technologies Ltd., Siemens AG, Synopsys Inc., The PEER Group Inc., Thermo Fisher Scientific Inc., Zuken Inc., Cantier Systems Pte Ltd., Fabmatics GmbH, Mindteck India Ltd., and Tismo Technology Solutions Pvt. Ltd.

Market Driver

The Semiconductor Fabrication Software market is experiencing significant trends in product pricing, industry coverage, and business strategy. Political and social scenarios, including geopolitical tensions and changing consumer demands, are impacting the market. Positive changes include scalability and innovation, with companies like Applied Materials, Cadence Design Systems, Mentor Graphics, Synopsys, Agnisys, Aldec, Ansoft focusing on cutting-edge product offerings. Negative changes include fragmentation dominance and amalgamation traits. CAE tools for IC, PCB, MCM, and Digital Manufacturing are in focus, with PEER and forefront technologies like Pathfinder and Accumulation driving growth. Strategies include niche differentiation and vital partnerships. The Ace Matrix highlights Synopsys and Cadence Design Systems as innovators, while Amalgamation traits are seen in Applied Materials and Mentor Graphics. Product satisfaction remains key, with companies striving to meet the needs of the industry. 

Semiconductor device manufacturers are focusing on memory devices like 3D NAND and DRAM due to the high growth potential of the semiconductor memory market. Consumer electronics market dynamics offer new opportunities for vendors in this shift. For instance, OEMs have moved from HDD storage to flash memory in smartphones and notebooks due to features such as resistance to vibration, lower chances of corruption, and less data loss. Precise chip fabrication is essential for these additional features, making semiconductor fabrication software solutions a necessity. 

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Market Challenges

The Semiconductor Fabrication Software market faces several challenges, including product pricing pressures and a complex business landscape. Political and social scenarios, such as trade policies and workforce demographics, also impact the industry. Positive changes include the adoption of digital manufacturing and the increasing importance of scalability and business strategy. Winning imperatives include offering cutting-edge solutions, focusing on niche areas, and providing excellent product satisfaction. Key players like Applied Materials, Cadence Design Systems, Mentor Graphics, Synopsys, Agnisys, Aldec, Ansoft, and others are active in the market, with strategies ranging from being innovators to fragmentation dominance and amalgamation traits. CAE tools for IC, PCB, MCM design, and digital manufacturing are in high demand, with PEER continuing to shape the industry landscape. The Ace Matrix identifies Forefront and Pathfinder as current leaders, with Vital, Accumulation, and Amalgamated traits shaping the future.The global semiconductor industry is experiencing significant challenges due to a chip shortage, impacting various sectors from automotive to consumer electronics. This shortage is limiting the world’s manufacturing capabilities, leading to increased prices and stock depletion. Chip orders, typically placed months in advance, are experiencing longer lead times, averaging over 28 weeks for most types of chips. Companies are ordering excess chips to secure their stocks, straining manufacturing capacity and raising costs. The semiconductor fabrication software market is crucial in this scenario, offering solutions to optimize production and reduce lead times, ultimately helping businesses mitigate the impact of the chip shortage.

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Segment Overview 

This semiconductor fabrication software market report extensively covers market segmentation by  

Solution 1.1 CAE1.2 IC physical design and verification1.3 PCB and MCM1.4 Fab management software1.5 OthersEnd-user 2.1 Process documentation2.2 Process integration2.3 OthersGeography 3.1 APAC3.2 North America3.3 Europe3.4 Middle East and Africa3.5 South America

1.1 CAE-  The Computer-Aided Engineering (CAE) segment of the semiconductor fabrication software market includes tools used for engineering tasks, such as electronic system level (ESL) simulation, register transfer level (RTL) simulation, hardware-assisted verification, synthesis, analysis, and various other tools. These tools are essential for solving complex engineering problems, including partial differential equations and boundary value problems, or deriving algorithms for fluid flows and flight tests. CAE tools are then translated into manufacturing instructions using Electronic Design Automation (EDA) software. ESL tools are particularly significant, as they follow a system-level approach, enabling faster design, verification, and simulation at lower costs and in less time. RTL tools help end-users verify logic designs using an RTL language and provide an abstract of complex circuit diagrams for extracting root-level circuit writings. The CAE segment is expected to grow slowly during the forecast period due to the widespread use and contractual business model of EDA software among users.

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Research Analysis

The Semiconductor Fabrication Software market is a critical segment of the semiconductor industry, providing essential tools for Foundries and Integrated Device Manufacturers (IDMs) to design, develop, and manufacture complex Integrated Circuits (ICs), Printed Circuit Boards (PCBs), Multi-Chip Modules (MCMs), and other advanced semiconductor products. The market is characterized by the forefront use of Computer-Aided Engineering (CAE) solutions for digital manufacturing, Process, Equipment and Environmental Reporting (PEER) for regulatory compliance, and Thermo Fisher’s Accumulation software for wafer handling and inspection. The market is fragmented, with several niche players and amalgamation trends, but key areas of dominance include advanced IC design, IC manufacturing execution systems, and PCB design and manufacturing software. Product pricing and political scenarios significantly impact the market dynamics. Tismo Technology and other emerging players are disrupting the market with innovative solutions.

Market Research Overview

The Semiconductor Fabrication Software market is a dynamic and innovative industry, focused on providing advanced solutions for the design, manufacturing, and testing of integrated circuits (ICs), printed circuit boards (PCBs), multi-chip modules (MCMs), and digital manufacturing. Product offerings range from computer-aided engineering (CAE) tools for semiconductor design, layout, and verification, to manufacturing execution systems (MES) for process control and yield optimization. Political scenarios, such as trade policies and regulations, and social factors, including demographic shifts and changing consumer preferences, can significantly impact the market. Positive changes include increasing demand for advanced technologies like AI, IoT, and 5G, while negative changes include rising fabrication costs and intensifying competition. Scalability, business strategy, and industry coverage are key winning imperatives for market players. The Ace Matrix, featuring Active, Cutting Edge, Innovator, and Niche players, highlights the competitive landscape. Applied Materials, Cadence Design Systems, Mentor Graphics, Synopsys, Agnisys, Aldec, Ansoft, and others offer product satisfaction through offerings like Forefront, Pathfinder, Vital, Accumulation, and Fragmentation dominance. Amalgamation traits, such as partnerships and acquisitions, are common strategies to expand market presence. PEER (Process, Equipment, and Materials) integration and digital manufacturing are current industry focuses.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

SolutionCAEIC Physical Design And VerificationPCB And MCMFab Management SoftwareOthersEnd-userProcess DocumentationProcess IntegrationOthersGeographyAPACNorth AmericaEuropeMiddle East And AfricaSouth America

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Reliance Digital Brings Samsung’s Latest Galaxy Z Fold8 Series and Galaxy Z Flip8 to Stores Across India

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Be among the first to own the new Samsung Galaxy Z Fold8 series and Galaxy Z Flip8. Customers can now pre-order the latest Galaxy foldables at Reliance Digital, with EMIs starting at ₹6000/month.

MUMBAI, India, July 25, 2026 /PRNewswire/ — Reliance Digital, India’s leading consumer electronics retailer, today announced the availability of Samsung’s latest generation of foldable smartphones – the Galaxy Z Fold8 Ultra, Galaxy Z Fold8 and Galaxy Z Flip8. Designed to deliver the next evolution of Galaxy AI, powerful performance and iconic foldable innovation, Samsung’s newest line-up is now available across Reliance Digital stores and online.

Built around Samsung’s vision of making AI more intuitive and personal, the new Galaxy foldables combine immersive displays, premium craftsmanship and intelligent experiences that seamlessly adapt to the way users work, create and stay connected.

Leading the line-up is the Galaxy Z Fold8 Ultra, Samsung’s most premium foldable yet. Featuring an expansive 8-inch Dynamic AMOLED 2X main display, a flagship 200MP camera, the latest Snapdragon® 8 Elite Gen 5 for Galaxy processor and a 5,000mAh battery, the device is engineered for users who demand the ultimate in productivity, creativity and entertainment. It is available in Graphite, Cream and Violet Shadow,.

The Galaxy Z Fold8 brings Samsung’s signature foldable experience in a more compact form factor, featuring a 7.6-inch Dynamic AMOLED 2X main display, a redesigned wider cover screen, Galaxy AI-powered multitasking and flagship-grade performance. Customers can choose from Lavender, Graphite and Cream colour options.

Completing the line-up is the Galaxy Z Flip8, Samsung’s most stylish foldable smartphone, designed for users who want flagship performance in a compact, pocket-friendly form. Equipped with a vibrant 6.9-inch Dynamic AMOLED 2X display, an enhanced FlexWindow, a 50MP camera system and Galaxy AI experiences, the Flip8 effortlessly blends fashion with functionality.

Customers can visit their nearest Reliance Digital store to experience the new foldables first-hand with guidance from Reliance Digital’s Tech Dosts, compare models, explore exclusive launch offers and Pre-order the Galaxy device that best fits their lifestyle. The complete Galaxy Z Fold8 series and Galaxy Z Flip8 are also available through Reliance Digital’s online platform, ensuring customers can be among the first to own Samsung’s latest foldable innovations.

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Weichai’s Five Tech Routes Global Debut: Diverse Paths to a Green, Smart Future

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HANOI, Vietnam, July 25, 2026 /PRNewswire/ — At VEC in Vietnam on July 21, the Shandong Heavy Industry global partners conference & green intelligent products expo opened. Responding to the green transition of global commercial vehicles and heavy equipment, Weichai – with decades of expertise – unveiled five core tech routes: BEV, HEV, PEMFC, alternative-fuel ICE, and ADAS. Through full-chain proprietary control and breakthroughs, it provides efficient, low-carbon, intelligent power solutions to the global market.

Battery electric vehicle powertrain: full-chain deployment and high-efficiency recharging: Weichai masters core battery, motor, and e‑control technologies. Its CT100 battery – for heavy tractors and dump trucks – features integrated design and triple insulation, delivering better reliability, efficiency, safety, and speed. The WMS3200 drive system, tailored for heavy‑truck haulage, boosts efficiency and cuts vehicle power consumption. The WMC‑L/H/B integrated controllers offer stable, efficient control for light trucks, heavy trucks, and buses.

Hybrid electric vehicle powertrain: deep integration and ultra-long range: Weichai covers series, parallel, and series-parallel architectures, deeply integrating engine and e-drive. For urban logistics, the WP2.5T range extender offers quick response and low noise; for long-haul transport, the WP3NNG natural-gas range extender uses a “pure electric for short hauls, range-extended for long hauls” mode, with over 1,000 km combined range, easing range anxiety.

Proton exchange membrane fuel cell: zero-carbon leadership: Weichai has built a full-chain hydrogen energy system covering components, stacks, and systems. The WEF300 fuel cell engine has been deployed in volume in 49-ton heavy-duty trucks, suitable for long-haul and port logistics. The WEFG500 power generation system provides megawatt-class scalable power to support data centers and industrial plants.

Alternative fuel internal combustion engine: diverse clean-energy options and exceptional cost-effectiveness: Modular design enables flexible switching between H₂ and methanol. WP15DI hydrogen ICE peaks at 46.8% thermal efficiency; WP17T methanol ICE targets heavy‑equipment energy use, cuts operating costs, and is mass‑deployed in 130‑ton mining trucks.

Intelligent driving assistance system: vehicle-road-cloud collaboration: Weichai built a vehicle‑road‑cloud full‑stack architecture, with mining autonomous solution for cm‑level docking & obstacle avoidance, and trunk‑line ADAS with intelligent cruise & auto lane‑change, boosting high‑speed safety and economy.

Going forward, Weichai will keep iterating these five tech routes with global partners to advance sustainable manufacturing.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/weichais-five-tech-routes-global-debut-diverse-paths-to-a-green-smart-future-302834548.html

SOURCE Weichai Group

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Portland General Electric declares dividend

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PORTLAND, Ore., July 24, 2026 /PRNewswire/ — The board of directors of Portland General Electric Company (NYSE: POR) declared a quarterly common stock dividend of $0.55125 per share.

The company’s dividend is evaluated based on capital requirements and financial performance. PGE targets a dividend payout ratio of 60 to 70% over the long term.

The quarterly dividend is payable on or before October 15, 2026, to shareholders of record at the close of business on September 25, 2026.

About Portland General Electric Company
Portland General Electric (NYSE: POR) is an integrated energy company that generates, transmits and distributes electricity to nearly 960,000 customers serving an area of approximately 2 million Oregonians. Since 1889, Portland General Electric (PGE) has been powering economies, delivering safe, affordable and reliable electricity while working to transform energy systems to meet evolving customer needs. PGE continues to make progress towards emissions reduction targets, and customers have set the standard for prioritizing clean energy with the No. 1 voluntary renewable energy program in the country. PGE is ranked a top ten utility in the 2025 Forrester U.S. Customer Experience Index. In 2025, PGE employees and retirees volunteered over 18,300 hours to more than 400 nonprofits organizations. Through the PGE Foundation, along with corporate contributions and the employee matching gift program, more than $5 million was directed to charitable organizations supporting economic growth and community resilience across our service area. For information: portlandgeneral.com/news.

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are based on assumptions about the future, involve risks and uncertainties, and are not guarantees. Future results may differ materially from those expressed or implied in any forward-looking statement. These forward-looking statements represent our estimates and assumptions only as of the date of this press release. We assume no obligation to update or revise any forward-looking statement as a result of new information, future events or otherwise.

Forward-looking statements include statements, other than statements of historical or current fact, regarding the Company’s amount and timing of dividends payable as well as other statements containing words such as “committed to,” “targets,” or similar expressions.

There can be no assurance that future dividends will be declared. The declaration of future dividends is subject to approval of our board of directors and various risks and uncertainties, including, but not limited to: our cash flow and cash needs; the timing or amount of dividends paid; the timing or outcome of various legal and regulatory actions; changes in the Company’s business strategy; increases in capital expenditures; changes in capital and credit market conditions, including volatility of equity markets as well as changes in PGE’s credit ratings and outlook on such credit ratings restrictions on the payment of dividends under existing or future financing arrangements; changes in tax laws relating to corporate dividends; deterioration in our financial condition or results, and those risks, uncertainties, and other factors identified from time-to-time in our filings with the United States Securities and Exchange Commission (SEC), including our annual report on Form 10-K for the year ended December 31, 2025 and subsequent quarterly reports on Form 10-Q. These reports are available through the EDGAR system free-of-charge on the SEC’s website, www.sec.gov and on the Company’s website, investors.portlandgeneral.com. Investors should not rely unduly on any forward-looking statements. The Company assumes no obligation to update or revise any forward-looking statement as a result of new information, future events or other factors.

Media Contact:
Drew Hanson
Corporate Communications
Phone: 503-464-2067

Investor Contact:
Erin Schwartz
Investor Relations
Phone: 503-464-7751

View original content:https://www.prnewswire.com/news-releases/portland-general-electric-declares-dividend-302834503.html

SOURCE Portland General Company

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