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Quobly Forges Strategic Collaboration with STMicroelectronics to Accelerate its Quantum Processor Manufacturing for Large-Scale Quantum Computing Solutions

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Collaboration will leverage ST’s 28nm FD-SOI commercial semiconductor volume manufacturing processes to pave the way towards cost-competitive, large-scale quantum computing solutions.Quobly and ST envision the first generation of commercial products to be available by 2027, targeting applicative markets including materials development and systems modeling.

GRENOBLE, France and GENEVA, Dec. 11, 2024 /PRNewswire/ — Quobly, a cutting-edge quantum computing startup, today announced a transformative collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, to produce quantum processor units (QPUs) at scale. By leveraging STMicroelectronics’ advanced FD-SOI semiconductor process technologies, this collaboration is set to make large-scale quantum computing feasible and cost-effective, positioning both companies at the forefront of next-generation computing technologies.

Quobly aims to break the 1-million-qubit barrier by 2031, targeting applications ranging from pharmaceuticals, finance, materials science and complex systems modeling, including climate and fluid dynamics simulations. Together, the two companies aim to achieve a breakthrough in quantum computing by utilizing their common expertise in FD-SOI, driving down R&D costs, and addressing the market’s demand for scalable, affordable quantum computing processors.

In the first phase of the collaboration, Quobly and ST will adapt ST’s 28nm FD-SOI process to match Quobly’s requirements, targeting a 100 Qubit Quantum Machine with proof of scalability beyond 100k physical qubits. ST will leverage its integrated device manufacturer model to bring Quobly its ability to bridge co-design, prototyping, industrialization and volume production at scale in 300mm fabs using FD-SOI, a technology it has developed and exploited commercially for years across automotive, industrial and consumer applications.

Maud Vinet, CEO of Quobly, expressed her enthusiasm: “This collaboration is unparalleled in the quantum computing landscape. Working closely with STMicroelectronics will fast-track the industrialization of our quantum processor technology by several years. We are thrilled to leverage ST’s semiconductor manufacturing expertise, which will speed up the development of a fully fault-tolerant quantum computer. We aim at breaking the 1-million-Qubit barrier by 2031, with applications ranging from pharmaceuticals, finance, materials science and complex systems modeling, including climate and fluid dynamics simulations.”

Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group at STMicroelectronics, said: “Quantum computing will transform the world, starting with AI, chemistry, security and supply chain applications. This collaboration is building on ST’s IDM strengths, centered around our Crolles facility, integrating together our process R&D expertise, our circuit design know-how and volume manufacturing. We truly believe that pairing Quobly’s quantum expertise with ST’s FD-SOI knowledge and manufacturing will allow to accelerate economically viable, large-scale quantum computing solutions.”

“In the future, to be successful, quantum computers still need to work on SWaP-C (size, weight, power, and cost)” explains Eric Mounier, PhD Chief Analyst, Photonics & Sensing at Yole Group. “This is also where semiconductor qubits have a big advantage in scalability by leveraging CMOS wafer-scale manufacturing. Although quantum technologies are long-term, the investment time is today. To that respect, today’s collaboration agreement between STMicroelectronics and Quobly could mark a major step for cost-efficient and more scalable quantum computing processors” (1)

(1) Source: Quantum Technologies 2024 report, Yole Intelligence. 

About Quobly

Quobly is a pioneer in the development of a fault-tolerant quantum computer based on semiconductor qubits. With a breakthrough method, Quobly addresses both techno-scientific challenges as well as industrial production, paving the way for mass production of the millions of qubits essential for practical, large-scale quantum computers. Based in Grenoble, the startup is the result of 15 years of collaborative research between internationally recognized RTOs, CEA Leti and CNRS. Founded in 2022, Quobly has brought together a team of experts from the semiconductor industry and distinguished researchers in quantum technologies. In 2023, Quobly made headlines with a seed round of 19 million euros, establishing a new record for seed funding of a European startup in the quantum sector. https://quobly.io/ 

About STMicroelectronics

At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com

Photo: https://mma.prnewswire.com/media/2579072/Quobly.jpg
Logo: https://mma.prnewswire.com/media/2579073/Quobly_Logo.jpg

QUOBLY
Andrea Busch
andrea.busch@quobly.io

STMICROELECTRONICS

INVESTOR RELATIONS
Jérôme Ramel
EVP Corporate Development & Integrated External Communication
jerome.ramel@st.com 

MEDIA RELATIONS
Alexis Breton
Group VP Corporate External Communications
Tel: +33 6 59 16 79 08
alexis.breton@st.com 

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WaterField Designs Introduces Shield Case for Steam Frame VR Headset and Accessories

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The compact, foam-reinforced case protects and organizes the Valve Steam Frame headset and its accessories between gaming sessions at home and on the road. An interior Padded Accessory Case keeps the controllers separate from the headset and helps stabilize it, while fleece lining, waterproof YKK zippers and durable materials provide added protection.

SAN FRANCISCO, Oct. 29, 2026 /PRNewswire/ — WaterField Designs introduces the Shield Case for Steam Frame, a compact protective case for Valve’s Steam Frame virtual reality (VR) headset, which ships without a dedicated carrying case. Designed and handcrafted in San Francisco, the new Steam Frame case protects and organizes the headset, both controllers and the included wireless adapter in a structured, foam-reinforced, fleece-lined interior for home storage and travel.

Shield Case for Steam Frame video demo.

The Steam Frame supports wireless PC game streaming and standalone play, whether at home, in a hotel room or at a friend’s house. To keep the case compact and the accessories organized, WaterField designed the Padded Accessory Case. Positioned between the goggles and headband, its main compartment holds both controllers, while an Ultrasuede® pocket holds the included wireless adapter. For owners with an Arcturus Vision Camera, the pocket also accommodates the camera alongside the adapter. The padded compartment cushions and helps stabilize the headset.

“We wanted to give the Steam Frame a protected place between gaming sessions and make it easy to take the whole setup along,” said company founder Gary Waterfield. “The tricky part was fitting the controllers without making the case larger than it needed to be. We used the space between the goggles and headband to give them their own padded compartment.”

Firm foam reinforces all sides of both the Shield Case and the Padded Accessory Case inside it. Three-layer, foam-padded fleece lines the interior, while cushioned zipper guards help protect the headset from scratches. Each case is handcrafted in small batches using 1680-denier ballistic nylon, 15-ounce waxed canvas, or Forza, a high-performance nylon with a distinctive, two-tone basketweave. Select versions feature full-grain leather accents. Waterproof YKK zippers and custom metal hardware complete the construction.

Key Features

Custom fit: Holds the Steam Frame headset, both controllers, the included wireless adapter, and other included accessories. The headset fits with its headband extended or collapsed and with or without the eye spacer attached.Padded Accessory Case: Holds both controllers between the goggles and headband, helping stabilize the headset. Its Ultrasuede® pocket fits the wireless adapter, with room for an Arcturus Vision Camera alongside it.Additional accessory storage: A plush, padded pocket in the main Shield Case holds a power adapter, power cables and other accessories.Exterior storage: A diagonal zippered front pocket holds a USB-C cable, cleaning cloth, or other small items; a hidden pocket holds an AirTag.Impact protection: Firm foam reinforces all sides of the Shield Case and Padded Accessory Case to help protect against bumps during storage and transport.Scratch protection: Three-layer, foam-padded fleece lining, fleece-covered sides of the Padded Accessory Case, and cushioned zipper guards help protect the headset and its sensitive surfaces from scratches.Weather-resistant closure: Waterproof YKK zippers secure the main compartment and exterior pocket.Carry options: A wide padded handle allows hand carry; D-rings accommodate an optional 1-inch shoulder strap (not included).

Availability and Pricing

Shield Case for Steam Frame

Price: $169—ballistic nylon, waxed canvas, or Forza; $189—ballistic nylon or waxed canvas with full-grain leather.

Colors: Black ballistic nylon; tan waxed canvas; blue Forza; titanium Forza; black ballistic nylon with black full-grain leather; tan waxed canvas with chocolate full-grain leather.

Materials: 1680-denier ballistic nylon, 15-ounce waxed canvas, or Blue Forza basketweave nylon; full-grain leather on select versions; foam reinforcement; padded fleece lining; Ultrasuede®; waterproof YKK zippers; custom metal hardware.

Dimensions: 10.5 x 8.5 x 5 inches.

Capacity: 5 liters.

Weight: Non-leather models: 1 pound. Models with leather: 1.25 pounds.

Compatibility: Valve Steam Frame VR headset and all included accessories, with headband extended or collapsed and with or without the eye spacer.

Optional add-on: 1-inch Cam Lock Shoulder Strap — $25.

Manufacturing: Handcrafted in small batches in San Francisco.

Availability: Non-leather models ship today. Models with leather ship Nov. 12, 2026.

About WaterField Designs

Founded in 1998, WaterField Designs handcrafts premium laptop bags, backpacks, travel bags and gaming cases in San Francisco. Known for meticulous craftsmanship, premium materials and functional design, the company produces bags and accessories in small batches for professionals, travelers and technology enthusiasts worldwide. More at Our Story.

WaterField Designs, SFbags, and Shield Case for Steam Frame are trademarks of WaterField Designs. Other company and product names may be trademarks of their respective owners. Copyright ©2026. All Rights Reserved.

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From Pitch to Pilot: Lee Kuan Yew Global Business Plan Competition Opens Global Search for Deep Tech Urban Solutions and Sustainability focused Founders

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Finalists compete for over S$2.5 million (US$2 million) in prizes and gain a pathway to SMU’s Urban SustaInnovator accelerator and US$10 million USI Fund

SINGAPORE, Oct. 29, 2026 /PRNewswire/ — For many deep-tech start-ups tackling urban and sustainability challenges, the biggest hurdle is not developing breakthrough technologies, but finding the customers, partners and opportunities to deploy them at scale.

Addressing this challenge, the 13th Lee Kuan Yew Global Business Plan Competition (LKYGBPC) today opened applications for university founders and recent graduates seeking to turn frontier ideas into real-world impact. Organised by Singapore Management University’s Institute of Innovation & Entrepreneurship (SMU IIE), LKYGBPC is one of Asia’s most globally representative deep-tech start-up competitions, spanning 12 focus areas including climate tech, energy, food and land use, urban mobility, longevity and healthtech, and sustainable materials and circularity.

Fifty finalists will be flown to Singapore 28 September to 1 October 2027 to compete for over S$2.5 million in prizes and take part in an Innovation Festival featuring investor engagement, mentorship, and connections with corporate and ecosystem partners.

Beyond the Competition: A Gateway to SMU’s Urban SustaInnovator (USI) accelerator

Selected LKYGBPC finalists can join SMU’s Urban SustaInnovator (USI) accelerator, launched in 2025, which supports start-ups through market access, pilot projects and strategic introductions across Asia. In May 2026, SMU IIE launched the USI Fund to back promising ventures as they pilot and scale.

“Founders of breakthrough technologies can create value only when they reach the people, industries, and communities they are designed to serve. SMU created LKYGBPC as a platform to help founders bring their innovative ideas to life by connecting them with the partners, markets and opportunities needed to turn innovation into real-world impact. Now, through the USI programme and USI Fund, we offer a post-competition pathway to pilot, scale, and raise capital throughout Asia,” said Rony Palathinkal, Head of the LKYGBPC and Urban SustaInnovator at SMU IIE.

One of the biggest challenges for sustainability start-ups is getting access to the right partners to validate and deploy new technologies.

SMU is uniquely positioned to help startups make these connections with its network of Overseas Centres in Bangkok, Jakarta, Ho Chi Minh City and Shenzhen, and its International Advisory Councils in eight countries. “SMU’s expansive network of partners from industry, government and community across Asia enables us to forge connections that enable startups to cross borders and scale their innovative solutions,” says Professor Sun Sun Lim, SMU’s Vice President of Partnerships and Engagement, and Lee Kong Chian Professor of Communication & Technology.

Singapore-based Standard Physics (formerly Inviscid AI), founded by Qiu Ziming and Kabir Jain, was a finalist in the 12th LKYGBPC before joining Y Combinator’s Winter 2026 cohort and SMU’s inaugural Urban SustaInnovator (USI) accelerator. The startup uses physics-informed AI and IoT-powered digital twins to optimise energy efficiency in buildings and data centres. Through USI, it secured a pilot with The GEAR by Japanese construction giant Kajima and is discussing three more opportunities. It has also raised US$2.3 million in seed funding led by Square Peg Capital and is preparing to launch an AI-powered agentic engineering platform. Jain credits Y Combinator’s start-up expertise and USI’s regional network for supporting its growth.

“The accelerators were very complementary. YC was good at getting us from zero to one, and then USI has been very helpful in getting us from one to 10. The USI team can make the right introductions and help you grow,” said Jain. 

Singapore is strengthening its position as a global sustainability innovation hub, providing start-ups with opportunities to pilot, validate and scale technologies across Asia and beyond. This government-led ambition is backed by the S$37 billion RIE 2030 plan, including S$10.8 billion for mission-oriented research, and a S$40 million USS Translation Fund to support the development and commercialisation of urban and sustainability solutions.

Building a Global Pipeline of Innovation

Established by SMU in 2002, LKYGBPC is a biennial competition open to start-ups with at least one founder currently enrolled in a university programme or who graduated within the past five years. Its 12th edition in October 2025 attracted over 1,500 entries from founders representing 1,200 universities across 91 countries. Finalists from the 9th to 12th editions have collectively raised over S$1 billion. Finalists from the 9th to 12th editions have collectively raised over S$1 billion.  Finalists from the 9th to 12th editions have collectively raised over S$1 billion.

Said Shirley Wong, Entrepreneur-in-Residence at SMU IIE, Chairperson of the 13th LKYGBPC Advisory Committee, and Managing Partner of TNF Ventures: “As Asia continues to urbanise, the region presents both complex challenges and significant opportunities for innovation. LKYGBPC brings together founders worldwide and connects them with Singapore’s ecosystem of industry, investors and institutions to accelerate solutions with regional and global impact.”

Applications are open at https://iie.smu.edu.sg/lkygbpc and close on 31 March 2027.

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Dragonpass Showcases AI-Powered Travel Experiences and Member Engagement Solutions at ITB Asia 2026

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SINGAPORE, Oct. 29, 2026 /PRNewswire/ — Dragonpass, a global travel and lifestyle platform and membership solutions provider, participated in ITB Asia 2026, held from 21 to 23 October at Marina Bay Sands, Singapore. The event provided an opportunity for Dragonpass to connect with industry stakeholders across the travel value chain and explore new partnership opportunities to deliver more connected travel and lifestyle experiences.

Under the theme “Experiences in Motion: Human-Centred Design in Travel & Tourism”, the event brought together more than 1,000 exhibiting brands and industry leaders to explore the future of travel and tourism. Dragonpass showcased its integrated travel ecosystem, highlighting how premium services, member engagement and AI-driven personalisation can create greater value for partners and travellers.

Connecting Partners Across the Travel Ecosystem

With 20 years of experience, Dragonpass demonstrated how it transforms travel benefits into long-term customer loyalty for corporate partners worldwide, bringing together airlines, airports, hotels and travel service providers to create more connected experiences across the journey.

Its integrated solutions span premium travel services, including first-class services, airport transit and flight delay assistance, alongside targeted member engagement through premium privileges, daily engagement and miles redemption. By connecting these services with partners’ existing membership programmes, Dragonpass helps make benefits more accessible and relevant to members, encouraging ongoing engagement beyond individual transactions.

Through co-branded lounges, dedicated counters and co-branded events, Dragonpass also enables partners to extend their brand presence into the airport environment and build more valuable connections with their members.

Reimagining Member Experiences for Interest-Driven Travel

As travel patterns evolve, interest-driven travel is creating new opportunities for membership programmes to move beyond benefit redemption towards more personalised, experience-led engagement.

“One of the most noticeable changes we see is that people are increasingly travelling around their interests — whether it’s flying to another city for a concert, a sporting event, a food experience or an art exhibition,” said Jane Zhu, Co-founder and CEO of Dragonpass.

“AI allows us to connect membership benefits with these real-life journeys, helping travellers discover relevant services when planning a trip and access available lounge or privileges at the airport. The opportunity is to move beyond simply offering benefits to showing members how those benefits can enrich their travel and lifestyle experiences,” she added.

As Dragonpass continues to expand its global ecosystem, the company is focused on using AI to deepen member relationships, connect more partners across the travel and lifestyle value chain, and transform membership benefits into meaningful experiences throughout the journey.

About Dragonpass

Established in 2005, Dragonpass is a leading global travel and lifestyle platform, providing premium benefits and experiences to more than 40 million members worldwide. Its growing ecosystem spans travel, health and wellness, lifestyle and entertainment, with a global network covering more than 140 countries and regions and partnerships with more than 800 enterprises.

For more information, please visit www.dragonpass.com.

Dragonpass Brand & Marketing
Email:brandmarketing@dragonpass.com

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