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Artificial Intelligence (Ai) Chips Market size to increase by USD 389.25 Billion between 2023 to 2028, Market Segmentation by Product, End-user, Geography , Technavio

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NEW YORK, Dec. 16, 2024 /PRNewswire/ — The global artificial intelligence (ai) chips market size is estimated to grow by USD 389.25 billion from 2024 to 2028, according to Technavio. The market is estimated to grow at a CAGR of over 68.13% during the forecast period. The report provides a comprehensive forecast of key segments below- 

Segmentation Overview

Product 1.1 ASICs1.2 GPUs1.3 CPUs1.4 FPGAsEnd-user 2.1 Media and advertising2.2 BFSI2.3 IT and telecommunication2.4 OthersGeography 3.1 North America3.2 Europe3.3 APAC3.4 South America3.5 Middle East and Africa

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1.1 Fastest growing segment:

Artificial Intelligence (AI) chips, specifically Application-Specific Integrated Circuits (ASICs), are becoming increasingly popular in data center applications due to their superior performance and speed. ASICs are customized, non-configurable chips that offer an instruction set and libraries for local data processing, acting as an accelerator for parallel algorithms. Google’s Tensor Processing Unit (TPU) is a prime example, designed for deep neural networks and already in use for Google Search and Google Street View. ASICs provide faster performance than GPUs, FPGAs, and CPUs, making them a preferred choice for data centers. TPUs have an instruction set that allows TensorFlow programs to be modified and new algorithms to be developed, making them a valuable asset for managing data effectively. The use of ASIC-based AI chips is expected to witness significant growth in the forecast period.

Analyst Review

Artificial Intelligence (AI) Chips Market: The global AI Chips Market is experiencing significant growth due to the increasing adoption of AI technologies in various industries. Deep learning and machine learning algorithms are driving the demand for AI chips, which are specialized hardware components designed to accelerate AI computations. These chips are essential for robotics, quantum computing, and advanced AI applications. The market includes CPU, FPGA, GPU, System on Chip (SoC), and Multichip Module (MCM) solutions. AI chips are finding applications in sectors like healthcare, retail, finance, automotive, autonomous vehicles, IoT devices, and more. High-performance AI chips are crucial for training generative AI models and powering supercomputers. Ethical concerns surrounding AI are also fueling the development of specific integrated circuits. Key technologies include highbandwidth memory and Trainium2 chip. The market is evolving with the shift from cloud to edge computing.

Market Overview

Artificial Intelligence (AI) Chips Market: Overview The AI Chips Market is witnessing significant growth due to the increasing demand for advanced AI technologies such as deep learning and machine learning in various industries. AI chips are specialized hardware components designed to accelerate AI algorithms and technologies, including neural networks, quantum computing, and cognitive computing. These chips are essential for powering AI applications in robotics, computer vision, natural language processing, and other fields. The market for AI chips includes various types of hardware components, such as CPUs, GPUs, FPGAs, ASICs, DSPs, and microcontrollers. Companies are investing heavily in the development of AI chip lines, including Nvidia’s A100 chip, Ascend 910B chipset, and H200 chipset, to meet the growing demand for energy-efficient and high-performance AI solutions. AI applications are widespread across industries, including healthcare, retail, finance, automotive, and manufacturing. The use of AI in healthcare for health monitoring, health information access, personalized health, and treatment devices is gaining popularity, especially for the elderly population. In retail, AI is used for customer behavior analysis, inventory management, and personalized marketing. In finance, AI is used for fraud detection, risk assessment, and algorithmic trading. The automotive industry is also adopting AI technologies for autonomous vehicles, advanced driver assistance systems, and connected cars. The use of AI in manufacturing machines, smart homes, and IoT devices is increasing, leading to the growth of AI data centers and edge computing. However, ethical concerns surrounding AI and the potential for system failure or malfunctioning are major challenges for the market. The development of specific integrated chips and multichip modules is a potential solution to address these challenges. The AI Chips Market is expected to continue growing due to the increasing demand for real-time applications, low latency, and big data processing. The market is also being driven by the development of generative AI, large language models, and other advanced AI technologies. The use of AI in mobile applications, gaming consoles, and personal computers is also expected to drive market growth. In conclusion, the AI Chips Market is a rapidly growing market, driven by the increasing demand for advanced AI technologies and applications across various industries. The market is expected to continue growing due to the development of energy-efficient and high-performance AI solutions, the increasing use of AI in various industries, and the growing demand for real-time applications and low latency. However, ethical concerns and the potential for system failure or malfunctioning are major challenges that need to be addressed.

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Key Topics Covered:

 1 Executive Summary
 2 Market Landscape
 3 Market Sizing
 4 Historic Market Size
 5 Five Forces Analysis
 6 Market Segmentation
 7 Customer Landscape
 8 Geographic Landscape
 9 Drivers, Challenges, and Trends
10 Venodr Landscape
11 Vendor Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Nordic brings edge AI to battery-powered Wi-Fi devices, achieving twenty times lower standby power with new nRF71 Series

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Wi-Fi, Bluetooth LE, Thread, and on-device AI on a single chip, with existing software and tools, built for billions of intelligent devices that run for years on a battery

OSLO, Norway, Nov. 3, 2026 /PRNewswire/ — Nordic Semiconductor, a global leader in low-power wireless solutions, today announces the nRF71 Series of ultra-low-power Systems-On-Chip (SoCs), bringing together ultra-low-power Wi-Fi®, Bluetooth® Low Energy (LE), Thread®, and edge AI onto a single chip.

Built on the ultra-low-power design, software, and tools that have made Nordic a trusted leader in Bluetooth LE, the nRF71 Series delivers up to 20 times lower standby power usage than current-generation nRF70 Series Wi-Fi products. 

This leap in energy efficiency is expected to unlock new possibilities for developers targeting battery-powered Wi-Fi devices in applications such as smart home, wearables, and industrial IoT.  

“Edge AI will be part of every connected device, but for those that run on a battery, Wi-Fi has demanded a power budget they could not afford,” said Kjetil Holstad, EVP Wi-Fi and Power Management, Nordic Semiconductor. “With the nRF71 Series, Nordic removes that barrier. We are bringing Wi-Fi and edge AI to the same ultra-low-power platform and tools developers already trust for Bluetooth LE, so the next generation of intelligent products can connect to any network, make decisions on the device, and still run for years on a battery.”

Edge AI and the entire application on one chip

AI inference at the edge can now run directly on a single chip, with no external AI processor, so devices respond faster, use less power, and need fewer components. Keyword spotting, anomaly detection, and image classification are practical on battery-powered devices using nRF71 Series, thanks to its integrated Axon Neural Processing Unit (NPU), which runs machine learning models 10x to 17x faster than the 256 MHz Arm® Cortex®-M33 processor alone. The nRF71 Series can also run ultra-small AI models that developers build from their own data with Nordic’s Neuton software, which is ideal for running edge AI on the processor alone.

From its Axon NPU and Neuton software to over-the-air model updates with nRF Cloud, Nordic is bringing edge AI to battery-powered Wi-Fi devices, with the application, wireless connectivity, and AI all running on a single chip.

Battery-powered Wi-Fi for smart home, security, and industrial IoT 

With nRF71 Series, battery-powered smart home hub, Matter bridge, or Thread border router designs can now run Wi-Fi, Thread, and Bluetooth LE on a single chip, as can Matter-enabled smart locks, security panels, wearables, and industrial sensors. Two independent radios with separate RF and processing blocks make this possible: a Wi-Fi radio and Nordic’s 2.4 GHz multiprotocol radio from the latest generation nRF54 Series wireless SoCs. Both radios receive simultaneously, for devices to maintain their Wi-Fi connection to the cloud while listening for Bluetooth LE or Thread traffic, without either protocol waiting for the other.

The first nRF71 Series SoCs are the nRF7120 and the nRF7120E.  The nRF7120 offers dual-band Wi-Fi 6, while nRF7120E adds tri-band Wi-Fi 6E, and the Axon NPU for hardware-accelerated edge AI. Both parts come with 4 MB of on-chip non-volatile memory and 1 MB of user-accessible RAM. 

On show at Electronica

Nordic will showcase the nRF71 Series, including a Nordic-branded module, at this year’s Electronica, in Hall C6, booth 159.

Availability

The nRF71 Series is now sampling with selected customers.  
Developers can contact their local Nordic sales representative for availability. 

About Nordic Semiconductor

Nordic Semiconductor is a leading low-power wireless IoT company, providing the essential platform and wireless technologies that connect the world’s IoT devices for the consumer, healthcare, and industrial markets. By offering world-class hardware, embedded software, development tools, and cloud lifecycle services, the company simplifies the development and maintenance of secure, reliable, and scalable connected products. www.nordicsemi.com 

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Tencent Cloud Selected for HKMA’s Agentic Finance Expert Group, Showcases WorkBuddy’s New Financial Capabilities at Hong Kong FinTech Week

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HONG KONG, Nov. 3, 2026 /PRNewswire/ — Tencent Cloud, the cloud business of global technology leader Tencent, showcased a range of innovative solutions at Hong Kong FinTech Week 2026, including the international version of WorkBuddy, eKYC, Tencent Cloud Risk Control Solutions, Tencent Marketing Cloud, and its global AI infrastructure network. Among them, the newly launched investment research capabilities on WorkBuddy International Edition emerged as a key focus among financial industry professionals attending the event.

During Hong Kong FinTech Week, the Hong Kong Monetary Authority (HKMA) announced the launch of Project SAGE (Securing Agentic Finance with Governance and Enablement) and established the Agentic Finance Expert Group. Tencent Cloud was selected as a member of the group, bringing its experience in deploying WorkBuddy across financial services to collaborate with the HKMA and industry stakeholders on standards and governance for Agentic Finance, supporting the responsible development and adoption of the technology in Hong Kong.

WorkBuddy International Edition Introduces New Financial Capabilities to Enhance Investment Research Efficiency

Tencent WorkBuddy is a full-scenario AI agent desktop workstation designed for modern workplace scenarios. Its International Edition was launched on May 28 this year. By simply entering a natural language prompt, users can instruct WorkBuddy to autonomously access information, break down tasks, utilize relevant tools, and execute complex workflows, generating ready-to-use deliverables across a wide range of work and learning scenarios.

Designed for financial researchers and consultants, financial content creators, and individual investors, WorkBuddy’s newly launched investment research capabilities help streamline a range of investment research tasks. It supports company research, portfolio assessments based on user-provided information, and stock screening based on specific criteria.

For example, when conducting company research, users can simply instruct WorkBuddy: “Compile data from Tencent Holdings Limited (00700.HK) across its latest 12 reported quarters, provide an in-depth analysis of its revenue, profit margins and growth drivers, and retain the original sources.” WorkBuddy can then help retrieve and consolidate financial reports across multiple quarters, analyze key business metrics, business composition and performance trends based on company disclosures, and generate a preliminary research report while preserving original source references. Users can further refine their analysis through follow-up questions on specific figures, calculation methodologies or the drivers behind business performance, significantly reducing the time spent on manual data collection and information consolidation.

According to the WorkBuddy spokesperson, WorkBuddy is built on human-in-the-loop collaboration. While AI assists with data gathering, data analysis and information synthesis, research judgment and investment decisions remain firmly in the hands of professionals. By streamlining repetitive, time-consuming and cross-platform workflows, WorkBuddy enables users to devote more time and effort to strategic analysis and in-depth research. Looking ahead, WorkBuddy will continue to expand its financial capabilities to improve productivity across a wider range of financial services scenarios.

Tencent Cloud Selected for the Agentic Finance Expert Group to Advance Interoperability Standards

During Hong Kong FinTech Week, the HKMA officially launched Project SAGE and established the Agentic Finance Expert Group. Tencent Cloud was selected to join the group and will focus on contributing to interoperability standards-related initiatives, drawing on WorkBuddy’s experience in financial services to support the responsible development and adoption of Agentic Finance in Hong Kong.

As AI Agent technologies continue to mature, the financial industry’s use of AI is evolving from improving internal operational efficiency to exploring how AI Agents can deliver more efficient and secure financial services. This emerging model, known as Agentic Finance, has the potential to reshape how customers access and use financial products and services. Meanwhile, the associated risks and challenges need to be properly addressed to support its responsible development and adoption, particularly in areas such as agent identity verification, accountability and system security.

According to the HKMA, Project SAGE aims to enable practical applications of Agentic Finance, while ensuring the governance framework is in place. This initiative focuses on four key areas: Market Development and Use Case Exploration, Agent Identity, Interoperability Standards, and Legal and Regulatory Frameworks. Through its participation in the interoperability standards initiatives, Tencent Cloud will support the exploration of how AI Agents across different institutions and platforms can securely identify one another, accurately communicate instructions, and safely exchange data, laying the foundation for the large-scale adoption of Agentic Finance.

Liming Hu, Vice President of Tencent Cloud, said: “Common standards and protocols can help reduce duplicate integration efforts and mitigate risks associated with interactions between systems, providing a critical foundation for the large-scale adoption of Agentic Finance. We look forward to bringing WorkBuddy’s practical experience in financial services into industry discussions and contributing to the development of Hong Kong’s Agentic Finance ecosystem and related standards.”

Tencent Cloud has extensive experience serving the financial industry, and supports more than 10,000 financial institution customers worldwide. Its AI Agent tool, WorkBuddy, is already widely used across banking, insurance, securities, and asset management scenarios, and has accumulated extensive practical experience in AI Agent collaboration and cross-platform interoperability.

About Tencent Cloud

Tencent Cloud, one of the world’s leading cloud companies, is committed to creating innovative solutions to resolve real-world issues and enabling digital transformation for smart industries. Through our extensive global infrastructure, Tencent Cloud provides businesses across the globe with stable and secure industry-leading cloud products and services, leveraging technological advancements such as cloud computing, Big Data analytics, AI, IoT, and network security. It is our constant mission to meet the needs of industries across the board, including the fields of gaming, media and entertainment, finance, healthcare, property, retail, travel, and transportation.

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SOURCE Tencent Cloud

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Wincomm and Portwell to Showcase Next-Gen Medical AI Computing at MEDICA 2026

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A Broader Computing Portfolio from Mobile care, Medical AI and Operating Room

HSINCHU, Nov. 3, 2026 /PRNewswire/ — Wincomm, a Portwell company, will join Portwell Taiwan and Portwell Europe at MEDICA 2026 to present a shared direction for medical AI computing. Taking place November 16–19 in Düsseldorf, Germany, the joint showcase at Hall 12, Stand C76 will connect embedded computing, medical All-in-One (AIO) PCs, and portable devices across a wider range of healthcare applications.

With participation from Portwell Taiwan and Portwell Europe, the showcase brings together product engineering expertise and regional support to help medical equipment manufacturers and system integrators explore suitable computing architectures for their applications.

The joint presentation reflects a broader development in healthcare technology: demand for more diverse computing platforms tailored to different workloads, power requirements, installation constraints, and system integration needs. By presenting their complementary portfolios together, Wincomm and Portwell offer visitors a more comprehensive view of the platforms available for developing connected medical equipment and deploying intelligence at the clinical edge.

A Shared Medical AI Direction: Application-Specific Platforms Across the Care Environment

Together, Wincomm and the Portwell group will present a medical AI development direction centered on application-specific computing: combining mobility, graphics acceleration, clinical integration, and serviceability according to the needs of each care setting.

The demonstration portfolio spans the following application areas:

Application area

Featured models

Development focus

Mobile medical
cart computing

WMP-22U/24U

Energy-efficient Intel® Core™ Ultra computing
and optional triple hot-swappable batteries for
continuous mobile workflows

GPU-accelerated
medical AI

WMP-22S/24S and
MEDS-P2210

Computing platforms for demanding medical
imaging and AI workloads, including AIO
configurations with discrete GPU options

Medical box
computing

MEDS-7081, 7082, 5210,
and DTEC-D012

Embedded computing options for medical
equipment integration and application-specific
deployment

Operating room
computing

WMP-22T/24T/27T-PIS

AIO platforms designed for operating room
integration and surgical information workflows

Point-of-care
computing

WMP-109, MEDS-
P1003, and WMP-
22P/24P-IP54

Clinical information access and interaction at the
point of care

Portable medical
computing

WMT-101

Handheld information access, barcode scanning,
and NFC-enabled data capture

Medical device manufacturers, system integrators, and healthcare technology partners are invited to explore the demonstration portfolio and discuss future medical AI development opportunities.

Exhibition: MEDICA 2026
Dates: November 16–19, 2026
Location: Düsseldorf, Germany
Wincomm Portwell Joint booth: Hall 12, Stand C76
TW Excellence booth: Hall 16, Stand B23

View original content to download multimedia:https://www.prnewswire.co.uk/news-releases/wincomm-and-portwell-to-showcase-next-gen-medical-ai-computing-at-medica-2026-302927355.html

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