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KYOCERA AVX EXHIBITS AT CES 2025

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KYOCERA AVX and Kyocera Corporation are showcasing an extensive selection of highly engineered component and device technologies designed to enable state-of-the-art innovations in the automotive, transportation, industrial automation, logistics, communications, and medical industries.

FOUNTAIN INN, S.C., Jan. 7, 2025 /PRNewswire/ — KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is co-exhibiting with its parent company, Kyocera Corporation, at CES 2025 in Las Vegas this week.

CES is widely renowned as one of the world’s foremost tech events and has earned a reputation for presenting the industry’s boldest breakthroughs, sharpest minds, and most impactful brands and uniting key stakeholders committed to pioneering the future and transforming how we live.

In light of this, KYOCERA AVX and Kyocera Corporation are showcasing an extensive range of highly engineered component and device technologies designed to enable state-of-the-art solutions to the world’s most pressing and pervasive challenges.

Kyocera Corporation is showcasing a number of new products and technologies optimized for next-generation, high-reliability automotive, transportation, industrial automation, logistics, communications, and medical applications, including:

A cutting-edge, High-Definition Aerial Display that uses curved mirrors and a variety of non-contact sensors to produce realistic, high-resolution floating images while minimizing physical space requirements and power consumption. CES attendees can experience the new display in a futuristic automotive navigation demonstration at the co-branded booth, #4816 in the Vehicle Tech and Advanced Mobility zone.A breakthrough AI-Based Depth Sensor that accurately measures challenging targets, including extremely small, shiny, and semi-transparent objects, with best-in-class resolution that’s 10 times more accurate than traditional monocular measurements and, in turn, helps users better contend with labor shortages and improve productivity. Ideal applications include helping robots sort tiny parts in industrial manufacturing operations, accurately measuring elements of the human body, identifying shiny metallic surgical instruments, and enabling the peripheral monitoring of transportation robots in logistics and retail operations.A groundbreaking new Underwater Wireless Optical Communication technology that delivers the world’s fastest underwater communication speeds — up to 2Gb/s — thanks to a combination of fast-response, semi-polar gallium nitride (GaN) lasers that enhance data communication capabilities by expanding optical bandwidth and unique beam shape propagation characteristics. In addition to being fast, this new optical communication technology is highly reliable and secure, capable of sending transmissions to specific receivers, and resistant to sunlight.A smart, contactless, Millimeter-Wave (mmWave) Sensing System that accurately detects even minute vibrations in vital sensing applications, including autonomous driving and health (e.g., heart rate) monitors.A mmWave Simultaneous Localization and Mapping (SLAM) technology designed to replace mechanical-based LiDAR with 4D imaging radar to enable safer, more accurate autonomous driving capabilities, even in bad weather conditions, while minimizing cost.The versatile new Camera-LiDAR Fusion Sensor — the world’s first LiDAR sensor equipped with an integrated camera, an optical axis, and a unique MEMS mirror that delivers the world’s highest resolution and durability and enables the real-time superimposition of camera image data and LiDAR distance data for advanced object recognition. Ideal applications include ADAS, ships, and heavy machinery.A new Bifocal Mirror that displays enlarged images in the distance, making it easier for farsighted drivers to adjust their focus and clearly see their surroundings, and leverages augmented reality (AR) technology to better support safe driving by instantly displaying information recognized by the rearview camera in the mirror.

KYOCERA AVX is showcasing a selection of advanced components designed to enable next-generation technologies in a number of different industries. Featured components on display at CES 2025 include:

Antennas optimized to facilitate wireless connectivity in a wide variety of applications extending throughout the automotive, industrial, IoT, consumer, medical, transportation, and networking industries, including high-reliability standard and ultra-small chip antennas rigorously tested to AEC-Q200 requirements, such as the A-Series all-in-one (LTE, GNSS, and NTN) embedded automotive broadband antennas and 2.4GHz automotive corner chip antennas.Multilayer ceramic capacitors (MLCC) that exhibit low parasitics, excellent EMI filtering capabilities, high capacitance values, and various voltage ratings over a wide temperature range and are available in chip, leaded, and stacked configurations in addition to unique geometries.The industry’s widest range of high-reliability tantalum capacitors, which includes the smallest case size, highest temperature, and lowest DCL MnO2 solid tantalum technologies available on the market.An award-winning portfolio of conductive, low-profile, lead- and halogen-free solid electrolytic polymer capacitors that exhibit excellent stability, high capacitance, low-ESR performance, and a benign failure mode under recommended use conditions — including the smallest, highest-voltage, and highest reliability polymer capacitors available on the market.Aluminum electrolytic chip capacitors that deliver high-CV, high endurance, and very low ESR performance in smaller packages than competing can-type aluminum capacitors and specialized conductive polymer and hybrid electrolytic versions that also exhibit higher tolerance for ripple currents, inrush currents, and high temperatures than standard versions.Low-, medium-, and high-power dry and oil-impregnated film capacitors based on polyester and polypropylene dielectrics that exhibit controlled self-healing capabilities, are engineered for power electronics applications rated for 75V to 100kV, and are ideal for applications ranging from DC filtering and semiconductor protection and tuning to discharge and high energy storage.Supercapacitors or double-layer capacitors that provide a unique combination of characteristics, including very high pulse power and capacitance densities.An extensive portfolio of high-quality sensing and control products that make engines more efficient, emissions cleaner, and cars safer and are designed and produced according to the stringent requirements of the global automotive industry.A variety of unique connectors based on industry-proven contact technology and proven to provide robust, performance-driven solutions in a wide range of harsh-environment applications, including the industry’s first dual-entry card-edge connectors, which also feature the company’s lowest above-board height profile.

For more information about the future-forward component and device technologies that KYOCERA AVX and Kyocera Corporation are showcasing and demonstrating at CES 2025, please visit the links embedded here or visit them at Booth #4816 in the Vehicle Tech and Advanced Mobility Zone in the West Hall. For all other inquiries, please visit https://www.kyocera-avx.com/, email inquiry@kyocera-avx.com, follow them on LinkedInX (Twitter), and Instagram, like them on Facebook, call 864-967-2150, or write to One AVX Boulevard, Fountain Inn, S.C. 29644.

About KYOCERA
Kyocera Corporation (TOKYO:6971), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as “advanced ceramics”). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of industrial and automotive components, semiconductor packages, electronic devices, smart energy systems, printers, copiers, and mobile phones. During the year ended March 31, 2024, the company’s consolidated sales revenue totaled 2.0 trillion yen (approx. US$13.3 billion). Kyocera is ranked #874 on Forbes magazine’s 2024 “Global 2000” list of the world’s largest publicly traded companies and has been named among “The World’s 100 Most Sustainably Managed Companies” by The Wall Street Journal.

About KYOCERA AVX
KYOCERA AVX is a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future. As a wholly owned subsidiary of Kyocera Corporation structured to capitalize on shared resources and technical expertise, KYOCERA AVX has an expansive global footprint comprised of several dozen research, development, and manufacturing facilities spanning more than 15 countries and staffed with talented personnel dedicated to innovation, component quality, customer service, and enabling a brighter future through technology. KYOCERA AVX designs, develops, manufactures, and supplies advanced capacitors, antennas, interconnects, circuit protection and timing devices, sensors, controls, filters, fuses, diodes, resistors, couplers, and inductors optimized for employment in the international 5G, IoT, aerospace, automotive, consumer electronics, industrial, medical, and military markets.

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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on

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

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