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Acer Launches New Predator Helios Neo AI Gaming Laptops with Next-Gen Processors and GPUs

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New 16- and 18-inch Predator Helios Neo AI devices are powered by new Intel Core Ultra 200HX Series processors and NVIDIA GeForce RTX 50 Series Laptop GPUs

KATOWICE, Poland, Feb. 7, 2025 /PRNewswire/ — Acer today announced the expansion of its Predator Helios Neo portfolio with the all-new Predator Helios Neo 16 AI and Predator Helios Neo 18 AI gaming laptops. These cutting-edge devices are powered by up to an Intel® Core™ Ultra 9 275HX processor and up to an NVIDIA® GeForce RTX™ 5070 Ti Laptop GPU, built to deliver game-changing AI capabilities for players entering the next era of gaming with these accessible, power-driven devices.

Powered by NVIDIA Blackwell, NVIDIA GeForce RTX™ 50 Series Laptop GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio. Plus, access NVIDIA NIM microservices – state-of-the-art AI models that let enthusiasts and developers build AI assistants, agents, and workflows with peak performance on NIM-ready systems.

In addition to the combination of their powerful silicon, the Predator Helios Neo AI devices showcase impressive display options. The 16-inch model offers up to an OLED panel option, while the 18-inch version features a Mini LED display. Both devices are equipped with 5th Gen AeroBlade™ 3D fans, ensuring smooth performance and advanced cooling under any task or challenge.

The Windows 11 Predator gaming laptops come with three months of PC Game Pass, designed for PC players, and provides access to games on day one such as Call of Duty: Black Ops 6, Indiana Jones and the Great Circle, Ara: History Untold, and titles from EA Play.

Predator Helios Neo 16 AI and Helios Neo 18 AI

Acer’s Predator Helios Neo AI line focuses on delivering affordable price points by zeroing in on select key components. The Helios Neo 16 AI (PHN16-73) AI is ideal for gamers and professionals on the go, while the Helios Neo 18 AI (PHN18-72) serves as a great desktop replacement option. Both gaming laptops are equipped with the latest technology in the market and feature subdued minimalist designs with an RGB logo on the lid and dynamic 4-zone RGB keyboards.

The Predator Helios Neo laptops are extremely powerful, offering up to an Intel® Core™ Ultra 9 275HX processor that ensures ultra-smooth and responsive gameplay. Users will experience fine-tuned game and system performance with less latency and automatic enhancements on classic titles, thanks to ongoing updates to the Intel Application Optimization[1] application. Additionally, these laptops come with up to an NVIDIA® GeForce RTX™ 5070 Ti Laptop GPU, featuring the latest NVIDIA DLSS 4, a revolutionary suite of neural rendering technologies that uses AI to boost FPS, reduce latency, and improve image quality. The NVIDIA GeForce RTX 5070 Ti Laptop GPUs also enhance the laptops with ray tracing for cinematic quality visuals at unprecedented speed, enabled by 4th gen RT Cores and breakthrough neural rendering technologies accelerated with 5th gen Tensor cores.

Both models support up to 64 GB of memory and 2 TB of storage, and come with Intel Killer Ethernet E3100G and Wi-Fi 6E to deliver fast and reliable gaming sessions and internet connections.

In addition to their advanced CPU and GPU specifications, the gaming laptops offer premium displays; the Helios Neo 16 AI features an OLED WQXGA (2560×1600) display with a 240 Hz refresh rate and 1 ms response time. The Helios Neo 18 AI includes a Mini LED WQXGA (2560×1600) panel with a speedy 250 Hz refresh rate and 3 ms response time. Both models also support NVIDIA G-SYNC technology, NVIDIA Advanced Optimus, and MUX Switch.

Gaming sessions are kept nice and cool with Acer’s 5th Gen AeroBlade technology, liquid metal thermal grease and a Vector Heat Pipe. They also include the latest PredatorSense 5.0 utility app, an AI Experience Zone and feature AI-enhanced communications such as Acer PurifiedVoice 2.0’s triple microphone array and AI noise reduction technology to filter out unwanted background sounds. Also, the Acer PurifiedView™ 2.0’s AI-powered webcam solution ensures clear video and image outputs.

Price and Availability

The Predator Helios Neo 16 AI (PHN16-73) will be available in North America in April, starting at USD 1,899.99, and in EMEA in May, starting at EUR 1,699.

The Predator Helios Neo 18 AI (PHN18-72) will be available in North America in May, starting at USD 2,199.99, and in EMEA in June, starting at EUR 1,799.

Exact specifications, prices, and availability will vary by region. To learn more about availability, product specifications and prices in specific markets, please contact your nearest Acer office via www.acer.com.

Specifications

Name

Predator Helios Neo 16 AI

Model

PHN16-73

Operating System

Windows 11 Home

Screen

16-inch OLED + WQXGA (2560×1600), 240 Hz, 400 nits, DCI-P3 100%, 1 ms response time,
NVIDIA Advanced Optimus

16-inch WQXGA (2560×1600), 240 Hz, 500 nits, DCI-P3 100%, 3 ms response time, NVIDIA
Advanced Optimus

16-inch WQXGA (2560×1600), 180 Hz, 400 nits, sRGB 100%, 3 ms response time, NVIDIA
Advanced Optimus

16-inch WQXGA (1920×1200), 180 Hz, 400 nits, sRGB 100%, 3 ms response time, NVIDIA
Advanced Optimus

Processor

Intel® Core™ Ultra 9 processor 275HX

Intel® Core™ Ultra 7 processor 255HX

Graphics

NVIDIA® GeForce RTX™ 5070 Ti Laptop GPU

NVIDIA® GeForce RTX™ 5070 Laptop GPU

Memory

Up to 64 GB DDR5 system memory, 6400 Hz

Storage

Up to 2 TB, PCIe Gen 4 SSD, SSD slots: 2

Cooling

5th Gen AeroBlade 3D Fans, liquid metal thermal grease, vector heat pipes

Dimensions

356.78 x 275.5 x 13.47/26.75 mm

Weight

2.7 kg

Battery

90 Whr

Wi-Fi  and Connectivity

Wi-Fi 6E 1675i, Bluetooth 5.4 or above, Intel Killer Ethernet E3100G, Thunderbolt 4 Type-C,
USB 3.2 Gen 2 Type-C, dual USB 3.2 Gen 2 Type-A, USB 3.2 Gen 1 Type-A, HDMI 2.1,
microSD Card reader, 3.5 mm combo audio jack

Features

Predator Sense 5.0/ Experience Zone 2.0, Acer PurifiedView™ 2.0,Acer PurifiedVoice™ 2.0,
Acer ProCam, Copilot, PC Game Pass (3 months)

Audio

DTS® X:Ultra, 2 speakers

Camera

FHD (1920×1080) IR camera

 

Name

Predator Helios Neo 18 AI

Model

PHN18-72

Operating System

Windows 11 Home

Screen

18-inch Mini LED + WQXGA (2560×1600), 250 Hz, DCI-P3 100%, 3 ms response time, NVIDIA
Advanced Optimus

18-inch LED, WQXGA (2560×1600), 240 Hz, 500 nits, DCI-P3 100%, 3 ms response time,
NVIDIA Advanced Optimus

18-inch LED, WQXGA (2560×1600), 165 Hz, 300 nits, DCI-P3 100%, 3 ms response time,
NVIDIA Advanced Optimus

18-inch LED, WUXGA (1920×1200), 165 Hz, 300 nits, sRGB 100%, 3 ms response time,
NVIDIA Advanced Optimus

Processor

Intel® Core™ Ultra 9 processor 275HX

Intel® Core™ Ultra 7 processor 255HX

Graphics

NVIDIA® GeForce RTX™ 5070 Ti Laptop GPU

NVIDIA® GeForce RTX™ 5070 Laptop GPU

Memory

Up to 64 GB DDR5 system memory, 6400 Hz

Storage

Up to 2 TB, PCIe Gen 4 SSD, SSD slots: 2

Cooling

5th Gen AeroBlade 3D Fans, liquid metal thermal grease, vector heat pipes

Dimensions

400.96 x 307.9 x 14.9/28 mm

Weight

3.3 kg

Battery

90 Whr

Wi-Fi  and Connectivity

Wi-Fi 6E 1675i, Intel Killer E3100, Bluetooth 5.3 or above, Intel Killer Ethernet E3100G,
Thunderbolt 4 Type-C, USB 3.2 Gen 2 Type-C, dual USB 3.2 Gen 2 Type-A, dual USB 3.2 Gen
1 Type-A, HDMI 2.1, microSD Card reader, 3.5 mm combo audio jack

Features

Predator Sense 5.0/ Experience Zone 2.0, Acer PurifiedView™ 2.0, Acer PurifiedVoice™ 2.0,
Acer ProCam, Copilot, PC Game Pass (3 months)

Audio

DTS® X:Ultra, 2 speakers

Camera

FHD (1920×1080) IR camera

 

[1] Intel® Application Optimization is a policy within Intel® Dynamic Tuning Technology that optimizes performance on select games, with required configurations on select Intel® Core 14th Gen processors. For additional information on Intel® Application Optimization, see www.intel.com/content/www/us/en/support/articles/000095419/processors.html.

About Acer

Founded in 1976, Acer is one of the world’s top technology companies with a presence in more than 160 countries. The company continues to evolve by embracing innovation across its offerings which include computers and displays, while branching out to new businesses. Acer is also committed to sustainable growth, exploring new opportunities that align with its environmental and social responsibilities. The Acer Group employs over 8,000 employees that contribute to the research, design, marketing, sales and support of products, solutions, and services that break barriers between people and technology. Visit www.acer.com for more information.

© 2025 Acer Inc. All rights reserved. Acer and the Acer logo are registered trademarks of Acer Inc. Other trademarks, registered trademarks, and/or service marks, indicated or otherwise, are the property of their respective owners. All offers subject to change without notice or obligation and may not be available through all sales channels. Prices listed are manufacturer suggested retail prices and may vary by location. Applicable sales tax extra.

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

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