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Hybrid Bonding Technology Market to Reach USD 756 Million by 2031, Driven by Demand for AI, 5G, and High-Performance Computing | Valuates Reports

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BANGALORE, India, April 11, 2025 /PRNewswire/ — Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor (CIS), NAND, DRAM, High Bandwidth Memory (HBM)).

The Global Market for Hybrid Bonding Technology was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during the forecast period.

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Major Factors Driving the Growth of Hybrid Bonding Technology Market:

The Hybrid Bonding Technology Market is transitioning from early‑adopter phase to high‑growth mainstream adoption. Capacity announcements, multi‑year equipment backlogs, and expanding design‑win pipelines signal robust double‑digit revenue growth through the forecast horizon. As heterogeneous integration becomes indispensable for AI, 5G, automotive autonomy, and ultra‑high‑resolution imaging, hybrid bonding emerges as the de facto interconnect standard, eclipsing micro‑bump and TSV‑centric approaches. Continued process refinements and cost reductions will open mid‑tier and IoT segments, further enlarging addressable demand. Overall, hybrid bonding stands poised to redefine advanced packaging economics and performance benchmarks, anchoring a vibrant ecosystem of materials, tools, and service providers.

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TRENDS INFLUENCING THE GROWTH OF THE HYBRID BONDING TECHNOLOGY MARKET:

Wafer‑to‑wafer hybrid bonding is emerging as a pivotal manufacturing step because it enables full‑surface metal‑oxide interconnects that virtually eliminate the parasitic resistance and capacitance associated with‑silicon vias. By stacking fully processed wafers with nanometer‑level alignment accuracy, manufacturers can co‑integrate logic, memory, photonic, and sensor layers into one monolithic three‑dimensional package, delivering massive bandwidth and lower energy per bit. These measurable system advantages have made wafer‑to‑wafer architectures indispensable for high‑performance computing, mobile processors, and AI accelerators, spurring capacity expansions by foundries and OSATs. Equipment vendors are likewise benefiting, booking orders for plasma activation tools, bonding aligners, and cluster systems. The resulting cycle of demand, investment, and ecosystem maturation propels sustained, robust growth in the Hybrid Bonding Technology Market worldwide today.

Die‑to‑wafer hybrid bonding unlocks heterogeneous integration by allowing known‑good die from disparate process nodes to be placed precisely onto a target wafer, eliminating costly yield penalties linked with full wafer stacking. This pick‑and‑place flexibility lets designers mix advanced logic, high‑density memory, and specialty analog functions inside a single 3D package, tailoring performance while shrinking footprint. The approach is particularly attractive for chiplet architectures powering data‑center GPUs, network switches, and AI accelerators where interposer limitations bottleneck bandwidth. As system companies embrace the chiplet paradigm, demand for die‑to‑wafer processes is skyrocketing, prompting capital spending on bond aligners, plasma cleaners, and metrology. Collaborative standards such as UCIe reinforce ecosystem confidence, amplifying orders. Consequently, die‑to‑wafer adoption expands revenue within the Hybrid Bonding Technology Market.

CMOS Image Sensors (CIS) are driving a share of hybrid bonding demand because the technology dramatically improves pixel‑level interconnect density, enabling smaller pitch, higher resolution, and superior signal‑to‑noise ratios. By hybrid‑bonding the photodiode wafer to a dedicated logic wafer, manufacturers separate light‑sensitive and processing functions, maximizing fill factor while embedding advanced AI engines beneath each pixel. This architecture is essential for smartphone cameras, automotive ADAS modules, security systems, and emerging AR/VR devices that require multi‑megapixel performance without thermal or power penalties. Major CIS foundries in Japan, South Korea, and Taiwan are investing heavily in hybrid bonding lines, negotiating long‑term supply agreements with handset and automotive OEMs. Their outlays translate into expanding tool shipments, bolstering Hybrid Bonding Technology Market growth trajectories.

Data‑center operators and cloud service providers are deploying ever‑larger AI training clusters and exascale supercomputers that crave higher memory bandwidth, lower latency, and reduced power consumption. Traditional 2.5D interposers and wire‑bonded packages cannot keep pace with the throughput requirements of transformer models and graph analytics. Hybrid bonding overcomes these bottlenecks by providing direct copper‑to‑copper interconnects at pitches below ten microns, allowing logic and HBM stacks to exchange terabytes per second while staying within stringent energy budgets. As hyperscalers commit billions to next‑gen accelerators, they push chip suppliers toward aggressive adoption roadmaps, thereby amplifying equipment, material, and service revenues across the Hybrid Bonding Technology ecosystem worldwide. The virtuous demand cycle intensifies competition and innovation momentum further.

Consumers expect thinner smartphones, smartwatches, and augmented reality glasses that deliver desktop‑class functionality without sacrificing battery life. Achieving such compactness requires stacking logic, memory, RF front‑ends, and power management circuits vertically rather than expanding the PCB footprint. Hybrid bonding enables this architecture by allowing fine‑pitch interconnects between heterogeneous wafers and dies, eliminating the height penalties of micro‑bumps. OEM roadmaps from Silicon Valley to Shenzhen explicitly reference hybrid bonding for next‑generation application processors and camera modules, triggering early production ramps at foundries. Component miniaturization also frees board area for larger batteries and novel sensors, creating additional differentiation. Consequently, handset competition acts as a persistent catalyst that widens the addressable Hybrid Bonding Technology Market, boosting volume shipments.

Automotive OEMs are integrating lidar, radar, high‑resolution cameras, and domain controllers to achieve advanced driver‑assistance and eventual autonomous operation. These sensor arrays generate enormous data streams that must be processed in real‑time under harsh thermal and vibration conditions. Hybrid bonding facilitates compact, ruggedized 3D stacks that combine logic, memory, and sensor dies, improving bandwidth and reducing latency while maintaining reliability. Government safety regulations such as Euro NCAP and China NCAP push adoption of ADAS features, creating predictable, multi‑year demand for high‑performance automotive semiconductors. Tier‑1 suppliers consequently sign capacity reservations with foundries, driving equipment purchases for hybrid bonding lines and reinforcing market growth.

 Initial hybrid bonding lines suffered from particle‑induced voids and alignment errors, but iterative advances in plasma activation chemistry, wafer‑handling robotics, and in‑line inspection have driven dramatic yield gains. Higher yields translate directly into lower cost‑per‑connection, making hybrid bonding economically competitive with micro‑bump solutions at high volumes. OSATs now advertise greater than 99 percent bonding yield for both wafer‑to‑wafer and die‑to‑wafer flows, convincing cautious fabless customers to convert existing 2.5D programs. As unit costs fall, hybrid bonding becomes viable for mid‑range mobile and IoT chips, expanding the addressable market. Continuous process optimization therefore serves as a reinforcing growth driver, unlocking new design‑win opportunities.

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HYBRID BONDING TECHNOLOGY MARKET SHARE:

Asia‑Pacific dominates the Hybrid Bonding Technology Market, led by Taiwan’s advanced‑node foundries, South Korea’s memory giants, and Japan’s CMOS image‑sensor specialists. China is rapidly scaling domestic capacity through state‑backed programs, while Southeast Asia’s OSAT clusters in Singapore and Malaysia add assembly breadth. North America follows, buoyed by U.S. logic IDMs and government‑funded packaging pilot lines. Europe leverages research institutes and automotive demand, whereas Israel anchors niche aerospace and defense applications.

Key Companies:

IntelApplied MaterialsHuaweiEV Group (EVG)SUSS MicroTecAdeia

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DISCOVER MORE INSIGHTS: EXPLORE SIMILAR REPORTS!

–          Hybrid Bonding Equipment Market was valued at USD 123 Million in the year 2023 and is projected to reach a revised size of USD 618 Million by 2030, growing at a CAGR of 24.7% during the forecast period.

–          Wafer Hybrid Bonding Equipment Market was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during the forecast period.

–          Wafer Bonding Equipment Market was valued at USD 321 Million in the year 2024 and is projected to reach a revised size of USD 449 Million by 2031, growing at a CAGR of 5.0% during the forecast period.

–          Hybrid Wedge Bonders market was valued at USD 54 Million in 2023 and is anticipated to reach USD 70 Million by 2030, witnessing a CAGR of 3.0% during the forecast period 2024-2030.

–          Chip Bonding Adhesive Market was valued at USD 355 Million in the year 2023 and is projected to reach a revised size of USD 510 Million by 2030, growing at a CAGR of 5.3% during the forecast period.

–          Optical Bonding Service Market

–          Temporary Bonding and Debonding Systems Market

–          Wafer Bond Alignment System Market was valued at USD 249 Million in the year 2023 and is projected to reach a revised size of USD 423 Million by 2030, growing at a CAGR of 7.9% during the forecast period.

–          Die Bonding Materials Market

–          Automotive Glass Bonding Market

–          Bonding Wire for Semiconductor Packaging Market

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“Where We Once Stood,” a Vietnam War Documentary from Veterans United and Gary Sinise, Available to Stream on Prime Video Starting on Veterans Day

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Veterans United Home Loans’ first feature-length documentary follows a group of Vietnam Veterans returning to the country 50 years after the war’s end

COLUMBIA, Mo., Nov. 4, 2026 /PRNewswire/ — Veterans United Home Loans’ first documentary, “Where We Once Stood,” will be available to stream on Prime Video in the U.S. starting on Veterans Day. Executive produced and narrated by Golden Globe winner and longtime Veteran advocate Gary Sinise, the film follows a group of Vietnam Veterans returning to the country for the first time since the war.

Filmed in 2025 to mark the 50th anniversary of the Vietnam War’s end, “Where We Once Stood” follows the Veterans as they revisit the pivotal places that defined their military service. Veterans United brought together Veterans from different branches of the military, many of whom had rarely spoken about their experiences, to face the memories they carried home and find healing alongside one another.

The documentary features Veterans from the U.S. Army, Marine Corps, Navy and Air Force. Among them are  Lt. Col. Robert “Bob” Jeffrey, who spent more than seven years as a prisoner of war in North Vietnam, including at the Hanoi Hilton, and Maj. James “Jim” Taylor, a Medal of Honor recipient who saved more than a dozen wounded soldiers during a nine-hour firefight in November 1967. Also featured is Capt. Buddie Joe “BJ” Penn, a naval aviator who became the first Black battalion officer at the U.S. Naval Academy and later the acting secretary of the Navy.

“I came home from Vietnam carrying a lot of anger and for years there were things I just didn’t talk about,” Penn said. “Going back with other Vietnam Veterans gave me the chance to share things I’d never told anyone before. Those conversations helped heal some of the wounds I have carried for more than 50 years. I don’t think that healing would have happened if we hadn’t made that trip together.”

“None of the Veterans on this trip had returned to Vietnam since the war’s end, and we wanted them to do it on their own terms,” said Pam Swan, vice president of military relations at Veterans United Home Loans. “The men in this film represent just a handful of the millions who served, and their experiences are part of our nation’s history. We owe it to that generation to make sure those stories are recorded, remembered and told in their own words.”

The film screened in Washington, D.C., Nashville and aboard the USS Midway in San Diego.

More than 50 years after the end of the Vietnam War, the documentary offers viewers an opportunity to hear directly from those who served and better understand their experiences.

“These men returned to places where they fought and lost friends more than 50 years ago,” said Gary Sinise. “Many Vietnam Veterans didn’t receive the welcome home they deserved, and this film is another opportunity to recognize them and make sure their experiences aren’t forgotten.”

To watch the trailer and learn more about “Where We Once Stood” and the Veterans featured, visit WhereWeOnceStoodFilm.com.

About Veterans United Home Loans

Veterans United Home Loans, a full-service national direct lender based in Columbia, Missouri, closed more than $26 billion in loans in fiscal 2025 and was the nation’s No. 1 VA purchase lender, according to Department of Veterans Affairs Lender Statistics. The company’s mission is to help Veterans and service members take advantage of the home loan benefits earned by their service.

VeteransUnited.com | 1-800-884-5560 | 550 Veterans United Drive, Columbia, MO 65201 | Veterans United Home Loans NMLS #1907 (www.nmlsconsumeraccess.org). Private lender. Not endorsed or sponsored by the Dept. of Veterans Affairs or any government agency. Licensed in all 50 states. Military advisors are paid employees of Veterans United. For State Licensing information, please visit www.veteransunited.com/licenses. Equal Housing Opportunity.

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SOURCE Veterans United Home Loans

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New “Bible Loop” App Gives Teens a Reason to Slow Down With God’s Word

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Created by YouVersion in partnership with OneHope, the free app makes daily time in Scripture fun and personal

OKLAHOMA CITY, Nov. 4, 2026 /PRNewswire/ — Bible Loop, the newest app in the YouVersion Family of Apps, gives teens a reason to slow down and spend more time in God’s Word. Created in partnership with OneHope, the free app was built for teens at a stage of life when independence is growing and habits are forming. Bible Loop is now available on Android and iOS in English, Spanish, Portuguese, and French.

Teens can start with a verse memorization game that turns daily Scripture into a habit, complete with an anonymous leaderboard for a little friendly competition. Learning Loops will add interactive lessons from partners teens love and trust, while Daily Check-Ins match devotional content to how a teen is feeling that day. A Verse of the Day and Daily Prayers round out the experience, with Bible text available in more than 50 versions across 10 languages.

“When we say we want to reach everyone, everywhere with God’s Word, teens are an important part of that vision, which is why we created Bible Loop specifically for them,” said Bobby Gruenewald, founder and CEO of YouVersion. “We’re grateful to OneHope for sharing their expertise in reaching young people with the Gospel. Together, our hope is that Bible Loop helps teens develop daily rhythms of Scripture engagement that make a real difference in their lives today and serve them well into the future.”

Since 1987, OneHope has shared God’s Word with more than 2 billion children and youth, partnering with local churches around the world. Grounded in a commitment to understanding the next generation, OneHope conducts original research to identify emerging trends, understand young people’s evolving realities, and inform innovative approaches to engaging them with Scripture.

In a recent U.S. study, OneHope found that Gen Alpha, whose oldest are now teens, spends an average of 4 hours and 6 minutes online daily. A 2021 OneHope study in partnership with Barna found that while 88% of engaged Christian parents of children ages 6-9 reported their children engaging with the Bible weekly, engagement dropped to 73% for children ages 10-12. That dip suggests Scripture habits begin to slip before the teen years start. Insights like these helped shape Bible Loop, meeting teens where they already spend their time and inviting them to go deeper in God’s Word.

“OneHope’s research shows that the preteen years are critical for spiritual development, yet this is often when intentional discipleship at home begins to decline. That’s why Bible Loop is so essential today. We’re meeting the next generation where they are, helping preteens engage meaningfully with God’s Word and build habits that lay a foundation for a lifelong relationship with Jesus,” said Rob Hoskins, co-founder and president of OneHope.

Teens can download Bible Loop now at www.youversion.com/bible-loop and start learning it, living it, and looping it.

About YouVersion
Created by Life.Church, YouVersion designs free, biblically centered experiences that encourage and challenge people to seek God throughout each day. The YouVersion Family of Apps—including the Bible App, Bible App Lite, Bible App for Kids and Bible Loop—has been installed on more than one billion devices worldwide. The Bible App offers a Bible experience in more than 2,400 languages and helps people deepen their relationship with God. Bible App Lite is optimized for offline use and helps people access God’s Word in markets with device and data limitations. Both developed in partnership with OneHope, the Bible App for Kids helps children engage with the Bible through interactive animations and fun activities, and Bible Loop gives teens a fun way to explore, remember and apply Scripture. For more information about YouVersion, visit youversion.com.

About OneHope
OneHope is a global ministry dedicated to engaging every child and youth with the life-transforming message of Jesus through His Word. Since 1987, OneHope has impacted over 2 billion young lives with the Gospel, and by 2033, their goal is to engage another 2 billion children and youth worldwide. To learn more about OneHope, visit http://onehope.net.

press@youversion.com 

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SOURCE YouVersion

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Equable Analysis: State and Local Pension Funds Have at Least $578 Billion Invested in AI Companies

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AI-related companies make up 35.1% of reported public pension equity holdings as of June 30, 2026; a new interactive breaks out exposure by pension fund

NEW YORK, Nov. 4, 2026 /PRNewswire/ — State and local pension funds have between $578.1 billion and $706.6 billion invested in AI-related companies, according to an analysis released today by Equable Institute. This accounts for 9% to 11% of the total $6.42 trillion in state and local pension assets, as of June 30, 2026. Equable considers this range a conservative, lower-bound estimate.

As of June 30, 2026, the 51 largest publicly traded AI-related companies made up 35.1% of all reported public equity investments by state and local pension funds. The Magnificent 7 account for 63.3% of all public AI-related holdings. NVIDIA ($47.3 billion), Apple ($42.5 billion) and Microsoft ($28.2 billion) are the largest AI-related holdings across the pension funds measured. 

Alongside the media brief, Equable has published an interactive that breaks down the $396 billion in AI-related stock holdings directly reported by the largest funds from the portions of the estimate that are not reported by name. The interactive also details AI-linked public equity fund exposure for these pension funds, where public data is available. 

“Given the growing concentration of public pension assets in AI-related investments, it is important to know the full scope of exposure that state and local retirement systems have to future changes in the value of AI-companies. However, the lack of complete transparency on public and private pension fund investments means we can only estimate the potential upsides or downsides of what comes next in the AI-trade,” said Anthony Randazzo, executive director of Equable Institute. “Every public pension fund should be doing an internal audit of their own AI-exposure and making public the findings. A positive economic outcome from the emergence of AI could meaningfully stabilize public pension plans; but a negative event like an AI-bubble bursting could cause very meaningful losses that stakeholders should be aware of.”

Explore the data

The interactive splits the $706.6 billion estimate into three parts: $396 billion in AI-related stock that 24 of the 25 largest funds report directly, about $180 billion in public stock not reported in detail, and about $130 billion in private equity and corporate debt. Users can pick any of the 24 funds to see each AI-related company it holds, in dollars and as a share of assets. A separate view shows AI-linked private equity funds that the 25 largest pension funds have invested in, as confirmed in each pension fund’s own documents. 

Read the media brief here.Explore the interactive here.

About Equable Institute
Equable Institute is a bipartisan nonprofit dedicated to making public retirement systems work. We sit at the intersection of retirement policy and broader public policy, equipping policymakers, public employees, and retirement plan managers with independent, data-driven research, analysis, and education.

Equable.org | Twitter: @EquableInst | Facebook: @EquableInstitute | Instagram: @EquableInst

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SOURCE Equable Institute

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