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Avnet AI Tech Days Empower Singapore’s AI Ambitions

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Event in Singapore to Showcase Latest AI Solutions and Expertise, Supporting National Growth Goals

SINGAPORE, April 29, 2025 /PRNewswire/ — Building on Singapore’s growing leadership in artificial intelligence (AI), fueled by strategic initiatives like the S$150 million Enterprise Compute Initiative and the National AI Strategy 2.0, Avnet Asia is set to power this progress at its upcoming AI Tech Day – Shaping the Future of AI on May 14, 2025. At this event, attendees will gain actionable insights into deploying the latest AI technologies, forge valuable connections with industry leaders, and discover how Avnet can accelerate their AI journey.

This event will feature Avnet’s comprehensive ecosystem of cutting-edge AI solutions, developed through close collaboration with a robust ecosystem of industry leaders, including AMD, Infineon, LITE-ON, Micron, Molex, MPS, Nichicon, NXP, STMicroelectronics, Supermicro, Taoglas, and Yageo Corporation. Attendees will have the opportunity to witness live demonstrations and static displays showcasing the latest AI innovations from Avnet’s design services team and its strategic partners. Alongside these collaborations and demonstrations, the event will also showcase Avnet’s sister companies, Tria and element14.

“Avnet is excited to host Avnet AI Tech Days – Shaping the Future of AI,” said Tan Aik Hoon, Regional President, Avnet South Asia and Korea. “Our collaboration with industry leaders aligns perfectly with Singapore’s ambitious National AI Strategy. We are committed to providing the technologies and expertise needed to empower local businesses and drive the nation’s success in the global AI arena.”

A key highlight of the Avnet AI Tech Day in Singapore will be the invaluable insights shared by prominent figures shaping Singapore’s AI landscape. Guest speakers Laurence Liew, Director of AI Innovation at AI Singapore, and Dr. Nyan Myo Naing, Senior Specialist & Senior Lecturer at the Autonomous Technology Innovation Centre (ATIC), Nanyang Polytechnic, who will both bring significant authority and practical expertise to the event. Their presentations will complement a comprehensive display of advanced AI infrastructure and platform technologies, expertly curated by Avnet to accelerate AI integration across various key sectors.

Laurence Liew, Director of AI Innovation at AI Singapore and a key architect of the national AI strategy, will keynote on “Building an AI-First Nation: Empowering Businesses with Singapore’s Leading AI Initiatives,” bringing his perspective from over 30 years of technology leadership and his pivotal role in initiatives like 100 Experiments (100E) and AI Apprenticeship Programme (AIAP).  Adding a crucial practical dimension to the Avnet AI Tech Day will be Dr. Nyan Myo Naing, Senior Specialist and Senior Lecturer at Nanyang Polytechnic. Dr. Naing, who has extensive expertise in AI, deep learning, computer vision, and deploying AI on edge computing devices, will present on “Real-Time Edge AI: Deploying Smart Algorithms and Streaming Pipelines for Industrial-Grade Performance.” His direct experience in delivering AI solutions for numerous industrial projects within Singapore brings a real-world perspective to the event, offering attendees actionable knowledge on implementing advanced AI in industrial settings.

Avnet’s commitment to understanding and addressing the evolving needs of the AI market is further emphasized by its recent Avnet Insights survey. The findings reveal a strong global optimism regarding AI’s impact on product development, with a significant percentage of engineers already integrating AI into their designs. Notably, Singapore is proactively leveraging its infrastructure and talent to adopt AI across diverse industries. The survey also identifies key challenges such as security, privacy, and data quality, highlighting the importance of the solutions and expertise Avnet and its partners will present at the Avnet AI Tech Day. Download the full Avnet Insights whitepaper here.

“The findings of our recent global Avnet Insights survey underscore Avnet’s commitment to equipping our customers to navigate the complexities of AI development. We are dedicated to providing the necessary tools, technologies, and expertise to succeed in this exciting new era of AI-powered innovation. Avnet will leverage our deep expertise and extensive network to unite leading suppliers, innovative customers, and a strong partner ecosystem, ensuring we collectively unlock AI’s transformative potential across Southeast Asia,” concluded Tan.

The Avnet AI Tech Day offers exclusive access to industry insights and networking opportunities with key semiconductor, technology, and business decision-makers. Engineering professionals from tech manufacturing companies may register their interest to participate here.

Our valued partners will showcase their latest innovations, including these highlights, at the Avnet AI Tech Day in Singapore:

AMD: AMD will showcase its comprehensive portfolio of high-performance computing solutions driving advancements in AI across various applications, from cloud infrastructure to edge devices and endpoint solutions. Their exhibit will highlight the capabilities of their advanced GPUs, CPUs, NPUs, and FPGAs in powering demanding AI workloads.

Infineon: Infineon will showcase the PSOC™ Edge Vision Demo, highlighting human detection using AI/ML on the PSOC™ Edge E84 with a USB camera. This demonstration illustrates the seamless integration of AI/ML capabilities with hardware, offering an efficient platform for advanced human detection in applications such as smart homes and buildings.

LITEON: LITEON will present its state-of-the-art power supply, emphasizing its high power efficiency and various features. This power supply supports GREEN initiatives and offers potential for AI-enabled applications.

Micron: Micron will feature the Micron 6550 ION SSD, the world’s first 60TB PCIe Gen5 data center SSD. This product is engineered to deliver unparalleled performance, energy efficiency, and density, making it ideal for addressing the growing demands of AI workloads in AI data lakes, high-performance computing (HPC), big data, and analytics environments.

Molex: Molex will exhibit its EXTreme Ten60 Power connectors and High-Speed Pluggable Solutions, providing the robust power distribution and high-bandwidth connectivity crucial for AI applications like servers and data centers. Additionally, they will display the Molex Mirror Mezz Connectors, which offer efficient board-to-board communication suitable for AI hardware requiring high-performance processing in compact spaces.

MPS: MPS will showcase its latest innovation, the MPC24380, the Highest Power Density Module for AI GPUs and TPUs. This module addresses the challenges of increasing power requirements for AI processors by integrating output caps and utilizing a thermally efficient DrMOS-on-top approach with extremely low ThetaJT for improved heat transfer.

Nichicon: Nichicon will showcase its advanced capacitor solutions, including aluminum, hybrid, polymer capacitors, and SLB products. The demonstration will highlight their high-performance, space-saving designs and enhanced durability, making them suitable for applications in smart meters, IoT, automotive, and industrial sectors.

NXP Semiconductors: NXP Semiconductors (NASDAQ: NXPI) will present its role as a trusted partner for innovative solutions across the automotive, industrial & IoT, mobile, and communications infrastructure markets. Their “Brighter Together” approach combines leading-edge technology with pioneering people to develop system solutions that enhance the connected world’s quality, safety, and security.

STM: STM will feature the STM32N6 microcontroller (MCU) series, their most powerful to date and the first to integrate the Neural-ART Accelerator (NPU). This new series delivers a 600-fold increase in machine-learning performance compared to current high-end STM32 MCUs, enabling advanced machine-learning capabilities at the edge for applications like computer vision, audio processing, and sound analysis in both consumer and industrial domains.

Super Micro Computer, Inc. (SMCI): Supermicro will present its capabilities in empowering AI-driven solutions for enterprise, retail, and edge server deployments. A key product on display will be the AS -1115S-FWTRT, a 1U, short-depth system leveraging AMD’s EPYC series processors and capable of supporting a single double-width NVIDIA L40S GPU, offering customers flexibility in core counts and GPU capacity. Supermicro is a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge.

Taoglas: Taoglas will highlight how antennas and Ethernet magnetics are becoming the essential connectivity backbone for edge computing and AI, ensuring robust, low-latency data transmission. Their presentation, “The Backbone of Connectivity,” will showcase groundbreaking innovations designed to support digital infrastructure.

YAGEO: Yageo will highlight its commitment to delivering high-quality passive component solutions designed to meet the evolving demands of AI across various industries worldwide. They will introduce the latest key applications of Yageo passive components in emerging technologies.

About Avnet

As a leading global technology distributor and solutions provider, Avnet has served customers’ evolving needs for more than a century. Through regional and specialized businesses around the world, we support customers and suppliers at every stage of the product lifecycle.  We help companies adapt to change and accelerate the design and supply stages of product development. With a unique viewpoint from the center of the technology value chain, Avnet is a trusted partner that solves complex design and supply chain issues so customers can realize revenue faster.  Learn more about Avnet at www.avnet.com.

Avnet Asia Media Contact

Seraphina Wee
Corporate Communications and Public Relations Manager, Asia Pacific
Seraphina.wee@avnet.com

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SOURCE Avnet Asia Pte Ltd

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Linktel Technologies Highlights Breakthrough 1.6T LPO Performance & Strong Market Pull at OCP 2026

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SAN JOSE, Calif., Oct. 18, 2026 /PRNewswire/ — At the recent 2026 OCP Global Summit, Linktel Technologies showcased its cutting-edge optical interconnect portfolios engineered specifically for next-generation AI computing networks. Among the heavy lineup, Linktel’s 1.6T Linear Pluggable Optics (LPO) solutions commanded immense industry attention, drawing heavy customer interest for their unprecedented energy efficiency, ultra-low latency, and supply-chain resilience.

Spotlight: 1.6T LPO Performance & High Customer Traction

AI data centers face immense scaling pressures, demanding higher bandwidth densities with tighter thermal and power budgets. Linktel’s 1.6T LPO solutions—highlighted by the 1.6T LPO 2DR4—delivered standout performance metrics that captured the spotlight at the summit:

Ultra-Low Power Consumption: Operates with power consumption as low as an impressive 10W, drastically mitigating data center cooling and power loads.Minimal Latency: Features a linear optics architecture that cuts down signal processing delays, making it a critical asset for high-performance AI scale-out fabrics.Enhanced Supply-Chain Resilience: Eliminating the optical DSP mitigates component choke points, ensuring robust scalability for mass deployments.Proven Interoperability: Following its breakthrough performance and multi-switch platform interoperability at the early September 2026 1.6T LPO-MSA Plugfest, Linktel has laid a solid foundation for the 200G-per-wavelength ecosystem.

Surging Market Interest

Throughout OCP 2026, Linktel’s live demonstrations of its 1.6T LPO, LRO, and FRO modules drew crowds of data center architects and industry partners. With volume production already in place, Linktel is fully equipped to meet the exploding market demand for energy-efficient, high-density 1.6T connectivity.

Overview of Other Innovations at OCP 2026

In addition to the heavily requested 1.6T LPO lineup, Linktel showcased two other major high-speed architectural pillars:

12.8T Liquid-Cooled XPO:Featured a live thermal demonstration integrating advanced liquid cooling to guarantee stable operations in high-density AI nodes.As a founding member of the XPO MSA, Linktel is actively scaling XPO series with FRO, LRO, and LPO variants for comprehensive scale-up, scale-out, and scale-across frameworks.6.4T/7.2T NPO Modules:Displayed with covers removed to reveal internal architectural designs supporting both ELS and ILS configurations.Combines compact high density with low power and low latency, backed by an established 6.4T/7.2T NPO roadmap.DMD Technology & Executive Presentation:Linktel Engineer Director Dr. Grace Zhang hosted a heavily attended Executive Session titled “Dispersion Managed Transceiver for Next-Gen AI Fabrics,” detailing cost-effective 800G (20km) and 1.6T (10km) solutions for OCS SuperPOD architectures, as well as the feasibility of 400G per lambda (3km).With its DMD product line already in volume production, Linktel actively calls upon ecosystem partners to join forces in collaborative development. To drive ecosystem maturity, Linktel is open to sharing its U.S.-filed patents, paving the way for industry-wide adoption and advancements in next-gen AI fabrics.

About Linktel Technologies

Linktel Technologies is a global leader in optical transceiver development and manufacturing, supplying high-speed optical I/O connectivity—including pluggable transceivers, optical engines, and ODM/JDM services.

For more information, visit www.linktel.com or follow Linktel Technologies on LinkedIn.

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Advanced Manufacturing in Focus: Smart Life and Robotics Take the Spotlight at 140th Canton Fair

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GUANGZHOU, China, Oct. 18, 2026 /CNW/ — Phase 1 of the 140th Canton Fair, themed “Advanced Manufacturing,” opened on October 15 and will run through October 19. As one of the event’s most closely watched sections, the Consumer Electronics and Information Products zone once again serves as a showcase for the latest achievements in China’s manufacturing and technology industries.

Smart Life Solutions Address an Aging and Globalized Market

A highlight of this section is the focus on smart living, which brings together smart solutions designed to support healthier, safer, and more independent lifestyles.

For example, wearable devices and continuous glucose monitoring systems enable convenient tracking of key health indicators such as heart rate and blood glucose levels. Meanwhile, wearable exoskeletons and other AI-powered devices support mobility training and functional recovery. For home and elderly care, companion robots, electric nursing beds and home-use hyperbaric oxygen chambers, offer a combination of daily care, wellness support and lifestyle assistance. All these solutions highlight a growing shift toward technology-enabled living, where health management, personal care, and independent living are becoming more accessible and connected.

Service Robots Demonstrate Expanding Real-World Applications

The Service Robot Zone remains one of the fair’s most popular attractions in this edition.

Among the crowd favorites is a humanoid robot standing roughly 70–80 centimeters tall. With its expressive movements and playful appearance, the robot draws constant attention as it dances, approaches visitors and occasionally performs flips to the delight of onlookers. Behind the product is a company that has overcome key challenges in compact joint modules and modular humanoid robot development. Its independently developed high-power-density joints deliver remarkable agility and explosive movement, while modular architecture provides flexibility for a wide range of future applications.

More broadly, the Service Robot Zone features exhibits spanning a wide range of application areas, including embodied intelligence, specialized operations, urban services, and smart living. Full-size humanoid robots, dexterous hands with multimodal sensing capabilities and wheeled robots highlight the latest advances in artificial intelligence, perception technologies and motion control. For demanding industrial and emergency environments, exhibitors are presenting robotic inspection systems, live-line maintenance robots and underwater propulsion robots designed to improve safety and operational efficiency.

The commercial services sector is also well represented through reception robots, façade-cleaning robots and fully automated coffee kiosks, while everyday life applications include wearable exoskeletons, robotic lawn mowers and educational robots for home use. Together, these exhibits demonstrate how China’s robotics industry is accelerating its transition from technological innovation to large-scale commercialization.

As the 140th Canton Fair gets underway, the showcased innovations highlight China’s growing strength in advanced manufacturing, turning cutting-edge technologies into practical, market-ready solutions for global customers.

For more convenient attendance, please click here for pre-registration:
https://buyer.cantonfair.org.cn/register/buyer/email?source_type=16

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SOURCE Canton Fair

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October 2026 Global Sources Hong Kong Shows Phase II Opens Today

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Asia’s first dedicated B2B Pre-Owned Mobile Devices focus pavilion 
Tencent Brings AI Ecosystem Products to the Show

HONG KONG, Oct. 18, 2026 /PRNewswire/ — Phase II of the October 2026 Global Sources Hong Kong Shows opened today at AsiaWorld-Expo, running from October 18 to 21. The four-day event focuses on four core tracks — mobile electronics, smart home security and appliances, lifestyle electronics, and sports and outdoor — bringing together more than 2,100 quality Asian suppliers across more than 4,000 booths, showcasing approximately 160,000 new products including mobile devices, smart wearables, AR/VR, smart home, energy storage and charging, personal health care, pet products, and sports and outdoor equipment.

John Kao, Vice President of Hong Kong Shows & Overseas Shows at Global Sources, said: “Hong Kong possesses a regulatory framework aligned with international standards, efficient intellectual property protection, and proximity to the Greater Bay Area’s manufacturing heartland — enabling it to meet buyers’ dual demands for compliance and efficiency. Buyers no longer need to travel to multiple locations: right here in Hong Kong, they can assess Asian manufacturing supply, complete compliance reviews, and place orders — all in a single visit. The trust established between buyers and sellers on site is often difficult to achieve through months of email exchanges. We aim to continuously strengthen Hong Kong’s role as an international trade hub, enabling genuinely capable suppliers and serious buyers to connect efficiently on this platform.”

Asia’s First B2B Phone Trade Focus Pavilion Officially Debuts

Hong Kong has long been an important transit hub for the global second-hand phone trade. According to IDC data, global used smartphone shipments reached 225.7 million units in 2024 and are projected to maintain a compound annual growth rate of 4.9% through 2029. While the market continues to expand, compliant distribution capability remains the key threshold for entering this space.

For the first time, the show has partnered with the Hong Kong International Communications Electronic Chamber (HKICEC) to unveil the “HKICEC Global Mobile Exchange Pavilion,” Asia’s first dedicated B2B pavilion for Pre-Owned Mobile Devices. The pavilion brings together nearly 60 leading companies from Chinese Mainland, Hong Kong SAR, India, Japan, the United Arab Emirates, the United States, the United Kingdom, and beyond — including Zhuan Zhuan, ATRenew, US Mobile Phones Inc., Belong Inc., and ecoATM LLC — exhibits and services span new mobile devices, professionally tested and data-sanitized refurbished smart devices compliant with EU WEEE standards, intelligent testing technologies, recycling solutions, and compliant export services. The pavilion offers buyers from Europe, North America, and Southeast Asia a trusted and comprehensive sourcing platform, creating a green trade corridor that connects Chinese Mainland’s manufacturing strengths, Hong Kong SAR’s international platform, and global markets.

Tencent AI Makes Show Debut; AI Mass Production Enters the Delivery Phase

The product selection logic for AI products has undergone a marked shift in the second half of the year. The focus has moved entirely from “What new AI products are available?” to deployment capability and delivery efficiency — no longer chasing feature gimmicks alone, buyers place greater emphasis on whether products can effectively address real needs and ship reliably on schedule. Suppliers’ overall fulfillment capability has surpassed mere product highlights to become the primary assessment criterion in sourcing decisions. The Phase II “AI+ Theme Zone” features over 1,200 booths spanning seven segments: AI terminal devices, AI wearables, AI glasses, AI toys, AI pet products, AI personal health devices, and AI-integrated products, showcasing suppliers’ proven ability to move from concept to mass production. The zone also extends to lifestyle electronics including wearable electronics, smart pet products, personal care and beauty tech, sports, outdoor and fitness tech, gifts, and smart living, covering a wide range of real-world application scenarios.

Tencent joins forces with its ecosystem partners to exhibit under the theme “AI-Empowered Business Growth,” showcasing Tencent’s AI office assistant WorkBuddy alongside enterprise-grade AI solutions from ecosystem partners, including the AI-powered business growth tool Buda.im and Busabase. Running concurrently with the fair, the “AI Agent Summit” brings together over 100 industry, investment and technology leaders to explore how AI Agents are moving beyond demos into real-world deployment and revenue generation, with in-depth discussions on commercialisation pathways, industry standardisation and emerging opportunities across the AI Agent ecosystem. In addition, the show has partnered with the Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA) to launch a Taiwan AI Supply Chain Theme Pavilion, showcasing the region’s established industrial cluster strengths in AI modules, components, and contract manufacturing.

Vietnamese Manufacturing and Mobile Accessories Take Center Stage; Diverse Sourcing Zones Debut

Phase II features a dedicated “Vietnam Sourcing Fair” zone, bringing together approximately 50 Vietnamese manufacturers with mature export capabilities, covering three product categories: fashion products and apparel, home and kitchenware, and gifts and packaging. For buyers seeking to diversify sourcing risks, the zone enables them to simultaneously access China’s main supply chain and Vietnam’s emerging production capacity at the same show, and negotiate directly face-to-face with Vietnamese factories.

With new-generation flagship smartphones from major brands hitting the market, demand for compatible mobile accessories is ramping up. The show floor features over 2,000 mobile-accessory booths showcasing new offerings including phone cases, charging gear, stands, and data cables, providing global buyers with an extensive range of options. The event also hosts the “Global Buyer’s Top Picks” creative phone-case contest to identify case designs with strong market potential.

The concurrent Hong Kong Security Tech Show, supported by the China Chamber of Commerce for Import and Export of Machinery and Electronic Products (CCCME), showcases products and solutions spanning security surveillance, smart access control, and cybersecurity.

Best of Innovation Awards Recognize Outstanding Products; Global New Product Launches Converge in Hong Kong

The Phase II Best of Innovation Awards focus on products across mobile electronics, smart home, security and appliances, lifestyle electronics, and sports and outdoor categories, with judging criteria emphasizing practicality, cost-effectiveness, technological maturity, and market relevance — identifying innovative products with genuine commercial deployment potential. Phase II also introduces a dedicated “AI Innovation Award” to recognize exhibits with outstanding applications of AI technology. The awards program continues its partnership with the internationally renowned European Product Design Award (EPDA)™ to present the “Best Product Design Award,” honoring products that combine innovative thinking with exceptional design. The show also serves as the preferred launch platform for multiple exhibitors’ annual new products, featuring heavyweight global and Asia premieres that further consolidate Hong Kong’s position as the world’s premier stage for consumer electronics product debuts.

About Global Sources

Global Sources is an internationally recognized multi-channel trade platform, connecting Asia with the world for 55 years. The company has been dedicated to facilitating global trade by connecting verified suppliers with qualified buyers worldwide. To date, it has successfully served more than 14 million registered buyers and users globally, providing efficient and convenient trade solutions.

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SOURCE Global Sources

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