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The Cybersecurity Services Industry Welcomes a New Player: Lydsec Digital Technology to Register on the Emerging Stock Market on May 13

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Focusing on enterprise cloud services, mobile finance, and digital government applications.

TAIPEI, May 12, 2025 /PRNewswire/ — The leading provider of online identity authentication security—Lydsec Digital Technology (d.b.a. Keypasco) (‘Lydsec’, Taipei Exchange stock code: 7834), will register on the emerging stock market on May 13, 2025, with a reference price of NT$58 per share. With its proprietary R&D technology, Lydsec Digital offers a diverse range of online identity authentication software systems and application solutions. Its primary products include the Keypasco series of authentication solutions, such as Zero Trust Network Access (ZTNA), Multi-Factor Authentication (MFA), and FIDO, which are designed to protect user privacy while offering ease of use and high security across various applications.

Lydsec Digital has a paid-in capital of NT$164 million, with Concord Securities serving as the lead underwriter. In 2024, the company not only consolidated its position in the Taiwan market but also expanded overseas, penetrating markets in Japan, Europe, the Middle East, and India. As a result, overseas revenue accounted for about 70% of its total business. Products such as MFA and Zero Trust solutions have garnered significant interest from financial institutions and government agencies worldwide. Lydsec Digital’s consolidated revenue in 2024 reached NT$110 million, representing a 69% increase compared to the previous year. This growth has led to profitability, with a net profit after tax of NT$15.42 million and an EPS of NT$1.15.

Lydsec Digital emphasized that global patent deployment is a key competitive advantage in the cybersecurity industry. The company’s innovative multi-factor identity authentication systems have been granted six international patents across 16 countries, including the U.S., Japan, Taiwan, South Korea, the EU, China, and Singapore. These patents cover:

Device Fingerprints and Geo-Location integrated with a risk management engine and two-channel authentication.Proximity authentication.Centralized PKI storage solutions.Dynamic URL links.Key management systems.

In recent years, governments worldwide have been actively promoting Zero Trust Network Architecture (ZTNA). Taiwan’s Institute for Information Industry under the Ministry of Digital Affairs has, since 2022, required Grade A agencies to gradually implement three core components of the zero-trust architecture: identity verification, device verification, and trust inference. It has also encouraged companies to obtain product functionality verification to ensure policy implementation. Lydsec Digital was among the first to pass both phases of the Institute’s zero-trust product functionality verification.

Since its inception, Lydsec Digital has focused on serving heavily regulated financial sectors. Its clients in Taiwan include over ten financial institutions, such as Hua Nan Bank and Taiwan Cooperative Bank. Globally, it has over 10 million active users, with applications spanning finance, government, real estate, e-commerce, EV charging, gaming, and healthcare. In response to rapid advancements in generative AI, Lydsec Digital continues to develop Keypasco-branded cybersecurity products that balance usability and security, catering to global market demands.

According to MarketsandMarkets Research Ltd., the global MFA market size is projected to grow from $15.2 billion in 2023 to $34.8 billion in 2028, highlighting the increasing need for identity security. Lydsec Digital’s Keypasco solutions offer multiple authentication factors, such as device authentication, geo-location, NFC/BT proximity authentication, visual signatures, and private key security (PKI Sign). Its proprietary two-channel authentication and smart risk management engine safeguard online identity and transaction security across diverse application scenarios.

With rapid growth in emerging overseas markets, Lydsec Digital’s 2024 overseas revenue was 2.5 times that of Taiwan. Its customers span the Middle East, Europe, and the Asia-Pacific, with over 10 million end users in industries ranging from banking and government to e-commerce and smart buildings. With a client renewal rate exceeding 90% over the past decade and the addition of enterprise customers from Japan, India, the Middle East, Europe, the U.S., and Latin America, the company is poised for sustained growth.

About Lydsec Digital:
Lydsec Digital Technology specializes in the development of innovative online identity authentication and management technologies. Headquartered in Taiwan, it has subsidiaries in Sweden, the Netherlands, Japan, the U.S., and India, with distribution partners in 24 countries. Its primary services include Keypasco multi-factor authentication, serving clients in diverse sectors such as finance, government, e-commerce, smart buildings, manufacturing, online gaming, healthcare, and EV charging.

For more information, visit Lydsec Digital’s website.

Disclaimer:
This document and accompanying materials contain forward-looking statements regarding Lydsec Digital’s future operations, events, and prospects. Actual outcomes may differ significantly due to factors beyond the company’s control, such as market dynamics, regulatory changes, and economic conditions. These statements reflect current expectations and are not subject to future updates.

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

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