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Rivada Space Networks Announces New Partners at AsiaTechX 2025

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Rivada’s Outernet, the world’s first global private network for enterprise and government is key for Asia-Pacific

Highlights:

High-speed global data constellation using satellite-to-satellite laser linksUltra-secure and low-latency networkCombining the speed of fiber with the reach of satelliteTelecom, Enterprise, Maritime, Energy and Government Services markets

SINGAPORE, May 27, 2025 /PRNewswire/ — Rivada Space Networks, a global network company launching a unique LEO satellite network to provide secure connectivity for governments and enterprises, has announced a series of new partners in the Asia Pacific region.  Rivada has now lined up over $US16 billion of business globally for its unique LEO network.

At AsiaTechX, the company will outline the key attributes of The Outernet, a unique space-based network providing Gigabits of ultra-secure connectivity with lower latencies than fiber, opening-up new opportunities for companies looking for scalable, flexible solutions for their expanding networks.

Rivada’s space-based data network is transformative—it will offer access to a secure satellite network with global reach, offering end-to-end latencies similar to or better than terrestrial fiber. The Outernet combines inter-satellite links with advanced onboard data routers creating an optical backbone in space to deliver an ultra-secure and highly reliable global data network for business operations in the telecom, enterprise, maritime, energy and government services markets. And as the first unified global communications network, in which data stays in space from origin to destination, traffic is routed on a physically separated network, providing a layer of defense for any enterprise or government organization that needs to securely share data across Asia and beyond.

Global subsea cables, which carry much of the world’s data traffic, are increasingly becoming a focal point of geopolitical tensions, with frequent cable cuts resulting in severe outages. More than ever, the Asia Pacific region needs resilient infrastructure that is fast, secure and reliable. The Outernet is key to enhancing the region’s telecommunications infrastructure in terms of data sovereignty and security, supporting AI national digital strategies, ensuring uninterrupted connectivity and expanding international networks.

For Enterprise and Government customers, the key attributes of the Outernet are ideal for a variety of applications, for example, to give banks and global companies secured networks with distributed offices, provide significantly more bandwidth for oil & gas exploration than is available today, enable seamless connectivity for shipping & fleet management, or provide 5G satellite backhaul connectivity network expansion for cellular operators. Connectivity providers in Asia can offer a competitive advantage by expanding these markets, enabling new opportunities through secure, multi-gigabit bi-directional performance, combined with worldwide reach.

iO3 – Singapore
iO3 delivers seamless integration of digital technologies tailored to the evolving needs of the maritime sector to improve efficiency, ensure compliance, and enhance security. iO3 will leverage Rivada’ Outernet to provide a resilient, space-based data connectivity network designed with global, low-latency coverage and high-availability and security to support advanced maritime capabilities—particularly in remote and high-risk environments. This enables real-time ship-to-shore data exchange, enhances operational safety, and ensures reliable access to critical digital services. iO3’s secure and scalable platforms are well-suited for defense and government maritime operations. Its cyber-hardened architecture, remote monitoring capabilities, and mission-critical communication systems support naval fleets, maritime enforcement, and sovereign offshore activities. These capabilities help ensure operational readiness, safeguard sensitive data, and enable mission success in today’s increasingly complex maritime landscape.

Acutec – Australia
Acutec Systems is specialized in communications technology and systems for the maritime, offshore oil and gas, cruise, defence, and superyacht sectors. The Rivada Outernet is the equivalent of having an ultra-secure, fast fiber connection at sea and is the ideal solution to future-proof digital infrastructure and provide enterprise-grade, secure bandwidth with high availability and guaranteed service levels that support complex maritime operating environments.

Tricom – India
Tricom India Pvt Ltd is a networking and connectivity solutions provider committed to advancing the maritime sector through innovative digital solutions. With a strong focus on the seamless integration of cutting-edge technologies, Tricom delivers customized systems that cater to the complex and evolving needs of the maritime industry. In collaboration with Rivada’s Outernet, Tricom aims to revolutionize maritime connectivity by providing a seamless, resilient data network. This high-availability infrastructure is designed to enhance the efficiency, safety, and operational performance of vessels navigating even the most challenging maritime environments.

Rikei – Japan
Rikei Corporation offers a broad array of leading-edge technologies and advanced solutions for the telco and enterprise sectors. Rikei will harness the Outernet’s seamless connectivity to ramp up performance, improve security, and increase customer efficiency. Rivada’s Outernet is particularly well suited for the low latency and secure connectivity required to expand telco and enterprise networks.

Transcontinental Enterprise Co, Ltd –Taiwan
Transcontinental Enterprise Co, Ltd are expert communications solutions providers to the Government sector in Taiwan. The company will leverage the Outernet to provide a secure and reliable infrastructure solution to address the ever-demanding secure communications needs of the Government sector in Taiwan, ensuring seamless coverage, even in remote areas. 

One Commerce – Philippines
One Commerce, will work with Rivada to improve connectivity for enterprise and government customers across the Philippines, ensuring seamless coverage, even in remote provinces.  One Commerce is ensuring total digital transformation for the government, harnessing cutting-edge technologies to boost operational efficiency, facilitate public access to information and elevate the quality of government services.

Donald Chew, Vice President of Sales, Asia Pacific at Rivada Space Networks, said: “We are seeing huge interest in Asia, particularly in the Government, Maritime and Energy sectors, underlining the growing appetite for our unique space-based network. The Outernet’s ability to meet the requirements of Asia’s connectivity providers in terms of security, latency, capacity, and coverage is a game-changer for the region. Our completely new type of LEO constellation will provide the whole of Asia with a transformative next-generation infrastructure for secure, resilient communications and network expansion.”

To find out more, meet us at stand 4N1-5 at AsiaTechX from 27-29 May. 

NOTE TO EDITORS
Rivada Space Networks representatives will be at AsiaTechX from 27-29 May. To arrange an interview, please contact Melanie Dickie at mdickie@rivadaspace.com

About Rivada Space Networks
Rivada Space Networks GmbH is deploying the first true “Outernet”: a global, low-latency, point-to-point connectivity network of LEO satellites. By connecting its satellites with lasers, Rivada will provide resellers and B2B customers with the ability to securely connect any two points on the globe with low latency and high bandwidth. The constellation, comprising 600 low-earth-orbit communications satellites, will represent a fundamental change in the availability of secure, global, end-to-end enterprise-grade connectivity for Telecom, Enterprise, Maritime, Energy and Government Services markets. Rivada Space Networks is a wholly owned subsidiary of Rivada Networks, Inc. www.rivadaspace.com 

Follow Rivada Space Networks on:
LinkedIn: https://www.linkedin.com/company/rivada-space/
Twitter: @rivadaspace 

Media Contacts
Melanie Dickie, Chief Marketing & Communication Officer
Rivada Space Networks GmbH
Tel: +31 6 14 22 97 62
Email: mdickie@rivadaspace.com

Brian Carney, SVP Corporate Communication
Rivada Networks, Inc
Tel: +1 (207) 256-0386
Email: bcarney@rivada.com 

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SOURCE Rivada Space Networks

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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on

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

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