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JBD Leaps Into 12-Inch-Wafer MicroLED Manufacturing

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SHANGHAI, May 15, 2026 /PRNewswire/ — JBD has announced that it has completed a major upgrade of its MicroLED microdisplay mass-production architecture, shifting from a 4-inch-based manufacturing architecture to a 12-inch reconstructed wafer platform. The milestone marks a step-change in manufacturing efficiency, cost competitiveness, and large-scale supply readiness.

In the early days of the industry, competition in MicroLED microdisplays revolved largely around performance metrics such as brightness, form factor, and power consumption. As the technology roadmap matures and demand for high-performance displays in AR/AI smart glasses continues to accelerate, manufacturing capability is emerging as the decisive variable for the industry’s next phase of development. Achieving scalable, cost-efficient production without compromising quality has become the new frontier of technological competition.

Yield and cost have long been central constraints on the broad adoption of MicroLED microdisplays. The prevailing wafer-to-wafer bonding approach offers high throughput, but it also presents a fundamental structural challenge: advanced silicon backplanes have fully transitioned to the 12-inch generation, while MicroLED epitaxial wafers, constrained by material systems and process complexity, have remained predominantly 4-inch. This wafer-size mismatch has become a key factor limiting cost efficiency and substrate utilization.

A common industry practice today is to dice 12-inch silicon backplanes to match smaller epitaxial wafers. Under this approach, however, the theoretical utilization ceiling for backplane wafers is only 77%, making it difficult to fully capture the value of advanced-node silicon backplanes. Given the substantially higher cost per unit area of silicon backplanes compared with epitaxial materials, any underutilization directly translates into higher device cost and constrains the economics of scaled production.

Many MicroLED companies have proposed using 8-inch wafer flows for mass production of MicroLED microdisplays. However, this approach presents two critical flaws. First, geometric analysis shows that 56% of the backplane area remains unutilized due to the mismatch between wafer sizes. Second, experimental data consistently reveals low wafer yields during the bonding and substrate removal stages—a persistent problem that remains unsolved to this day. Consequently, JBD has decided to forgo the 8-inch approach entirely and leap directly to 12-inch wafer flows.

Against this backdrop, JBD has integrated its “die-to-carrier-to-wafer” bonding scheme into its volume production architecture. Under this process, small-format epitaxial wafers are diced into individual dies, followed by pre-bond inspection and sorting to identify and remove defective chips at an early stage. Qualified dies are then reconstituted onto a temporary 12-inch carrier substrate with high placement accuracy and uniformity, creating a reconstructed epitaxial wafer for subsequent wafer-level bonding with a matching 12-inch silicon backplane.

This approach enables significantly more efficient utilization of silicon backplane wafers, mitigates the impact of epitaxial defects before they are carried into finished devices, reduces variability in downstream processing, and materially improves yield. More importantly, it combines the proven process maturity of small-format epitaxy with the scale advantages of advanced 12-inch backplanes. This provides a practical pathway to upgrade the manufacturing system before native 12-inch epitaxy becomes commercially viable at scale. It also establishes a more stable manufacturing foundation for high-precision hybrid bonding. As pixel pitches continue to shrink, MicroLED microdisplays will increasingly depend on advanced-node silicon backplanes.

JBD has now addressed the key technical and process bottlenecks associated with 12-inch wafer reconstitution and established a validated process architecture. End-to-end validation has been completed on its pilot line, where wafer-reconstitution yield has exceeded 98%, and the company is now accelerating the transfer of this architecture to volume production. “The 12-inch wafer reconstitution solution overcomes a key bottleneck in large-format mass production for the MicroLED microdisplay industry and achieves an optimal balance between efficiency and cost,” said Dr. Qiming Li, CEO of JBD. “Thanks to JBD’s engineers and technologists, after years of innovative study, we are now confident that 12-inch reconstitution will be the ultimate solution for MicroLED mass production. It marks the beginning of a new stage of scaled manufacturing for MicroLED microdisplays. Beyond MicroLED mass production, the new 12-inch platform will likely open many new opportunities in the computing with light. JBD believes in light.”

The transition from 4-inch to 12-inch wafers marks a critical step in the maturation of MicroLED microdisplay manufacturing toward application-ready, scaled production. With this architectural upgrade, JBD is reinforcing its large-scale supply capability while providing a more dependable manufacturing foundation for the global commercialization of AR smart devices at scale.

About the Company

Founded in 2015, the Company—known in the industry through its JBD technology brand—stands at the forefront of technological innovation in MicroLED microdisplay technology. Renowned for delivering some of the smallest, brightest, and most energy-efficient microdisplay panels, the Company is a global pioneer in advanced display solutions. The Company’s product portfolio extends well beyond AR near-eye displays, encompassing ultra-compact MicroLED displays, projection solutions, and optical modules—enabling a wide spectrum of consumer, automotive, and commercial applications. Driven by an unwavering commitment to excellence and innovation, the Company continues to expand the boundaries of application and deliver reliable, system-level solutions that help shape a brighter, more vibrant digital world.

Mission
Enlighten the human perspective with MicroLED.

Vision
To become a global leader of near-eye display solutions, reshaping the human-AI interaction experience and gatewaying humanity to the digital world through MicroLED.

Explore more about the Company’s groundbreaking advancements by visiting their website(www.jb-display.com) or engaging with them on LinkedIn and X (Twitter).

 

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SOURCE JBD

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LeanDNA Launches Demand Scenario Modeling in APEX, Replacing Spreadsheet Guesswork With Real-Time Production Feasibility

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New capability lets production planners test demand changes against live supply and BOM data in minutes, without exporting ERP data or risking live system records.

AUSTIN, Texas, Aug. 25, 2026 /PRNewswire/ — LeanDNA, a leading intelligent supply chain execution platform, today announced the general availability of Demand Scenario Modeling (DSM), a new capability within its APEX platform that lets production planners, buyers, and supply chain managers instantly test demand changes against real supply and Bill of Materials (BOM) data, without spreadsheets or system risk.

When forecasts shift, most production planners still turn to spreadsheets to find out whether production can support it: exporting ERP data, flattening multi-level BOMs, and reconciling supply just to answer one question — can we build this? The process is slow, error-prone, and disconnected from real-time system data, and it often produces false shortages that obscure the actual constraints.

Demand Scenario Modeling replaces that manual exercise with what-if analysis built directly into APEX. Production planners can model a demand change and immediately see which components truly constrain production, how many units can realistically be built, and where shortage risk increases, turning a process that has historically taken hours into a workflow measured in minutes.

Because DSM runs in a sandbox environment connected to live ERP and BOM data, planners can test and compare multiple scenarios, adjust quantities and dates, and recalculate instantly, without posting temporary plans or manipulating live records to get an answer. That combination of speed and system safety is central to how LeanDNA has built the capability.

“Production planners shouldn’t have to choose between speed and safety when they’re testing a demand change,” said Andy Ellenthal, CEO of LeanDNA. “Demand Scenario Modeling gives them both: an answer in minutes, grounded in the same supply and BOM data running their factory, without ever touching a live ERP record. It replaces guesswork with a repeatable way to say yes, no, or not yet with confidence.”

Demand Scenario Modeling is available now to APEX customers and is purpose-built for the tactical-to-mid-horizon planning window — roughly one to twelve months out — where production teams most often need to turn a demand question into a production commitment.

About LeanDNA

LeanDNA powers the world’s discrete manufacturing with a single source of truth for factory-first supply planning, materials management, and inventory optimization. APEX, the AI-powered expert execution platform from LeanDNA, transforms data into optimized decisions and action. LeanDNA empowers manufacturers in aerospace, HVAC,industrials, automotive, and medical to improve on-time delivery and working capital levels. Leading manufacturers including Caterpillar, Daikin Applied, Safran, and Siemens use APEX for supply chain orchestration to gain visibility into current and incoming materials, take action based on inventory criticality, collaborate in real time with suppliers, and track progress toward inventory optimization goals. Learn more at LeanDNA.com.

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SOURCE LeanDNA Inc

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OppFi to Participate in September 2026 Conferences

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CHICAGO, Aug. 25, 2026 /PRNewswire/ — OppFi Inc. (NYSE: OPFI) (“OppFi” or the “Company”), a leading tech-enabled digital finance platform that works with banks to provide financial products and services for everyday Americans, today announced that management will participate in the following conferences in September 2026:

Oppenheimer Fintech Leaders Conference
Location: New York
Date: September 15, 2026

U.S. Bancorp | BTIG Consumer Finance Conference 2026
Location: Boston
Date: September 17, 2026

To schedule a meeting with OppFi, please reach out to your Oppenheimer or BTIG representatives.

About OppFi
OppFi (NYSE: OPFI) is a leading tech-enabled digital finance platform that works with banks to provide financial products and services for everyday Americans. Through a transparent and responsible platform, which includes financial inclusion and excellent customer experience, the Company supports consumers who are turned away by mainstream options to build better financial health. OppLoans by OppFi maintains a 4.4/5.0 star rating on Trustpilot with more than 5,400 reviews, making the Company one of the top consumer-rated financial platforms online. OppFi also holds a 35% equity interest in Bitty Holdings, LLC (“Bitty”), a credit access company that offers revenue-based financing and other working capital solutions to small businesses. For more information, please visit oppfi.com.

Investors:

investors@oppfi.com

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SOURCE OppFi

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Zillow Group to present at Goldman Sachs Communacopia + Technology Conference

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SEATTLE, Aug. 25, 2026 /PRNewswire/ — Zillow Group, Inc. (Nasdaq: Z and ZG), which is transforming the way people buy, sell, rent and finance homes, today announced Zillow Group will present at this year’s Goldman Sachs Communacopia + Technology Conference in San Francisco. 

Chief Operating Officer & Chief Financial Officer Jeremy Hofmann will participate in a fireside chat on Thursday, Sept. 10, at 10:50 a.m. PT / 1:50 p.m. ET. 

Register and access the live webcast here. Live and recorded versions of the webcast will also be available under the Events & Presentations section on Zillow Group’s Investor Relations website.

About Zillow Group:

Zillow Group, Inc. (Nasdaq: Z and ZG) is reimagining real estate to make home a reality for more and more people. 

As the most visited real estate app and website in the United States, Zillow connects hundreds of millions of consumers with innovative technology, trusted agents and loan officers, and seamless digital solutions. With industry-leading tools and resources, Zillow supercharges real estate professionals so they can grow their businesses and deliver exceptional client experiences. For renters and housing providers, Zillow offers not only a robust marketplace but a set of end-to-end products and services to streamline applications, leases, payments and more. 

Zillow’s ecosystem spans the entire home journey — from dreaming and shopping to renting, buying, selling and financing.

Zillow Group’s affiliates, subsidiaries and brands include Zillow®, Zillow Premier Agent®, Zillow Home Loans®, Zillow Rentals®, Zillow® New Construction, Trulia®, StreetEasy®, Out East®, HotPads®, Follow Up Boss®, ShowingTime®, dotloop® and Zillow® Closing.

All marks herein are owned by MFTB Holdco, Inc., a Zillow affiliate. Zillow Home Loans, LLC is an Equal Housing Lender, NMLS #10287 (www.nmlsconsumeraccess.org). © 2026 MFTB Holdco, Inc., a Zillow affiliate.

(ZFIN)

View original content to download multimedia:https://www.prnewswire.com/news-releases/zillow-group-to-present-at-goldman-sachs-communacopia–technology-conference-302859785.html

SOURCE Zillow Group, Inc.

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