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J.K. Fenner (India) Limited Announce Strategic Relationship with Yamada Manufacturing Co., Ltd.

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CHENNAI, India, Oct. 1, 2026 /PRNewswire/ — J.K. Fenner (India) Limited, a leading manufacturer of automotive and industrial engineering solutions, today announced a strategic relationship with Yamada Manufacturing Co., Ltd., Japan, to strengthen the development and manufacturing of advanced automotive components for domestic and global markets.

Established in 1946, Yamada Manufacturing Co., Ltd., Japan, is a leading Japanese automotive component manufacturer with expertise in oil pumps, water pumps, steering columns, drivetrain components, and other precision automotive systems. The company serves leading global OEMs, bringing decades of engineering excellence and manufacturing expertise.

The strategic relationship combines JK Fenner’s strong manufacturing capabilities, engineering expertise, and customer reach with Yamada Manufacturing’s advanced Japanese technology and product development capabilities. The partnership aims to accelerate innovation, enhance product quality, and address the evolving requirements of automotive OEMs, including next-generation mobility solutions.

Through this strategic relationship, the two companies will focus on:

Technology transfer for advanced automotive component manufacturing.Joint product development to meet global quality and performance standards.Localization of advanced technology products for the Indian automotive market.Enhancing manufacturing processes, quality systems, and engineering capabilities.Delivering innovative, reliable, and cost-effective mobility solutions to customers.

Through this strategic relationship, Yamada aims to accelerate its market entry and business expansion in India.

About Yamada Manufacturing Co., Ltd. 

Yamada Manufacturing Co.,Ltd. is specialized in development, design and manufacturing auto parts for the critical function of “driving, steering and braking” including transmission components, steering system components and automotive pumps, particularly oil and water pumps for automobiles and motorcycles. Yamada operates in Japan, United States, China and Thailand. Yamada’s philosophy is working together as a technology oriented corporation to provide value beyond customers’ expectations in a creative and original way, and to spread joy to people all over the world.

www.yamada-s.co.jp

About J.K. Fenner (India) Limited

J.K. Fenner (India) Limited is one of India’s leading manufacturers of automotive and industrial engineering solutions, offering a comprehensive portfolio that includes power transmission products, automotive components, sealing solutions, fluid transfer system, and engineered products. With a strong manufacturing footprint, advanced engineering capabilities, and a customer-first approach, the company serves leading OEMs and industrial customers across India and international markets.

www.jkfenner.com

Media Contact:
Phone: +91 44 4399 4666
Email:contact@jkfenner.com
Website:www.jkfenner.com

 

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MiniTool Video Converter 6.0: All-New Video Cutting & Merging Features

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VANCOUVER, BC, Oct. 1, 2026 /PRNewswire/ — MiniTool Software Limited has released a new version of its video converter – MiniTool Video Converter 6.0. This update brings video cutting and merging features, GPU acceleration, a new home page, UI improvements, and bug fixes.

Key Features of MiniTool Video Converter 6.0

Cut a video into segments.Merge multiple videos into one.Added GPU acceleration management.Optimized user interface.Fixed some bugs.

Cut a Video into Segments

MiniTool Video Converter 6.0 introduces a new video-cutting feature that allows you to split videos into segments and remove unwanted parts. It also enables you to trim the start or end of a video. You can export the cut video clips separately or into a combined file.

The video cutting feature supports a wide range of input formats, including AVI, 3GP, VOB, WebM, WMV, MP4, MOV, FLV, MKV, MPG, MPEG, MXF, M4V, TS, F4V, M2TS, ASF, and more.

Merge Multiple Videos into One

The latest version of MiniTool Video Converter supports merging multiple videos into one file. It also provides editing options for individual clips, including cutting, trimming, and adding transitions between clips.

The video merging feature supports various input formats, including AVI, 3GP, VOB, WebM, WMV, MP4, MOV, FLV, MKV, MPG, MXF, M4V, Xvid, OGV, DivX, and more. The merged video can be exported in MP4 format at 1080p.

Added GPU Acceleration Management

MiniTool Video Converter 6.0 uses GPU acceleration to offload video processing tasks to the GPU, improving video conversion, compression, transcription, enhancement, cutting, and merging efficiency. It makes better use of the computer’s hardware resources to increase processing speed, especially when processing large or high-resolution videos.

Optimized UI Interface

MiniTool Video Converter 6.0 adds a new Home page for quick access to its main video tools, including Convert Video, Compress Video, Cut Video, Merge Video, Video Enhancer, Intelligent Subtitle, and more.

Fixed Some Bugs

Fixed some issues to enhance the overall user experience:

Fixed software response delays in some scenarios.Fixed missing audio after video conversion on certain devices.Optimized Instagram downloads to retrieve only video content and exclude non-video items.

About MiniTool Video Converter

MiniTool Video Converter is a Windows-based multimedia tool from MiniTool Software Ltd. that brings multiple functions together in one application. It supports video and audio conversion, video compression, audio-to-text conversion, video enhancement, video cutting, and video merging features.

MiniTool Video Converter also offers AI-powered features, including Intelligent Subtitle for transcribing video or audio into text and exporting SRT or TXT files, as well as Video Enhancer for upscaling videos and reducing video grain.

About MiniTool® Software Ltd.

MiniTool® Software Ltd. is a software development company that provides customers with complete business software solutions for screen recording, audio and video format conversion, video compression, video editing, and data management.

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SOURCE MiniTool® Software Limited

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IGEL Brings Now & Next® Workspace & Endpoint Security Summit to Dubai

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The event brings together customers, partners, and industry leaders to advance endpoint security, resilience, and secure workspace delivery.

DUBAI, UAE, Oct. 1, 2026 /PRNewswire/ — IGEL®, a global software company delivering the IGEL Adaptive Secure Endpoint Platform™, today announced it is bringing the IGEL Now & Next® Workspace & Endpoint Security Summit to Dubai, United Arab Emirates, for a showcase on October 21, 2026, at Dubai Knowledge Park. The one-day program will bring together IT and security leaders to examine the endpoint security, resilience, and workspace delivery priorities shaping enterprise strategy across the region.

The Dubai event extends IGEL’s flagship Now & Next® series following its five-city European roadshow earlier this year, as well as events in Australia and the United States. It arrives as organizations across the Middle East increase investment in artificial intelligence, cloud services and digital experiences, expanding the technology environments they must manage and secure.

According to the UAE Government Cybersecurity Council, the country faces more than 90,000 to 200,000 breach attempts every day, underscoring the security pressures accompanying the region’s rapid digital transformation. As these environments become more distributed and interconnected, organizations are placing greater emphasis on strengthening cyber resilience and maintaining operational continuity while continuing to innovate.

“What we are hearing from customers is consistent: organizations want stronger control at the endpoint, greater resilience when disruption occurs, and a practical path to support both current and emerging workspace models,” said Klaus Oestermann, CEO of IGEL. “The Now & Next® summit roadshow is designed to bring those conversations closer to home, together with the customers and ecosystem partners, helping define the next phase of endpoint strategy.”

The summit will bring together IGEL leaders, customers, and ecosystem partners to share perspectives on secure endpoint strategy, resilience, and the future of digital work. Complementing the IGEL-led sessions, customers and ecosystem partners will bring real-world perspectives and expertise to the program, including event sponsors Microsoft, Omnissa, and Lenovo.

“Dubai is an important meeting point for technology leaders across the Middle East, and the Now & Next® summit gives us an opportunity to bring the region’s customers, partners and experts together around the challenges they are addressing today,” said Carsten Thomsen, VP of Sales for Emerging Markets at IGEL. “The goal is to turn those conversations into practical ideas organizations can take back to their own environments.”

The summit runs from morning sessions through the afternoon executive panel and networking lunch at Dubai Knowledge Park – Conference Centre Block 1. Attendance is open to enterprise IT and security leaders across the UAE and broader Middle East region.

To learn more about the security, resilience and workspace modernization topics that will be explored at Now & Next® Dubai, read the latest IGEL blog.

To review the full agenda, explore speakers, and register, visit the event page.

About IGEL
IGEL® is a global software company delivering the IGEL Adaptive Secure Endpoint Platform™, a trusted and governed endpoint platform for secure access to cloud, VDI, DaaS, SaaS, Secure Browsers, enterprise applications, as well as OT endpoints. At its foundation is IGEL OS, an immutable operating system that helps reduce endpoint attack surface, preserve a known-good endpoint state, and support secure access across distributed work environments. Through the IGEL Preventative Security Model®, the platform adds attested workload delivery, centralized governance, and contextual enforcement, aligning endpoint security with Zero Trust and SSE/SASE architectures from key IGEL Ready partners.

IGEL Business Continuity & Disaster Recovery™ (BC&DR) helps organizations restore secure access on Windows endpoints affected by ransomware, other cyberattacks, or outages. Founded in 2001, IGEL is headquartered in Germany with U.S. offices in San Francisco and Fort Lauderdale, working with an ecosystem of 130 leading technology brands. Learn more at www.igel.com.

Windows is a trademark of the Microsoft group of companies.

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SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under ‘K-On-Device AI Semiconductor’ Program

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Accelerates commercialization of robotics AI chip through end-to-end “Spec Hand-off” developmentIntegrates next-generation memory and interface technologies, including LPDDR6, PCIe Gen6 and UCIe-SExpands applications beyond data center, HPC and edge AI into Physical AI, diversifying business portfolio

SEOUL, South Korea, Oct. 1, 2026 /PRNewswire/ — SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced today that it has signed a turnkey development contract with Mobilint, a South Korean AI semiconductor company, to develop an AI chip for robotics applications.

The project is part of the “K-On-Device AI Semiconductor Technology Development” program led by Korea’s Ministry of Trade, Industry and Resources (MOTIR). The government-funded program supports collaboration between domestic AI semiconductor companies and end-user companies to develop and validate chips tailored to industry-specific products, with the core objective of carrying them through to commercialization.

Through this collaboration, the two companies aim to deliver a robotics chip capable of performing high-performance AI computation on its own, even in outdoor environments where connectivity to external servers is limited. The custom chip will be deployed in applications such as agricultural robots, processing vision and sensor data in real time across diverse operating conditions.

Notably, the project will be carried out under SEMIFIVE’s “Spec Hand-off” model, the earliest-stage engagement within its turnkey business. Unlike conventional approaches in which customers complete a substantial portion of the design before handing off downstream processes, Spec Hand-off allows customers to simply define their key performance targets and specifications, while SEMIFIVE delivers integrated services across the entire process, from detailed design to packaging, testing and mass production.

The chip will integrate a wide range of next-generation technologies, including LPDDR6, the latest low-power DRAM standard; PCIe Gen6, a high-speed interface; and UCIe-S (Universal Chiplet Interconnect Express – Standard Package), which connects multiple function-specific chiplets at high speed within a single package so they operate as a single monolithic die. These technologies will enable the chip to achieve both high power efficiency and operational stability without data bottlenecks, even in outdoor settings such as areas with limited network coverage.

The two companies expect the collaboration to contribute to building a homegrown AI semiconductor ecosystem in Korea, while securing an early lead in next-generation robotics platforms and creating new markets.

“This contract marks a pivotal moment for SEMIFIVE as we extend our proven, end-to-end ASIC capabilities from data center and edge AI into the realm of robotics AI,” said Brandon Cho, CEO and co-founder of SEMIFIVE. “As a leader in custom semiconductors, we will continue to expand our technological footprint and influence across advanced industries.”

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SOURCE SEMIFIVE

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