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Works360 Launches PLAiPulse, Bringing the AI PC Experience to Life

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New experience intelligence technology makes AI compute visible during hands-on customer evaluations, with broader commercial availability planned for 2027

HOUSTON, Oct. 6, 2026 /PRNewswire/ — Works360 today announced the launch of PLAiPulse™, a new AI PC experience intelligence technology designed to make the technology inside an AI PC visible while customers evaluate devices in their own environments.

As AI PCs increasingly distribute workloads across CPUs, GPUs and dedicated NPUs, much of what differentiates these systems happens beneath the applications customers use every day. PLAiPulse gives customers a simple, real-time view into how key compute resources respond while they use their own applications, workflows and AI experiences.

Rather than evaluating an AI PC solely through specifications or a short demonstration, customers can experience the device in their actual work environment and see how its underlying compute resources are being utilized.

“The AI PC represents a major shift in personal computing, but much of what makes these systems different happens underneath the surface,” said Ali Khan, Founder of Works360. “PLAiPulse helps make that technology visible. Customers can experience the AI PC with their own applications and workflows and actually see the CPU, GPU and NPU come alive.”

See the AI PC Come Alive

PLAiPulse is being introduced across select Works360-operated AI PC evaluation programs, enabling customers to experience eligible AI PCs before making broader deployment decisions.

The initial rollout includes eligible systems powered by Intel® Core™ Ultra processors and Qualcomm Snapdragon® X Series platforms, as well as select Works360-operated Microsoft Surface evaluation programs through distribution. Availability also extends to select Intel-based AI PC evaluation programs in Australia and New Zealand.

PLAiPulse is a Works360 technology designed to support AI PC evaluation experiences across multiple processor and device platforms, giving customers a consistent way to explore how CPU, GPU and NPU resources respond during real-world use.

Making AI Compute Visible

Modern AI PCs combine multiple compute engines designed for different types of workloads. PLAiPulse provides a visual experience that helps customers observe how those resources are being utilized while they work.

CPU utilizationGPU utilizationNPU utilizationMemory utilizationPower consumptionAdditional system and experience metrics where supported

This allows customers to move beyond the specification sheet and better understand what is happening inside the AI PC during a hands-on evaluation.

Built for a Multi-Platform AI PC Market

The AI PC market is rapidly expanding across processor architectures and device platforms. PLAiPulse is designed as a platform-independent Works360 technology that can support evaluation experiences across that evolving ecosystem.

Within Works360-operated programs, eligible Intel Core Ultra-based AI PCs can be experienced with PLAiPulse across participating evaluation programs. Works360 is also extending PLAiPulse to Qualcomm Snapdragon X Series-powered AI PC evaluation experiences and select Microsoft Surface evaluation programs through distribution.

By supporting multiple AI PC architectures and device platforms, PLAiPulse helps create a consistent evaluation experience while allowing customers to use the applications and workflows that matter to their own organizations.

A New Way to Experience On-Device AI

As more AI experiences move onto the PC, dedicated local compute resources are becoming increasingly important. PLAiPulse is designed to help make that shift more tangible during the evaluation process by showing customers how system resources respond as they work.

“As AI PCs take advantage of dedicated processing across the CPU, GPU and NPU, giving customers greater visibility into how those resources are being utilized can help make the AI PC experience more tangible,” said Gavin Georgitsis of Qualcomm Technologies. “PLAiPulse gives customers a new way to explore that experience while evaluating Snapdragon-powered PCs with their own applications and workflows.”

From Demo Device to Experience Intelligence

PLAiPulse is designed to complement the physical AI PC evaluation programs Works360 operates with technology manufacturers, distributors and solution providers. Customers receive an eligible AI PC to evaluate in their own environment and can use PLAiPulse to better understand how the system behaves during the experience.

For sales teams, the technology creates a more tangible way to demonstrate the differences behind the next generation of AI PCs while giving customers the opportunity to evaluate the technology for themselves.

“You can talk about TOPS, NPUs and AI acceleration all day,” Khan added. “But when a customer can actually use the PC and see what’s happening inside it, the conversation changes. That’s what we want PLAiPulse to enable.”

Experience the AI PC

PLAiPulse will begin appearing across select Works360-operated AI PC evaluation programs, with broader availability planned as the technology expands across additional programs, devices and partners.

Following its initial deployment across Works360-powered AI PC evaluation programs, Works360 plans to expand PLAiPulse in 2027 as a commercially available experience intelligence solution for organizations looking to better understand how AI PCs are being utilized across real-world applications and workflows.

Customers: Request an eligible AI PC evaluation and experience PLAiPulse.

Sales teams: Bring a PLAiPulse-enabled AI PC evaluation into a qualified customer opportunity.

About Works360

Works360 designs and operates technology evaluation programs that help manufacturers, distributors, solution providers and sales organizations put technology into the hands of customers. Through its evaluation infrastructure and PLAi technology platform, Works360 connects physical product experiences with digital tools, analytics and experience intelligence designed to help customers better understand technology before making deployment decisions.

PLAiPulse™ — See the AI PC Come Alive.

Program & Trademark Notice

PLAiPulse is a Works360 technology. References to manufacturers, processors, devices or evaluation programs indicate compatibility or program availability and do not imply endorsement of PLAiPulse by those companies unless expressly stated. All trademarks are the property of their respective owners.

Media Contact

PLAi Team
Team@theplai.ai
www.theplai.ai

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NovoLINC Demonstrates 400 W/cm² Cooling on Warped Silicon with MaxLINC™

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MaxLINC™ sustains 400 W/cm² heat flux and 3,300 W total power on production-representative silicon with ~150 µm warpage, demonstrating a path to overcoming a critical thermal barrier for next-generation AI accelerators.

PITTSBURGH, Oct. 6, 2026 /PRNewswire/ — NovoLINC, a provider of advanced thermal solutions for AI computing, today announced a significant high-power demonstration of its MaxLINC™ thermal interface material, achieving 400 W/cm² uniform heat flux and 3,300 W total power on a production-representative silicon test die with approximately 150 µm of warpage.

The demonstration was conducted using a specialized single-phase direct liquid cooling cold plate from CoolIT, an Ecolab Company. Throughout the test, the complete thermal stack maintained the silicon junction temperature below 90°C, demonstrating MaxLINC’s ability to provide highly effective heat transfer even when significant die warpage creates challenging mechanical and thermal interface conditions.

As AI processors move toward higher power and larger package sizes, silicon and package warpage are becoming increasingly important thermal design challenges. Even small variations in flatness can create uneven contact at the interface between the semiconductor and cooling system, increasing thermal resistance and potentially creating localized hot spots.

MaxLINC is engineered to address this challenge through NovoLINC’s proprietary nanostructured composite architecture, combining ultra-low thermal resistance with mechanical compliance. The technology is designed to maintain effective thermal contact across non-flat surfaces, enabling efficient heat transfer from high-power semiconductor devices into advanced cooling systems.

“NovoLINC is actively working with companies across single-phase direct liquid cooling, two-phase direct liquid cooling, and immersion cooling,” said Dr. Sheng Shen, CTO of NovoLINC. “These results demonstrate a clear thermal roadmap: combining NovoLINC’s advanced thermal interface technology with today’s and future liquid cooling systems can provide a pathway to enabling advancement of higher-power chips and AI server architectures.”

“Data center operators are making long-term infrastructure decisions today, and they need confidence that the cooling they deploy will keep up with future silicon,” said Ben Sutton, Product Marketing Manager at CoolIT™. “Pairing CoolIT’s advanced cold plate technology with NovoLINC’s MaxLINC shows that single-phase DLC can handle high-heat-flux processors well into the next decade, without the cost and complexity of switching cooling architectures.”

The demonstration reached 3,300 W of total device power, highlighting the ability of MaxLINC to address the rapidly increasing thermal demands of next-generation GPUs, CPUs, ASICs, and other AI accelerators.

“AI compute is advancing toward multi-kilowatt processors, but extracting that heat efficiently from increasingly large and mechanically complex packages is becoming one of the industry’s most difficult challenges,” said Dr. Ning Li, CEO of NovoLINC. “Our goal with MaxLINC is to remove the thermal interface as a limiting factor, and to give chip designers, system designers, and cooling partners greater freedom to push compute performance and power density to the next level.”

The 400 W/cm² demonstration builds on NovoLINC’s development of MaxLINC for high-performance semiconductor thermal interfaces. The platform is designed for use across the thermal pathway, from direct chip-to-cooling interfaces and chip-to-package heat spreaders to interfaces between packaged devices and cold plates or other advanced cooling hardware.

MaxLINC samples are available for customer evaluation and qualification.

About NovoLINC

NovoLINC is a Pittsburgh-based advanced materials company developing next-generation thermal interface solutions for AI computing and other energy-dense electronic systems. Spun out of Carnegie Mellon University, NovoLINC has developed a proprietary nanostructured materials platform and a scalable manufacturing process designed to overcome thermal bottlenecks in high-performance computing, data centers, automotive electronics, aerospace systems, and power electronics.

NovoLINC works with leading companies across the semiconductor, hyperscaler, AI server OEM/ODM, and cooling systems industries to enable higher computing performance while improving the energy efficiency and sustainability of next-generation computing infrastructure. The company’s technology development has been supported by the U.S. National Science Foundation and the U.S. Department of Energy’s ARPA-E COOLERCHIPS program.

www.novolinc.com

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GEP NAMED AS A LEADER IN SUPPLY CHAIN PLATFORMS EVALUATION, RECEIVES HIGHEST SCORE POSSIBLE IN INNOVATION CRITERION

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GEP recognized for its investments in AI-native architecture, agentic AI, and autonomous decision-making supplier networksRecognition follows recent leadership positions from Gartner, IDC and The Hackett Group across procurement, direct spend and supply chain technology

CLARK, N.J., Oct. 7, 2026 /PRNewswire/ — GEP®, a leading provider of AI-powered procurement and supply chain platforms and services to Fortune 500 and Global 2000 enterprises worldwide, today announced that it has been named a Leader in The Forrester Wave™: Supply Chain Platforms, Q3 2026, a recognition that GEP believes places it among the leading providers in the broader enterprise supply chain technologies.

Forrester evaluated 13 of the most significant supply chain platform providers and named GEP a Leader. GEP also received the highest possible score of 5 out of 5 in the Innovation criterion.

Forrester specifically cited GEP’s investments in agentic AI, knowledge graphs, autonomous decision-making and AI-native architecture. It also recognized GEP’s superior network participant authentication, and demand signal and forecast collaboration.

 “We have invested in building an AI-native platform because the real value of AI comes only when it is embedded across the work, the data and the decisions to identify new value, reduce risk, and drive competitive compete,” said Subhash Makhija, CEO and co-founder, GEP. “GEP Quantum Intelligence provides our customers a fundamentally different advantage: one intelligent platform connecting sourcing, suppliers, risk, demand and execution, rather than adding a thin layer AI on top of fragmented systems.”

Forrester said GEP is best suited to large enterprises seeking a unified procurement and supply chain platform with strong agentic AI, network collaboration, autonomous decision-making and multienterprise orchestration capabilities. Customers interviewed by Forrester also praised GEP’s service and transparency and expressed positive repurchase intent.

GEP believes this recognition extends its leadership from procurement and direct materials into the broader supply chain platform market. It also follows a series of major independent analyst assessments placing GEP at the forefront of enterprise procurement and supply chain technology:

Gartner® named GEP a Leader in the 2026 Magic Quadrant™ for Source-to-Pay Suites.

The Hackett Group named GEP a Leader in its Fall 2026 SolutionMap, with GEP the only provider at the top of the “Sophisticated & Holistic” category across all 15 evaluated areas.

IDC MarketScape named GEP a Leader in its 2026 assessment of AI-enabled direct spend.

Together, for GEP, the assessments recognize a common set of strengths: Its comprehensive source-to-pay capabilities, unified platform and data, AI and agentic innovation, and deep procurement expertise.

GEP Quantum Intelligence™ brings procurement and supply chain capabilities together on an AI-native platform, connecting sourcing, supplier intelligence, multi-tier visibility and risk management with demand signals, supply collaboration and execution.

Forrester does not endorse any company, product, brand, or service included in its research publications and does not advise any person to select the products or services of any company or brand based on the ratings included in such publications. Information is based on the best available resources. Opinions reflect judgment at the time and are subject to change. This report is part of a broader collection of Forrester resources, including interactive models, frameworks, tools, data, and access to analyst guidance. For more information, read about Forrester’s objectivity here .

About GEP

GEP® delivers AI-native procurement and supply chain Quantum Intelligence platform, consulting and services that help global enterprises become more agile and resilient, operate more efficiently and effectively, gain competitive advantage, boost profitability and increase shareholder value. Our customers are the world’s best companies, including more than 550 Fortune 500 and Global 2000 industry leaders who rely on GEP to meet ambitious strategic, financial and operational goals. A leader in multiple Gartner Magic Quadrants, GEP’s AI-native Quantum Intelligence platform consistently win awards and recognition from industry analysts, research firms and media outlets, including Gartner, IDC, ISG, and Spend Matters. GEP is also regularly ranked a top procurement and supply chain consulting and strategy firm, and a leading managed services provider by ALM, Everest Group, NelsonHall, IDC, ISG and HFS, among others. Headquartered in Clark, New Jersey, GEP has offices and operations centers across Europe, Asia, Africa and the Americas. To learn more, visit www.gep.com.

Media Contact

Derek Creevey
GEP
derek.creevey@gep.com

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Drainage Planning and Flood Planning Examined In HelloNation, Featuring Land Surveying and Drainage Engineer Expert Michael Cuppy

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The article explains how early water management decisions protect building site stability and reduce costly construction risks.

PUEBLO, Colo., Oct. 6, 2026 /PRNewswire/ — What role should drainage planning and flood planning play before construction begins on a building site? HelloNation has published the answer in an article, featuring insights from Engineering & Surveying Expert Michael Cuppy of Pueblo, Colorado.

 

The HelloNation article explains that drainage planning is a critical part of preparing any building site, yet it is often overlooked during early construction decisions. Water management affects everything from grading to long-term structural performance, making it essential to evaluate how runoff will move across the property. Without proper drainage planning, water can collect in unwanted areas, leading to erosion, foundation damage, and limited site access during storms.

The article describes how a well-designed drainage planning approach maps the natural flow of runoff and identifies low points across a building site. Engineers use this information to guide grading decisions and develop systems such as swales, retention areas, or underground piping. These elements help control water management and ensure that runoff is directed away from structures, roads, and utilities. By aligning site layout with natural water flow, construction projects can avoid preventable complications.

Flood planning expands on drainage planning by addressing more extreme weather conditions. The article notes that flood planning considers how a building site will respond during heavy rainfall or seasonal flooding events. This process allows engineers to adjust grading, elevate structures when necessary, and reinforce vulnerable areas. Without proper flood planning, construction projects face increased risks that can lead to costly repairs and long-term damage.

The article emphasizes that even small miscalculations in runoff patterns can create major issues for a building site. Poor drainage planning can result in standing water, soil instability, or basement flooding. These problems often extend beyond the original construction area, affecting neighboring properties and increasing liability. Engineering & Surveying Experts highlight that early analysis of grading and water management helps prevent these outcomes and supports a more stable site layout.

In addition to protecting structures, the article explains that effective drainage planning improves the performance of infrastructure over time. Roads, landscaping, and utility systems all depend on proper water management to function correctly. When runoff is controlled through thoughtful grading and design, maintenance needs are reduced, and long-term durability improves. This makes drainage planning an essential part of both short-term construction success and long-term property value.

Flood planning also plays an important role in regulatory and insurance considerations. The article notes that local municipalities often require drainage planning and flood planning documentation before approving construction permits. Insurance providers may also evaluate flood risk when determining coverage requirements. Addressing these factors early helps streamline the construction process and reduces the likelihood of delays.

The article further explains that integrating drainage planning into site layout decisions leads to more efficient construction outcomes. When grading, utilities, and road placement are designed with water management in mind, builders can avoid costly redesigns. Engineering & Surveying Experts emphasize that proactive planning allows construction teams to work with natural site conditions rather than against them.

Ultimately, the HelloNation article presents drainage planning and flood planning as essential components of responsible construction. Ignoring water management may seem like a shortcut, but it often leads to complex, expensive challenges. By focusing on runoff control, grading accuracy, and thoughtful site layout, builders can create safer, more resilient building site conditions.

Why Drainage and Flood Planning Matter Before You Build features insights from Michael Cuppy, Engineering & Surveying Experts of Pueblo, Colorado, in HelloNation.

About HelloNation
HelloNation is a premier media platform that connects readers with trusted professionals and businesses across various industries. Through its innovative “edvertising” approach that blends educational content with storytelling, HelloNation delivers expert-driven, good-news articles that inform, inspire, and empower. Covering topics from home improvement and health to business strategy and lifestyle, HelloNation highlights leaders making a meaningful impact in their communities.

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