Technology
GMIF2026: AI Inference Powers the “Token Factory” and Drives System-Level Rethinking of Memory & Storage
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6 hours agoon
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SHENZHEN, China, Oct. 18, 2026 /PRNewswire/ — The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026, GMIF2026) recently concluded at the Renaissance Shenzhen Bay Hotel. Co-hosted by the Shenzhen Memory Industry Association (SMIA) and the School of Integrated Circuits at Peking University, the summit was themed “The Future Built on AI Memory and Storage.” Now in its fifth edition, GMIF has grown from a regional industry gathering into a benchmark for the global semiconductor memory ecosystem, with diversified programs including keynote sessions, an investment forum, product exhibitions, a global livestream, and a golf friendship match, all centered on the value of memory and storage in the token economy and the AI inference era.
In the opening remarks by Rixin Sun, President of Shenzhen Memory Industry Association (SMIA), GMIF’s growth over five consecutive editions was traced from its early days to today. As a platform for global exchange, GMIF is built around the memory value chain, linking wafer IDMs and players in controllers, modules, packaging and testing, equipment and materials, and end applications to promote technical exchange, supply-demand matching, and ecosystem cooperation.
President Sun noted that as AI evolves from generative to agentic, inference efficiency, data scheduling, and system coordination have become shared priorities. Collaboration across the value chain is no longer a traditional supply-demand relationship, but a deeper partnership built around workload requirements, joint product definition, and scenario validation. Looking ahead, GMIF will pursue a more specialized and differentiated format, connecting memory companies with AI compute and end-application players worldwide.
Capital Meets Technology: Memory & Storage Moves to the Center of AI Infrastructure
As AI shifts from model training to large-scale commercial inference, the token is becoming a new unit of value. Inference demands low latency, high concurrency, and sustained throughput, which places memory and storage bandwidth, capacity, and energy efficiency among the variables that shape overall system efficiency and cost.
Daniel Yen of Morgan Stanley projected that global data center capital expenditure will stay strong in the coming years, with more than half of cloud data center capex expected to go to memory & storage (excluding HBM) by 2027. Yen identified six innovation paths to overcome the “memory wall” challenge: process migration, design changes, advanced packaging, memory peripherals, PIM/CIM, and new materials.
Prof. Yimao Cai, Dean of the School of Integrated Circuits at Peking University, pointed out that HBM remains central to high-end AI compute, but yield, cost, and thermal constraints limit broader adoption. NAND-based high-bandwidth technologies such as HBF have become a major research focus because of their cost advantage, and hybrid multi-media architectures could balance performance, capacity, and cost for deploying models with hundreds of billions of parameters.
Kevin Yoon, CVP & CTO of Samsung Memory China at Samsung Electronics, described how agents are generating massive KV cache demand and driving rapid iteration of tiered storage, citing Samsung’s work on Z-NAND, PCIe Gen6 SSDs, and ultra-high-capacity data center SSDs. Maya Zhang, Senior Director of Product Marketing from Sandisk, called this the first year of the “inference boom.” As inference reaches commercial scale, AI data centers are shifting from cost centers to value and capacity centers, and the evaluation framework is moving from TCO to TVO. NAND is becoming a strategic core component of AI, and the SSD is becoming a “token battery” that greatly improves the economics of the industry through token reuse.
Solidigm and Arm focused on the evolution of system-level design. Benny Ni, GAR Sales VP at Solidigm, noted high-capacity QLC SSDs are being adopted faster, and that memory offloading has moved from an alternative to a core design paradigm for data centers, while liquid cooling has become a prerequisite for unlocking high-end storage performance. John Xavier Lionel, Head of Global Storage Business at Arm, shared competition in the AI era is shifting from simply chasing higher TOPS to building a more efficient system balance among compute, memory, storage, and data movement. Arm’s cloud-edge-device continuum framework balances power, capacity, bandwidth, latency, security, and cost constraints at each tier, so that “the right AI workload runs in the right place.”
Moving from the cloud to the edge, Stanley Huang, AVP of Silicon Motion, stressed that devices are the ultimate carrier of AI experiences and that intelligent storage directly determines real-world device performance. Its PerformaShape technology allocates resources flexibly across different agents and greatly improves read/write consistency.
Sam Sun, Chairman of BIWIN, explained that large-scale AI inference is extending memory demand from data centers to the edge and endpoints, where differing needs in capacity, performance, power, size, and reliability are pushing storage from general-purpose specifications toward deep matching with specific scenarios and platforms. Drawing on full-stack capabilities from media selection and controller and firmware development to advanced packaging, testing, and volume delivery, BIWIN works closely with customers, platforms, and chip makers to tailor products to each use case, shortening development and validation cycles and improving system space, energy efficiency, and performance.
Token Factories Move Enterprise AI from Pilot to Production
As the token becomes the core unit of value, producing tokens efficiently and at low cost has become a shared challenge for enterprise AI adoption worldwide, and the “token factory” is emerging as a new industry paradigm. Tao Zhou, General Manager of the Server Division of Lenovo ISG China, said 80% of enterprises have deployed at least one type of agent, yet fewer than 40% of projects can scale and deliver positive ROI. Lenovo has built a full-stack “token factory” paradigm spanning data governance, compute optimization, and security management to address this.
A solid token factory depends on underlying storage media and architecture. Numbers Law’s PMD (Parallel Magnetic Drive) technology and NEXWISE‘s “KuberCloud” token factory solution contributed to full-stack capability from hardware to compute scheduling and model operations. Infplane, Maxio, and Genstoraige lowered the deployment threshold for large on-device models through AI SSD tiered offloading and memory expansion.
Real-world applications are also deepening. SYNCORE has achieved vehicle-cloud embodied intelligence across the whole vehicle. Dify, with its private agent architecture, and Paratera, with its MaaS compute service platform, are moving AI from basic compute supply toward deeper industry intelligence services, accelerating the industrialization of AI.
40 Companies Showcase the Core of the AI Memory & Storage Chain
The concurrent exhibition brought together 40 companies across the full value chain, from memory chips and controllers to compute servers, AIDC services, packaging and testing equipment, and system applications, presenting the latest advances in AI memory and storage from around the world.
Memory IDMs and controller makers led with new products. SanDisk featured its iNAND AT EU752 automotive UFS 4.1, SN861 enterprise NVMe SSD, and BiCS8 QLC NAND. Silicon Motion introduced the SM8466 PCIe Gen6 16-channel controller and the SM2524XT controller for edge SSDs. Maxio, YEESTOR, and other Chinese controller makers showed flagship PCIe Gen4/Gen5 and UFS controllers with enhanced LDPC, a sign that China’s controller portfolio is taking shape and benchmarking itself against leading international standards.
Compute and token factory solutions were another highlight. Lenovo exhibited its WenTian series of AI training-and-inference integrated servers. NEXWISE presented its full-stack token factory hardware and software, with heterogeneous compute management and token-based billing. Paratera showed its intelligent compute cloud and supercomputing cloud services, and Numbers Law demonstrated its PMD (Parallel Magnetic Drive) technology, aimed at sharply raising HDD IOPS and throughput. Infplane, Genstoraige, and Quanxing introduced KV cache offload and memory-fusion AI SSD solutions that use storage to share the compute load and significantly cut deployment costs.
Module makers and full-scenario solution providers brought a wide range of products. BIWIN exhibited enterprise SSDs, CXL products, wide-temperature industrial storage, and embedded products spanning AI cloud, edge, and device. KingSpec, POWEV, Topdisk, Barycn, Jielong Storage, HIKSEMI, and others presented industrial-grade, automotive-grade, server, and embedded product families, demonstrating strong volume production and reliable delivery.
Equipment, testing, and materials suppliers rounded out the floor. Attach Point, MICROVIEW, and Maxwell Technologies showed die attach and bonding equipment for 2.5D/3D advanced packaging. OKN Technology, Acroview Technology, Hongjingwei, and Tytantest introduced test and burn-in systems covering SSD, DRAM, and NAND that can accurately reproduce high-load AI I/O scenarios. Hemei Jingyi and Silergy brought storage IC package substrates and dedicated power management ICs. From advanced packaging equipment to test validation to core components, this supporting ecosystem lays the manufacturing foundation for volume production of AI memory and storage and for Chinese suppliers expanding overseas.
GMIF2026 Annual Awards Unveiled: Global Memory & Storage Leaders Build an Open, Collaborative Ecosystem
To recognize companies that have made outstanding contributions to the memory and storage value chain, the summit established the GMIF2026 Annual Awards, which cover memory, compute, packaging and testing equipment, test systems, and end applications across AI infrastructure, and were judged on technological innovation, industry contribution, market service, and real-world results.
Honorees, including Samsung Semiconductor, SanDisk, Solidigm, CXMT, Arm, Lenovo, Dify, Silicon Motion, Infplane, Genstoraige, Numbers Law, Paratera, SYNCORE, NEXWISE, Maxio Technology, BIWIN, Topdisk, KingSpec, POWEV, Quanxing Technology, OKN Technology, Attach Point, COMIX, Barycn, LKAUTO, Maxwell Technologies, Hemei Jingyi, Silergy, Heyan Technology, ExTripod Electronics, UNIMOS, GBAT, and Tytantest, were recognized for standout achievements in technology breakthroughs, product deployment, ecosystem building, and the industry chain.
Global Livestream and Golf Friendship Match Extend the Boundaries of Industry Cooperation
To join the global ecosystem and expand international cooperation, the summit featured a special Global Livestream by Memory Brands on LinkedIn, Facebook, and YouTube. Eight brands presented online: BIWIN, Silicon Motion, Quanxing Technology, OKN Technology, KingSpec, Maxwell Technologies, ExTripod Electronics, and Silergy. They gave overseas audiences a direct look at China’s latest advances in memory chips, advanced packaging, test systems, and other core AI infrastructure components, connecting technology standards, supply chain resources, and market demand across regions.
The momentum carried into the next day. The GMIF2026 “BIWIN Cup” golf friendship match, exclusively sponsored by BIWIN, brought senior executives from across the global memory value chain to the course. After a day of intensive discussion at the main forum, the setting was more relaxed, but the conversations among technology, capital, and markets carried on, helping speed practical cooperation across borders and sectors.
Conclusion
Across the GMIF program, one message stood out: global AI competition is moving beyond the “single-point era” of peak GPU performance into a “system-level era” that integrates storage, compute, networking, and software. In the token economy, memory and storage is shedding its auxiliary role and becoming the strategic foundation of AI inference.
This edition of GMIF brought together capital outlook, frontier technology, product innovation, real-world practice, and ecosystem collaboration, and, with the awards, livestream, and networking events, carried the conversation from ideas to product showcases, overseas exposure, and business deals. Going forward, GMIF will stay focused on the industry’s frontier issues and connect key players across the global memory value chain, promoting joint standards, technology development, and market expansion to open a new chapter for the AI memory and storage industry.
About GMIF
Global Memory Innovation Forum (GMIF) is a premier annual gathering that connects the global memory and storage community. Featuring diverse activities including keynote speeches, roundtable dialogues, supply-demand match-making, product showcases, industry rankings, awards programs, and global livestreaming, GMIF brings together key enterprises across the memory and storage chain, technical experts, terminal companies and investment institutions to exchange insights, build partnerships, and create business opportunities. Learn more about GMIF, please visit https://www.gmif.com.cn/. Follow us on LinkedIn, YouTube and Facebook.
Media Contact:
Carina Gu, wenjing.gu@gmif.com.cn
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SOURCE Shenzhen Memory Industry Association (SMIA)
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Technology
HiBy Launches RS2 II Portable Hi-Fi Player with Flagship DARWIN III Architecture
Published
16 minutes agoon
October 19, 2026By
LEWES, Del., Oct. 19, 2026 /CNW/ — HiBy has officially launched the RS2 II, a compact portable Hi-Fi player featuring the company’s third-generation DARWIN III audio architecture, the same architecture used in the flagship RS8 II. Designed for audiophiles seeking flagship-level sound in a smaller and more portable form, the RS2 II combines HiBy’s proprietary R2R technology, a fully balanced analog stage, HiByOS, and flexible connectivity.
At the heart of the RS2 II is the DARWIN III architecture, powered by a newly developed FPGA digital engine featuring more than 35K logic units and 40 high-speed, high-performance DSP units. This processing platform provides the computing power required for HiBy’s adjustable pure FIR filters, multiple DARWIN filters, harmonic control, NOS/OS switching, and native DSD processing.
Digital-to-analog conversion is handled by a high-precision R2R resistor network. High-speed electronic switches drive the resistor network to convert digital signals into corresponding analog voltage levels, helping reduce high-frequency noise introduced by digital modulation while delivering a natural, transparent, and musical presentation.
The analog stage uses a four-stage OPA1612 signal chain. One OPA1612 performs low-pass filtering after the DAC stage, another provides current amplification after volume control, while two additional OPA1612 devices form a fully balanced voltage amplification stage. At the headphone output, four flagship-grade OPA1622 amplifiers provide independent four-channel current amplification for improved dynamics, control, and compatibility with multi-driver earphones.
The RS2 II is also more compact than its predecessor. The standard aluminum alloy edition weighs just 156g and features a dark green finish with a houndstooth-pattern rear panel. Compared with the original RS2, the display area has increased by 45% and resolution by 122%. The new 3.55-inch 480 × 800 display, together with narrower bezels, provides a significantly improved visual experience. An upgraded X1600E dual-core platform further enhances system responsiveness.
Running HiBy’s dedicated HiByOS, the RS2 II supports coaxial output, Line Out, and USB DAC functionality. Dual microSD card slots support up to 4TB of total expandable storage.
The HiBy RS2 II Aluminum Alloy Edition is priced at US$439 and is available as a standard production model. The Limited Brass Edition is priced at US$549 and is expected to become available in October, with worldwide production restricted to just 500 units.
Contact
William Yueng
bd@hiby.com
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SOURCE HiBy
Technology
Beyond a Single Payment Rail: Building Resilience into Cross-Border B2B Trade
Published
17 minutes agoon
October 19, 2026By
At the 140th Canton Fair, PhotonPay examines how fiat and stablecoin infrastructure can give advanced manufacturers more flexibility in managing cross-border payments and working capital.
HONG KONG, Oct. 19, 2026 /PRNewswire/ — A piece of industrial machinery may take months to engineer, manufacture and deliver. The payments behind it follow a different timeline. Suppliers need to be paid, freight costs must be covered, and overseas buyers may settle invoices in stages. When production, delivery and payment span multiple markets, keeping these commitments aligned becomes a challenge of its own.
At the 140th Canton Fair, where manufacturers are showcasing industrial machinery, electronic components, automotive parts and other advanced manufacturing products, this less visible side of global trade deserves closer attention. PhotonPay is participating in the fair at Area D, Booths DT1714–DT1718, examining how more flexible financial infrastructure can help businesses manage cross-border payments alongside the demands of international trade.
The Payment Gap Behind Global Supply Chains
Supply chain resilience is often discussed in terms of sourcing, manufacturing capacity and logistics. The flow of money deserves the same attention.
A manufacturer may have sufficient orders and production capacity but still face pressure when incoming payments and outgoing obligations fall out of sync. A payment initiated by a buyer does not necessarily mean the funds are immediately available to the seller. The transfer may involve multiple financial institutions, currency conversion, local processing and compliance checks before the recipient can use the money.
Costs can also be difficult to assess across different payment corridors. Depending on the banks and arrangements involved, intermediary fees, foreign exchange charges and other transaction costs may affect the final amount received. Limited visibility into a payment’s status can make it harder for finance teams to plan supplier payments and reconcile invoices.
The answer is not to abandon established banking infrastructure. Bank transfers still remain important to international trade. Nor is every payment delayed or expensive simply because it crosses a border. The more useful question is whether businesses have the right payment options for different markets, currencies and settlement requirements, rather than relying on one approach for every transaction.
Why Fiat and Stablecoin Rails Need to Work Together
Discussions about cross-border payments increasingly include stablecoins, but the choice facing corporate finance teams is not simply traditional banking versus blockchain.
Banking infrastructure remains essential. It connects businesses to local accounts, domestic payment systems and established financial relationships. Stablecoin networks offer a different set of capabilities: transfers can take place outside conventional banking hours, subject to the network and service arrangements involved.
Each serves different needs. A stablecoin transfer alone may not put spendable local currency in a supplier’s hands. The recipient’s ability to accept the asset, conversion and liquidity arrangements, access to local payout channels and applicable regulatory requirements all matter. A business also needs to know how a transaction will be screened, recorded and reconciled with its underlying commercial documents.
This is where a dual-rail model becomes relevant. By connecting traditional fiat infrastructure with stablecoin payment channels, a business can access different ways to move funds within a unified financial environment, where supported and permitted.
The choice of payment route should reflect the corridor, currency, counterparty, timing requirements and compliance obligations. For advanced manufacturers, this flexibility can help finance teams coordinate incoming payments with supplier invoices, logistics costs and other business obligations. Foreign exchange exposure, liquidity constraints and compliance reviews still require careful management, while access to different payment rails gives businesses more options to work with.
From Payment Choice to Operational Control
More payment options are useful only when they fit into the way a business operates.
For an exporter, receiving funds is one step in a longer process. The money may need to be converted into another currency, held until a supplier payment is due, or distributed to different counterparties across markets. Managing these steps through disconnected accounts and systems can add work for finance teams and make it harder to maintain a consistent view of cash positions.
PhotonPay, a stablecoin-powered payment operating system, brings together global accounts, local collection capabilities, multi-currency fund management, currency conversion and global payouts across fiat and stablecoin infrastructure.
Through PhotonPay’s global accounts, businesses can collect payments from overseas customers through local accounts and international transfers. Its multi-asset wallet connects fiat currencies with stablecoins, while its 24/7 currency conversion capabilities give businesses greater flexibility in managing different currency needs. Global payout capabilities help businesses move funds onward to suppliers and other counterparties across markets.
Together, these capabilities connect the key stages of cross-border fund management, from receiving customer payments and converting currencies to making subsequent business payments. Finance teams can manage incoming funds and outgoing obligations within a more integrated financial environment, with greater visibility across their global operations.
For B2B trade, operational visibility is as important as the ability to initiate a transfer. Finance teams need to understand the amount received, the costs associated with a transaction, its processing status and how the resulting movement of funds relates to an invoice or supplier payment.
By bringing payment infrastructure and fund management into a more connected workflow, PhotonPay helps businesses manage the movement of money alongside the commercial activity it supports.
Making Money Move at the Pace of Business
Global trade depends on two flows moving in sync: goods moving through supply chains and money moving between counterparties. For manufacturers operating across markets, the ability to collect, convert and deploy funds efficiently can shape how they manage supplier commitments, working capital and the next stage of production.
At the 140th Canton Fair, PhotonPay is showcasing how integrated fiat and stablecoin capabilities can help businesses keep capital moving alongside their operations. Visit PhotonPay at Area D, Booths DT1714–DT1718, during the Canton Fair.
About PhotonPay
PhotonPay is a stablecoin-powered payment operating system built for global infrastructure. Designed for modern enterprises, PhotonPay enables businesses to send, receive, convert, and settle funds across both fiat and stablecoin rails through a single, compliance-first integration, spanning 200+ countries and territories.
For more information, visit [www.photonpay.com].
Disclaimer
This material is for general informational purposes only and does not constitute legal, regulatory, tax, accounting, or investment advice, nor an offer or solicitation for any product or service. The availability, features, and regulatory treatment of PhotonPay’s products and services may vary depending on the user’s location, business model, and the laws and regulations that apply. Any descriptions of functionality, performance, efficiency, cost savings, or compliance support (including, without limitation, references to “real‑time”, “24/7”, “high‑efficiency”, or “compliant” solutions) are aspirational or forward‑looking in nature. Actual outcomes may differ due to market conditions, technological constraints, and regulatory developments, and PhotonPay makes no express or implied representation, warranty, or guarantee as to the achievement of any particular result.
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SOURCE PhotonPay
Technology
Following the Money: Stablecoin Transfers Under $100 Account for 77% of Activity, While Large Transactions Move Two-Thirds of Value, Mercuryo and BNB Chain Report Finds
Published
17 minutes agoon
October 19, 2026By
LONDON, Oct. 19, 2026 /PRNewswire/ — Global payments infrastructure platform Mercuryo and BNB Chain, the community-driven blockchain ecosystem, have published a joint report highlighting the versatility of stablecoins, which facilitate activity ranging from low-value remittances to transactions made by ‘crypto whales’ moving digital assets across capital markets.
The research found that 77.4% of stablecoin transfers on BNB Chain in Q3 2026 were valued at under $100, while transfers of $10,000 or more accounted for 66.2% of total transfer value.
Combining Mercuryo’s fiat-to-crypto and crypto-to-fiat transaction data with BNB Chain’s on-chain data for Q3 2026, Stablecoins on BNB Chain: Fiat to Crypto and Back offers a complementary view of how stablecoins move. The findings show the versatility and usability of stablecoins and how they can serve very different purposes on the same permissionless blockchain infrastructure.
Everyday Transfers & Large-Scale Capital Movements
The findings point to a market serving multiple purposes simultaneously. While stablecoins remain an important component of digital asset markets, the data also highlights patterns consistent with their growing role in everyday stablecoin payments such as cross-border remittances. Most on-chain transfers are low-value, and stablecoins are frequently being converted between local currencies and digital dollars.
The median network fee for a stablecoin transfer on BNB Chain was just *$0.0068:Low costs matter both to people sending remittances and to institutions settling high-value payments.Together, these figures demonstrate how the same blockchain infrastructure can accommodate frequent, low-value transfers alongside large-scale movements of capital.
“The research by Mercuryo and BNB Chain sheds light on one of the defining features of stablecoins, that being their versatility,” said Arthur Firstov, Chief Business Officer at Mercuryo. “The same permissionless blockchain infrastructure that facilitates small-value transfers and cross-border payments is underpinning large-scale trading and liquidity across capital markets. Stablecoins were designed as a place to hold value between trades for those taking positions on Bitcoin. We now see the tokens being used for a host of different purposes as the efficiencies and lower costs of blockchain technology bring benefits to the masses.”
Local Currencies & Familiar Payment Methods
The report found that in Q3 2026, 70% of the value used to purchase dollar-denominated stablecoins on BNB Chain through Mercuryo was paid in non-US dollar currencies. The US accounted for just 9.8% of purchase value, with Asia the largest regional market at 39.3%, followed by Europe at 33.4%.
Payment preferences also resemble mainstream online shopping behaviour. Everyday shopping patterns are mirrored on-chain, with Apple Pay and Google Pay accounting for 69.5% of stablecoin purchases and 57.7% of purchase value through Mercuryo. Their combined share of purchases increased from 42.3% in Q3 2025, while 87.2% of purchases with a recorded device were made on a phone.
Worldpay’s Global Payments Report 2026 found that digital wallets collectively accounted for 56% of global e-commerce value in 2025. The comparison suggests that stablecoin purchases are increasingly compatible with the familiar checkout experiences consumers already use online, rather than requiring every user to adopt specialist crypto payment methods.
Self-Custody Leads
Self-custody leads at every stage of a stablecoin’s usage examined in the report. Through Mercuryo, 59.5% of stablecoin purchase value went to self-custody wallet channels. Across BNB Chain, individual addresses held 63.3% of stablecoin value, while 59.8% of off-ramp value processed through Mercuryo originated from self-custody wallet channels.
Although the datasets use different measures of wallet activity, the findings point to the continued importance of self-custody wallets in accessing and managing stablecoins. These wallets allow users to hold and transfer assets directly, while providing access to applications and services across the on-chain ecosystem.
Stablecoins in Active Circulation
The report also found that 64.3% of stablecoin value on BNB Chain had moved within the previous 30 days, suggesting that much of the value was actively circulating. The findings highlight stablecoins’ dual role, facilitating the movement of value while continuing to support trading, decentralised finance (DeFi) and broader on-chain activity.
Taken together, the findings of this report show stablecoins as more than digital tokens held on a blockchain. They form part of a broader financial lifecycle connecting fiat currencies, self-custody wallets, on-chain applications, and traditional payment infrastructure, serving a wider range of financial needs than trading alone.
* Stablecoin transfers on BNB Chain are $0.0068. Additional fees for the purchase, sale or conversion into stablecoins may apply.
Stablecoins carry risks, including potential loss of value, issuer and redemption risks, and risks associated with the underlying blockchain. They are not equivalent to bank deposits or cash, and are not be covered by deposit protection schemes.
About Mercuryo
Mercuryo is a leading payment infrastructure platform in the digital token space. Standing out in the decentralized ecosystem by enhancing payment use case growth and on-chain integration, Mercuryo’s intuitive and robust solutions are powering the next generation of Web3 payment services. Mercuryo’s innovative payment products such as Spend, bridge the gap between TradFi, Web2 and Web3. Mercuryo is the proud partner of leading pillars in the digital token economy such as Trust Wallet and MetaMask, along with Revolut, Mastercard and Visa. Driven by an evolving product suite, Mercuryo is expanding further and continuing to innovate with a diversified stack of payment services.
Media Contact
Joe Morgan, PR Manager, Mercuryo
j.morgan@mercuryo.io
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Beyond a Single Payment Rail: Building Resilience into Cross-Border B2B Trade
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