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DEEPX Honored with Three CES Innovation Awards 2024 for Leading-Edge AI Chip Tech

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Korean fabless startup unleashes world’s most innovative AI chip technology — ultra-gap source technology

– DEEPX is honored with three CES Innovation Awards 2024 in its core focus areas: Computer Hardware, Embedded Technology, and Robotics.
– The brand is a fabless AI chipmaker with world-leading innovation in cutting-edge source technologies — specifically ultra-gap source technology.

SEOUL, South Korea and LAS VEGAS, Nov. 17, 2023 /PRNewswire/ — DEEPX (CEO, Lokwon Kim), an AI chipmaking startup, is announcing that its proprietary ultra-gap source technology for AI chips has been recognized with three CES Innovation Awards 2024 — in Computer Hardware, Embedded Technology, and Robotics — ahead of the January 2024 CES trade show in Las Vegas, Nevada.

Join DEEPX at Booth #9069, North Hall during CES 2024 to experience the latest in AI chip technology and explore DEEPX’s Early Access Customer Program. 

As the world’s largest electronics exhibition since 1967, CES’ Innovation Awards, organized by the Consumer Technology Association (CTA), have served as a global beacon for technological innovation. DEEPX is the first AI chip company in the world to be honored with CES Innovation Awards in all three categories, and the brand anticipates that the positive recognition from these awards will soon be shared more broadly, through expanding international partnerships and attracting further investment.

The following DEEPX solutions were recognized: 

Embedded Technology category: An “All-in-4 AI Total Solution” consisting of four AI chips optimized for AI capabilities and performance that can be applied to various embedded systemsComputer Hardware category: The DX-H1, a technology specialized in minimizing energy consumption in high-performance AI computation processing in servers and data centers to reduce carbon emissionsRobotics category: The DX-M1 module, which innovatively realizes the intelligentization of edge devices such as robots for unmanned industrial sites and social infrastructure as well as daily life

Each of these solutions utilizes DEEPX’s ultra-gap source technology, its core and independently developed technology. The brand’s AI chip source solutions offer the latest AI algorithm support technology for edge AI applications, GPU-level high AI accuracy, and the world’s highest effective power-to-performance ratio. DEEPX is also the only AI chip company in the world to offer: an All-in-4 AI Total Solution consisting of four products optimized for various AI applications; technology that minimizes on-chip SRAM and off-chip DRAM usage requirements to minimize AI technology implementation costs; and DEEPX Software Development Environment (DXNNTM) technology that can unify and support four AI chip products for development of various AI applications. In addition, DEEPX is actively honing the cutting edge of AI chip technology and striving to lead the way — it currently has over 200 patents pending in the U.S., China, and Korea, the most in the world for edge AI chip development.

“DEEPX set out from the start to dominate the global market by developing the world’s best AI chip source technology, and, through hard work and dynamic innovation, we have already set the standard for AI chip technology,” remarked DEEPX CEO Lokwon Kim. “The fact that the first solution we developed — ultra-gap source technology — has been recognized with three CES Innovation Awards is an immense honor and a truly promising start. As we move forward, we will continue to challenge ourselves to constantly develop new technologies so that the name ‘DEEPX’ will be synonymous with ‘the world’s best original technology company’.”

DEEPX will showcase the winning source technologies and more at Booth #9069, North Hall during CES 2024, January 9-12, 2024, in Las Vegas, NV, as it leads the way in shaping the future with innovation.

<ABOUT DEEPX>
Founded in anticipation of an era when artificial intelligence will be as ubiquitous as electricity and Wi-Fi, DEEPX develops the underlying technology for high-performance AI chips and computing solutions that can make all electronic devices intelligent. DEEPX’s AI chips are optimized for various AI applications, improving the energy efficiency of AI devices and enabling efficient AI functions. Currently, DEEPX is cooperating with customers such as Hyundai Kia Motors Robotics LAB, POSCO DX, and Jahwa Electronics, which signed a mass production cooperation agreement earlier this year. The brand is also expanding cooperation with more than 30 global companies in smart cameras, control and security systems, robots, AI medical devices, and AI servers, while it scales up business globally, especially in the United States, China, and Taiwan region.

For more information, please visit: https://deepx.ai/

 

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Greater San Diego Science and Engineering Fair Students Win Big at the 75th California Science and Engineering Fair

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SAN DIEGO, April 26, 2026 /PRNewswire/ — The 75th California Science and Engineering Fair (CSEF) took place April 11–12 at California Lutheran University in Thousand Oaks, bringing together 900 of the best of 1st place winners from regional competitions covering 58 counties across the state, including the Greater San Diego Science and Engineering Fair (GSDSEF). GSDSEF students earned 40 awards at the event, including two of only six highly coveted spots to the prestigious Regeneron International Science and Engineering Fair (ISEF). Seven students earned 1st Place awards in the categories of Biochemistry and Molecular Biology, Chemistry, Cognitive Science, Microbiology, Physics and Astronomy, and Zoology. In addition, one student won the Saban Family Foundation Scholar Prize, while another won the South Coast AQMD Air Quality Award and A&WMA Environmental Leadership Award. CSEF is the oldest science fair west of the Mississippi River and the highest level competition in the state.

Top winners were:

Arya Bhatt, Grade 7, Oak Valley Middle School, South Coast AQMD Air Quality Award, A&WMA Environmental Leadership Award, “Context Aware Real Time Air Quality Prediction Using Machine Learning”.

Joie Green, Grade 8, Muirlands Middle School, 1st Place, “Soon I will be Invisible: How to Direct Energy with Topological Metamaterials”.

Maggie Hao, Grade 10, The Bishop’s School, 1st Place, “Harnessing Tardigrade Genes to Enhance Bacterial Biosensors for Heavy Metal Pollutant Detection”.

Uma Kattamuri, Grade 7, Oak Valley Middle School, 1st Place, “Elevated CO2 During Kalanchoe pinnata Growth Reveals Enhanced Antiproliferative and Synergistic Therapies”.

Sonika Dhenuva Konda, Grade 11, Del Norte High School, Saban Family Foundation Scholar Prize, “Adaptive Swarm Coordination for Wildfire Control via Q-Learning Tuned PSO with Quantum-Inspired Coupling”.

Emma Liu, Grade 11, The Bishop’s School, ISEF Finalist, 1st Place, “Defining 3D Phenotypic Cell States of Polymorphonuclear Neutrophils via Novel Computational Pipeline”.

Sharvi Mahajan, Grade 8, Bernardo Heights Middle School, 1st Place, “Evaluating Predictive EEG Theta/Beta Features in Adult ADHD via Machine Learning”.

Sydney O’Donnell, Grade 8, The Rhoades School, 1st Place, TFJIC, “Effects of Marigold Versus Chlorella Supplementation on Yolk Lutein Content”.

Ihan Sung, Grade 11, Eastlake High School, ISEF Finalist, 1st Place, “Renewable Ammonia Electrochemical Synthesis by Glow Discharge with an Iron Based Catalyst”.

Full results and project showcase available online.

About the GSDSEF

Since 1955, the Greater San Diego Science and Engineering Fair (GSDSEF) has provided an inspiring experience in science and engineering for tens of thousands of San Diego and Imperial County students, motivating them to pursue careers in science, technology, engineering, and mathematics. This regional competition challenges students to go beyond classroom studies to do independent research – to ask compelling questions, to design and implement innovative solutions, and to present and defend results to judges who are professionals in their fields. The GSDSEF brings together 800 of the best middle and high school students, 400+ judges who are professionals in their fields and over 60 professional societies and organizations, with $40k in prizes awarded.

The GSDSEF fosters creativity and innovation through inquiry, celebrates students’ STEM achievements, and showcases how young minds can make an impact in the present and future. Many of these student scientists are conducting world-class research and conducting groundbreaking experiments in fields ranging from Astronomy to Zoology, such as the discovery of cures for diseases, formulations of new vaccines, cancer research, applying AI to enhance medical diagnoses, using biomimicry for water conservation, novel drone technology, advances in micro robotics and autonomous driving technology. The GSDSEF is the highest-level STEM competition in the region and one of the oldest, most respected and competitive in the world. The GSDSEF is a 501(c)(3) organization. Learn more at gsdsef.org and follow us on LinkedIn and Instagram.

Copyright © 2026 Greater San Diego Science and Engineering Fair. All rights reserved.

Media Contact:
Sany Zakharia
sany.zakharia@gsdsef.org

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Innowise Named to 2026 CRN Tech Elite 250 List By The Channel Company

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WARSAW, Poland, April 26, 2026 /PRNewswire-PRWeb/ — Innowise has officially secured a position on CRN’s 2026 Tech Elite 250. This annual ranking identifies IT solution providers across the US and Canada that have achieved top-tier status within the partner programs of the industry’s leading technology vendors. The inclusion follows a period of verified growth in technical proficiency and a focus on high-impact engineering.

“Innowise concentrates on creating scalable, resilient architectures that produce measurable benefits for our clients. The honor of being recognized by CRN highlights the commitment of our experts to maintain high standards in highly competitive markets,” said Dmitry Nazarevich, CTO at Innowise.

About the Tech Elite 250

The Tech Elite 250 is a directory of companies recognized as having the highest level of partnership and certifications within the global IT ecosystem. In order to reach the final list, the provider must hold the most advanced technical credentials from vendors like AWS, Cisco, Dell, HPE, IBM, Intel, Nutanix, and Nvidia.

This directory serves as a verified ledger for enterprise clients who need to orchestrate complex hardware and software stacks without letting legacy environments rot. Holding these certifications is mandatory to stop the cash bleed caused by inefficient infrastructure and unoptimized cloud usage.

About Innowise

Founded in 2007, Innowise is a global software engineering and IT consulting center. The company is focused on developing high-value technologies, including artificial intelligence, data engineering, and cloud computing. Innowise crafts technological solutions for companies across 40+ domains in order to assist them in updating, creating, and modernizing their digital ecosystems.

Innowise specializes in using established technologies and modular approaches to enable organizations to expand or shift their operations while retaining complete control over all their physical and intangible assets.

Media Contact

Lizaveta Piaskova, Innowise, 48 48 787 027 706, lizaveta.piaskova@innowise.com, innowise.com

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Neusoft Showcases Full-Stack & Global Innovations at Auto China 2026

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BEIJING, April 26, 2026 /PRNewswire/ — At Auto China 2026, Neusoft Corporation hosted a press conference on April 25th and announced three key strategic moves: the iteration of Neusoft OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0, the launch of Neusoft NAGIC.AI Cockpit Software Platform, and the strategic upgrade of its subsidiary, Neusoft Smart Go. By leveraging full-stack technology and a global ecosystem to drive innovation and empowerment, Neusoft is transforming vehicles into proactive, connected and collaborative mobile intelligent spaces.

OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0: An Evolved AI Companion for Global Intelligent Mobility

Intelligent mobility requires proactive perception, scenario integration, and global connectivity to meet personalized user needs and complex driving scenarios. Neusoft, whose products cover over 130 countries and regions worldwide, addresses these challenges with its OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0 through AI-driven innovation and global ecosystem collaboration. Powered by One Mate’s cross-agent collaboration and a sub-product matrix including One Map, One Sight, One Cloud, One Pay, One Store, One Link, and One Guard, the solution delivers full-link global mobility services spanning navigation, in-cabin AR, payment, app ecosystem services, connectivity and security. By breaking down functional silos, it streamlines multi-step operations into a single “depart” command, leveraging full-stack AI technology across perception, decision-making, interaction, and execution processes.

Guan Xin, Vice President of Neusoft and General Manager of Neusoft Automotive Innovative Solutions Division, said, “Adhering to the core principles of AI and globalization, OneCoreGo® 7.0 keeps innovating, evolving into a globally intelligent mobility companion that truly understands user needs.”

To enhance driving safety and mobility efficiency, OneCoreGo® 7.0 has also comprehensively upgraded its sub-products: One Map Global Navigation newly introduces 3D city effects, 3D lane-level maps, and traffic light guidance, offering dedicated solutions for two-wheelers and commercial vehicles as well. One Sight AR For Car improves navigation display effects, reducing instances of taking wrong routes. One Pay In-Vehicle Payment achieves over 90% payment coverage for parking services across core European cities. Combined with One Cloud’s global compliance cloud monitoring platform and One Guard’s full-stack vehicle networking security services, it creates a truly comprehensive OneCoreGo® Global In-Vehicle Intelligent Mobility Solution.

Neusoft NAGIC.AI Cockpit Software Platform: Dual-track Architecture for AI Integration in Every Vehicle

Amid the AI-driven transformation of the automotive industry, the market faces two challenges: limited computing power in legacy vehicles and high adaptation difficulties for next-gen models. Neusoft’s NAGIC.AI Cockpit Software Platform adopts a flexible “distributed + centralized” dual-track architecture approach. For existing vehicle models, it introduces the AI BOX solution, rapidly boosting computing power via external AI computing units, significantly reducing upgrade costs and timelines. For new vehicle models built on next-gen central computing platforms, Neusoft provides a full-stack AI cockpit software product suite, meeting automakers’ stringent requirements for system stability, reliability, and full-domain control.

Pang Hongyan, Vice President of Neusoft and General Manager of the Automotive Intelligent Software Division, said, “Our dual-track architecture enables every vehicle to embrace AI and enjoy an intelligent future. Both existing models and new-generation vehicles can find the most suitable path to intelligentization.”

Moreover, Neusoft’s NAGIC.AI Cockpit Software Platform features scenario-based, human-centric AI Agents seamlessly integrating driving safety, occupant care services, intelligent assisted driving and in-cabin entertainment. Neusoft also collaborates with global ecosystem partners to drive intelligent upgrades of in-cabin interaction products, fostering a more open and dynamic intelligent cockpit ecosystem.

Strategic Upgrade of Neusoft Smart Go: A World-leading Provider of Full-Domain Upper-Body Electronics Solutions for Intelligent Vehicles

Aligning with the trend of E/E architecture evolution from distributed control to “central computing + zonal control”, Neusoft Smart Go, a subsidiary of Neusoft in the field of intelligent vehicle connectivity, has completed a strategic upgrade, aiming to become a global leader in full-domain upper-body electronics solutions for intelligent vehicles.

This strategic upgrade positions Neusoft Smart Go to focus on full-domain scenarios in upper-body electronics, building a product matrix covering full-category in-vehicle electronics solutions, including central computing platforms, cockpit-driving-parking integration, intelligent cockpits, intelligent communications, intelligent audio systems, and zonal control units, and pioneering the integration of large model algorithms.

Jian Guodong, Senior Vice President of Neusoft and CEO of Neusoft Smart Go, said, “This strategic upgrade represents a significant leap from partial focus to comprehensive layout. Through our dual-track strategy of high-end cutting-edge solutions and mature standardized products, we can flexibly meet the mass production needs of vehicle models across different regions and price segments worldwide.” Neusoft Smart Go will provide mass-producible, adaptable hardware-software integrated solutions, empowering global automakers in achieving intelligent transformation.

Neusoft’s President, Mr.Gai Longjia stated, “In the future, Neusoft Smart Go will create stronger synergy with Neusoft Corporation by sharing internal technologies and capabilities while responding jointly to external demands. This specialized yet collaborative model will preserve business unit’s agility and expertise while enhancing Neusoft’s full-stack technological advantages.”

As a trusted partner in a smarter world, Neusoft is committed to collaborating with global automakers and ecosystem partners to build an open and inclusive intelligent automotive community together for the future of global mobility.

For more information about Neusoft, please visit www.neusoft.com.

 

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