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AmberSemi Showcases Its Power Products with ST Embedded Solutions

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At APEC 2024 the companies will showcase reference design for brushless motors jointly developed using AmberSemi’s AC Direct DC Enabler Power Conversion Technology and ST’s STM32 MCU devices

LONG BEACH, Calif., Feb. 26, 2024 /PRNewswire/ — Amber Semiconductor, Inc. announced a reference design for brushless motor applications using AmberSemi’s breakthrough AC to DC conversion semiconductor system to power ST’s STM32 microcontrollers. This reference design will be demonstrated at the Applied Power Electronics Conference in Long Beach, CA (Feb 25-29, 2024). 

AmberSemi and ST Micro team up to showcase jointly developed reference design for brushless motors at APEC 2024

The reference design takes a direct AC input through AmberSemi’s patented AC Direct DC Enabler™ technology and powers the ST microcontroller, gate drivers and Hall sensors for brushless motor applications. Compared to typical brushless DC motor-control design, AmberSemi’s off-line solution provides up to 5 watts of regulated output, enough to drive today’s requirement of control logic and sensors, with additional headroom for expanded intelligent functionality. The Enabler offers selectable output voltages determined by internal, configurable register settings or with a simple external voltage-divider feedback circuit.  An adjustable current limiting feature on the VDC output offers protection and notification via an interrupt signal. Generation of the DC output is controlled by an internal register selection of regulator switching frequencies.  This allows the designer to easily optimize between efficiency, reduced ripple, interference with sensitive system circuitry, and board space footprint.

In addition to meeting the tasks of a high-performance AC-DC offline converter, the Enabler also provides integrated functionality for supporting the next generation of intelligent applications in IoT/IIoT/AIoT. Through the integrated SPI communication port and coupled with an SPI-equipped MCU, such as one from the STM32 family of microcontrollers, the designer can set alarm bits, protection thresholds, monitor status bits for over-current, over/under voltage, over-temperature and interrupt signals on the Enabler. Achieving real-time reporting and telemetry monitoring of the motor load are key building blocks towards a preventative maintenance plan required in industrial applications.

“The reference design for brushless motors shown at the APEC 2024 conference is set to demonstrate the advantages the Amber and ST technologies are capable of delivering to the AC-powered application landscape, simplifying the power-supply circuitry, reducing the overall BOM and PCB footprint, and improving efficiency,” said Sean Newton, Applications Director, Microcontrollers, Microprocessors, and Wireless Products at STMicroelectronics.

“We are excited to showcase with ST, a global, market-leading semiconductor company,  a reference design around our breakthrough technologies at APEC 2024,” said Thar Casey, CEO at AmberSemi. “The timing of this reference design, as we enter the commercialization phase for our first semiconductor products, could not be more ideal. It is timed with the expansion of our design-in evaluations of our semiconductor engineering samples in 2024 with our electrical product manufacturing partners.”

AmberSemi discovered a way the physics of electricity is managed differently – digitally – in silicon chips. The company’s mission is to transform electrical product power management architecture globally from outdated, 1950’s-era electro-mechanical power technologies, standard today in every electrical product, to smaller, safer, and smarter silicon chips.

Mr. Casey continued, “Our products enable a change in the design possibilities for electrical products by delivering smarter, smaller more dynamic power systems to electrical products not only enabling the possibilities of more streamlined product designs and form factors, but also opening the possibilities to pose a significantly broader set of features within these products.”

About AmberSemi
Amber Semiconductor, Inc is a leading developer of patented, innovative solid-state power management technologies for the digital control of electricity. The company’s disruptive breakthroughs change the electrical landscape forever for industrial, commercial and residential building products, powered appliances, and semiconductor solutions worldwide. With 38 patents secured around the company’s core breakthroughs, its technologies upgrade power management from 1950’s era electro-mechanical standards to safer, more reliable silicon architecture with embedded intelligence. Based in Dublin, California, the company is a voting member of the National Electrical Manufacturers Association, the Global Semiconductor Alliance (The GSA). The company was honored with numerous industry awards, such as Time Magazine’s Best Inventions of 2021, Fast Companies’ Next Big Thing in Tech 2022 and the coveted Edison Gold Award for Innovation in 2023, The GSA’s top four global Startups to Watch 2023, among many others. For more information visit www.ambersi.com.

Media Contact
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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

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