Connect with us

Technology

Global Composable Infrastructure Strategic Business Report 2024: Market to Reach $73.5 Billion by 2030 – U.S. Market is Estimated at $1.8 Billion, While China is Forecast to Grow at 53.5% CAGR

Published

on

DUBLIN, Feb. 26, 2024 /PRNewswire/ — The “Composable Infrastructure – Global Strategic Business Report” report has been added to  ResearchAndMarkets.com’s offering.

Global Composable Infrastructure Market to Reach $73.5 Billion by 2030

The global market for Composable Infrastructure estimated at US$3.6 Billion in the year 2022, is projected to reach a revised size of US$73.5 Billion by 2030, growing at a CAGR of 45.9% over the analysis period 2022-2030. Hardware, one of the segments analyzed in the report, is projected to record 45% CAGR and reach US$57.9 Billion by the end of the analysis period. Growth in the Software segment is estimated at 49.7% CAGR for the next 8-year period.

Composable infrastructure emerges as a critical asset in the IT arsenal, offering the best of both cloud and traditional worlds. Understanding the working of composable infrastructure involves delving into its architecture and primary components, highlighting its distinctive features and merits. A comparison with converged and hyper-converged infrastructures further elucidates its advantages.

Amidst a global economic update marked by a shift towards an endemic COVID-19 strategy, the pandemic’s impact on the global composable infrastructure market is significant. Despite challenges, the global market outlook remains optimistic, with hardware leading the charge and the IT & Telecom sector emerging as the largest end-use segment.

The U.S. Market is Estimated at $1.8 Billion, While China is Forecast to Grow at 53.5% CAGR

North America leads the market, with developing regions poised to spearhead future growth. In this competitive landscape, market presence varies from strong and active to niche players worldwide. Recent market activity underscores the dynamic nature of the composable infrastructure market, presenting opportunities and challenges for industry participants.

The Composable Infrastructure market in the U.S. is estimated at US$1.8 Billion in the year 2022. China, the world’s second largest economy, is forecast to reach a projected market size of US$6.5 Billion by the year 2030 trailing a CAGR of 53.5% over the analysis period 2022 to 2030.

Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 40.4% and 44.6% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 48.4% CAGR.

MARKET TRENDS & DRIVERS

Composable Infrastructure as Buzzing IT Trend in Dynamic Business LandscapeBusinesses Are Increasingly Adopting Composable Applications for Improving AgilityComposable Infrastructure in Select End-UsesComposable Infrastructure Lays Robust Foundation for Next-Level Digital ExperiencesRising Significance of Data Centers Amidst Burgeoning Data Generation Drives Market GrowthSurging Workloads of Data Center Workloads to Fuel Market ProspectsGrowing Internet Footprint, the Starting Point for All IP Data CreationTrends Catalyzing Composable Infrastructure Demand for DatacentersHere’s Why Data Centers Are the Starting Point for Successful Digital TransformationWorldwide Data Center Storage CapacityData Centers Play a Pivotal Role during COVID-19 OutbreakAs Modern IT Networks Increasingly Handle HPC and AI Applications, Role of Composable Infrastructure on the Edge GrowsImplementation of Edge Computing Leads to Cost SavingsComposable Infrastructure is a Looming Bonanza amid March of Edge ComputingRobust Growth of Edge Computing: Opportunity for the MarketGrowing Data Security Concerns Propel Implementation of Composable Infrastructure SolutionsIncreasing Adoption of Cloud Infrastructure & Solutions: Key Growth FactorKey Benefits Driving Adoption of Cloud Services of Large, Medium and Small BusinessesComposable Infrastructure as the Next Step ForwardGoogle Cloud Platform: A Leading Composable Cloud Infrastructure SolutionMarket to Benefit from Rising Demand for Software-Defined NetworkingIncreasing Demand for DevOps and Agile Methodologies Favor Market OutlookAgility Promise of Composable Infrastructure Becomes Imperative to Facilitate AI InnovationsTransition Towards Flexible Computing Bodes Well for Composable Dynamic InfrastructureRise of Composable Applications Sets Stage for Composable EnterpriseGrowing Impetus on Using Automated Technologies Propel Demand for CDIAdvent of ML and AI Devices Foster Demand for Composable Disaggregated InfrastructureCXL – Touted As the Future of Composable InfrastructureSoftware Composable Infrastructure: What Does the Future Look Like?Challenges Facing Composable Infrastructure

FOCUS ON SELECT PLAYERS (Total 31 Featured) 

Comport Technology SolutionsIBM Corp.Lenovo.Liqid Inc.,Microsoft Corp.NetApp, Inc.Nutanix Inc.NVIDIA CorporationSchneider Electric SEWipro Limited

For more information about this report visit https://www.researchandmarkets.com/r/58s1s3

About ResearchAndMarkets.com
ResearchAndMarkets.com is the world’s leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.

Media Contact:

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com    

For E.S.T Office Hours Call +1-917-300-0470 
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1904
Fax (outside U.S.): +353-1-481-1716 

Logo:  https://mma.prnewswire.com/media/539438/Research_and_Markets_Logo.jpg 

View original content:https://www.prnewswire.com/news-releases/global-composable-infrastructure-strategic-business-report-2024-market-to-reach-73-5-billion-by-2030—us-market-is-estimated-at-1-8-billion-while-china-is-forecast-to-grow-at-53-5-cagr-302071415.html

SOURCE Research and Markets

Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Technology

Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

Published

on

By

SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

Continue Reading

Technology

Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

Published

on

By

SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

Continue Reading

Technology

Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

Published

on

By

New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

Continue Reading

Trending