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Global Printed and Flexible Electronics Report 2024-2034, with Coverage of Emerging Areas, the Metaverse, Flexible OLED Lighting, Transparent Antennas, Heaters, Biomonitoring and Assistive Wearables

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DUBLIN, Feb. 28, 2024 /PRNewswire/ — The “Global Market for Printed and Flexible Electronics 2024-2034” report has been added to ResearchAndMarkets.com’s offering.

Printed and flexible electronics are shaping the future. Due to advancements in materials science, printing technology, and other additive manufacturing processes, product designers can now leverage flexible electronics’ many benefits without sacrificing capabilities and functionality. Flexible hybrid electronics (FHE) that combine flexible substrates and low-cost functional ink printing with other traditional components are leading to innovative form factors and product differentiation, including smaller devices, improved comfort for users, and light weighting.

The Global Market for Printed and Flexible Electronics 2024-2034 provides an in-depth analysis of the global printed, flexible, stretchable and hybrid electronics industry. The report analyses the overall industry landscape including macro trends, latest technical and commercial developments, products, key enabling technologies like sensors, displays, circuits, materials etc. It provides a comparative analysis of manufacturing techniques like screen printing, inkjet printing, 3D printing, roll-to-roll processing etc.

In-depth demand analysis is provided across several verticals:

Consumer Electronics: wearables, hearables, sports/fitness monitors etc.Medical & Healthcare: electronic skin patches, continuous glucose monitors, remote patient monitoring, drug delivery, prosthetics etc.Automotive: HMI, sensors, lighting, battery monitoring, EV range enhancement etc.Smart Buildings & Construction: HVAC, lighting, asset tracking etc.Smart Packaging: freshness indicators, track & trace, anti-counterfeiting etc.E-textiles and apparel: temperature monitoring & regulation, stretchable E-fabrics, therapeutic textiles, sports & fitness, smart footwear, wearable displays, smart gloves etc.Displays: Flexible and foldable displays, Micro-LEDs, lighting etc.

Additionally, the report analyses the flexible, printed and solid-state battery markets for electronics. It also explores latest advances in flexible photovoltaics, wireless charging, energy harvesting for powering flexible and wearable devices. The report provides a deep dive into the global printed, flexible and hybrid electronics industry with a detailed value chain analysis and benchmarking of over 15 manufacturing methods like screen, inkjet, gravure, flexographic printing, laser processing, photolithography, full 3D printing etc.

Over 50 key enabling materials and components are explored in detail spanning substrates, conductive materials, inks, printable semiconductors, thin film batteries, photovoltaics, lighting solutions etc. Trends in sustainability, biodegradability and recycling of flexible electronics are also analyzed.

On the demand side, the study provides granular ten-year forecasts by 24 key end-use applications and over a dozen vertical markets. For instance, in medical electronics, market revenues are segmented by continuous glucose monitors, cardiovascular monitors, wearable drug delivery devices, electronic skin patches, flexible displays, exoskeletons etc.

For automotive, forecast demand is quantified for sensors, lighting, EV range enhancement, HMI etc. The report also analyzes the integration of printed electronics in smart infrastructure across buildings, factories, warehouses, airports, retail spaces etc. and the key technologies powering this shift.

Emerging areas like the metaverse, flexible OLED lighting, transparent antennas, heaters, biomonitoring and assistive wearables have also been covered.

On the supply side, the report profiles 800+ manufacturers and developers of printed flexible electronics across sensors, batteries, PV, substrates, wearables, medical devices etc. Latest product launches, partnerships, pilot plants and production capacities are tracked for each company. Companies profiled include BeFC, Brewer Science, C3 Nano, Canatu, CHASM, Dracula Technologies, DuPont, e2ip Technologies, Electroninks, Elephantech, Epicore Biosystems, FlexEnable, Fuji Corporation, GE Healthcare, Heraeus Epurio, Inkron Oy (Nagase), Inuru, Japan Display, Inc. (JDI), LG Display, Liquid Wire, Myrias Optics, NovaCentrix, Optomec, Panasonic, PowerON, Pragmatic Semiconductor, Printoptix, PVNanoCell, SmartKem Ltd., Syenta, tacterion GmbH, Tactotek, TracXon, Voltera, Xymox Technologies, Inc. and Ynvisible.

Backed by over 250 tables and 500 figures, the report provides historic revenues from 2018-2022 and market forecasts up to 2034 by technology, components, products, regions and application sectors.

Key Topics Covered:

1 EXECUTIVE SUMMARY
1.1 The evolution of electronics
1.2 Markets for printed and flexible electronics
1.3 The wearables revolution
1.4 The wearable tech market in 2023
1.5 Continuous monitoring
1.6 Market map for printed and flexible electronics
1.7 Wearable market leaders
1.8 What is printed/flexible electronics?
1.8.1 Motivation for use
1.8.2 From rigid to flexible and stretchable
1.9 Role in the metaverse
1.10 Wearable electronics in the textiles industry
1.11 New conductive materials
1.12 Entertainment
1.13 Growth in flexible and stretchable electronics market
1.14 Innovations at CES 2021-2024
1.15 Investment funding and buy-outs 2019-2024
1.16 Flexible hybrid electronics (FHE)
1.17 Sustainability in flexible electronics
1.18 Global market revenues, 2018-2034

2 MANUFACTURING METHODS
2.1 Comparative analysis
2.2 Printed electronics
2.3 3D electronics
2.4 Analogue printing
2.5 Digital printing
2.6 In-mold electronics (IME)
2.7 Roll-to-roll (R2R)

3 MATERIALS AND COMPONENTS
3.1 Component attachment materials
3.2 Conductive inks
3.3 Printable semiconductors
3.4 Printable sensing materials
3.5 Flexible Substrates
3.6 Flexible ICs
3.7 Printed PCBs
3.8 Thin film batteries
3.9 Energy harvesting

4 PRINTED AND FLEXIBLE CONSUMER ELECTRONICS
4.1 Macro-trends
4.2 Market drivers
4.3 SWOT analysis
4.4 Wearable sensors
4.5 Wearable actuators
4.6 Recent market developments
4.7 Wrist-worn wearables
4.8 Sports and fitness
4.9 Hearables
4.10 Sleep trackers and wearable monitors
4.11 Pet and animal wearables
4.12 Military wearables
4.13 Industrial and workplace monitoring
4.14 Global market revenues
4.15 Market challenges

5 PRINTED AND FLEXIBLE MEDICAL AND HEALTHCARE/WELLNESS ELECTRONICS
5.1 Macro-trends
5.2 Market drivers
5.3 SWOT analysis
5.4 Current state of the art
5.5 Wearable and health monitoring and rehabilitation
5.6 Electronic skin patches
5.7 Wearable drug delivery
5.8 Cosmetics patches
5.9 Femtech devices
5.10 Smart footwear for health monitoring
5.11 Smart contact lenses and smart glasses for visually impaired
5.12 Smart woundcare
5.13 Smart diapers
5.14 Wearable robotics-exo-skeletons, bionic prostheses, exo-suits, and body worn collaborative robots
5.15 Global market revenues
5.16 Market challenges

6 ELECTRONIC TEXTILES (E-TEXTILES) AND SMART APPAREL
6.1 Macro-trends
6.2 Market drivers
6.3 SWOT analysis
6.4 Performance requirements for E-textiles
6.5 Growth prospects for electronic textiles
6.6 Textiles in the Internet of Things
6.7 Types of E-Textile products
6.8 Materials and components
6.9 Applications, markets and products
6.10 Global market revenues
6.11 Market challenges

7 PRINTED AND FLEXIBLE ENERGY STORAGE AND HARVESTING
7.1 Macro-trends
7.2 Market drivers
7.3 SWOT analysis
7.4 Applications of printed and flexible electronics
7.5 Flexible and stretchable batteries for electronics
7.6 Battery market megatrends
7.7 Solid-state thin film batteries
7.8 Flexible batteries (including stretchable, rollable, bendable and foldable)
7.9 Printed batteries
7.10 Photovoltaics
7.11 Stretchable heaters
7.12 Spray-on thermoelectric energy harvesting
7.13 Paper based fuel cells
7.14 Global market revenues
7.15 Market challenges

8 PRINTED AND FLEXIBLE DISPLAYS
8.1 Macro-trends
8.2 Market drivers
8.3 SWOT analysis
8.4 Printed and flexible display prototypes and products
8.5 Organic LCDs (OLCDs)
8.6 Flexible AMOLEDs
8.7 Flexible PMOLED (Passive Matrix OLED)
8.8 Flexible and foldable microLED
8.9 Flexible QD displays
8.10 Smartphones
8.11 Laptops, tablets and other displays
8.12 Products and prototypes
8.13 Flexible lighting
8.13.1 OLED lighting
8.14 FHE for large area lighting
8.15 Directly printed LED lighting
8.16 Flexible electrophoretic displays
8.17 Electrowetting displays
8.18 Electrochromic displays
8.19 Perovskite light-emitting diodes (PeLEDs)
8.20 Metamaterials
8.20.1 Metasurfaces
8.21 Transparent displays
8.22 Global market revenues
8.23 Market challenges

9 PRINTED AND FLEXIBLE AUTOMOTIVE ELECTRONICS
9.1 Macro-trends
9.2 Market drivers
9.3 SWOT analysis
9.4 Applications
9.4.1 Electric vehicles
9.4.2 HMI
9.4.3 Automotive displays and lighting
9.4.4 In-Mold Electronics
9.4.5 Printed and flexible sensors
9.4.6 Printed heaters
9.4.7 Transparent antennas
9.4.8 Global market revenues
9.4.9 Market challenges

10 PRINTED AND FLEXIBLE SMART BUILDINGS AND CONSTRUCTION ELECTRONICS
10.1 Macro-trends
10.2 Market drivers
10.3 SWOT analysis
10.4 Applications
10.4.1 Industrial asset tracking/monitoring with hybrid electronics
10.4.2 Customizable interiors
10.4.3 Sensors
10.4.4 Building integrated transparent antennas
10.4.5 Reconfigurable intelligent surfaces (RIS)
10.4.6 Industrial monitoring
10.5 Global market revenues

11 SMART PACKAGING ELECTRONICS
11.1 What is Smart Packaging?
11.1.1 Flexible hybrid electronics (FHE)
11.1.2 Printed batteries and antennas
11.1.3 Flexible silicon integrated circuits
11.1.4 Natural materials in packaging
11.1.5 Extruded conductive pastes and inkjet printing
11.1.6 OLEDs for smart and interactive packaging
11.1.7 Active packaging
11.1.8 Intelligent packaging
11.2 SWOT analysis
11.3 Supply chain management
11.4 Improving product freshness and extending shelf life
11.5 Brand protection and anti-counterfeiting
11.6 Printed and flexible electronics in packaging
11.7 Global market revenues

12 COMPANY PROFILES (690 company profiles)

A selection of companies mentioned in this report includes

BeFCBrewer ScienceC3 NanoCanatuCHASMDracula TechnologiesDuPonte2ip TechnologiesElectroninksElephantechEpicore BiosystemsFlexEnableFuji CorporationGE HealthcareHeraeus EpurioInkron Oy (Nagase)InuruJapan Display, Inc. (JDI)LG DisplayLiquid WireMyrias OpticsNovaCentrixOptomecPanasonicPowerONPragmatic SemiconductorPrintoptixPVNanoCellSmartKemSyentatacterionTactotekTracXonVolteraXymox TechnologiesYnvisible

For more information about this report visit https://www.researchandmarkets.com/r/taaiqb

About ResearchAndMarkets.com
ResearchAndMarkets.com is the world’s leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.

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SOURCE Research and Markets

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Pillsbury Notice of Data Breach

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NEW YORK, July 18, 2026 /PRNewswire/ — Pillsbury Winthrop Shaw Pittman LLP (“Pillsbury”) was among many law firms targeted by sophisticated social engineering attempts in an incident last year. While the firm quickly detected and blocked the activity, an unauthorized actor was able to access some of the firm’s documents during a short window of time. Pillsbury notified any impacted clients last year and undertook a detailed process to review the accessed documents for personal information. Pillsbury then began notifying individuals whose personal information was affected. That process is now complete, and today, Pillsbury is publishing substitute notice as a final step.

For more information, please visit the substitute notice on our website at https://www.pillsburylaw.com/en/breach-notice.html

View original content to download multimedia:https://www.prnewswire.com/news-releases/pillsbury-notice-of-data-breach-302828892.html

SOURCE Pillsbury Winthrop Shaw Pittman LLP

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From Remote Racing to Embodied AI: Fibocom and Intedigo Bring 5G Bidirectional Data Transmission into Real-World Applications

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SHANGHAI, July 18, 2026 /PRNewswire/ — From July 17 to 20, Fibocom and Intedigo will jointly present a cross-regional, beyond-visual-line-of-sight (BVLOS) teleoperation demonstration at Booth H3-C408 during the World Artificial Intelligence Conference (WAIC) 2026. Visitors will be able to enter a remote driving cockpit and control a real race car located at HURA PARK in Jiading, Shanghai, steering, accelerating, and braking in real time while experiencing how 5G connectivity enables remote operation.

More than an immersive driving experience, the demonstration provides a live validation of 5G bidirectional data transmission for embodied AI teleoperation. The vehicle continuously sends live track video, vehicle status, and operating data to the remote cockpit, while control commands are transmitted back to the vehicle, creating a closed-loop teleoperation system. Stable, low-latency, and highly reliable connectivity is essential for high-dynamic maneuvers such as high-speed cornering, precision braking, and continuous lane changes.

Developed by Intedigo, the remote driving system connects a real race car with an immersive remote driving cockpit. It supports 1080p@60Hz video transmission, glass-to-glass (G2G) video latency of less than 80 ms, and control latency of less than 10 ms. The demanding racing environment magnifies differences in video continuity and control responsiveness, making communications performance directly perceptible, measurable, and verifiable.

At the joint demonstration, Fibocom’s FM160 5G module provides cellular connectivity for the system. Powered by the Qualcomm Snapdragon™ X62 5G Modem-RF System, the FM160 supports SA and NSA network architectures as well as 3GPP Release 16. On the downlink, it supports NR Carrier Aggregation (NR CA) with bandwidth of up to 120 MHz, delivering peak speeds of up to 3.5 Gbps in NSA mode and 2.5 Gbps in SA mode. On the uplink, it supports UL MIMO and delivers peak speeds of up to 900 Mbps in SA mode. These capabilities support the continuous transmission of HD video and vehicle status data, along with reliable delivery of control commands.

As embodied AI moves into factories, data centers, logistics operations, and industrial parks, robots are becoming increasingly capable of performing tasks autonomously. Yet complex environments, unexpected events, and edge cases still require Human-in-the-Loop (HITL) remote intervention to help ensure safe and reliable operation.

Daniel Liu, CEO of Intedigo, said:

“5G represents the pinnacle of human communications and the starting point of machine communications. In the past, communications connected people to people; in the future, they will connect people to robots and robots to robots. Remote racing is simply the easiest entry point for people to understand this concept. What we are truly validating is a communications system capable of supporting remote collaboration for embodied AI. HURA makes low-latency remote driving a tangible experience, while RoBOX extends this capability to robots and a broader range of intelligent terminals. Together with Fibocom, we hope to enable more machines to receive remote assistance whenever needed while remaining continuously connected and operating reliably.”

Simon Tao, VP of Wireless Solutions Business Group and General Manager of MBB BU at Fibocom, said:

“As embodied AI enters real-world industrial environments, reliable connectivity will become the foundation for telemetry feedback, remote control and operational management. Fibocom’s 5G solutions, represented by FM160, provide the cellular connectivity required for continuous on-site data transmission and reliable control command delivery. Fibocom will continue collaborating with ecosystem partners such as Intedigo to bring cellular connectivity to more robots, autonomous machines and mobile intelligent terminals, enabling embodied AI systems to stay continuously connected and respond reliably in real-world applications.”

From remote race cars to robots, unmanned equipment, and mobile intelligent terminals, 5G is evolving from connecting people to connecting machines. This joint demonstration makes the capabilities of 5G bidirectional data transmission directly perceptible, experiential, and verifiable, helping pave the way for embodied AI to scale across real-world applications.
 

About Fibocom

Fibocom, founded in 1999, is China’s first wireless communication module company listed on both the A-share and H-share markets (300638.SZ, 0638.HK). As a global leading provider of wireless communication modules and AI solutions, Fibocom leverages wireless communication and artificial intelligence as its core technologies to provide integrated hardware and software solutions that empower industry applications. These solutions accelerate the transformation from “Connect Everything” to “Intelligent Connectivity” across diverse industries.

Fibocom’s one-stop solutions encompass cellular communication, AI, automotive, and GNSS modules, as well as AI toolchains, supporting industry-side and mainstream large model integration, and providing AI Agent, global connectivity, and cloud services, driving the digital intelligence upgrades in industries such as robotics, consumer electronics, low-altitude economy, intelligent transportation, smart retail, and smart energy.

View original content to download multimedia:https://www.prnewswire.com/news-releases/from-remote-racing-to-embodied-ai-fibocom-and-intedigo-bring-5g-bidirectional-data-transmission-into-real-world-applications-302828996.html

SOURCE Fibocom Wireless Inc.

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DR. PHONE FIX ANNOUNCES SECOND TRANCHE CLOSING OF NON-BROKERED CONVERTIBLE DEBENTURE UNIT FINANCING

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/NOT FOR DISTRIBUTION TO U.S. NEWSWIRE SERVICES OR FOR DISSEMINATION IN THE UNITED STATES/

EDMONTON, AB, July 18, 2026 /CNW/ — Dr. Phone Fix Canada Corporation (“Dr. Phone Fix” or the “Company”) (TSXV: DPF) is pleased to announce that, further to its news release dated May 19, 2026 and June 24, 2026 (the “Prior News Releases”), it has closed the second tranche of its non-brokered private placement (the “Offering”) of convertible debenture units of the Company (each, a “Unit”). The Company issued 726 Units, at a price of $1,000 per Unit, for aggregate gross proceeds of $726,000. Each Unit is comprised of (i) one $1,000 principal amount unsecured convertible debenture of the Company (a “Convertible Debenture”) and (ii) 3,125 common share (“Common Share”) purchase warrants of the Company (each, a “Warrant”). Additional detail on the Offering, including terms of the Convertible Debentures and Warrants, is set out in the Prior News Releases.

In connection with the Offering, the Company paid a finder’s fee consisting of an aggregate cash fee of $50,820 and issued an aggregate of 317,625 common share purchase warrants of the Company (each, a “Finder’s Warrant”) to certain qualified arm’s length parties. Each Finder’s Warrant is exercisable to acquire one Common Share of the Company at an exercise price of $0.22 prior to the date that is 24 months from the date of issuance.

All securities issued pursuant to the Offering, including any Common Shares issuable upon conversion of the Convertible Debentures or exercise of the Warrants and Finder’s Warrants, are subject to a statutory hold period of four months and one day from the closing of the Offering, in accordance with applicable securities laws and TSX Venture Exchange (the “TSXV”) policies. 

The Offering remains subject to final acceptance of the TSXV.

This news release does not constitute an offer to sell or a solicitation of an offer to buy any of the securities described in this news release in the United States. Such securities have not been, and will not be, registered under the U.S. Securities Act, or any state securities laws, and, accordingly, may not be offered or sold within the United States, or to or for the account or benefit of persons in the United States or “U.S. Persons”, as such term is defined in Regulation S promulgated under the U.S. Securities Act, unless registered under the U.S. Securities Act and applicable state securities laws or pursuant to an exemption from such registration requirements.

About Dr. Phone Fix

Dr. Phone Fix is a national, award-winning, eco-friendly, and customer-centric leader in Canada’s cell phone and electronics repair and certified pre-owned device industry. Founded in 2019, the Company now operates 44 retail locations nationwide through a standardized and scalable operating platform designed to support consistent execution across multiple markets, delivering fast, reliable, and environmentally conscious repair services alongside a curated selection of certified pre-owned devices and premium accessories. Dr. Phone Fix maintains strong partnerships with OEMs and certified suppliers, ensuring consistently high-quality standards across its national footprint. With a focus on responsible device lifecycle management, customer service, and operational discipline, Dr. Phone Fix continues to set the benchmark for device care and resale in Canada.

www.docphonefix.com

NEITHER THE TSXV NOR ITS REGULATION SERVICES PROVIDER (AS THAT TERM IS DEFINED IN THE POLICIES OF THE TSXV) ACCEPTS RESPONSIBILITY FOR THE ADEQUACY OR ACCURACY OF THIS NEWS RELEASE.

Forward-Looking Information and Cautionary Statements

Certain information in this news release constitutes forward-looking statements under applicable securities laws. Any statements that are contained in this news release that are not statements of historical fact may be deemed to be forward-looking statements. Forward-looking statements are often identified by terms such as “may”, “should”, “anticipate”, “expect”, “potential”, “believe”, “intend” or the negative of these terms and similar expressions. Forward-looking statements in this news release include statements relating to: the final acceptance of the Offering by the TSXV; and the expected use of proceeds following the closing of the Offering. Forward-looking information in this news release is based on certain assumptions and expected future events, namely: the Company’s financial condition and development plans do not change as a result of unforeseen events; the TSXV will provide its final acceptance of the Offering; and the Company will be able to obtain the financing required in order to develop and continue its business and operations. These statements involve known and unknown risks, uncertainties and other factors, which may cause actual results, performance or achievements to differ materially from those expressed or implied by such statements, including but not limited to: the Company’s inability to obtain TSXV final acceptance for the Offering; the potential failure to complete the balance of the Offering or to raise the full anticipated gross proceeds; market conditions and investor demand for the Company’s securities; the Company’s inability to deploy the proceeds as currently intended; and general economic and market conditions. Readers are cautioned that the foregoing list is not exhaustive. Readers are further cautioned not to place undue reliance on forward-looking statements, as there can be no assurance that the plans, intentions or expectations upon which they are placed will occur. Such information, although considered reasonable by management at the time of preparation, may prove to be incorrect and actual results may differ materially from those anticipated. Forward-looking statements contained in this press release are expressly qualified by this cautionary statement and reflect the Company’s expectations as of the date hereof and are subject to change thereafter. The Company undertakes no obligation to update or revise any forward-looking statements, whether as a result of new information, estimates or opinions, future events or results or otherwise or to explain any material difference between subsequent actual events and such forward-looking information, except as required by applicable law.

 

SOURCE Dr. Phone Fix

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