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Road to 6G: IDTechEx Investigates Emerging Low-Loss Materials

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BOSTON, March 4, 2024 /PRNewswire/ — As the world awaits the full take-off of the next generation of telecommunication technologies, 5G, important stakeholders are preparing for the future of future telecommunications – 6G. This may seem premature, given that deployment of 5G infrastructure and base stations are not nearly at their peak yet. In fact, IDTechEx forecasts that the high-frequency, high-performance bands of mmWave 5G will only take off in several years. However, for 6G technologies to eventually be deployed globally in a decade, key research and development activities by numerous stakeholders across the supply chain (i.e., telecommunications operators, component suppliers, materials suppliers, governments, academics, etc.) must take place now. This includes R&D for low-loss materials, which IDTechEx extensively explores in its report, “Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts“.

 

 

A look into 6G and its current status

First, it is important to understand the 5G frequency bands to understand why the 6G frequency bands seem so promising. 5G’s frequency bands include the sub-6GHz band (from 3.5 – 6 GHz) and the millimeter wave (mmWave) band (from 24 – 40 GHz). While these 5G bands can offer faster data rates, low latency, and enhanced reliability for end-users, 6G can go a step further. 6G will likely include frequency bands extending into the THz (terahertz) range (from 0.3 to 10 THz), which will be able to offer Tbps (terabits per second) data rates, microsecond latency, and extensive network dependability. Compared to 5G, 6G is expected to have a 50x higher data rate and 100x faster speeds.

With such benefits, it is not surprising that research on 6G technologies has been accelerating since 2019. The first major milestone occurred in 2017 when Huawei began its 6G research. Since then, key governmental authorities like the US Federal Communications Commission (FCC) have opened up THz frequencies for research, while the Chinese government began its research activities for 6G. Additionally, partnerships and consortiums are shaping up to be important hubs of innovation for future 6G technologies. Recently, the AI-RAN Alliance was launched with the goal of effectively combining artificial intelligence (AI) with wireless communication technologies; it includes many notable founding members, including Samsung Electronics, Arm, Ericsson, Microsoft, Nokia, NVIDIA, SoftBank, and Northeastern University.

Overcoming the key technical challenges of 6G

The two biggest challenges that will need to be addressed for 6G technologies are:

Very short signal propagation rangeSignal loss due to line-of-sight obstacles (i.e. buildings, trees, etc.)

For the former challenge, minimizing transmission loss will require different technical advancements, including innovations in materials for 6G. Speaking broadly, materials innovation acts as an essential building block on which other technical advances can develop. For THz communications, low-loss materials that help minimize signal loss will be critical to enabling new 6G technologies and applications.

Landscape of low-loss materials for high-frequency 5G applications. Source: IDTechEx

Approaches to low-loss materials for 6G

While the precise performance targets needed for 6G are still unknown, it can be expected that next-generation low-loss materials must surpass the performance of current ultra-low-loss materials at a minimum. As such, some researchers are approaching the challenge of 6G low-loss materials from the starting point of current commercially used low-loss materials. These material approaches may incorporate novel structures or modifiers into industry-standard dielectric materials, such as PTFE (polytetrafluoroethylene) and reinforced epoxy thermosets.

Others are considering the need for low-loss materials for integrated packages. As telecommunications components continue to be integrated into smaller packages, the need for materials that facilitate such packages increases. Organic materials such as polyimide (PI) and poly p-(phenyl ether) (PPE) are being developed into build-up materials for substrates.

However, more substantial research activity is taking place for inorganic materials for integrated packages. Numerous papers have been published demonstrating the feasibility of using glass as a substrate in an antenna-integrated die-embedded package, which may reduce signal loss in the interconnects. Additionally, many papers are exploring novel ceramic compositions for low-temperature co-fired ceramics (LTCC) for 6G applications.

Lastly, other research approaches are utilizing less conventional materials, like low-cost thermoplastics, silica foams, or wood-based composites. The diversity in approaches explored by IDTechEx shows not only the level of interest in low-loss materials for 6G but also offers a look into how diverse the future landscape of low-loss materials for 6G may be.

Market forecasts for low-loss materials for 5G and 6G

The IDTechEx report, “Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts”, explores the technology developments and market trends driving the growth of the low-loss materials market for next-generation telecommunications. IDTechEx forecasts future revenue and area demand for low-loss materials for 5G while carefully segmenting the market by frequency (sub-6 GHz vs mmWave), six material types, and three application areas (smartphones, infrastructure, and CPEs) to provide sixty different forecast lines. For further information on low-loss materials for 5G and 6G, including material benchmarking studies, player analysis, market drivers and barriers, and granular 10-year market forecasts, please see the IDTechEx report.

For more information on this report, including downloadable sample pages, please visit www.IDTechEx.com/LowLossMats.
For the full portfolio of 5G-related research available from IDTechEx, please visit www.IDTechEx.com/Research/5G.

IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com

About IDTechEx

IDTechEx guides your strategic business decisions through its Research, Subscription and Consultancy products, helping you profit from emerging technologies. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com.

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Penetron Strengthens Global Research Collaboration at ICSHM 2026

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PHILADELPHIA, July 19, 2026 /PRNewswire/ — Penetron participated in the 10th International Conference on Self-Healing Materials (ICSHM 2026), held July 8–10, 2026, at Drexel University in Philadelphia, Pennsylvania. The international event brought together leading researchers, engineers, and industry representatives to present and discuss the latest advances in self-healing materials and related technologies.

A global delegation of Penetron executives attended the conference, representing the United States, Greece, Italy, Brazil, India, Chile, the United Arab Emirates, Belgium, and Singapore.

“For over 50 years, Penetron has provided self-healing concrete solutions to the industry that optimize concrete durability by sealing cracks and reducing concrete permeability to limit maintenance requirements, extend structural service life, and help protect infrastructure exposed to groundwater, chemicals, chlorides, and other aggressive conditions,” says Christopher Chen, Director of The Penetron Group. “Our participation at the ICSHM reinforces Penetron’s long-standing commitment to international research collaboration and allows us to better understand emerging research and develop leading-edge solutions for real-world construction challenges.”

Hosted at Drexel University’s Bossone Research Enterprise Center, ICSHM 2026 welcomed specialists from more than 18 countries across six continents and featured over 70 technical presentations, including keynote addresses, plenary sessions, research presentations, and an interactive poster program. The conference opened with remarks from Drexel University President Antonio Merlo and ICSHM Chair Dr. Nele De Belie. Finally, the conference provided valuable opportunities for researchers and industry specialists to strengthen cooperation between academia and the construction sector to further develop self-healing technologies.

“Extending the service life of concrete infrastructure requires cooperation between universities, materials specialists, engineers, and industry,” said Jozef Van Beeck, Director of International Sales and Marketing for The Penetron Group. “ICSHM 2026 provided an important forum for connecting scientific research with the practical requirements of the global construction industry.”

The Penetron Group is a leading manufacturer of specialty construction products for concrete waterproofing, concrete repairs, and floor preparation systems. The Group operates through a global network, offering support to the design and construction community through its regional offices, representatives, and distribution channels.

For more information on Penetron waterproofing solutions, please visit penetron(dot)com or Facebook(dot)com/ThePenetronGroup, email CRDept(at)penetron(dot)com or contact the Corporate Relations Department at 631-941-9700.

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SOURCE The Penetron Group

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Singtel Receives Four Frost & Sullivan 2026 Recognitions for Leadership in Enterprise Connectivity, Cybersecurity, and Digital Transformation

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The recognitions highlight Singtel’s leadership in secure connectivity, network transformation, IoT innovation, and cybersecurity, delivering customer value through intelligent digital infrastructure and AI-enabled enterprise services.

SAN ANTONIO, July 19, 2026 /CNW/ — Frost & Sullivan is pleased to honor Singtel with the 2026 Southeast Asia IoT Connectivity Service Provider Company of the Year, 2026 Singapore Network Transformation Customer Value Leadership, 2026 Singapore Cybersecurity Services Company of the Year, and 2026 Singapore SD-WAN and SASE Service Provider Company of the Year recognitions. These acknowledgements reflect Singtel’s outstanding achievements in delivering secure, intelligent, and scalable digital infrastructure that enables enterprises to modernize operations, simplify complexity, and accelerate digital transformation across Singapore and Southeast Asia. They underscore the company’s consistent leadership in strategy execution, customer value creation, and innovation across enterprise connectivity, cybersecurity, software-defined networking, and IoT connectivity services.

Frost & Sullivan evaluates companies through a rigorous benchmarking process across two core dimensions: strategy effectiveness and strategy execution. Singtel excelled in both, demonstrating its ability to anticipate evolving enterprise requirements while consistently translating long-term vision into measurable customer outcomes. Through platforms such as Singtel CUBΣ (CUBE) and its multidomestic IoT connectivity architecture, the company continues to unify networking, cybersecurity, automation, and AI-driven intelligence into integrated solutions that address the growing complexity of hybrid, multicloud, and connected environments. “Singtel has established itself as a benchmark for enterprise digital infrastructure by converging connectivity, cybersecurity, network intelligence, and IoT orchestration into a unified, customer-centric ecosystem. Its disciplined execution, platform-led innovation, and commitment to simplifying complex enterprise environments continue to strengthen operational resilience and deliver sustained value for organizations across the region,” said Kenny Yeo, Director at Frost & Sullivan.

Guided by a long-term strategy focused on digital innovation, intelligent infrastructure, and customer-centric transformation, Singtel has moved well-beyond traditional telecommunications to a trusted technology partner for enterprises navigating increasingly connected and data-driven environments. Its strategic investments in AI-enabled operations, cloud-native platforms, secure connectivity, and ecosystem partnerships enable organizations to modernize critical infrastructure while maintaining the flexibility to support future business growth.

The company’s strategic agility and sustained investment in integrated digital platforms have enabled it to scale innovative services across local, regional, and global enterprise environments. Innovation remains central to Singtel’s approach through solutions including the CUBΣ connected intelligence platform, multidomestic IoT connectivity powered by eSIM orchestration, managed cybersecurity services, AI-driven network automation, and network-as-a-service capabilities. These solutions simplify network and security management, strengthen cyber resilience, improve operational visibility, and provide enterprises with scalable, secure, and high-performing connectivity across cloud, edge, IoT, and hybrid infrastructures.

By streamlining service delivery through intelligent automation, centralized orchestration, proactive monitoring, and flexible managed and co-managed service models, Singtel continues to help organizations reduce operational complexity while improving service reliability and business agility. Its ability to integrate best-of-breed technologies in a unified operational framework, combined with strong regional network ownership and localized expertise, enables customers to confidently scale digital initiatives while maintaining security, governance, and operational excellence.

Frost & Sullivan commends Singtel for setting a high standard in competitive strategy, execution, and customer value across multiple technology domains. By combining intelligent networking, secure digital infrastructure, AI-enabled operations, and cross-border IoT capabilities in an integrated platform strategy, the company is shaping the future of enterprise connectivity while helping organizations build resilient, future-ready digital ecosystems.

Each year, Frost & Sullivan presents its Company of the Year and Customer Value Leadership recognitions to organizations that demonstrate outstanding strategy development and implementation, resulting in measurable improvements in customer satisfaction, competitive positioning, and business performance. These recognitions honor forward-thinking companies that continuously raise industry standards through innovation, operational excellence, and long-term value creation.

Frost & Sullivan Best Practices Recognition
Frost & Sullivan’s Best Practices Recognitions honor companies across regional and global markets that exhibit exceptional achievement and consistent excellence in areas such as leadership, technological innovation, customer experience, and strategic product development. Each recognition is the result of a rigorous analytical process in which Frost & Sullivan industry experts benchmark performance through comprehensive interviews, deep-dive analysis, and extensive secondary research. The goal is to identify true best-in-class organizations that are driving transformative growth and setting new industry standards.
Contact us: Start the discussion.

Contact:
Tarini Singh
E: Tarini.Singh@frost.com

 

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SOURCE Frost & Sullivan

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Emdoor Launches “Ailyn” AI Hub at WAIC 2026: Unifying Intelligence Across Every Device

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SHANGHAI, July 18, 2026 /PRNewswire/ — Emdoor, a leading provider of intelligent computing devices, unveiled its latest innovation — Ailyn, an integrated software-hardware AI hub — at the World Artificial Intelligence Conference (WAIC) 2026. Under the theme “Intelligence in All Things, Boundless Edge Intelligence”, Emdoor’s Booth X1B-804 showcases four immersive scenarios spanning personal, home, enterprise, and industrial use cases, demonstrating how AI can flow seamlessly across devices.

With decades of experience across cloud, edge, device, and wearable form factors, Emdoor has established one of the industry’s most comprehensive intelligent hardware portfolios. Yet the company recognized a critical gap: while individual devices grow smarter, they often operate in isolation.

Ailyn is Emdoor’s answer to this challenge. Introduced on the WAIC Magic Box stage, Ailyn serves as a unified intelligence layer that orchestrates storage, computing power, AI models, and data across PCs, NAS systems, computing boxes, and IoT devices. The result is a scalable, centrally managed intelligence platform that delivers seamless cross-device collaboration, data privacy, and AI capabilities that improve with use.

At its core, Ailyn follows a device-first, multi-device connected philosophy. By prioritizing on-device model deployment, it reduces costs while preserving privacy, minimizing latency, and enabling offline functionality. Key capabilities include unified data access, uninterrupted task handoff between devices, intelligent multi-model routing, and dynamic compute scaling — plus built-in features for knowledge accumulation, skill expansion, persona customization, and automated task execution.

Four Scenarios, One Intelligent Ecosystem

The enterprise lineup features high-performance AI workstations, AI servers, AI NAS, Mini PCs, and motherboards. Workstations support up to 96-core processors and four double-width GPUs with integrated BMC remote management. AI servers run dual Intel Xeon scalable processors with up to eight mainstream AI accelerators. The single-GPU workstation series offers dual-platform compatibility with both Intel and AMD, featuring a PCIe 5.0 ×16 slot and up to 128GB DDR5 memory. Available in two form factors — a 23.9L tower chassis and a 15.3L compact chassis with tempered glass side panel — it delivers balanced performance for both creative workloads and local AI inference. The AI NAS unifies storage and AI computing power in one device, with192GB of octa-channel LPDDR5X memory to support local large model deployment. Ailyn unifies these resources into a private computing backbone, intelligently offloading heavy workloads so users get instant on-device responsiveness with datacenter-grade power on demand.

For individual users, the showcase includes Mini PCs, AI PCs, AI tablets, and multimodal wearables. The AP16, powered by Intel’s 3rd Generation Core™ Ultra processor, delivers 180 TOPS of AI performance with sustained 54W output — capable of running large models locally. Multimodal wearable solutions built on Qualcomm and BES chips offer faster time-to-market for brand partners. Within the Ailyn ecosystem, PCs handle heavy computing while wearables provide continuous environmental awareness, each device strengthening the whole.

Industrial visitors will find AI BOX units, rugged AI notebooks, handheld terminals, and industrial PCs. AI BOX devices come preloaded with industry-specific models for production line visual inspection. Rugged notebooks deliver reliable performance for mobile field operations. Industrial PCs feature industrial-grade architecture for 24/7 uptime. Through Ailyn, these connected devices break down traditional data silos, enabling intelligent resource orchestration and a closed-loop perception-decision-execution system that accelerates industrial digital transformation.

At the center of the home scenario are AI tablets and home NAS, connected to a full-house AIoT network. The NAS acts as the family’s private data and computing hub, while the tablet serves as the primary interface for senior health reminders and children’s learning support. Ailyn weaves these devices into a cohesive system covering family memories, health care, companionship, and home security — bringing intelligence into daily life without intruding on it.

The launch of Ailyn marks a significant evolution for Emdoor — shifting from a hardware manufacturer to a builder of intelligent infrastructure. It represents the convergence of the company’s deep hardware heritage and its AI innovation roadmap. Moving forward, Emdoor will continue investing in edge AI technology and expanding the Ailyn ecosystem alongside partners, bringing distributed intelligence from the showroom into everyday life.

Company: Emdoor Digital Technology Co.,Ltd.
Contact Person: Yao Zhou
Email: marketing.digi@emdoor.com
Website: http://www.emdoordigi.com/
City: Shenzhen, China

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SOURCE Emdoor Digital

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